JP2003037154A - Substrate compression bonding jig and apparatus and method for mounting the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate compression bonding jig and an apparatus and a method for mounting the same, for processing glass substrates of different size and shape in a single manufacturing line or with a single substrate retainer during the period of process of the surface of non-magnetic substrates such as a glass substrate by using a substrate compression bonding jig that has a simpler structure and that does not damage the substrate itself. SOLUTION: A substrate compression bonding jig 1 for non-magnetic substrates, comprising a thin plate-shaped flat holder 2 and plural magnetic materials 3 retained independently of each other by retaining sections 2a of the flat holder 2, wherein at least the surface of the magnetic material 3 in contact with the non-magnetic substrate is covered with a heat resistant resin and the magnetic material 3 is retained by the retaining section 2a inserted into a recess 3a, which is formed in the outer surface of the magnetic material 3 and the cross section of which is semicircular.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate crimping jig, a substrate crimping jig attachment device, and a substrate crimping jig attachment method used when processing a non-magnetic substrate such as a glass substrate.

[0002]

2. Description of the Related Art In recent years, display devices such as liquid crystal display devices and plasma displays have been widely used as display devices for office automation equipment such as Japanese word processors and personal computers due to their features of thinness, light weight and low power consumption. Accordingly, the components used in these display devices are also strongly desired to have improved manufacturing technology and productivity. In particular, the display portion of a liquid crystal display device is manufactured through a process of forming a transparent conductive film, a TFT element, wirings for signal lines and scanning lines, a color filter, an alignment film, etc. on the surface of a substrate such as a glass substrate. For this reason, the glass substrate holder used in each step involving heat treatment does not cause warpage or undulation on the glass surface by following expansion and contraction of the glass substrate during heat treatment, and damages the substrate. Need to be held securely. In this way, jigs, devices, etc. for surface-treating non-magnetic substrates such as glass substrates and ceramic substrates are important parts in the field of manufacturing display devices in order to smoothly proceed the work and improve the yield of products. Is becoming.

Conventionally, when treating the surface of a non-magnetic substrate such as a glass substrate, without damaging the surface,
As a substrate crimping jig and a substrate holder capable of holding the substrate itself without damage, a non-magnetic substrate, a ferromagnetic plate arranged on one main surface of the substrate, and a ferromagnetic plate Substrate crimping jig including a magnet embedded in a base body at a position where magnetic lines of force are substantially vertical, and a spring body arranged in a predetermined arrangement with the magnet and having a pressing force in the direction of the other main surface of the base body. Also, a substrate holder using this substrate crimping jig is known (Japanese Patent Laid-Open No. 10-120173).

[0004]

However, as the size of liquid crystal display devices has increased and mobile computers and mobile phones have become widespread, glass substrates of different sizes and shapes are processed by one manufacturing line or one substrate holder. However, the conventional substrate holder using the substrate crimping jig has a problem that it is difficult to frequently replace and attach the substrate crimping jig. Also, ITO
When a transparent conductive film such as tin oxide or tin oxide is formed on a glass substrate by a spray method or the like, the glass substrate must be pressure-bonded and held under a temperature condition of several hundreds of degrees, and the glass substrate becomes even thinner. Then, the conventional substrate crimping jig has a problem that the glass substrate itself is likely to be cracked during the processing work, and the glass substrate cannot be securely fixed and held.

The present invention has been made to solve such a problem, and when treating the surface of a non-magnetic substrate such as a glass substrate, the substrate itself is not damaged by a substrate crimping jig having a simpler structure. An object of the present invention is to provide a substrate crimping jig, a substrate crimping jig attaching device, and a substrate crimping jig attaching method capable of processing glass substrates having different sizes and shapes with one manufacturing line or one substrate holder.

[0006]

A substrate crimping jig according to the present invention comprises a thin plate-shaped holder and a plurality of magnetic bodies held independently by a holding portion of the plate-shaped holder. A substrate pressure bonding jig for a non-magnetic substrate, wherein the magnetic body is
At least the surface in contact with the non-magnetic substrate is covered with a heat resistant resin, and the holding portion of the plate-shaped holder is held in a recess having a semicircular cross section formed on the outer periphery of the magnetic body.

At least the surface of the magnetic material that is in contact with the non-magnetic substrate is covered with a heat-resistant resin, and the holding portion of the thin plate-shaped holder is held in the recess formed in the outer periphery of the magnetic material and having a semi-circular cross section. As a result, the thin plate-shaped holder becomes a spring state, and the plurality of magnetic bodies can be loosely moved without being fixed to each other. Therefore, even if the glass substrate is thinned, it is not cracked or damaged in the process of forming the transparent conductive film or the like.

A substrate crimping jig attaching device according to the present invention is a substrate crimping jig made of a magnetic material having a magnet surface coated with a heat-resistant resin at a predetermined position of a non-magnetic substrate placed on a substrate holder on a gantry. Is used for a substrate holding device that holds the non-magnetic substrate, and the substrate crimping jig attaching device can mount the ferromagnetic substrate holder on a pedestal and the substrate holder in order. An inner door and an upper door are provided, and the upper door is made of a ferromagnetic material and the inner door is made of a non-magnetic material. Further, the middle door and the upper door are hinged to one side of the gantry. In addition,
In the present invention, nonmagnetic means a property that does not exhibit ferromagnetism.

A substrate crimping jig mounting device for mounting a substrate crimping jig at a predetermined position such as a glass substrate placed on a ferromagnetic plate is a substrate holder made of a ferromagnetic material frame, and this substrate holder. With a middle door and an upper door that can be sequentially placed on the top, and in particular by including a non-magnetic middle door and a ferromagnetic upper door hinged to one frame of the substrate holder, The attachment point of the substrate crimping jig can be reversed and moved through the inner door of the non-magnetic material, and the arbitrarily set attachment point of the substrate crimping jig can be maintained to process the next glass substrate. Therefore, even glass substrates of different types can be processed by one substrate holder.

The substrate crimping jig attachment method according to the present invention is a method of attaching a substrate crimping jig made of a magnetic material coated with a heat resistant resin to a predetermined position of a non-magnetic substrate placed on a substrate holder. And (1) the step of placing the untreated non-magnetic substrate on the substrate holder, and (2) the inner door and the upper door on which the substrate crimping jig is reversibly attached at a predetermined position. By stacking the upper door, (3) peeling the upper door from the inner door with the inner door stacked on the untreated non-magnetic substrate, and (4) peeling the inner door from the substrate crimping jig. And a step of attaching an unprocessed non-magnetic substrate onto the substrate holder by the magnetic force of the substrate adsorption jig.

According to the method of the present invention, glass substrates having different sizes and shapes can be processed by one production line or one substrate holder without changing the substrate holder.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A substrate crimping jig according to the present invention is shown in FIG.
Will be described. FIG. 1A is a plan view of a substrate crimping jig,
1B is an AA cross-sectional view, and FIG. 1C is an enlarged cross-sectional view of a B part. The substrate crimping jig 1 is composed of a plurality of magnetic bodies 3 held by a plate holder 2 independently of each other. The plate-shaped holder 2 can be used as long as it has a material and a shape that can hold the magnetic body 3 while processing the glass substrate. In particular, a material whose coefficient of thermal expansion does not differ greatly from that of glass or ceramics is preferable. Examples of such a material include 42 alloy, ferritic stainless steel, and iron alloy. Further, the plate-shaped holder 2 has a thin plate shape, and has a hole 2b having a protrusion 2a formed on the inner peripheral surface thereof. The magnetic body 3 is held by the projection 2a which is held in the concave portion 3a having a semicircular cross section with a gap. In particular, by having a gap, even if the plate-shaped holder 2 expands and contracts, the magnetic body 3 fixed by magnetic force
Will not be displaced with respect to the glass substrate, so that the glass substrate is less likely to be cracked during the processing operation.

A sectional view of the magnetic body 3 is shown in FIG. Magnetic body 3
At least the surface of the permanent magnet 3c in contact with the non-magnetic substrate is covered with the heat resistant resin 3b. In addition, a cover portion 3d for holding the permanent magnet 3c in the heat resistant resin 3b.
Are integrally formed with the heat resistant resin 3b. Cover part 3
d may be a heat resistant resin layer or a metal material having a rust preventive ability. Outer periphery of magnetic body 3, that is, heat resistant resin 3
b or a recess 3 having a semicircular cross section on the outer periphery of the covering portion 3d
a is formed. Heat resistant resin 3b or cover 3
Any shape d can be used as long as it has a built-in permanent magnet 3c and can form a recess 3a on the outer circumference. Further, it is preferable to press fit the heat resistant resins 3b to each other because the number of production steps can be reduced. The material of the permanent magnet 3c can be selected depending on the heat treatment conditions such as the glass substrate. That is, any permanent magnet having a Curie point equal to or higher than the glass substrate processing temperature can be used. For example, an alnico system, a ferrite system, a rare earth-cobalt system, an iron-chromium-cobalt system magnet, etc. can be used.

As the heat resistant resin 3b, a material such as a glass substrate which does not undergo thermal deformation or thermal deterioration at the heat treatment temperature can be selected. Especially when it comes in contact with a glass substrate,
A heat resistant resin material that does not damage the surface is preferable. As the heat resistant resin, there are thermoplastic resins and thermosetting resins. Suitable thermoplastic resins include polyphenylene sulfide (PPS), polyether ether ketone (PEEK), polyhydroxyphenylene ether (P
PO), polyether sulfone (PES), polyether nitrile (PEN), aromatic polyesters such as polyarylate and polyoxybenzoyl, liquid crystal polymers, and polyetherimide. Examples of the thermosetting resin include epoxy resin, polyimide resin, maleimide resin, silicone resin, and phenol resin. These resins may be used alone or in combination, and among these resins, curing agents, catalysts, plasticizers, colorants, flame retardants, fillers, low stress additives, various other additives, etc. Can also be included. Among these, as the heat resistant resin 3b usable in the present invention, polyether ether ketone (PE
A resin composition containing EK) as a main component is particularly preferable because it has high tensile strength and deflection temperature under load, and does not damage the glass surface or the like.

A substrate crimping jig attaching device according to the present invention will be described with reference to FIG. FIG. 3 is a perspective view of the substrate crimping jig attachment device. The substrate crimping jig attachment device 4 includes a non-magnetic substrate 6 such as a glass substrate placed on the substrate holder 5.
Is a device for mounting the substrate crimping jig 1 on the non-treated surface of the glass substrate in order to fix it during the treatment. The substrate crimping jig attachment device 4 includes a pedestal 7 on which the substrate holder 5 can be placed, and an inner door 8 having one side hinged to one frame of the pedestal 7.
And an upper door 9. The upper door 9 and the substrate holder 5 are made of the same material as the plate-shaped holder 2 such as 42 alloy, ferritic stainless steel, and iron alloy.
Is formed of a non-magnetic material. The middle door 8 and the upper door 9 may have any structure that can be sequentially placed on the substrate holder 5.

A magnet 10 is arranged on the upper door 9 along at least the expected mounting position of the substrate crimping jig 1 so that the magnetic force lines are in a direction substantially perpendicular to the upper door 9. Magnet 1
In No. 0, the upper door 9 is preliminarily provided with lattice-shaped arrangement holes, and after being inserted into an arbitrary hole suitable for the mounting shape of the substrate crimping jig 1, it is fixed by a snap retainer or the like. Further, the upper door 9 is provided with a handle 11.

The middle door 8 is interposed between the upper door 9 and the substrate holder 5, and has a function of moving the substrate crimping jig 1 to the substrate holder 5 side or the upper door 9 side. In order to fulfill this function, the attraction force by the magnetic force between the magnet 10 attached to the upper door 9 and the substrate pressure bonding jig 1 which is a ferromagnetic material through the inner door 8 is mediated by the substrate holder 5 and the non-magnetic substrate 6. It is set so as to be larger than the attraction force by the magnetic force with the substrate pressure bonding jig 1. Further, the inner door 8 is attached with an elasticity adjusting member 8a, for example, a plastic material, for adjusting the elasticity so that the substrate pressing jig 1 can be peeled off while being fixed on the non-magnetic substrate 6. Further, the middle door 8 is provided with a handle 11.

Since the gantry 7 has four legs having different lengths, one corner of the gantry 7 is lowered and the upper surface of the gantry 7 is inclined. By utilizing this inclination and the stopper 7a installed on the pedestal 7, the non-magnetic substrate 5 can be accurately placed on a predetermined place.

A board crimping jig mounting method using the board crimping jig mounting apparatus 4 will be described with reference to FIG. FIG. 4A to FIG. 4D are process diagrams for attaching the substrate crimping jig. (1) An unprocessed non-magnetic substrate 6 is placed on the substrate holder 5 (FIG. 4A). At this time, the substrate crimping jig 1 is the inner door 8
It is adsorbed to the side in an inverted state. (2) The inner door 8 and the upper door 9 to which the substrate crimping jig 1 is reversely attached at a predetermined position are overlapped on the untreated non-magnetic substrate 6 at the same time (FIG. 4B). (3) The upper door 9 is peeled off from the inner door 8 with the inner door being overlaid on the untreated non-magnetic substrate 6 (FIG. 4C). By this operation, the substrate crimping jig 1 is released from the magnetic force of the upper door 9. (4) The unprocessed non-magnetic substrate 6 is attached to the substrate holder 1 by the magnetic force of the substrate crimping jig 1 by peeling the inner door 8 from the substrate crimping jig 1 (FIG. 4D).

In this way, the untreated non-magnetic substrate 6 mounted on the substrate holder 5 is subjected to a surface treatment such as a transparent conductive film treatment in the mounted state. The processed non-magnetic substrate 6 is removed from the substrate holder 5 by a process reverse to the attaching process shown below. (5) The processed non-magnetic substrate 6 is mounted on the substrate holder 5 fixed to the pedestal 7. (6) Both the upper door 9 and the middle door 8 are closed, and the magnetic force of the magnet arranged on the upper door 9 attracts the substrate crimping jig 1 to the door side. (7) By lifting both the upper door 9 and the middle door 8 at the same time, the substrate crimping jig 1 can be removed from the non-magnetic substrate 6 while maintaining the attached shape. When the two doors are pulled up, the inner door 8 is slightly curved, so that it can be easily removed from the non-magnetic substrate 6. (8) The processed non-magnetic substrate 6 is removed, and the process returns to (1). By the operations of (1) to (8), the substrate crimping jig 1 can be attached to the same position of the non-magnetic substrate 6 and continuously removed.

The initial placement of the substrate crimping jig 1 is manually mounted on the non-magnetic substrate 6. This operation is first performed only once in a continuous operation for processing non-magnetic substrates of the same shape. After that, the substrate crimping jig 1 can be removed from the non-magnetic substrate 6 while keeping the attached shape by the action of the upper door and the middle door.

[0022]

The substrate crimping jig according to the present invention comprises a thin plate-shaped holder and a plurality of magnetic bodies held independently by the holding portion of the plate-shaped holder. Covers at least the surface in contact with the non-magnetic substrate with a heat-resistant resin, and since the holding part of the plate-shaped holder is held in a concave part with a semi-circular cross section formed on the outer periphery of the magnetic body, it is covered with a heat-resistant resin. The plurality of magnetic bodies formed are not fixed to each other.
As a result, even a thin glass substrate can be held without being cracked or damaged in the process of forming a transparent conductive film or the like.

A substrate crimping jig attaching device according to the present invention comprises a gantry on which a ferromagnetic substrate holder can be placed, and a middle door and an upper door which can be sequentially placed on the substrate holder.
Since the upper door is made of a ferromagnetic material and the inner door is made of a non-magnetic material, the middle door and the upper door are hinged to one side of the pedestal. The mounting position of the substrate crimping jig can be reversed and moved, and the next mounting position of the substrate crimping jig can be maintained and the next glass substrate can be processed. As a result, even glass substrates of different types can be processed with one substrate holder.

The method of attaching a substrate crimping jig according to the present invention comprises (1) a step of placing an unprocessed non-magnetic substrate on a substrate holder, and (2) a substrate crimping jig is reversely attached at a predetermined position. A step of stacking the middle door and the upper door on the untreated non-magnetic substrate; (3) a step of peeling the upper door from the middle door in a state where the middle door is laminated on the untreated non-magnetic substrate, (4) By removing the inner door from the substrate crimping jig, the unprocessed non-magnetic substrate is attached onto the substrate holder by the magnetic force of the substrate adsorption jig, so that the size and size of the substrate holder can be changed without changing the substrate holder. Glass substrates having different shapes can be processed by one manufacturing line or one substrate holder.

[Brief description of drawings]

FIG. 1 is a diagram illustrating a substrate crimping jig.

FIG. 2 is a cross-sectional view of a magnetic body.

FIG. 3 is a perspective view of a substrate crimping jig attachment device.

FIG. 4 is a process drawing of a substrate crimping jig attachment process.

[Explanation of symbols]

1 Substrate crimping jig 2 plate holder 3 magnetic material 4 Substrate crimping jig attachment device 5 Substrate holder 6 Non-magnetic substrate 7 stand 8 middle door 9 Upper door 10 magnets 11, 12 handles

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 5F031 CA05 HA02 HA03 HA10 HA25                       HA28 HA29 HA44 MA21                 5G435 AA17 BB06 BB12 EE33 KK05                       KK10

Claims (4)

[Claims] 1. A substrate pressure bonding jig for a non-magnetic substrate, comprising a thin plate-shaped holder and a plurality of magnetic bodies held independently of each other by a holding portion of the plate-shaped holder, wherein the magnetic body Is characterized in that at least a surface in contact with the non-magnetic substrate is covered with a heat-resistant resin, and a holding portion of the plate-shaped holder is held in a concave portion having a semicircular cross section formed on the outer periphery of the magnetic body. Substrate crimping jig. 2. A non-magnetic substrate is attached to a non-magnetic substrate mounted on a substrate holder on a gantry at a predetermined position with a substrate crimping jig made of a magnetic material whose magnet surface is coated with a heat-resistant resin. A substrate crimping jig attachment device used for a substrate holding device for holding, wherein the substrate crimping jig attachment device can mount a ferromagnetic substrate holder on a pedestal and a substrate holder that can be sequentially placed on the substrate holder. A substrate crimping jig attachment device comprising a door and an upper door, wherein the upper door is made of a ferromagnetic material and the inner door is made of a non-magnetic material. 3. The substrate crimping jig attachment device according to claim 2, wherein the middle door and the upper door are hinged to one side of the gantry. 4. A method for attaching a substrate crimping jig, which attaches a substrate crimping jig made of a magnetic substance having a magnet surface coated with a heat-resistant resin to a predetermined position of a non-magnetic substrate placed on a ferromagnetic substrate holder. And (1) the step of placing the untreated non-magnetic substrate on the substrate holder, and (2) the middle door and the upper door, in which the substrate crimping jig is reversely attached at a predetermined position, to the untreated non-magnetic substrate. A step of stacking on the magnetic substrate, (3) a step of peeling the upper door from the middle door in a state where the middle door is piled on the untreated non-magnetic substrate, and (4) a step of peeling the middle door from the substrate crimping jig. Accordingly, a step of attaching an unprocessed non-magnetic substrate to the substrate holder by the magnetic force of the substrate adsorption jig is provided.