JP5841739B2 - Magnetic sheet transfer system, carrier and magnetic sheet transfer method - Google Patents

Description

  The present invention relates to a magnetic sheet transfer system, a carrier for supporting a magnetic sheet, and a magnetic sheet transfer method.

  Conventionally, a silicon substrate, a glass substrate, a metal substrate, an insulator substrate, and the like are known as substrates on which a thin film is formed by vacuum processing, but a magnetic substrate may also be employed. For example, Patent Document 1 describes a film forming apparatus that can hold and fix a substrate with a magnet during vacuum processing of a magnetic substrate fitted in a tray.

  When vacuum processing such as film formation is performed on a substrate using a vacuum processing apparatus, an unprocessed substrate is typically transferred from an atmospheric chamber to a processing chamber and subjected to a predetermined vacuum processing, and the processed substrate is It is again transported to the atmosphere chamber and transferred to a cassette or the like. Depending on the characteristics of the substrate, as in Patent Document 1, a series of steps may be performed while being supported by a tray or the like in order to maintain the form.

JP 9-324273 A

  In a vacuum processing method in which a substrate is held on a tray by the magnetic force of a magnet, it is often difficult to smoothly transfer the substrate from the tray to a cassette or the like due to the influence of the magnetic force. In particular, when the substrate is in the form of a sheet or film, the substrate may be wrinkled or deformed during transfer, or the substrate may fall out of the tray or cassette.

  In view of the circumstances as described above, an object of the present invention is to provide a magnetic sheet transfer system capable of smoothly transferring a magnetic sheet, a carrier for supporting the magnetic sheet, and a magnetic sheet transfer method. There is.

In order to achieve the above object, a magnetic sheet transfer system according to an embodiment of the present invention includes a carrier and a moving mechanism.
The carrier includes a first nonmagnetic substrate, a second nonmagnetic substrate, and a magnet. The first non-magnetic substrate has a first surface capable of supporting the magnetic sheet, and a second surface opposite to the first surface. The second nonmagnetic substrate has a third surface facing the second surface, and a fourth surface opposite to the third surface. The magnet is fixed to the second nonmagnetic substrate and forms a magnetic field on the first surface.
The moving mechanism includes a support capable of supporting the first nonmagnetic substrate and a driving unit. The driving unit includes a first support position where the first nonmagnetic substrate is close to the second nonmagnetic substrate, and a second position where the first nonmagnetic substrate is separated from the second nonmagnetic substrate. The support is moved between the support positions.

A carrier according to an embodiment of the present invention is a carrier for supporting a magnetic sheet, and includes a first nonmagnetic substrate, a second nonmagnetic substrate, and a magnet.
The first nonmagnetic substrate has a first surface capable of supporting the magnetic sheet, and a second surface opposite to the first surface.
The second non-magnetic substrate faces the second surface.
The magnet is fixed to the second nonmagnetic substrate and forms a magnetic field on the first surface.

A magnetic sheet transfer method according to an aspect of the present invention includes a first nonmagnetic substrate, a second nonmagnetic substrate facing the first nonmagnetic substrate, and a fixing to the second nonmagnetic substrate This is a method for transferring a magnetic sheet using a carrier having a magnet formed thereon.
The magnetic sheet is held on the surface of the first nonmagnetic substrate by the magnetic force of the magnet.
The magnetic sheet on the carrier is vacuum processed in a vacuum processing chamber.
The first nonmagnetic substrate is separated from the second nonmagnetic substrate.
The magnetic sheet is transferred together with the first nonmagnetic layer onto a mounting table disposed between the first nonmagnetic substrate and the second nonmagnetic substrate.

It is a schematic block diagram of the vacuum processing apparatus provided with the transfer system which concerns on one Embodiment of this invention. It is a schematic plan view which shows the carrier which concerns on one Embodiment of this invention. It is a schematic sectional drawing of the [A]-[A] direction in FIG. It is a perspective view which shows the structure of the moving mechanism of this invention. It is the schematic sectional drawing which showed the aspect of the carrier and lifter pin at the time of transfer of a magnetic sheet, (A) shows the aspect in a 1st support position, (B) is in the 2nd support position. An aspect is shown. It is the schematic which showed the relationship between the transfer system at the time of transferring a magnetic sheet to a wafer cassette, and a wafer cassette, (A) shows the aspect by which a magnetic sheet and a 1st board | substrate are supported by the lifter pin. (B) shows a mode in which the magnetic sheet and the first substrate are accommodated in the wafer cassette. It is a schematic sectional drawing which shows the carrier which concerns on one Embodiment of this invention.

A magnetic sheet transfer system according to an embodiment of the present invention includes a carrier and a moving mechanism.
The carrier includes a first nonmagnetic substrate, a second nonmagnetic substrate, and a magnet. The first non-magnetic substrate has a first surface capable of supporting the magnetic sheet, and a second surface opposite to the first surface. The second nonmagnetic substrate has a third surface facing the second surface, and a fourth surface opposite to the third surface. The magnet is fixed to the second nonmagnetic substrate and forms a magnetic field on the first surface.
The moving mechanism includes a support capable of supporting the first nonmagnetic substrate and a driving unit. The driving unit includes a first support position where the first nonmagnetic substrate is close to the second nonmagnetic substrate, and a second position where the first nonmagnetic substrate is separated from the second nonmagnetic substrate. The support is moved between the support positions.

  In the transfer system, the first nonmagnetic substrate can be moved between the first support position and the second support position by a moving mechanism. In the first support position, the magnetic sheet is held by the magnetic field of the magnet formed on the first surface. Thus, for example, when the substrate is transported in a vacuum chamber, the magnetic sheet is attracted and fixed onto the first surface, and the shape can be maintained. Further, for example, when a vertical film forming apparatus or the like is employed in the processing chamber, the magnetic sheet can be held and the shape thereof can be maintained even if the carrier is set up vertically.

  On the other hand, in the second support position, the magnetic sheet and the first nonmagnetic substrate are separated from the magnet and the second nonmagnetic substrate. Since the magnetic field of the magnet formed on the first surface at the second support position is lower than that at the first support position, the magnetic sheet is placed between the transfer system and a platform such as a cassette. Easy to transfer. Moreover, even if the holding force by magnetic force falls in the 2nd support position, since the magnetic sheet is supported by the 1st surface on a 1st nonmagnetic board | substrate, the change of the shape is suppressed.

  In the transfer system, the magnet may be fixed to a third surface of the second nonmagnetic substrate. The magnet may be fixed to a fourth surface opposite to the third surface.

  The second nonmagnetic substrate may have a plurality of through holes, and the support may have a plurality of shaft members disposed corresponding to the plurality of through holes. In this case, the drive unit raises and lowers each of the plurality of shaft members in the axial direction.

  The magnet may be a permanent magnet or an electromagnet. The magnet may be composed of a plurality of permanent magnet pieces or a single magnet. The permanent magnet material is not particularly limited, and is composed of, for example, a samarium cobalt magnet or a neodymium magnet. By using a magnet made of such a material, the magnetic sheet can be held with a sufficient magnetic force, but in particular for samarium-cobalt magnets, there is little decrease in magnetic force even at high temperatures during vacuum processing, and the magnetic sheet can be held stably. can do. Furthermore, by using a plurality of magnets, the form stability of the magnetic sheet can be improved.

A carrier according to an embodiment of the present invention is a carrier for supporting a magnetic sheet, and includes a first nonmagnetic substrate, a second nonmagnetic substrate, and a magnet.
The first nonmagnetic substrate has a first surface capable of supporting the magnetic sheet, and a second surface opposite to the first surface.
The second non-magnetic substrate faces the second surface.
The magnet is fixed to the second nonmagnetic substrate and forms a magnetic field on the first surface.

A transfer method according to an embodiment of the present invention is fixed to a first nonmagnetic substrate, a second nonmagnetic substrate facing the first nonmagnetic substrate, and the second nonmagnetic substrate. It is the transfer method of the magnetic sheet using the carrier which has a magnet.
The magnetic sheet is held on the surface of the first nonmagnetic substrate by the magnetic force of the magnet.
The magnetic sheet on the carrier is vacuum processed in a vacuum processing chamber.
The first nonmagnetic substrate is separated from the second nonmagnetic substrate.
The magnetic sheet is transferred together with the first nonmagnetic layer onto a mounting table disposed between the first nonmagnetic substrate and the second nonmagnetic substrate.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[Configuration of vacuum processing equipment]
FIG. 1 is a schematic configuration diagram of a vacuum processing apparatus 1 including a transfer system according to the present embodiment. In the present embodiment, it is assumed that the vacuum processing apparatus 1 is a multi-chamber vacuum processing apparatus. Here, the configuration of the vacuum processing apparatus 1 will be described assuming that a general substrate is subjected to vacuum processing.

  The vacuum processing apparatus 1 includes a transfer chamber 6, load lock chambers 2 </ b> A and 2 </ b> B, processing chambers 3 </ b> A and 3 </ b> B, and a core chamber (transfer chamber) 4. The load lock chambers 2A and 2B, the processing chambers 3A and 3B, and the core chamber 4 are connected to an exhaust system (not shown) to constitute a vacuum chamber that can be evacuated.

  The transfer chamber 6 is at atmospheric pressure, and a wafer cassette 7 and a substrate transfer robot 6a are installed therein. The substrate transfer robot 6a has a moving mechanism 20 which will be described later, and by this moving mechanism, unprocessed or processed substrates can be transferred between the substrate transfer robot 6a and the wafer cassette 7. Further, the substrate transfer robot 6a transfers unprocessed or processed substrates between the load lock chambers 2A and 2B and the wafer cassette 7. The transfer chamber 6 communicates with the load lock chambers 2A and 2B through doors 5A and 5B.

  The load lock chambers 2A and 2B have the same configuration, and a stocker capable of accommodating a predetermined number of substrates is installed therein. The load lock chambers 2 </ b> A and 2 </ b> B are not limited to being installed in a plural number as in the illustrated example, but may be a single one.

  The processing chambers 3A and 3B perform predetermined vacuum processing on the substrate, and are composed of an etching chamber, a heating chamber, a film forming chamber (sputtering chamber, CVD chamber), and the like. It is a room. In the processing chambers 3A and 3B, a platen mechanism (not shown) for supporting the substrate during vacuum processing is installed, and a cathode (not shown) capable of supplying high frequency power is provided around the mechanism. Although not shown, each processing chamber 3A, 3B is connected to a gas source of a predetermined film forming gas (reaction gas, source gas, inert gas, etc.) corresponding to the process.

  In the core chamber 4, the substrate is transferred between the load lock chambers 2A and 2B and the processing chambers 3A and 3B. Although not shown, the core chamber 4 has a substrate transfer robot inside, and the substrate is placed between the load lock chambers 2A and 2B and the processing chambers 3A and 3B, or between the processing chamber 3A and the processing chamber 3B. It is comprised so that delivery may be performed.

  When the substrate is vacuum processed using the vacuum processing apparatus 1, the substrate is first transferred from the wafer cassette 7 to the moving mechanism 20 (substrate transfer robot 6a) in the transfer chamber 6, and is load-locked by the substrate transfer robot 6a. It is conveyed to the chambers 2A and 2B. Further, the substrate is transferred to the processing chambers 3A and 3B by the substrate transfer robot in the core chamber 4, and predetermined vacuum processing is performed. The substrate after the vacuum processing is transferred to the transfer chamber 6 through a process reverse to that before the processing, and transferred to the wafer cassette 7 by the moving mechanism 20.

  Driving of the vacuum exhaust system and the substrate transport system in the vacuum processing apparatus 1, opening and closing of the door valve, driving of the substrate transport robot 6a (the moving mechanism 20) in the transfer chamber 6 are controlled by a controller (not shown).

  The vacuum processing apparatus 1 configured as described above employs the transfer system according to the present invention in the transfer chamber 6. The transfer system includes a carrier 10 and a moving mechanism 20. Hereinafter, the configurations of the carrier 10 and the moving mechanism 20 will be described.

[Composition of career]
FIG. 2 is a schematic plan view showing the carrier 10 of the magnetic sheet according to one embodiment of the present invention, and FIG. 3 is a schematic cross-sectional view in the [A]-[A] direction in FIG. The carrier 10 includes a first substrate (first nonmagnetic substrate) 11, a second substrate (second nonmagnetic substrate) 12, and a magnet 13.

  The first substrate 11 is placed on the second substrate 12. The first substrate 11 is a glass substrate, for example, and has a first surface 11a capable of supporting the magnetic sheet M and a second surface 11b on the opposite side. The material constituting the first substrate 11 may be nonmagnetic and may be a conductor or an insulator. The thickness of the first substrate 11 is formed with a uniform thickness that can hold the magnetic sheet M on the first surface 11a by the magnetic force of the magnet 13 while being placed on the second substrate 12. For example, it has a thickness of 0.3 mm or more and 1.2 mm or less. The size of the first surface 11a is not particularly limited, and is larger than the magnetic sheet M in this embodiment.

  The second substrate 12 has a third surface 12a facing the second surface 11b of the first substrate 11 and a fourth surface 12b opposite to the third surface 12a. The material constituting the second substrate 12 is, for example, a glass substrate, but may be nonmagnetic and may be a conductor or an insulator. The second substrate 12 is formed with a substantially uniform thickness. The size of the second glass substrate 12 is not particularly limited, but in the present embodiment, the second glass substrate 12 is formed to have almost the same size as the first substrate 11.

  Further, the second substrate 12 has a plurality of through holes 210a corresponding to a plurality of lifter pins 210 described later. The through holes 210a are configured to be able to pass through the lifter pins 210, respectively.

  The magnet 13 is composed of a plurality of permanent magnet pieces that form a magnetic field on the first surface 11 a via the first substrate 11. In the present embodiment, each magnet 13 is fixed to the third surface 12 a of the second substrate 12. The arrangement of the magnet 13 is set so that the shape of the magnetic sheet M can be maintained in consideration of the shape of the magnetic sheet M, the magnetic characteristics and shape of the magnet 13, the distance from the magnetic sheet M, and the like. For example, when the magnetic sheet M is rectangular as shown in FIG. 2, it is disposed on the second surface 12a corresponding to, for example, the four corners and the central portion. Moreover, each magnet 13 is arrange | positioned in the position where the through-hole 210a is not formed.

  For example, an adhesive is used to fix the magnet 13 on the third surface 12a. As this type of adhesive, even if the first substrate 11 and the second substrate 12 are separated with a magnetic force acting between the magnetic sheet M, the magnet 13 remains on the third surface 12a. Adhesives that do not peel off from the substrate and whose adhesiveness does not deteriorate due to temperature and pressure during vacuum processing are used. As such an adhesive, a heat-resistant inorganic adhesive can be used, and more specifically, for example, “Aron Ceramic” (trade name) manufactured by Toagosei Co., Ltd. can be mentioned.

  Further, the shape of the magnet 13 is not particularly limited as long as the magnetic sheet M can be held with the first substrate 11 interposed therebetween, and it is a single plate shape or a sheet shape that covers the entire third surface 12a regardless of a square shape or a round shape. But it may be. In this case, a plate-like or sheet-like magnet is perforated at a portion corresponding to the through hole 210a so as not to block the through hole 210a.

  If the material which comprises the magnet 13 has the magnetic force which can hold | maintain the magnetic sheet M to the 1st surface 11a on both sides of the 1st board | substrate 11, and magnetism does not fall with the temperature and pressure at the time of vacuum processing Often, such materials include permanent magnets such as samarium cobalt magnets and neodymium magnets.

  A samarium-cobalt magnet is one of rare earth magnets and is known as a powerful permanent magnet. Further, since the Curie point is high, the magnetic force can be sufficiently maintained even at high temperatures (150 ° C. to 300 ° C.) during vacuum processing. For this reason, by using the magnet 13 composed of the samarium-cobalt-based magnet piece, the magnet 13 is hardly denatured and the magnetic force is reduced even after a series of steps related to vacuum processing, and the holding force for the magnetic sheet M is stably maintained. can do.

  On the other hand, neodymium magnets are also rare earth magnets, and are known as very strong permanent magnets. For example, a neodymium-based magnet piece can be used as the magnet 13 when a processing step under high temperature is not included in the vacuum processing apparatus 1. Other permanent magnet pieces can also be used as the magnet 13 if the magnetic sheet M can be stably held in view of the magnetism and processing conditions in the vacuum processing apparatus 1.

  The magnetic sheet M is composed of a sheet or foil formed of a ferromagnetic material having a soft magnetic property that is magnetized by an external magnetic field. Further, the magnetic sheet M may be a composite sheet in which the ferromagnetic layer is formed on the surface of a plastic film or paper. The ferromagnetic material is not particularly limited and typically includes Fe, Co, Ni, and the like, but other than this, an alloy material such as Fe—Al-based or Fe—Ni-based may be used.

[Configuration of moving mechanism]
FIG. 4 is a perspective view showing the configuration of the moving mechanism 20 according to the present embodiment. The moving mechanism 20 includes a plurality of lifter pins (shaft members) 210 as a support and a drive unit 22.

  The lifter pin 210 and the drive unit 22 are provided in the hand 211. The hand 211 is attached to the tip of the articulated arm of the substrate transfer robot 6a, and the upper surface of the hand 211 constitutes a stage surface 211a on which the carrier 10 can be placed.

  Each lifter pin 210 is arranged perpendicular to the stage surface 211 a of the hand 211, and is configured to be lifted and lowered in the axial direction of the lifter pin 210 by the drive unit 22. The lifter pin 210 is retracted inside the hand 211 except when the magnetic sheet M is transferred, and is configured to protrude upward from the stage surface 211a during transfer. The number and arrangement of the lifter pins 210 are not particularly limited as long as the first substrate 11 can be supported as will be described later.

  The drive unit 22 is installed in the hand 211 and lifts and lowers the plurality of lifter pins 210 simultaneously in the axial direction. The drive unit 22 is typically an air cylinder or a stepping motor, but is not particularly limited as long as the lifter pin 210 can be raised and lowered. The driving of the driving unit 22 is controlled by the controller.

  Next, a method for transferring the magnetic sheet M using the transfer system according to the present embodiment will be described with reference to the drawings.

[Method of transferring magnetic sheet]
FIG. 5 is a schematic cross-sectional view showing aspects of the carrier 10 and the lifter pin 210 when the magnetic sheet is transferred. (A) shows the mode at the first support position where the first substrate 11 and the second substrate 12 are close to each other, and (B) shows the first substrate 11 and the second substrate 12. Shows a mode at a second support position spaced apart from each other. The hand 211 is not shown.

  When the magnetic sheet M is vacuum processed by the vacuum processing apparatus 1, the carrier 10 is always in the mode shown in FIG. 5A during the processes in the load lock chambers 2 A and 2 B, the processing chambers 3 A and 3 B, and the core chamber 4. The magnetic sheet M is held by the magnetic force of the magnet 13 on the first surface 11 a of the carrier 10. That is, the magnetic sheet M is conveyed to the processing chambers 3A and 3B integrally with the carrier 10, and predetermined vacuum processing such as film formation is performed in the processing chambers 3A and 3B.

  In the first support position, the magnetic sheet M is held on the first surface 11a by the magnet 13, and the magnetic sheet M and the carrier 10 are integrated. Therefore, when these are conveyed in the vacuum processing apparatus 1, the magnetic sheet M can maintain the shape on the first surface 11a. Further, for example, when a vertical film forming apparatus or the like is employed in the processing chambers 3A and 3B, the magnetic sheet M is held on the first surface 11a even when the carrier 10 is set up vertically, and the shape is maintained. Can do.

  Moreover, since the magnet 13 is a samarium-cobalt magnet piece having a relatively high Curie point, it can sufficiently maintain the magnetic force even at high temperatures (150 ° C. to 300 ° C.) during vacuum processing. Therefore, even if it goes through a series of processes concerning vacuum processing, the modification of magnet 13 and the fall of magnetic force are few, and the retention power to magnetic sheet M can be maintained stably.

  The vacuum-processed magnetic sheet M is transferred to the transfer chamber 6 and transferred to the wafer cassette 7 by the substrate transfer robot 6a. FIG. 6 is a schematic diagram showing the relationship between the transfer system and the wafer cassette 7 when the magnetic sheet M is transferred to the wafer cassette 7. FIG. 6A shows the lift of the magnetic sheet M and the first substrate 11. The mode supported by the pins 210 is shown, and (B) shows the mode in which the magnetic sheet M and the first substrate 11 are accommodated in the wafer cassette 7. As shown in FIG. 6, the wafer cassette 7 typically has a substrate support table (mounting table) 7 a that supports two opposite sides of the substrate.

  The magnetic sheet M and the carrier 10 conveyed from the load lock chambers 2 </ b> A and 2 </ b> B to the transfer chamber 6 are supported on the stage surface 211 a of the hand 211. When the magnetic sheet M is transferred, the lifter pins 210 that have been retracted inside the hand 211 are lifted in the axial direction and pass through the through holes 210a of the second substrate 12, respectively. The lifter pins 210 that are in contact with the first substrate 11 are further lifted, and the magnetic sheet M and the first substrate 11 are integrally lifted (FIG. 5B). At this time, the first substrate 11 is separated from the second substrate 12 and is in the second support position.

  The first substrate 11 and the magnetic sheet M supported by the plurality of lifter pins 210 are disposed on a predetermined substrate support 7a of the wafer cassette 7 (FIG. 6A). At this time, the substrate support 7 a of the wafer cassette 7 is located between the first substrate 11 and the second substrate 12. The plurality of lifter pins 210 are simultaneously lowered, and the magnetic sheet M and the first substrate 11 are transferred to the wafer cassette 7 (FIG. 6B).

  As described above, the carrier 10 can be moved between the first support position and the second support position by the moving mechanism 20. In the second support position, the magnetic sheet M and the first substrate 11 are separated from the magnet 13, and the holding force by the magnet 13 is reduced. For this reason, the magnetic sheet M is easily transferred to the substrate support 7 a of the wafer cassette 7. The magnetic sheet M is supported by the first surface 11a on the first substrate 11 even if the holding force due to the magnetic force is reduced at the second support position, so that the change in the shape of the magnetic sheet M is suppressed. Can do.

  The embodiment of the present invention has been described above. Of course, the present invention is not limited to this, and various modifications can be made based on the technical idea of the present invention.

  For example, in the above embodiment, the magnet 13 is fixed to the third surface 12a of the carrier 10, but the magnet 13 is attached to the fourth surface 12b opposite to the third surface 12a as shown in FIG. May be fixed. In this embodiment, the thicknesses of the first substrate 11 and the second substrate 12 are uniform, and the magnet 13 can hold the magnetic sheet M with the first substrate 11 and the second substrate 12 interposed therebetween. Is formed. In this case, the first substrate 11 may be thinner than the second substrate 12.

  In the above embodiment, the stage on which the magnetic sheet M is transferred has been described as the wafer cassette 7. However, the present invention is not limited to this. For example, a hand of another transfer robot may be used.

  In the above embodiment, the moving mechanism 20 has been described with the support 21 having the lifter pins 210 that can be raised and lowered, but instead, the lower surface of the first substrate 11 is supported and raised and lowered. You may be comprised with the robot which has a hand etc. to make. In this embodiment, it is not necessary to form the through hole 210a in the second substrate 12, but a groove or the like into which a hand or the like can be inserted may be formed in the first substrate 11 or the second substrate 12. . A robot configured to be able to grip the first substrate from the side may be employed as the moving mechanism.

  Although the multi-chamber type vacuum processing apparatus 1 has been described as an embodiment, the present invention is not limited to this, and is applicable to, for example, an in-line type vacuum processing apparatus. Further, in the transfer chamber 6, the movement mechanism 20 is configured as a part of the substrate transfer robot 6a, but another robot may be used.

DESCRIPTION OF SYMBOLS 1 ... Vacuum processing apparatus 2A, 2B ... Load lock chamber 3A, 3B ... Processing chamber 4 ... Core chamber 6 ... Transfer chamber 7 ... Wafer cassette M ... Magnetic sheet 10 ... Carrier 11 ... First substrate 12 ... Second substrate 13 ... Magnet 20 ... Moving mechanism 22 ... Drive unit 210 ... Lifter pin 211 ... Hand

Claims (7)

A magnetic sheet transfer system for transferring a magnetic sheet conveyed by a conveyance mechanism ,
A first non-magnetic substrate having a first surface capable of supporting the magnetic sheet and a second surface opposite to the first surface; and a third facing the second surface. And a second nonmagnetic substrate having a fourth surface that is opposite to the third surface and can be supported by the transport mechanism, and the second nonmagnetic substrate a carrier for have a magnet that forms a magnetic field, to convey the magnetic sheet integrally with the first surface is fixed to,
A support capable of supporting the first non-magnetic substrate; a first support position where the first non-magnetic substrate is close to the second non-magnetic substrate; and the first non-magnetic substrate being the second A magnetic sheet transfer system comprising: a moving mechanism having a drive unit that moves the support body to and from a second support position spaced from the nonmagnetic substrate. A magnetic sheet transfer system according to claim 1,
The magnet is fixed to the third surface. A magnetic sheet transfer system. A magnetic sheet transfer system according to claim 1,
The magnet is fixed to the fourth surface. A magnetic sheet transfer system. A magnetic sheet transfer system according to any one of claims 1 to 3,
The second nonmagnetic substrate has a plurality of through holes,
The support has a plurality of shaft members arranged corresponding to the plurality of through holes,
The drive unit moves up and down each of the plurality of shaft members in the axial direction thereof. A magnetic sheet transfer system according to any one of claims 1 to 4,
The magnet is composed of a plurality of permanent magnet pieces. A carrier for supporting a magnetic sheet and conveying the magnetic sheet integrally by a conveying mechanism ,
A first nonmagnetic substrate having a first surface capable of supporting the magnetic sheet and a second surface opposite to the first surface;
A second non-surface having a third surface facing the second surface and a fourth surface opposite to the third surface and capable of being supported by the transport mechanism. A magnetic substrate;
A carrier fixed to the second non-magnetic substrate and forming a magnetic field on the first surface. Transfer of a magnetic sheet using a carrier having a first non-magnetic substrate, a second non-magnetic substrate facing the first non-magnetic substrate, and a magnet fixed to the second non-magnetic substrate A method,
Holding the magnetic sheet on the surface of the first non-magnetic substrate by the magnetic force of the magnet,
The magnetic sheet on the carrier is vacuum processed in a vacuum processing chamber,
The vacuum-processed magnetic sheet is transported integrally with the carrier by a transport mechanism,
After transporting, the first nonmagnetic substrate is separated from the second nonmagnetic substrate,
A method for transferring a magnetic sheet, wherein the magnetic sheet is transferred together with the first nonmagnetic substrate onto a mounting table disposed between the first nonmagnetic substrate and the second nonmagnetic substrate.

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