JP2003031531A - ウェーハ研磨装置及びウェーハ研磨方法 - Google Patents

ウェーハ研磨装置及びウェーハ研磨方法

Info

Publication number
JP2003031531A
JP2003031531A JP2002156237A JP2002156237A JP2003031531A JP 2003031531 A JP2003031531 A JP 2003031531A JP 2002156237 A JP2002156237 A JP 2002156237A JP 2002156237 A JP2002156237 A JP 2002156237A JP 2003031531 A JP2003031531 A JP 2003031531A
Authority
JP
Japan
Prior art keywords
wafer
region
polishing
membrane
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002156237A
Other languages
English (en)
Japanese (ja)
Inventor
Jae-Phil Boo
在弼 夫
Jong-Soo Kim
種秀 金
Jun-Gyu Ryu
俊圭 柳
Sang-Seon Lee
湘先 李
Sun-Wung Lee
善雄 李
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of JP2003031531A publication Critical patent/JP2003031531A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2002156237A 2001-05-31 2002-05-29 ウェーハ研磨装置及びウェーハ研磨方法 Pending JP2003031531A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR2001-30365 2001-05-31
KR10-2001-0030365A KR100437456B1 (ko) 2001-05-31 2001-05-31 화학적 기계적 평탄화 기계의 폴리싱 헤드 및 그것을이용한 폴리싱방법

Publications (1)

Publication Number Publication Date
JP2003031531A true JP2003031531A (ja) 2003-01-31

Family

ID=19710216

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002156237A Pending JP2003031531A (ja) 2001-05-31 2002-05-29 ウェーハ研磨装置及びウェーハ研磨方法

Country Status (4)

Country Link
JP (1) JP2003031531A (ko)
KR (1) KR100437456B1 (ko)
DE (1) DE10202701B4 (ko)
TW (1) TW520319B (ko)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7166019B2 (en) 2004-02-09 2007-01-23 Samsung Electronics Co., Ltd. Flexible membrane for a polishing head and chemical mechanical polishing (CMP) apparatus having the same
US7727055B2 (en) 2006-11-22 2010-06-01 Applied Materials, Inc. Flexible membrane for carrier head
US8021215B2 (en) 2006-11-22 2011-09-20 Applied Materials, Inc. Carrier head with retaining ring and carrier ring
JP4833355B2 (ja) * 2008-08-29 2011-12-07 信越半導体株式会社 研磨ヘッド及び研磨装置

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004070806A1 (en) * 2003-02-10 2004-08-19 Ebara Corporation Substrate holding apparatus and polishing apparatus
JP2009131920A (ja) * 2007-11-29 2009-06-18 Ebara Corp 研磨装置及び方法
KR100954690B1 (ko) * 2008-07-08 2010-04-27 주식회사 실트론 웨이퍼 가압헤드
US8460067B2 (en) * 2009-05-14 2013-06-11 Applied Materials, Inc. Polishing head zone boundary smoothing
KR102191916B1 (ko) * 2013-06-26 2020-12-16 주식회사 케이씨텍 화학 기계적 연마 장치의 캐리어 헤드
US9662761B2 (en) * 2013-12-02 2017-05-30 Ebara Corporation Polishing apparatus
KR101613153B1 (ko) * 2014-05-09 2016-04-19 주식회사 케이씨텍 화학 기계적 연마 장치의 캐리어 헤드의 멤브레인 및 이를 구비한 캐리어 헤드
US9873179B2 (en) * 2016-01-20 2018-01-23 Applied Materials, Inc. Carrier for small pad for chemical mechanical polishing
JP6575463B2 (ja) * 2016-08-24 2019-09-18 信越半導体株式会社 ウェーハの研磨方法
CN110142689B (zh) * 2019-04-17 2021-09-14 杭州众硅电子科技有限公司 一种晶圆装载支架、晶圆装载系统及晶圆装片方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10235554A (ja) * 1997-02-25 1998-09-08 Speedfam Co Ltd 研磨装置のヘッド
US5957751A (en) * 1997-05-23 1999-09-28 Applied Materials, Inc. Carrier head with a substrate detection mechanism for a chemical mechanical polishing system
DE69813374T2 (de) * 1997-05-28 2003-10-23 Tokyo Seimitsu Co Ltd Halbleiterscheibe Poliervorrichtung mit Halterring
US5964653A (en) * 1997-07-11 1999-10-12 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
JPH11226865A (ja) * 1997-12-11 1999-08-24 Speedfam Co Ltd キャリア及びｃｍｐ装置
US6422927B1 (en) * 1998-12-30 2002-07-23 Applied Materials, Inc. Carrier head with controllable pressure and loading area for chemical mechanical polishing
JP3068086B1 (ja) * 1999-05-07 2000-07-24 株式会社東京精密 ウェ―ハ研磨装置
JP2001121411A (ja) * 1999-10-29 2001-05-08 Applied Materials Inc ウェハー研磨装置
US6652362B2 (en) * 2000-11-23 2003-11-25 Samsung Electronics Co., Ltd. Apparatus for polishing a semiconductor wafer and method therefor

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7166019B2 (en) 2004-02-09 2007-01-23 Samsung Electronics Co., Ltd. Flexible membrane for a polishing head and chemical mechanical polishing (CMP) apparatus having the same
US7727055B2 (en) 2006-11-22 2010-06-01 Applied Materials, Inc. Flexible membrane for carrier head
US8021215B2 (en) 2006-11-22 2011-09-20 Applied Materials, Inc. Carrier head with retaining ring and carrier ring
JP4833355B2 (ja) * 2008-08-29 2011-12-07 信越半導体株式会社 研磨ヘッド及び研磨装置
US8636561B2 (en) 2008-08-29 2014-01-28 Shin-Etsu Handotai Co., Ltd. Polishing head and polishing apparatus

Also Published As

Publication number Publication date
DE10202701A1 (de) 2002-12-12
DE10202701B4 (de) 2006-05-18
KR100437456B1 (ko) 2004-06-23
TW520319B (en) 2003-02-11
KR20020091325A (ko) 2002-12-06

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