JP2003042729A - Apparatus and method for noncontact measurement of shape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus and a method for the noncontact measurement of a shape wherein the shape of a substrate and that of a solder bump can be found quickly by medium. SOLUTION: A noncontact shape measuring apparatus is provided with a random light projection means which projects random light while the angle of incidence on a measuring object of projection light from a light source is set at a prescribed angle, a polarization means by which reflected light from the measuring object obtained by projecting the random light at the prescribed angle is polarized to the random light, light having a light component parallel to a reflecting surface and light having a light component perpendicular to the reflecting surface, a detection means of detecting the polarized light, a storage means by which resolution data obtained by a preliminary measurement and data regarding an inspection means are stored, and a shape calculation and processing means which calculates the shape of the measuring object by using detected result data obtained by the detection means, by using the resolution data and by using data regarding the inspection method.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact shape measuring apparatus and a non-contact shape measuring method for projecting a laser beam onto a solder bump on a substrate and receiving the reflected light with a light receiving element to measure the shape of the solder bump. It is a thing.

[0002]

2. Description of the Related Art Generally, the height of a solder bump at a joint portion in an electronic component is measured by a triangulation method in which light is projected onto an object to be measured and the reflected light is received by a light receiving element to measure the height of the solder bump. Is being measured.

As an application example of the measurement method using the triangulation method, there is a device described in Japanese Utility Model Laid-Open No. 6-88709. According to this invention, it is inclined at 45 ° with respect to the measuring object.
By projecting linearly polarized light from above and providing a polarization filter so that the reflected light has the same polarization state component as the incident light, work such as focusing on the solder bumps can be further shortened.

[0004]

However, since the light intensity of the reflected light from the object to be measured greatly differs depending on the material of the object to be measured, it is difficult to simultaneously measure the substrate and the solder bump with the same gain. There was a problem. Further, a part of the laser beam projected to the solder bump may be reflected toward the substrate, and the reflected light may be re-reflected on the substrate. In this case, the reflected light re-reflected on the substrate and the solder bump There is a problem that an erroneous measurement due to multiple reflection occurs by simultaneously receiving the reflected light from the. The erroneous measurement due to the multiple reflection is a problem that can occur even when measuring the upper surface of the substrate.

The method disclosed in Japanese Utility Model Laid-Open No. 6-88709 does not always provide reflected light having the same component as the incident light component, depending on the type of medium and the incident angle of the laser light. However, there is a problem that the height can be measured only at the place where the reflected light is obtained. Further, there is a problem that the polarization filter for reflected light must be changed every time the component of linearly polarized light is changed.

Therefore, an object of the present invention is to solve the above problems, suppress measurement errors due to multiple reflections, and quickly obtain the shape of the substrate and the solder bump for each medium without changing the gain or the deflection filter. It is to provide a shape measuring device and a non-contact shape measuring method.

[0007]

In order to achieve the above object, the non-contact shape measuring apparatus of the present invention projects random light with the incident angle of the projection light from the light source on the object to be measured being a predetermined angle. Random light projection means and reflected light from the measuring object obtained by projecting at this predetermined angle are random light, light having a light component parallel to the reflecting surface, and light having a light component perpendicular to the reflecting surface. And a polarization means for polarizing the light, detection means for respectively detecting the light polarized by the polarization means, storage means for storing resolution data obtained by measurement in advance, and data relating to an inspection method, and Shape detection processing means for calculating the shape of the measuring object using the detection result data obtained by the detection means and the resolution data and the inspection method data stored in the storage means.

Further, the measuring unit in the non-contact shape measuring apparatus of the present invention can be tilted so that the incident angle of the projection light projected from the random light projecting means onto the measurement object with respect to the measurement surface becomes the Brewster angle. And

Further, the non-contact shape measuring method of the present invention detects the reflected light from the measurement object obtained by projecting the light from the light source onto the measurement object having a different refractive index on the upper surface of the substrate or on the substrate. A non-contact shape measuring method for obtaining the shape of the measuring object by means of: projecting random light with an incident angle of the light source as a predetermined angle; and a measuring object obtained by projecting at the predetermined angle. Obtained by detecting the polarized light from the object into a random light, a light component of light parallel to the reflecting surface, and a light component of light perpendicular to the reflecting surface, and detecting each polarized light. And a step of calculating the shape of the measurement target using the obtained detection result data, the resolution data obtained by measuring in advance, and the data relating to the inspection method.

Further, in the above-mentioned non-contact shape measuring method of the present invention, a predetermined incident angle of the projection light from the light source onto the object to be measured is defined as Brewster's angle.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION A non-contact shape measuring apparatus according to an embodiment of the present invention will be described in detail below with reference to FIG. Here, FIG. 1 is a schematic configuration diagram of a non-contact shape measuring apparatus according to an embodiment of the present invention.

<Construction of the non-contact shape measuring apparatus of the present invention> The non-contact shape measuring apparatus of the present invention is roughly classified into a table 1 on which a substrate as an object to be measured is placed and a height and shape of the object to be measured. Measuring unit 4 for measuring with laser light
And a control device 18 electrically connected to the table 1 and the measurement unit 4 by wiring. The detailed configuration of each unit will be described below.

<Table> The table 1 is configured to be movable in the X-axis direction and the Y-axis direction in the drawing. On the table 1, for example, a glass epoxy substrate (hereinafter referred to as substrate) 2 is placed, and a plurality of solder bumps 3 are provided at the joints on the substrate 2.

<Measurement Unit> The measurement unit is
The incident angle of the incident light on the measurement surface is the Brewster angle θ _M
So that it can be tilted at an arbitrary angle 24 so that
It is configured. In addition, this measuring unit 4 has a triangular
Run to measure the shape of the measured object using the surveying method.
A laser projector 5 for projecting dam light is provided.
Below the laser projector 5 from the laser projector 5
Measures the projected light through the polygon mirror 22.
The scan lens 6 for condensing on the surface of the object is provided
There is. Furthermore, the light 16 projected from the scan lens 6
To collect the reflected light 17 from the object to be measured,
A lens 23 is provided.

A deflection mirror 7 and a prism 8 are provided above the condenser lens 23, and the light condensed by the condenser lens 23 changes its direction at the deflection mirror 7 and is incident on the prism 8. Is configured to. Further, the prism 8 is configured to disperse the random light incident from the deflection mirror 7 into the light receiving element 9 and the beam splitter 11. The light receiving element 9 is electrically connected to the amplification operation amplifier 10 by wiring.

The light receiving element 9 is a semiconductor position detecting element (PSD: Position S Position) capable of detecting the position of spot-like light.
ensitive Detector). Since the light receiving element 9 including such a semiconductor position detecting element creates a flow of positive and negative charges excited by the energy of the projected light, it is inversely proportional to the distance to the output electrodes at both ends of the light receiving element 9. By taking out as such a current, the spot position can be measured, and at the same time, the light intensity can be measured. The amplification operational amplifier 10 amplifies a current generated by the light receiving element 9 receiving light and converts the current into a voltage, and then performs an operation.
Reference numeral 1 is for polarizing the reflected light that has been separated into individual components.

The measuring unit 4 is also provided with light receiving elements 12 and 14 so that one light polarized by the beam splitter 11 enters the light receiving element 12 and the other light enters the light receiving element 14. ing. Further, the light receiving element 12
Is electrically connected to the amplification calculation amplifier 13 by wiring, and the light receiving element 14 is electrically connected to the amplification calculation amplifier 15 by wiring.

Here, the light receiving element 12 receives a light component (hereinafter referred to as a p-wave) in a direction parallel to the reflecting surface, and semiconductor position detection capable of detecting the position and light intensity of spot-like light. It is formed of elements. On the other hand, the light receiving element 14 receives a light component (hereinafter referred to as s wave) perpendicular to the reflecting surface, and like the light receiving elements 9 and 12, the semiconductor position capable of detecting the light intensity and the position of the spot-like light. It is a detection element. In addition, the amplification operation amplifier 13 includes a light receiving element 12
Amplifies the current generated by receiving light and converts it into a voltage, and the amplification operational amplifier 15 amplifies the current generated by receiving light by the light receiving element 14 and converts it into a voltage.

<Control Device> The control device 18 is for controlling the measurement unit 4, the amplification operation amplifiers 10, 13, 15 and the semiconductor laser which constitutes the laser projector 5. This control device controls the inclination of the measuring unit, converts analog data input from the respective amplification operation amplifiers 10, 13, 15 into digital data, converts current values into displacement amounts, and a keyboard (not shown). )
A CPU 20 for processing various data input from
The memory 21 for storing the processing result performed by the CPU 20 and various input data from the keyboard, and the laser projector 5
And an interface (not shown) for communicating with each of the amplification operation amplifiers 10, 13, and 15. In addition, the control device 18 has a monitor 1 for displaying measurement results performed by the control device 18 and various input data from the keyboard.
9 is attached.

<Measuring Operation in this Embodiment> The measuring operation of the solder bump shape in the non-contact shape measuring apparatus configured as described above will be described below with reference to FIGS. 1 to 3. Here, FIG. 2 is a flowchart showing a solder bump shape measuring operation in the non-contact shape measuring apparatus of the present embodiment. Further, FIG. 3 is a diagram for explaining a scanning method of projected light in the solder bump shape measuring operation.

First, the controller 18 is turned on to perform teaching data creation processing (step 101). In the processing for creating the teaching data, the resolution data obtained by previously measuring the displacement amount at the light receiving position of the semiconductor position detecting element and the data regarding the inspection method are input.

In the teaching data creating process in step 101, the input of resolution data is specifically performed as follows. First, for example, length 1, width m,
A jig (not shown) having a cubic shape whose height h is known in advance is placed on the table 1, and the table 1 is moved so that the projection light 16 from the laser projector 5 strikes the jig. Subsequently, the laser projection light 16 is projected onto the upper surface of the jig, and the reflected light 17 from the jig is received by each of the light receiving elements 9 and 1 by component.
Light is received at 2 and 14. By the above operation, the spot position h ₁ of the random light component, the spot position of the p-wave component h ₂
And the spot position h ₃ of the s wave component are obtained. Based on the measurement results of the light receiving elements 9, 12, and 14 thus obtained and the height h of the jig, the resolutions h / h ₁ , h / h ₂ ,
h / h ₃ is calculated and each resolution data is stored in the memory 21. In this way, the resolution data is input.

Data input regarding the inspection method is specifically performed as follows. First, set an arbitrary position on Table 1 as the reference position and enter the position data,
After that, the projection position of the projection light 16 from the laser projector 5 viewed from the reference position, the position of the substrate position origin 32 set on the table 1, and the position of each solder bump 3 viewed from the position of the substrate position origin 32 are related. Input of each position data is performed. Then, the projection light 1 from the laser projector 5
6 so that the upper surface of the substrate 2 and the upper surface of the solder bump 3 can be scanned by the scanning start position 31 from the substrate position origin 32.
Pitch interval 33, scan width 34, scan interval 35, number of scans 3
Each data regarding 6 is input.

After the teaching data creation process (step 101) is completed, the scanning position P11 which is the scanning start position 31 on the substrate 2 is determined based on the teaching data.
The table 1 is moved so that the projection light 16 is projected to the laser projector 5, and the inclination of the laser projector 5 is changed so that the incident angle of the projection light from the laser projector 5 with respect to the measurement surface becomes the Brewster angle θ _M. (Step 102). The tilt change processing operation of the laser projector 5 and the movement processing operation of the table 1 are controlled by the controller 18.

By moving the table 1, the scanning position P11
The projection light 16 projected to the light is reflected at the scanning position P11, and the reflected light 17 is simultaneously received by the light receiving elements 9, 12, and 14 (step 103). At this time, the light receiving data regarding the spot position and the light intensity is obtained in each of the light receiving elements 9, 12, and 14 (step 104).
The received light data obtained in step 104 is output from the respective amplification operation amplifiers 10, 13, 15 to the control device 18,
After being subjected to analog-digital conversion processing by the CPU 20 in the control device 18, it is stored in the memory 21 (step 105).

After the data is stored in step 105, it is examined whether or not the control device 18 stores the received light data at the scanning position Pnm (step 106). If the received light data at the scanning position Pnm is stored, this processing operation is performed. finish.
On the other hand, if not stored, this processing operation will be continued. Specifically, the polygon mirror 22 is rotated so that the projection light 1 from the laser projector 5 is moved to the scanning position P12.
6 is projected onto the measurement surface so that the incident angle of the projection light 16 becomes the Brewster angle θ _M. Polygon mirror 22
After the rotation, the projection light 16 projected to the scanning position P12 is reflected, and the reflected light 17 is simultaneously received by each of the light receiving elements 9, 12, and 14, and the spot position of each of the light receiving elements 9, 12, 14 is received. And light reception data relating to the light intensity are obtained. The received light data obtained here is used for each amplification operational amplifier 1
It is output from the controller 0, 13, and 15 to the control device 18, is subjected to analog-digital conversion by the CPU 20 in the control device 18, and is then stored in the memory 21 in the control device 18. Less than,
The above operation is similarly repeated up to the scanning position P1m.

After storing the received light data at the scanning position P1m in the memory 21 by the above-described processing operation, the table 1 is moved in the Y direction in FIG. 3 by the scanning interval 35 and the polygon mirror 22 is rotated. The projection light 16 from the laser projector 5 is projected onto the scanning position P2m so that the incident angle of the projection light 16 on the measurement surface becomes the Brewster angle θ _M. After that, similarly to the above-mentioned operation, the scanning position P
The light reception data at 2 m is stored in the memory 21. After storing the received light data at the scanning position P2m, the above operation is repeated to store the received light data up to the scanning position P21 in the memory 21. After storing the received light data at the scanning position P21, the table 1 is moved in the Y direction by the scanning interval 35 and the polygon mirror 22 is rotated, so that the projection light 16 from the laser projector 5 is projected onto the measuring surface at the scanning position P31. On the other hand, the light is projected so that the incident angle of the projection light 16 becomes the Brewster angle θ _M. After that, the received light data at each scanning position is stored in the memory 21 and the previous scanning position P
Repeat until the received light data in nm is measured and stored.

As described above, the scanning from step 102 to step 105 is repeated at each scanning position, and when it is determined in step 106 that the received light data at the scanning position Pnm is stored, each scanning position obtained. The shape of the solder bump 3, which is the object to be measured, is measured using the received light data of (step 107).

<Shape Calculation Operation of Solder Bump> The shape calculation operation of the solder bump 3 based on the above received light data will be specifically described below. In the following description, n ₁
Is set to 1.0 and n _{2 is set} to 2.0, and the calculation of the solder bump having the shape of FIG.
The calculation operation of the shape in the column will be described.
This is performed in the same manner as in the case of the m column.

<Characteristics of Reflected Wave Used in Shape Calculation Operation> First, what characteristics each component of reflected light has for each medium will be described with reference to FIGS. 7 and 8. When the medium is a transparent material, Fresnel's law is established between incident light, reflected light, and refracted light of a light wave between different media. Here, reference numeral 51 in FIG. 7 is incident light of a light wave, reference numeral 52 is refracted light, and reference numeral 53 is reflected light. In the above state, the amplitude reflectances of the s-wave and the p-wave can be obtained from the law of refraction and the Fresnel's law. less than,
1 shows the refraction law, and the s-wave and p-wave amplitude reflectances (equations 2 and 3) obtained by using the equation 1 and Fresnel's law.

[0031]

[Equation 1] Here, n ₁ is the refractive index of air, and n ₂ is the refractive index of the light transmitting material.

[0032]

[Equation 2] Here, r _s is the amplitude reflectance of the s wave.

[0033]

[Equation 3] Here, r _p is the amplitude reflectance of the p wave.

The measurable light intensity propagates in a plane perpendicular to the traveling direction of light, and the intensity reflectances of the s-wave and the p-wave can be derived from the equations 4 and 5.

[0035]

[Equation 4] Here, R _s is the intensity reflectance of the s wave.

[0036]

[Equation 5] Here, R _p is the intensity reflectance of the p-wave.

The characteristics of the reflected light components s-wave and p-wave will be described below based on the above mathematical expressions and the polarization dependence of the intensity reflectances of the equations 4 and 5 shown in FIG.

According to the above formula and the polarization dependence of FIG.
And the s-component wave (s-wave) perpendicular to the incident surface is incident angle θ_i
There is a characteristic that the reflectance increases with the increase of
The parallel p-component wave (p-wave) has an incident angle θ_iAs the
, The reflectance decreases and once becomes zero (θ _iBrewster angle
Degree θ_MAnd then the reflectance will increase.
There is a characteristic. However, metal or opaque material
Light incident on the paint absorbs a few percent of these opaque materials.
However, it is not related to the characteristics based on Fresnel's law.
The p-wave and the s-wave are reflected and diffused.

Here, considering the case of calculating the shape of the solder bump 3 on the substrate 2, when the laser beam 16 is projected onto the solder bump 3 which is an opaque material in the vicinity of the Brewster's angle as described above, the light is emitted on the solder bump 3. The p-wave and the s-wave are received because they are reflected without being transmitted. However, when the laser beam 16 is projected onto the substrate 2 which is a transparent material in the vicinity of the Brewster angle, Fresnel's law is observed on the substrate 2. Since only the s-wave is reflected from, the only s-wave is received. From the above, for the solder bumps 3, the reflected light p
By calculating the shape from the wave component and calculating the shape of the substrate 2 from the reflected light s wave component, the shape of the measurement target can be easily obtained. At the same time, noise from multiple reflections can be eliminated.

<Concrete operation of solder bump shape calculation>
From the above technical idea, the shape of the measuring object can be obtained based on the light intensity data of the scanning position P3m and the light spot position data stored in the memory 21.
A specific operation for calculating the shape of the solder bump will be described below with reference to FIGS. 4 to 6.

<Calculation of Solder Bump Boundary Position (Two-Dimensional Shape Calculation)> First, a two-dimensional shape calculation operation is performed based on the data of FIG. FIG. 4 shows light intensity data at the scanning position P3m in this embodiment. Figure 4 (a)
Is the light intensity f ₁ of the random reflected light, FIG. 4B is the light intensity f ₂ of the p-wave reflected light, and FIG. 4C is the light intensity f of the s-wave reflected light.
₃ , the horizontal axis represents position coordinates in the X direction, and the vertical axis represents light intensity.

Here, when the graph of FIG. 4B is analyzed,
As a characteristic of the reflected light component from the upper surface of the substrate 2 or the upper surface of the solder bump 3, a region Q that is considered to be the upper surface of the solder bump 3 is obtained.
₁ , the light intensity of the p-wave is high, and the other regions Q ₂ and Q ₃
In, the light intensity of the p-wave is hardly detected. On the other hand, in the graph of FIG. 4C, the s wave is detected in the regions Q ₂ ′ and Q ₃ ′ having the same positional relationship. From this, the region Q ₁ is the solder bump 3 and the other regions Q 1
_It can be judged that ₂ and Q ₃ are the substrate 2. Also, FIG.
There is N, which is considered to be noise, in (a). The cause of this noise is considered to be multiple reflection that occurs when the upper surface of the solder bump 3 is measured. That is, it is considered that a part of the laser light projected to the solder bump is reflected toward the substrate, and the reflected light is re-reflected on the substrate, so that the re-reflected light is received as noise on the light receiving side. When each graph is actually compared, such noise N is not confirmed in the graph of FIG.
It is confirmed in the area Q ₁ 'of the graph of (c).

The two-dimensional shape of the solder bump 3 is calculated based on the analysis of each graph data of FIG. 4 as described above. Specifically, from the ratio of the light intensity with the s-wave f ₃ corresponding to the p-wave f ₂ shown in FIG. 4B (see FIG. 4C), the boundary position X _{1 of} the solder bump 3 called an edge, A two-dimensional shape is calculated by obtaining X ₂ .

Here, s used for measuring the two-dimensional shape
A graph showing the light intensity ratio of wave / p wave is shown in FIG. As shown in FIG. 5, the area of the solder bump 3 (X ₁ and X _{2 in the} figure)
In the area) between, the light intensity ratio for intensity of p-wave f ₂ and S-wave f ₃ is comparable is close to 1, in the region of the substrate 2, as compared to the s-wave f ₃ p Since the light intensity of the wave f ₂ becomes very small, the light intensity ratio becomes large. Therefore, in the graph of FIG. 5, the gradient change in the graph at X ₁ and X ₂ becomes large, and the boundary positions X ₁ and X _{2 of} the solder bump 3 are clearly shown. From the above, the solder bump 3 and the substrate 2
The boundary position between and is the two points X ₁ and X ₂ where the graph data starts to drop most, and the average value of the two points = (X ₂ + X ₁ ) / 2 is set as the center point X ₃ of the solder bump ₃ Shape features can be calculated.

As a method for calculating the boundary positions X ₁ and X ₂ , an arbitrary edge threshold value SH is provided for detecting the boundary line between the solder bump 3 and the substrate 2, and the light intensity ratio is determined from this edge threshold value SH. Boundary position X
There is a method of obtaining ₁ and X ₂ .

<Calculation of Solder Bump Height (Three-Dimensional Shape Calculation)> Based on the two-dimensional shape calculation result of the solder bump 3 obtained as described above, the three-dimensional shape of the solder bump 3 is calculated. In the operation of calculating the three-dimensional shape of the solder bump 3, in the waveform of the p wave shown in FIG. 6A, within the diameter range of the solder bump 3 obtained as described above (the area between X ₁ and X ₂ ). The height of the solder bump 3 is obtained using the waveform of. That is, the displacement amount in the Z-axis direction is obtained using the measurement spot position data and the data of the resolution (h / h ₂ ) of the teaching data. As a result, the position with the largest displacement in the Z direction (= vertex (X ₄ , H ₂ )) is obtained. In the measurement of the substrate 2, it is possible to determine that the point that is smaller than the position X _{1 of the} solder bump 3 obtained as described above and larger than X ₂ , that is, the regions Q ₂ ′ and Q ₃ ′ in FIG. 6B are the substrate 2. . Further, the shape data of the thickness H ₁ of the substrate 2 is created by using the measurement spot position data which is the s wave shown in FIG. 6B and the data of the resolution (h / h ₃ ) of the teach data.

As described above, the data of the solder bumps 3 and the data of the substrate 2 are converted into p-wave f ₂ and s-wave f _{3 of the} optical components for each medium.
By analyzing with and combining the obtained analysis results, the shape of the measurement object as shown in FIG. 6C can be calculated with high accuracy.

[0048]

As described above, according to the present invention,
The shape of the solder bump and the shape of the substrate around the solder bump can be promptly obtained without causing a measurement error without contact.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram of a non-contact shape measuring device according to an embodiment of the present invention.

FIG. 2 is a flowchart showing a solder bump shape measuring operation in the non-contact shape measuring apparatus of the present embodiment.

FIG. 3 is a diagram for explaining a method of scanning projected light in the solder bump shape measuring operation of FIG.

FIG. 4 is a graph showing a reflected light intensity in the present embodiment, FIG. 4 (a) is a diagram showing a light intensity f ₁ of random reflected light, and FIG. 4 (b) is a light intensity of p-wave reflected light. is a diagram showing the f _2, FIG. 4 (c) is a diagram showing the light intensity f ₃ of the s-wave reflected light.

FIG. 5 is a graph showing a light intensity ratio of s wave / p wave in the present embodiment.

6A and 6B are graphs respectively showing a spot position of reflected light and a solder bump shape to be measured in the present embodiment, FIG. 6A is a graph showing a spot position of p-wave reflected light, and FIG. FIG. 6C is a graph showing the solder bump shape, which shows the spot position of the s-wave reflected light.

FIG. 7 is a diagram for explaining Fresnel's law.

FIG. 8 is a diagram for explaining polarization dependency of intensity reflectance.

[Explanation of symbols]

1 ... table, 2 ... substrate, 3 ... solder bump, 4 ... measuring unit, 5 ... laser projector, 6 ... scan lens, 7
Deflection mirror, 8 Spectral prism, 9 Light receiving element, 10
Amplification arithmetic amplifier, 11 ... Beam splitter, 12 ... Photodetector, 13 ... Amplification arithmetic amplifier, 14 ... Photodetector, 15
… Amplification operational amplifier, 16… Projected light, 17… Reflected light, 18
... control device, 19 ... monitor, 20 ... CPU, 21 ... memory, 22 ... polygon mirror, 23 ... condensing lens.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Tadashi Takagaki             Hitachi-te, 5-2 Koyodai, Ryugasaki City, Ibaraki Prefecture             Development Laboratory, Kuno Engineering Co., Ltd.             Within (72) Inventor Kazuyoshi Kishida             Hitachi-te, 5-2 Koyodai, Ryugasaki City, Ibaraki Prefecture             Development Laboratory, Kuno Engineering Co., Ltd.             Within F term (reference) 2F065 AA02 AA03 AA04 AA12 AA14                       AA17 AA24 AA30 AA54 BB05                       BB22 BB24 CC01 CC26 DD11                       FF09 FF41 FF49 FF61 FF65                       FF67 GG06 HH04 HH08 HH12                       HH18 JJ02 JJ05 JJ16 LL10                       LL12 LL15 LL31 LL37 LL62                       MM15 NN20 PP05 PP12 QQ03                       QQ04 QQ23 QQ26 QQ28 QQ29                       QQ42 RR10                 5E319 BB04 CD51

Claims (4)

[Claims] 1. Random light projecting means for projecting random light with an incident angle of a projection light from a light source on a measurement target being a predetermined angle, and a measurement target obtained by projecting at this predetermined angle. The reflected light of Random light and the light of the light component parallel to the reflecting surface,
Polarizing means for polarizing light having a light component perpendicular to the reflecting surface, detecting means for respectively detecting the light polarized by the polarizing means, resolution data obtained by measurement in advance, and inspection method-related data. , A shape for calculating the shape of a measurement target using the detection result data obtained by the detection means, and the resolution data and the inspection method data stored in the storage means A non-contact shape measuring device comprising: a calculation processing unit. 2. The non-contact shape measuring device according to claim 1, wherein in the measuring unit, the incident angle of the projection light projected from the random light projecting means onto the measurement object with respect to the measurement surface is the Brewster angle. A non-contact shape measuring device, which can be tilted as described above. 3. The shape of the object to be measured is detected by detecting reflected light from the object to be measured, which is obtained by projecting light from a light source onto the object to be measured having a different refractive index on the upper surface of the substrate or on the substrate. A non-contact shape measuring method to be obtained, wherein the step of projecting random light with the incident angle of the light source as a predetermined angle, and the reflected light from the measuring object obtained by projecting at the predetermined angle are random light. And the light of the light component parallel to the reflecting surface,
The process of polarizing the light having a light component perpendicular to the reflecting surface, the detection result data obtained by detecting each polarized light, the resolution data obtained in advance and the data concerning the inspection method. And a step of calculating the shape of the measuring object using the. 4. The non-contact shape measuring method according to claim 3, wherein a predetermined incident angle of the projection light from the light source onto the object to be measured is Brewster's angle. .