JP4528467B2 - Substrate crimping jig, substrate crimping jig mounting apparatus, and substrate crimping jig mounting method - Google Patents

Substrate crimping jig, substrate crimping jig mounting apparatus, and substrate crimping jig mounting method Download PDF

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JP4528467B2
JP4528467B2 JP2001222836A JP2001222836A JP4528467B2 JP 4528467 B2 JP4528467 B2 JP 4528467B2 JP 2001222836 A JP2001222836 A JP 2001222836A JP 2001222836 A JP2001222836 A JP 2001222836A JP 4528467 B2 JP4528467 B2 JP 4528467B2
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substrate
crimping jig
magnetic
holder
door
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JP2003037154A (en
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徹 菅谷
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桑名エンヂニアリングプラスチック株式会社
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【0001】
【発明の属する技術分野】
本発明は、ガラス基板などの非磁性基板を処理する際に用いられる基板圧着冶具、基板圧着冶具取り付け装置および基板圧着冶具取り付け方法に関する。
【0002】
【従来の技術】
近年、液晶表示装置やプラズマディスプレーなどの表示装置は、薄型軽量、低消費電力という特長のため、日本語ワードプロセッサやパーソナルコンピュータ等のOA機器の表示装置に多用されている。それに伴い、これら表示装置に使用されている部品類も、その製造技術や生産性の向上が強く望まれている。とくに、液晶表示装置の表示部は、ガラス基板などの基板表面に透明導電膜やTFT素子、信号線や走査線の配線類、カラーフィルター、配向膜などの形成工程を経て作製されている。このため、熱処理を伴う各工程において用いられているガラス基板保持具は、熱処理時のガラス基板の膨脹収縮にも追随してガラス表面に反りやうねりを生じさせることなく、かつ基板を破損させることなく確実に保持する必要がある。このように、作業を円滑に進め、製品の歩留まりを向上させる上でガラス基板やセラミック基板などの非磁性基板を表面処理等するための冶具、装置等は、表示装置の製造分野において重要な部品となってきている。
【0003】
従来、ガラス基板などの非磁性基板表面を処理する際に、表面を傷つけたりすることなく、また、基板自身を破損することなく保持することのできる基板圧着治具および基板保持具として、非磁性基体と、この基体の一主面に配設された強磁性板と、この強磁性板に対して磁力線が略垂直方向となる位置であって基体に埋設された磁石と、この磁石と所定の配列で配設され基体の他の主面方向に押圧力を有するばね体とを具備する基板圧着冶具およびこの基板圧着冶具を用いた基板保持具が知られている(特開平10−120173号)。
【0004】
【発明が解決しようとする課題】
しかしながら、液晶表示装置の大型化が進む一方、モバイルコンピュータや携帯電話が普及すると、大きさや形状の異なるガラス基板を一つの製造ラインまたは一つの基板保持具で処理する必要性が出てきたが、従来の基板圧着冶具を用いた基板保持具では、基板圧着冶具を頻繁に交換して取り付けすることが困難であるという問題が生じた。
また、ITOや酸化錫などの透明導電膜をスプレー法などでガラス基板上に形成する場合、数百度の温度条件下においてガラス基板を圧着保持しなければならないことと、ガラス基板のより一層の薄型化が進むと、従来の基板圧着冶具では、処理作業中にガラス基板自体にひび割れが入りやすくなり、ガラス基板を確実に固定保持することができないという問題がある。
【0005】
本発明はこのような問題に対処するためになされたもので、ガラス基板などの非磁性基板表面を処理する際に、より簡易な構造の基板圧着冶具で基板自身を破損することなく、かつ大きさや形状の異なるガラス基板を一つの製造ラインまたは一つの基板保持具で処理できる基板圧着冶具、基板圧着冶具取り付け装置および基板圧着冶具取り付け方法の提供を目的とする。
【0006】
【課題を解決するための手段】
本発明に係る基板圧着治具は、薄板状の板状ホルダーと、この板状ホルダーの保持部に相互に独立して保持された複数の磁性体とからなる非磁性基板の基板圧着冶具であって、上記磁性体は、少なくとも上記非磁性基板に接する面が耐熱性樹脂で被覆され、上記磁性体の外周に断面が半円弧状の凹部が形成され、上記板状ホルダーは、内周面に突起を有する孔部が形成され、上記磁性体は、該磁性体の凹部に隙間を有して上記板状ホルダーの突起にて保持されることを特徴とする。
【0007】
磁性体の少なくとも非磁性基板に接する面が耐熱性樹脂で被覆され、磁性体の外周に形成された断面が半円弧状の凹部に薄板状の板状ホルダーの保持部が保持されることにより、薄板状の板状ホルダーがバネ状態となり、複数個の磁性体が相互に固定されないで緩く移動できる。そのため、薄型化が進んだガラス基板であっても透明導電膜などの形成工程において、ひび割れたり、破損したりしなくなる。
【0008】
本発明に係る基板圧着冶具取り付け装置は、架台上の基板保持具に載置された非磁性基板の所定位置に磁石表面を耐熱性樹脂で被覆された磁性体からなる基板圧着治具を取り付けて、上記非磁性基板を保持する基板保持装置に用いられ、該基板圧着冶具取り付け装置は、強磁性体の基板保持具を載置できる架台と、上記基板保持具上に順に載置できる中扉および上扉とを備え、上扉が強磁性体で、中扉が非磁性体で形成されてなることを特徴とする。
また、中扉および上扉が上記架台の一つの辺に蝶着されてなることを特徴とする。なお、本発明において、非磁性とは強磁性を示さない性質をいう。
【0009】
強磁性板上に載置されたガラス基板などの所定位置に基板圧着治具を取り付けするための基板圧着冶具取り付け装置が、強磁性体枠からなる基板保持具と、この基板保持具上に順に載置できる中扉および上扉とを備え、とくに上記基板保持具の一つの枠に蝶着された非磁性体の中扉および強磁性体の上扉とを備えていることにより、非磁性体の中扉を介して基板圧着治具の取り付け個所を反転移動させることができ、任意に設定した基板圧着治具の取り付け個所を維持して、次のガラス基板の処理ができる。このため、種類が異なるガラス基板であっても一つの基板保持具で処理できる。
【0010】
本発明に係る基板圧着冶具取り付け方法は、基板保持具上に載置された非磁性基板の所定位置に耐熱性樹脂で被覆された磁性体からなる基板圧着治具を取り付ける方法であって、(1)基板保持具上に未処理非磁性基板を載置する工程と、(2)上記耐熱性樹脂で被覆された磁性体面と上記未処理非磁性基板表面とが接触するように、上記基板圧着治具が所定位置に取り付けされている中扉および上扉を上記未処理非磁性基板上に重ねる工程と、(3)中扉を上記未処理非磁性基板上に重ねた状態で上扉を中扉から剥離する工程と、(4)中扉を基板圧着治具から剥離することにより、基板保持具上に未処理非磁性基板を基板吸着冶具の磁力により取り付ける工程とを備えてなることを特徴とする。
【0011】
本発明方法により、基板保持具を変更することなく、大きさや形状の異なるガラス基板を一つの製造ラインまたは一つの基板保持具で処理できる。
【0012】
【発明の実施の形態】
本発明に係る基板圧着冶具を図1により説明する。図1(a)は基板圧着冶具の平面図、図1(b)はA−A断面図、図1(c)はB部拡大断面図である。
基板圧着冶具1は、板状ホルダー2に相互に独立して保持された複数の磁性体3で構成される。
板状ホルダー2は、ガラス基板を処理する間、磁性体3を保持できる材質、形状であれば使用できる。とくに熱膨張係数がガラスやセラミックスと大きく異ならない材料が好ましい。そのような材料としては、42アロイ、フェライト系ステンレス、鉄合金などがある。
また、板状ホルダー2は、薄板状であり、内周面に突起2aを有する孔部2bが形成されている。磁性体3は、断面が半円弧状の凹部3aに隙間を有して保持された突起2aにて保持される。とくに隙間を有することにより、板状ホルダー2が膨張収縮しても、磁力により固定された磁性体3がガラス基板に対してズレを生じることがなくなるので、処理作業中にガラス基板にひび割れが入り難くなる。
【0013】
磁性体3の断面図を図2に示す。磁性体3は、永久磁石3cの少なくとも前記非磁性基板に接する面が耐熱性樹脂3bで被覆されている。また、永久磁石3cを耐熱性樹脂3b内に保持するための覆い部分3dが耐熱性樹脂3bと一体に形成されている。覆い部分3dは耐熱性樹脂層であっても、防錆能を有する金属材であってもよい。磁性体3の外周、すなわち耐熱性樹脂3bまたは覆い部分3dの外周に断面が半円弧状の凹部3aが形成されている。耐熱性樹脂3bまたは覆い部分3dは、永久磁石3cを内蔵し、外周に凹部3aを形成できる形状であれば使用できる。また、耐熱性樹脂3b同士を圧入嵌合することが生産工数を少なくできるので好ましい。
永久磁石3cの材質については、ガラス基板などの熱処理条件等により選択することができる。すなわち、ガラス基板処理温度以上のキュリー点を有する永久磁石であれば使用できる。たとえば、アルニコ系、フェライト系、希土類−コバルト系、鉄−クロム−コバルト系磁石等を使用できる。
【0014】
耐熱性樹脂3bは、ガラス基板などの熱処理温度で熱変形や熱劣化を起こさない材料を選択できる。とくにガラス基板などに接触した場合であっても、その表面を傷つけることのない耐熱性樹脂材料が好ましい。耐熱性樹脂としては、熱可塑性樹脂や熱硬化性樹脂があり、好適な熱可塑性樹脂としては、ポリフェニレンサルファイド(PPS)、ポリエーテルエーテルケトン(PEEK)、ポリヒドロキシフェニレンエーテル(PPO)、ポリエーテルサルホン(PES)、ポリエーテルニトリル(PEN)、ポリアリレートやポリオキシベンゾイルなどの芳香族ポリエステル系類、液晶ポリマー類、ポリエーテルイミド等を挙げることができる。また、熱硬化性樹脂としては、たとえばエポキシ樹脂、ポリイミド樹脂、マレイミド樹脂、シリコーン樹脂、フェノール樹脂等を挙げることができる。これらの樹脂は単独で用いても組み合わせてもよく、またこれらの樹脂の中に硬化剤、触媒、可塑剤、着色剤、難燃化剤、充填材、低応力添加剤、その他各種添加剤等を含有することもできる。これらの中でも、本発明に使用できる耐熱性樹脂3bとしては、ポリエーテルエーテルケトン(PEEK)を主成分とする樹脂組成物が、引っ張り強度と荷重たわみ温度が高く、ガラス表面などを傷つけたりしないのでとくに好ましい。
【0015】
本発明に係る基板圧着冶具取り付け装置を図3により説明する。図3は基板圧着冶具取り付け装置の斜視図である。
基板圧着冶具取り付け装置4は、基板保持具5上に載置されたガラス基板などの非磁性基板6を処理の間中固定するため、基板圧着冶具1をガラス基板の非処理面上に取り付けするための装置である。
基板圧着冶具取り付け装置4は、基板保持具5を載置できる架台7と、架台7の一つの枠に一辺が蝶着された中扉8および上扉9とを備えている。上扉9および基板保持具5は板状ホルダー2と同一の材料である42アロイ、フェライト系ステンレス、鉄合金などで形成され、中扉8は非磁性体で形成される。
なお、中扉8および上扉9とは、基板保持具5上に順に載置できる構造であればよい。
【0016】
上扉9には、磁力線をこの上扉9と略垂直方向となるように磁石10が、基板圧着冶具1の少なくとも取り付け予想配置に沿って配設されている。磁石10は、上扉9全体にあらかじめ格子状に配設孔があけられており、基板圧着冶具1の取り付け形状に合った任意の孔に嵌挿された後スナップリテーナーなどにより固定される。また、上扉9には取っ手11が設けられている。
【0017】
中扉8は、上扉9と基板保持具5との間に介在して、基板圧着冶具1を基板保持具5側または上扉9側に移動させる機能を果たす。この機能を果たすため、上扉9に取り付けられた磁石10と中扉8を介した強磁性体である基板圧着冶具1との磁力による吸着力が、基板保持具5と非磁性基板6を介した基板圧着冶具1との磁力による吸着力よりも大きくなるように設定する。
また、中扉8は、基板圧着冶具1を非磁性基板6上に固定したまま剥離できるように、その弾力性を調整する弾力調整部材8a、例えばプラスチック材を貼り付けている。さらに、中扉8には取っ手11が設けられている。
【0018】
架台7は長さの異なる4本の脚部を有することにより、架台7の1つの角部を低くして架台7上面が傾斜している。この傾斜と、架台7上に設置された止め具7aを利用することにより、非磁性基板5を正確に所定の場所に載置できる。
【0019】
上記基板圧着冶具取り付け装置4を用いた基板圧着冶具取り付け方法について、図4により説明する。図4(a)〜図4(d)は基板圧着冶具取り付け工程図である。
(1)基板保持具5上に未処理の非磁性基板6を載置する(図4(a))。このとき、基板圧着治具1は中扉8側に反転状態で吸着している。
(2)基板圧着治具1が所定位置に反転取り付けされている中扉8および上扉9を未処理の非磁性基板6上に同時に重ねる(図4(b))。
(3)中扉を未処理の非磁性基板6上に重ねた状態で上扉9を中扉8から剥離する(図4(c))。この操作により、基板圧着治具1が上扉9の磁力から解放される。
(4)中扉8を基板圧着治具1から剥離することにより、基板保持具1上に未処理の非磁性基板6を基板圧着治具1の磁力により取り付ける(図4(d))。
【0020】
このようにして、基板保持具5上に取り付けられた未処理非磁性基板6は、取り付けられた状態のまま透明導電膜処理などの表面処理を行なう。
処理後の非磁性基板6は、以下に示す取り付け工程とは逆の工程により、基板保持具5から外される。
(5)処理後の非磁性基板6を架台7に固定された基板保持具5上に取り付ける。
(6)上扉9、中扉8を両方閉じ、上扉9に配設された磁石の磁力により基板圧着治具1を扉側に引き付ける。
(7)上扉9、中扉8の両方を同時に持ち上げることにより取り付けした形状を保ったまま基板圧着治具1を非磁性基板6から取り除くことができる。両扉を引き上げる際に、中扉8が若干湾曲することにより、非磁性基板6からの取り除きが容易になる。
(8)処理した非磁性基板6を取り除き、(1)に戻る。
(1)〜(8)の操作により非磁性基板6の同一位置に基板圧着治具1を取り付け、取り外しを連続的に行なうことができる。
【0021】
なお、基板圧着治具1の最初の配置は、非磁性基板6上に手動等で取り付ける。この操作は同形状の非磁性基板を処理する連続操作において、最初1度行なうのみである。その後は、上扉、中扉の作用により取り付けした形状を保ったまま基板圧着治具1を非磁性基板6から取り除くことができる。
【0022】
【発明の効果】
本発明に係る基板圧着治具は、薄板状の板状ホルダーと、この板状ホルダーの保持部に相互に独立して保持された複数の磁性体とからなり、この磁性体が少なくとも非磁性基板に接する面を耐熱性樹脂で被覆し、磁性体の外周に断面が半円弧状の凹部が形成され、上記板状ホルダーは、内周面に突起を有する孔部が形成され、上記磁性体は、該磁性体の凹部に隙間を有して上記板状ホルダーの突起にて保持されてなるので、耐熱性樹脂で被覆された複数個の磁性体が相互に固定されない。その結果、薄型のガラス基板であっても透明導電膜などの形成工程において、ひび割れたり、破損したりしないで、保持できる。
【0023】
本発明に係る基板圧着冶具取り付け装置は、強磁性体の基板保持具を載置できる架台と、上記基板保持具上に順に載置できる中扉および上扉とを備え、上扉が強磁性体で、中扉が非磁性体で形成されてなるので、とくに中扉および上扉が上記架台の一つの辺に蝶着されてなるので、非磁性体の中扉を介して基板圧着治具の取り付け個所を反転移動させることができ、任意に設定した基板圧着治具の取り付け個所を維持して、次のガラス基板の処理ができる。その結果、種類が異なるガラス基板であっても一つの基板保持具で処理できる。
【0024】
本発明に係る基板圧着冶具取り付け方法は、(1)基板保持具上に未処理非磁性基板を載置する工程と、(2)上記耐熱性樹脂で被覆された磁性体面と上記未処理非磁性基板表面とが接触するように、上記基板圧着治具が所定位置に取り付けされている中扉および上扉を上記未処理非磁性基板上に重ねる工程と、(3)中扉を上記未処理非磁性基板上に重ねた状態で上扉を中扉から剥離する工程と、(4)中扉を基板圧着治具から剥離することにより、基板保持具上に未処理非磁性基板を基板吸着冶具の磁力により取り付ける工程とを備えてなるので、基板保持具を変更することなく、大きさや形状の異なるガラス基板を一つの製造ラインまたは一つの基板保持具で処理できる。
【図面の簡単な説明】
【図1】基板圧着冶具を説明する図である。
【図2】磁性体の断面図である。
【図3】基板圧着冶具取り付け装置の斜視図である。
【図4】基板圧着冶具取り付け工程図である。
【符号の説明】
1 基板圧着冶具
2 板状ホルダー
3 磁性体
4 基板圧着冶具取り付け装置
5 基板保持具
6 非磁性基板
7 架台
8 中扉
9 上扉
10 磁石
11、12 取っ手
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate crimping jig, a substrate crimping jig mounting apparatus, and a substrate crimping jig mounting method used when processing a nonmagnetic substrate such as a glass substrate.
[0002]
[Prior art]
In recent years, display devices such as liquid crystal display devices and plasma displays have been widely used in display devices of office automation equipment such as Japanese word processors and personal computers because of their thin, light weight and low power consumption. Accordingly, it is strongly desired to improve the manufacturing technology and productivity of the parts used in these display devices. In particular, a display portion of a liquid crystal display device is manufactured through a formation process of a transparent conductive film, a TFT element, signal lines and scanning lines, a color filter, an alignment film, and the like on a substrate surface such as a glass substrate. For this reason, the glass substrate holder used in each process involving heat treatment can follow the expansion and contraction of the glass substrate during the heat treatment without causing warping or undulation on the glass surface and damaging the substrate. It is necessary to hold it securely. In this way, jigs, devices, etc. for surface treatment of non-magnetic substrates such as glass substrates and ceramic substrates in order to facilitate work and improve product yield are important parts in the display device manufacturing field. It has become.
[0003]
Conventionally, when processing the surface of a non-magnetic substrate such as a glass substrate, the substrate pressing jig and the substrate holder that can hold the substrate without damaging the surface and without damaging the substrate itself are non-magnetic. A base, a ferromagnetic plate disposed on one main surface of the base, a magnet embedded in the base at a position where the lines of magnetic force are substantially perpendicular to the ferromagnetic plate, and the magnet and a predetermined A substrate crimping jig provided with a spring body arranged in an array and having a pressing force in the direction of another main surface of the substrate and a substrate holder using this substrate crimping jig are known (Japanese Patent Laid-Open No. 10-120173). .
[0004]
[Problems to be solved by the invention]
However, as the size of liquid crystal display devices has increased, mobile computers and mobile phones have become popular. However, it has become necessary to process glass substrates of different sizes and shapes with one production line or one substrate holder. In the substrate holder using the conventional substrate crimping jig, there is a problem that it is difficult to frequently replace and attach the substrate crimping jig.
In addition, when a transparent conductive film such as ITO or tin oxide is formed on a glass substrate by a spray method or the like, the glass substrate must be held under pressure at a temperature of several hundred degrees, and the glass substrate is made thinner. As the process proceeds, the conventional substrate crimping jig tends to crack in the glass substrate itself during the processing operation, and there is a problem that the glass substrate cannot be securely fixed and held.
[0005]
The present invention has been made to cope with such a problem, and when processing the surface of a non-magnetic substrate such as a glass substrate, the substrate itself is not damaged by a substrate crimping jig having a simpler structure and is large. An object of the present invention is to provide a substrate crimping jig, a substrate crimping jig mounting apparatus, and a substrate crimping jig mounting method capable of processing glass substrates having different sheath shapes with one production line or one substrate holder.
[0006]
[Means for Solving the Problems]
A substrate crimping jig according to the present invention is a substrate crimping jig for a non-magnetic substrate comprising a thin plate-shaped holder and a plurality of magnetic bodies held independently of each other by a holding portion of the plate-shaped holder. The magnetic body has at least a surface in contact with the non-magnetic substrate covered with a heat-resistant resin, and a concave portion having a semicircular cross section is formed on the outer periphery of the magnetic body, and the plate-shaped holder is formed on the inner peripheral surface. A hole having a protrusion is formed, and the magnetic body is held by the protrusion of the plate-shaped holder with a gap in the concave portion of the magnetic body .
[0007]
The surface of the magnetic body that is in contact with the non-magnetic substrate is covered with a heat-resistant resin, and the holding portion of the thin plate-like plate-like holder is held in the concave portion having a semicircular arc-shaped cross section formed on the outer periphery of the magnetic body The thin plate-like plate holder is in a spring state, and a plurality of magnetic bodies can move loosely without being fixed to each other. Therefore, even a thin glass substrate is not cracked or damaged in the process of forming a transparent conductive film or the like.
[0008]
The substrate crimping jig attachment device according to the present invention attaches a substrate crimping jig made of a magnetic material having a magnet surface coated with a heat-resistant resin to a predetermined position of a nonmagnetic substrate placed on a substrate holder on a gantry. Used for a substrate holding device for holding the non-magnetic substrate, and the substrate crimping jig mounting device includes a gantry on which a ferromagnetic substrate holder can be placed, an inner door that can be placed in order on the substrate holder, and The upper door is formed of a ferromagnetic material, and the inner door is formed of a non-magnetic material.
The middle door and the upper door are hinged to one side of the gantry. In the present invention, non-magnetic means a property that does not show ferromagnetism.
[0009]
A substrate crimping jig attachment device for attaching a substrate crimping jig to a predetermined position such as a glass substrate placed on a ferromagnetic plate, a substrate holder made of a ferromagnetic frame, and the substrate holder in turn. A non-magnetic material is provided by including a non-magnetic middle door and a ferromagnetic upper door that are hinged to one frame of the substrate holder. The attachment location of the substrate crimping jig can be reversed and moved through the inner door, and the next glass substrate can be processed while maintaining the arbitrarily set location of the substrate crimping jig. For this reason, even if it is a glass substrate from which a kind differs, it can process with one substrate holder.
[0010]
The substrate crimping jig attaching method according to the present invention is a method of attaching a substrate crimping jig made of a magnetic material coated with a heat-resistant resin to a predetermined position of a nonmagnetic substrate placed on a substrate holder, 1) a step of placing the raw non-magnetic substrate on a substrate holder, (2) such that the heat-resistant resin-coated magnetic member surface and the untreated non-magnetic substrate surface are in contact, the substrate bonding A step of superimposing the middle door and the upper door on which the jig is attached at a predetermined position on the untreated non-magnetic substrate; and (3) the middle of the upper door with the middle door being superimposed on the untreated non-magnetic substrate. A step of peeling from the door, and (4) a step of attaching the non-processed non-magnetic substrate onto the substrate holder by the magnetic force of the substrate suction jig by peeling the middle door from the substrate crimping jig. And
[0011]
According to the method of the present invention, glass substrates having different sizes and shapes can be processed with one production line or one substrate holder without changing the substrate holder.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
A substrate crimping jig according to the present invention will be described with reference to FIG. FIG. 1A is a plan view of a substrate crimping jig, FIG. 1B is an AA sectional view, and FIG.
The substrate crimping jig 1 is composed of a plurality of magnetic bodies 3 held by a plate-like holder 2 independently of each other.
The plate-like holder 2 can be used as long as the material and shape can hold the magnetic body 3 while processing the glass substrate. In particular, a material whose thermal expansion coefficient is not significantly different from that of glass or ceramics is preferable. Examples of such materials include 42 alloy, ferritic stainless steel, and iron alloy.
Moreover, the plate-shaped holder 2 is thin plate shape, and the hole part 2b which has the processus | protrusion 2a is formed in the internal peripheral surface. The magnetic body 3 is held by a protrusion 2a that is held with a gap in a recess 3a having a semicircular cross section. In particular, by having a gap, even if the plate-like holder 2 expands and contracts, the magnetic body 3 fixed by the magnetic force is not displaced with respect to the glass substrate, so that the glass substrate is cracked during the processing operation. It becomes difficult.
[0013]
A sectional view of the magnetic body 3 is shown in FIG. In the magnetic body 3, at least the surface of the permanent magnet 3c that contacts the nonmagnetic substrate is covered with a heat resistant resin 3b. Further, a cover portion 3d for holding the permanent magnet 3c in the heat resistant resin 3b is formed integrally with the heat resistant resin 3b. The covering portion 3d may be a heat resistant resin layer or a metal material having a rust prevention ability. A recess 3a having a semicircular cross section is formed on the outer periphery of the magnetic body 3, that is, on the outer periphery of the heat resistant resin 3b or the covering portion 3d. The heat-resistant resin 3b or the cover portion 3d can be used as long as it has a shape in which the permanent magnet 3c is incorporated and the recess 3a can be formed on the outer periphery. In addition, it is preferable to press-fit the heat-resistant resins 3b to each other because production man-hours can be reduced.
About the material of the permanent magnet 3c, it can select according to heat processing conditions, such as a glass substrate. That is, any permanent magnet having a Curie point equal to or higher than the glass substrate processing temperature can be used. For example, alnico, ferrite, rare earth-cobalt, iron-chromium-cobalt magnets, etc. can be used.
[0014]
As the heat-resistant resin 3b, a material that does not undergo thermal deformation or thermal degradation at a heat treatment temperature such as a glass substrate can be selected. In particular, a heat-resistant resin material that does not damage the surface even when it comes into contact with a glass substrate or the like is preferable. Examples of heat-resistant resins include thermoplastic resins and thermosetting resins, and suitable thermoplastic resins include polyphenylene sulfide (PPS), polyether ether ketone (PEEK), polyhydroxyphenylene ether (PPO), and polyether sulfone. Examples include phon (PES), polyether nitrile (PEN), aromatic polyesters such as polyarylate and polyoxybenzoyl, liquid crystal polymers, and polyetherimide. Moreover, as a thermosetting resin, an epoxy resin, a polyimide resin, a maleimide resin, a silicone resin, a phenol resin etc. can be mentioned, for example. These resins may be used alone or in combination, and in these resins, curing agents, catalysts, plasticizers, colorants, flame retardants, fillers, low stress additives, other various additives, etc. Can also be contained. Among these, as the heat resistant resin 3b that can be used in the present invention, the resin composition mainly composed of polyether ether ketone (PEEK) has high tensile strength and deflection temperature under load, and does not damage the glass surface or the like. Particularly preferred.
[0015]
A substrate crimping jig mounting apparatus according to the present invention will be described with reference to FIG. FIG. 3 is a perspective view of the substrate crimping jig mounting apparatus.
The substrate crimping jig attachment device 4 attaches the substrate crimping jig 1 on the non-processed surface of the glass substrate in order to fix the nonmagnetic substrate 6 such as a glass substrate placed on the substrate holder 5 during the processing. It is a device for.
The substrate crimping jig attachment device 4 includes a gantry 7 on which the substrate holder 5 can be placed, and an intermediate door 8 and an upper door 9 that are hinged on one frame of the gantry 7. The upper door 9 and the substrate holder 5 are made of 42 alloy, ferritic stainless steel, iron alloy, etc., which are the same material as the plate-like holder 2, and the middle door 8 is made of a non-magnetic material.
The middle door 8 and the upper door 9 may be any structure that can be placed on the substrate holder 5 in order.
[0016]
A magnet 10 is arranged on the upper door 9 along at least a predicted arrangement of the substrate crimping jig 1 so that the magnetic lines of force are substantially perpendicular to the upper door 9. The magnet 10 has holes arranged in advance in a lattice shape in the entire upper door 9, and is fixed by a snap retainer or the like after being inserted into an arbitrary hole that matches the mounting shape of the substrate crimping jig 1. Further, a handle 11 is provided on the upper door 9.
[0017]
The middle door 8 is interposed between the upper door 9 and the substrate holder 5 and functions to move the substrate crimping jig 1 to the substrate holder 5 side or the upper door 9 side. In order to fulfill this function, the attracting force due to the magnetic force between the magnet 10 attached to the upper door 9 and the substrate crimping jig 1 which is a ferromagnetic body via the middle door 8 is caused to pass through the substrate holder 5 and the nonmagnetic substrate 6. It sets so that it may become larger than the adsorption | suction force by the magnetic force with the board | substrate crimping | compression-bonding jig 1 performed.
Further, the middle door 8 is attached with a resilience adjusting member 8a for adjusting its resilience, for example, a plastic material so that the substrate crimping jig 1 can be peeled while being fixed on the non-magnetic substrate 6. Further, a handle 11 is provided on the inner door 8.
[0018]
Since the gantry 7 has four legs having different lengths, one corner of the gantry 7 is lowered, and the upper surface of the gantry 7 is inclined. By using this inclination and the stopper 7a installed on the gantry 7, the nonmagnetic substrate 5 can be accurately placed at a predetermined place.
[0019]
A substrate crimping jig mounting method using the substrate crimping jig mounting apparatus 4 will be described with reference to FIG. FIG. 4A to FIG. 4D are process diagrams for attaching a substrate crimping jig.
(1) An unprocessed nonmagnetic substrate 6 is placed on the substrate holder 5 (FIG. 4A). At this time, the board | substrate crimping | compression-bonding jig | tool 1 is adsorb | sucking in the reverse state at the inner door 8 side.
(2) The middle door 8 and the upper door 9 on which the substrate crimping jig 1 is reversely attached at a predetermined position are simultaneously stacked on the non-processed nonmagnetic substrate 6 (FIG. 4B).
(3) The upper door 9 is peeled from the middle door 8 in a state where the middle door is overlapped on the non-processed nonmagnetic substrate 6 (FIG. 4C). By this operation, the substrate crimping jig 1 is released from the magnetic force of the upper door 9.
(4) By peeling the middle door 8 from the substrate crimping jig 1, an unprocessed non-magnetic substrate 6 is mounted on the substrate holder 1 by the magnetic force of the substrate crimping jig 1 (FIG. 4D).
[0020]
In this way, the untreated nonmagnetic substrate 6 attached on the substrate holder 5 is subjected to a surface treatment such as a transparent conductive film treatment while being attached.
The processed nonmagnetic substrate 6 is removed from the substrate holder 5 by a process reverse to the attaching process shown below.
(5) The processed nonmagnetic substrate 6 is mounted on the substrate holder 5 fixed to the gantry 7.
(6) Both the upper door 9 and the middle door 8 are closed, and the substrate crimping jig 1 is attracted to the door side by the magnetic force of the magnet disposed on the upper door 9.
(7) The substrate crimping jig 1 can be removed from the non-magnetic substrate 6 while maintaining the attached shape by lifting both the upper door 9 and the middle door 8 simultaneously. When pulling up both doors, the middle door 8 is slightly curved, so that it can be easily removed from the nonmagnetic substrate 6.
(8) The processed nonmagnetic substrate 6 is removed, and the process returns to (1).
By the operations (1) to (8), the substrate crimping jig 1 can be attached to the same position of the nonmagnetic substrate 6 and removed continuously.
[0021]
The initial arrangement of the substrate crimping jig 1 is manually mounted on the nonmagnetic substrate 6. This operation is only performed once in a continuous operation for processing a nonmagnetic substrate having the same shape. Thereafter, the substrate crimping jig 1 can be removed from the non-magnetic substrate 6 while maintaining the attached shape by the action of the upper door and the middle door.
[0022]
【The invention's effect】
A substrate crimping jig according to the present invention includes a thin plate-shaped holder and a plurality of magnetic bodies held independently of each other by a holding portion of the plate-shaped holder, and the magnetic body is at least a non-magnetic substrate. The surface in contact with is coated with a heat-resistant resin, and a concave portion having a semicircular cross section is formed on the outer periphery of the magnetic body . The plate-shaped holder has a hole having a protrusion on the inner peripheral surface. The plurality of magnetic bodies coated with the heat-resistant resin are not fixed to each other because the recesses of the magnetic body have gaps and are held by the protrusions of the plate holder . As a result, even a thin glass substrate can be held without being cracked or damaged in the process of forming a transparent conductive film or the like.
[0023]
A substrate crimping jig mounting apparatus according to the present invention includes a gantry on which a ferromagnetic substrate holder can be placed, an intermediate door and an upper door that can be placed on the substrate holder in order, and the upper door is made of a ferromagnetic material. Since the inner door is made of a non-magnetic material, the inner door and the upper door are hinged to one side of the frame, so that the substrate crimping jig can be connected via the non-magnetic inner door. The attachment location can be reversed and the next glass substrate can be processed while maintaining the arbitrarily set location of the substrate crimping jig. As a result, different types of glass substrates can be processed with a single substrate holder.
[0024]
The substrate crimping jig mounting method according to the present invention includes (1) a step of placing an untreated nonmagnetic substrate on a substrate holder, (2) a magnetic surface coated with the heat resistant resin, and the untreated nonmagnetic material. A step of stacking the middle door and the upper door on which the substrate crimping jig is attached at a predetermined position so as to come into contact with the substrate surface on the untreated nonmagnetic substrate; A step of peeling the upper door from the middle door while being stacked on the magnetic substrate; and (4) peeling the middle door from the substrate crimping jig to place the untreated non-magnetic substrate on the substrate holder. And the step of attaching by magnetic force, glass substrates having different sizes and shapes can be processed with one production line or one substrate holder without changing the substrate holder.
[Brief description of the drawings]
FIG. 1 is a diagram illustrating a substrate crimping jig.
FIG. 2 is a cross-sectional view of a magnetic body.
FIG. 3 is a perspective view of a substrate crimping jig attaching device.
FIG. 4 is a process diagram for attaching a substrate crimping jig.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Board | substrate crimping jig 2 Plate-shaped holder 3 Magnetic body 4 Board | substrate crimping jig mounting apparatus 5 Board | substrate holder 6 Nonmagnetic board | substrate 7 Base 8 Middle door 9 Upper door 10 Magnet 11, 12 Handle

Claims (4)

薄板状の板状ホルダーと、この板状ホルダーの保持部に相互に独立して保持された複数の磁性体とからなる非磁性基板の基板圧着冶具であって、
前記磁性体は、少なくとも前記非磁性基板に接する面が耐熱性樹脂で被覆され、前記磁性体の外周に断面が半円弧状の凹部が形成され、
前記板状ホルダーは、内周面に突起を有する孔部が形成され、
前記磁性体は、該磁性体の凹部に隙間を有して前記板状ホルダーの突起にて保持されることを特徴とする基板圧着冶具。
A substrate crimping jig for a non-magnetic substrate comprising a thin plate-shaped holder and a plurality of magnetic bodies held independently of each other by a holding portion of the plate-shaped holder,
The magnetic body has at least a surface in contact with the non-magnetic substrate covered with a heat-resistant resin, and a concave portion having a semicircular cross section is formed on the outer periphery of the magnetic body .
The plate-like holder is formed with a hole having a protrusion on the inner peripheral surface,
The magnetic material substrate crimping jig, characterized in that a gap in a recess of the magnetic body is held by the protrusion of the plate-like holder.
架台上の基板保持具に載置された非磁性基板の所定位置に磁石表面を耐熱性樹脂で被覆された磁性体からなる基板圧着治具を取り付けて、前記非磁性基板を保持する基板保持装置に用いられる基板圧着冶具取り付け装置であって、
該基板圧着冶具取り付け装置は、強磁性体の基板保持具を載置できる架台と、前記基板保持具上に順に載置できる中扉および上扉とを備え、前記上扉が強磁性体で、前記中扉が非磁性体で形成されてなることを特徴とする基板圧着冶具取り付け装置。
A substrate holding apparatus for holding a nonmagnetic substrate by attaching a substrate crimping jig made of a magnetic material having a magnet surface coated with a heat-resistant resin at a predetermined position of a nonmagnetic substrate placed on a substrate holder on a gantry. A substrate crimping jig mounting device used for
The substrate crimping jig mounting apparatus includes a gantry on which a ferromagnetic substrate holder can be placed, an intermediate door and an upper door that can be placed in order on the substrate holder, and the upper door is made of a ferromagnetic material. A substrate crimping jig attaching device, wherein the inner door is formed of a non-magnetic material.
前記中扉および上扉が前記架台の一つの辺に蝶着されてなることを特徴とする請求項2記載の基板圧着冶具取り付け装置。  3. The substrate crimping jig mounting device according to claim 2, wherein the middle door and the upper door are hinged to one side of the frame. 強磁性体の基板保持具上に載置された非磁性基板の所定位置に磁石表面を耐熱性樹脂で被覆された磁性体からなる請求項1記載の基板圧着治具を取り付ける基板圧着冶具取り付け方法であって、
(1)基板保持具上に未処理非磁性基板を載置する工程と、
(2)前記耐熱性樹脂で被覆された磁性体面と前記未処理非磁性基板表面とが接触するように、前記基板圧着治具が所定位置に取り付けされている中扉および上扉を前記未処理非磁性基板上に重ねる工程と、
(3)中扉を前記未処理非磁性基板上に重ねた状態で上扉を中扉から剥離する工程と、
(4)中扉を基板圧着治具から剥離することにより、基板保持具上に未処理非磁性基板を基板吸着冶具の磁力により取り付ける工程と、を備えてなることを特徴とする基板圧着冶具取り付け方法。
2. A substrate crimping jig mounting method for mounting a substrate crimping jig according to claim 1, comprising a magnetic body having a magnet surface coated with a heat-resistant resin at a predetermined position of a nonmagnetic substrate placed on a ferromagnetic substrate holder. Because
(1) placing an untreated nonmagnetic substrate on a substrate holder;
(2) The untreated middle door and the upper door on which the substrate crimping jig is attached at a predetermined position so that the surface of the magnetic material coated with the heat resistant resin and the surface of the untreated nonmagnetic substrate are in contact with each other. A process of stacking on a non-magnetic substrate;
(3) peeling the upper door from the middle door in a state where the middle door is overlaid on the untreated non-magnetic substrate;
(4) attaching the unprocessed nonmagnetic substrate onto the substrate holder by peeling the inner door from the substrate crimping jig by the magnetic force of the substrate adsorption jig, and mounting the substrate crimping jig Method.
JP2001222836A 2001-07-24 2001-07-24 Substrate crimping jig, substrate crimping jig mounting apparatus, and substrate crimping jig mounting method Expired - Fee Related JP4528467B2 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6165783A (en) * 1984-09-07 1986-04-04 富士電機株式会社 Flexible substrate support jig
JPH10120173A (en) * 1996-08-27 1998-05-12 Kuwana Eng Plast Kk Substrate press fitting jig and substrate holder
JP2000183593A (en) * 1998-12-16 2000-06-30 Optrex Corp Carrier for flexible circuit board, and soldering method and apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6165783A (en) * 1984-09-07 1986-04-04 富士電機株式会社 Flexible substrate support jig
JPH10120173A (en) * 1996-08-27 1998-05-12 Kuwana Eng Plast Kk Substrate press fitting jig and substrate holder
JP2000183593A (en) * 1998-12-16 2000-06-30 Optrex Corp Carrier for flexible circuit board, and soldering method and apparatus

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