JP2003010991A5 - - Google Patents

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Publication number
JP2003010991A5
JP2003010991A5 JP2002097725A JP2002097725A JP2003010991A5 JP 2003010991 A5 JP2003010991 A5 JP 2003010991A5 JP 2002097725 A JP2002097725 A JP 2002097725A JP 2002097725 A JP2002097725 A JP 2002097725A JP 2003010991 A5 JP2003010991 A5 JP 2003010991A5
Authority
JP
Japan
Prior art keywords
region
processing method
laser processing
modified
cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002097725A
Other languages
English (en)
Japanese (ja)
Other versions
JP3867003B2 (ja
JP2003010991A (ja
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Publication date
Application filed filed Critical
Priority to JP2002097725A priority Critical patent/JP3867003B2/ja
Priority claimed from JP2002097725A external-priority patent/JP3867003B2/ja
Publication of JP2003010991A publication Critical patent/JP2003010991A/ja
Publication of JP2003010991A5 publication Critical patent/JP2003010991A5/ja
Application granted granted Critical
Publication of JP3867003B2 publication Critical patent/JP3867003B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2002097725A 2000-09-13 2002-03-29 レーザ加工方法 Expired - Lifetime JP3867003B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002097725A JP3867003B2 (ja) 2000-09-13 2002-03-29 レーザ加工方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000278306 2000-09-13
JP2000-278306 2000-09-13
JP2002097725A JP3867003B2 (ja) 2000-09-13 2002-03-29 レーザ加工方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2001278752A Division JP3722731B2 (ja) 2000-09-13 2001-09-13 レーザ加工方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006055538A Division JP2006205259A (ja) 2000-09-13 2006-03-01 レーザ加工方法

Publications (3)

Publication Number Publication Date
JP2003010991A JP2003010991A (ja) 2003-01-15
JP2003010991A5 true JP2003010991A5 (enrdf_load_stackoverflow) 2006-04-13
JP3867003B2 JP3867003B2 (ja) 2007-01-10

Family

ID=26599900

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002097725A Expired - Lifetime JP3867003B2 (ja) 2000-09-13 2002-03-29 レーザ加工方法

Country Status (1)

Country Link
JP (1) JP3867003B2 (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8168514B2 (en) * 2006-08-24 2012-05-01 Corning Incorporated Laser separation of thin laminated glass substrates for flexible display applications
JP5670647B2 (ja) 2010-05-14 2015-02-18 浜松ホトニクス株式会社 加工対象物切断方法
US8950217B2 (en) 2010-05-14 2015-02-10 Hamamatsu Photonics K.K. Method of cutting object to be processed, method of cutting strengthened glass sheet and method of manufacturing strengthened glass member
US10576585B1 (en) 2018-12-29 2020-03-03 Cree, Inc. Laser-assisted method for parting crystalline material
US10562130B1 (en) 2018-12-29 2020-02-18 Cree, Inc. Laser-assisted method for parting crystalline material
US11024501B2 (en) 2018-12-29 2021-06-01 Cree, Inc. Carrier-assisted method for parting crystalline material along laser damage region
US10611052B1 (en) 2019-05-17 2020-04-07 Cree, Inc. Silicon carbide wafers with relaxed positive bow and related methods

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