JP2003006587A - Manufacturing method for component on which semiconductor component is mounted, manufacturing method for finished product on which semiconductor component is mounted and finished product on which semiconductor component is mounted - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a component on which a semiconduc tor component is mounted with high quality and high productivity at a low cost, the manufacturing method of a finished product on which the semiconductor component is mounted and the finished product on which the semiconductor component is mounted. SOLUTION: After burying the semiconductor component 104 and a first semiconductor component reinforcing member 116 in a first thermoplastic resin base material 122, a circuit pattern 119 is formed and made into a module and thus, a finished component 101 on which the semiconductor component is mounted is composed of a flat outer surface. Also, since the burying processing is performed, the need of a conventional depression is eliminated and also the need of an adhesive material 7 for mounting the semiconductor component reinforcing member on the semiconductor component is eliminated. Thus, processes and costs regarding them are reduced, the productivity is improved and the costs are lowered.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor component-mounted component manufacturing method for manufacturing a semiconductor component-mounted component by mounting a semiconductor component and a reinforcing member for preventing cracking or chipping of the semiconductor component on a base material. The present invention relates to a method for manufacturing a semiconductor component-mounted finished product having a semiconductor component mounted component manufactured by the manufacturing method, and a semiconductor component-mounted completed product manufactured by the semiconductor component mounted-finished product manufacturing method. In the method of manufacturing a semiconductor component-mounted component, an IC chip is electrically connected to a circuit pattern formed of aluminum, copper, nickel, a conductive paste, etc., as in the case of manufacturing a non-contact IC card, for example. Used when you want to.

[0002]

2. Description of the Related Art Taking a non-contact IC card as an example, a conventional method for manufacturing a completed semiconductor component-mounted product will be described below with reference to FIGS. Conventionally, in a non-contact IC card that has an antenna coil and an IC chip built therein and gives data to the outside through the antenna coil, a bending stress and a twist applied to the non-contact IC card after the non-contact IC card is manufactured. Problems such as cracking and chipping of the IC chip due to at least one of the stresses have become a problem. As a countermeasure, generally, when manufacturing a non-contact IC card, after mounting the IC chip on a substrate on which a circuit pattern such as the antenna coil is formed, stainless steel or copper is mounted on the back surface of the mounted IC chip. Attach a reinforcing member made of foil etc. with an adhesive to
Methods are in place to prevent chip cracking and chipping.

28 to 35 show a conventional non-contact IC card and its manufacturing method. FIG. 28 shows a conventional non-contact IC
The semiconductor component mounted component in which the semiconductor component reinforcement member in the card was mounted is shown. As shown in FIG. 28, a conventional semiconductor component mounted component 1a is a circuit pattern including an antenna coil pattern 2 formed of copper, aluminum or the like on a substrate 1 of glass epoxy, polyimide, polyethylene terephthalate, vinyl chloride or the like. The semiconductor component 3 is electrically connected to the upper surface 6 through the anisotropic conductive sheet 5 or the anisotropic conductive paste 5. Reference numeral 4 denotes a bump formed on the electrode of the semiconductor component 3 by a wire bonding method or a plating method, specifically, a plating method using solder, gold, silver, copper or the like. The reinforcing member 15 is attached to the back surface of the semiconductor component 3 via the adhesive 7.

The manufacturing process of such a conventional non-contact IC card is as shown in FIG. 29. First, in step (indicated by "S" in the figure) 1, as shown in FIG. The bumps 4 are formed on the electrodes 8 by a wire bonding method or a plating method using a gold wire, a copper wire, an aluminum wire or the like, specifically, a plating method using a solder, gold, silver, copper or the like. Reference numeral 9 is a passivation film that protects the active surface of the semiconductor component 3. In step 2, FIG.
Substrate 1 made of glass epoxy, polyimide, polyethylene terephthalate, vinyl chloride, etc. as shown in 1
The semiconductor component 3 in the circuit pattern 6 formed on the
The anisotropic conductive sheet 5 is attached to the place where is to be mounted, and is temporarily pressure-bonded. The anisotropic conductive sheet 5 is a resin sheet containing metal particles, and is electrically connected to the bumps 4 and the circuit pattern 6 via the metal particles by being heated and pressed. The temporary pressure bonding condition is generally heating at 100 ° C. for about 5 seconds.

In step 3, the semiconductor component 3 is placed on the anisotropically conductive sheet 5 that has been temporarily pressure-bonded. In step 4, 2
The substrate 1 and the semiconductor component 3 for 30 seconds at a temperature of 00 ° C.
Is heated to cure the anisotropic conductive sheet 5 as shown in FIG. 32, and the semiconductor element 3 is pressure-bonded onto the substrate 1. As a result, the curing shrinkage force of the anisotropic conductive sheet 5 electrically connects the bumps 3 and the circuit patterns 6 via the metal particles 10 of the anisotropic conductive sheet 5. Incidentally, in a general semiconductor mounting in which the reinforcing member 6 is not arranged on the semiconductor component 3, the mounting operation of the semiconductor element is completed by this step 4.

In step 5, as shown in FIG. 33, the semiconductor component 3 facing the surface where the electrodes 8 and the bumps 4 are formed.
An adhesive 7 of epoxy type, acrylic type or the like is applied to the back surface 3a of the. Then, in step 6, the semiconductor component reinforcing member 15 is placed on the back surface 3a, and in step 7, the adhesive 7 is cured, whereby the semiconductor component mounted component 1a shown in FIG. 28 is completed. As the semiconductor component reinforcing member 15, a metal plate such as stainless steel, nickel, or copper having a thickness of about 50 μm to 100 μm is generally used. After step 7, the semiconductor component-mounted component 1a is placed on the first base material 11, the second base material 12, and the third base material 13 as shown in FIG. 34, and is laminated, whereby the semiconductor component shown in FIG. The non-contact IC card 1b is obtained as a mounted finished product. In FIG. 34, in order to absorb the step due to the convex portion formed on the substrate 1 by the semiconductor component 3 and the semiconductor component reinforcing member 15 in the semiconductor component mounted component 1a in advance on the second substrate 12, A hollow hole 14 is provided.

[0007]

However, the above-mentioned conventional method of manufacturing a completed semiconductor component mounted product, and non-contact I as a semiconductor component mounted completed product manufactured by the manufacturing method.
The C card configuration has the following problems. In the semiconductor component mounted component 1a, the semiconductor component reinforcing member 1 is used.
Adhesive 7 for mounting 5 is required, and steps for coating and curing the adhesive are required, resulting in poor productivity.
In addition, the material cost of the adhesive 7 is increased. Further, in the above-mentioned semiconductor component mounted component 1a, since the convex portion is formed on the substrate 1 by the semiconductor component 3 and the semiconductor component reinforcing member 15, it becomes a flat outer surface after the laminating process shown in FIG. It is difficult to obtain the completed semiconductor component mounted product 1b. Therefore, as shown in FIG. 34, the hollow hole 14 is provided in a part of the second base material 12.
4 is required, the productivity is poor and the cost is high. The present invention has been made to solve such a problem, and is a method for manufacturing a semiconductor component mounted component for manufacturing a high quality, high productivity and inexpensive semiconductor component mounted component, and the manufacturing method. An object of the present invention is to provide a method for manufacturing a semiconductor component-mounted finished product having a manufactured semiconductor component-mounted component, and a semiconductor component-mounted finished product manufactured by the semiconductor component-mounted finished product manufacturing method.

[0008]

According to a first aspect of the present invention, there is provided a method of manufacturing a semiconductor component mounted component, wherein a first semiconductor component reinforcing member for reinforcing the semiconductor component is provided in contact with a back surface of the semiconductor component. , The semiconductor component and the first semiconductor component reinforcing member are in contact with each other, and the semiconductor component and the first semiconductor component reinforcing member are relatively pressed against the first base material, and the semiconductor component and the first semiconductor The component reinforcing member is embedded in the first base material.

After the burying operation, a conductive paste or metal plating is applied to the circuit forming surface of the first base material where the electrode portion formed on the active surface of the semiconductor component facing the back surface is exposed. It is also possible to form a circuit pattern by contacting the electrode part.

Further, according to the second aspect of the present invention, in the method for manufacturing a semiconductor component mounted component, the semiconductor component and the first base material are relatively pressed to embed the semiconductor component in the first base material. A second base material in which a first semiconductor component reinforcing member for reinforcing the semiconductor component is embedded in advance, the second base material being on the back surface side of the semiconductor component embedded in the first base material, 1 Semiconductor component reinforcing member is arranged so as to overlap, the first base material and the second base material are joined, and after the joining, an electrode formed on the active surface of the semiconductor component facing the back surface. A circuit pattern is formed by contacting the electrode portion with a conductive paste or metal plating on the circuit forming surface of the first base material where the portion is exposed.

A semiconductor component-mounted component according to a third aspect of the present invention is manufactured by the method for manufacturing a semiconductor component-mounted component according to the first or second aspect.

Further, a fourth aspect of the present invention is a method of manufacturing a completed semiconductor component-mounted product, wherein the semiconductor component-mounted component is manufactured by the method of manufacturing a semiconductor component-mounted component according to the first or second aspect. The third component and the fourth substrate are laminated from the thickness direction of the first substrate to the semiconductor component-mounted component.

In the method of manufacturing a completed semiconductor component-mounted product according to the fourth aspect, when the fourth base material is arranged on the circuit forming surface side of the first base material, the semiconductor component is opposed to the semiconductor component. The second semiconductor component reinforcing member may be embedded in advance in the fourth base material.

Furthermore, the semiconductor component-mounted finished product of the fifth aspect of the present invention is manufactured by the method of manufacturing a semiconductor component-mounted finished product of the fourth aspect.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention, a method for manufacturing a semiconductor component-mounted component, a method for manufacturing a semiconductor component-mounted component, and a semiconductor component-mounted component will be described below with reference to the drawings. explain. Here, the manufacturing method of the semiconductor component mounted finished product is a method of manufacturing a semiconductor component mounted finished product including the semiconductor component mounted component manufactured by the semiconductor component mounted component manufacturing method, and The semiconductor component-mounted finished product is manufactured by the method for manufacturing the semiconductor component-mounted completed product. Further, in each figure, the same components are designated by the same reference numerals.
A non-contact IC card is taken as an example in the present embodiment as an example of fulfilling the function of the "semiconductor component mounted completed product", but the present invention is not limited to this.

First Embodiment FIG. 1 shows a semiconductor component mounted component manufactured by using the semiconductor component mounted component manufacturing method of the present embodiment. The above-mentioned semiconductor component mounted component may be referred to as a semiconductor component built-in core module component. Further, in FIG. 1, as an example of the semiconductor module built-in core module part, a semiconductor part built-in core module part 101 forming a non-contact IC card is shown. In the core module component 101 with a built-in semiconductor component in the above non-contact IC card, the semiconductor component 104 and the first semiconductor component reinforcing member 116 have the first thermoplastic resin substrate 1 in advance.
22 of the first thermoplastic resin substrate 122,
On the circuit pattern forming surface 123 corresponding to the circuit forming surface,
Electrode exposed surface 11 of bump 113 of semiconductor component 104
5 is exposed. Such a circuit pattern forming surface 12
3, a circuit pattern 119 including an electrode portion 118 that makes electrical contact with the electrode exposed surface 115 and an antenna coil pattern 102 that functions as an antenna is formed.

In the semiconductor component built-in core module component 101 having such a structure, the circuit pattern 119 and the electrode exposed surface 115 are directly connected to each other without the anisotropic conductive paste or the like. There is no adhesive between the first semiconductor component reinforcing member 116 and the first semiconductor component reinforcing member 116, and the first component in the semiconductor component mounted component 101.
This is different from the conventional technique in that the circuit pattern forming surface 123 of the thermoplastic resin base material 122 and the back surface 122a of the first thermoplastic resin base material 122 facing the circuit pattern forming surface 123 are flat.

FIG. 2 shows a non-contact IC card 100 as an example of a semiconductor component-mounted finished product including a semiconductor component-mounted component manufactured by the method for manufacturing a semiconductor component-mounted component of the present embodiment. ing. Where 124, 12
5 is a semiconductor component 104, a first semiconductor component reinforcing member 11
6 is a sheet-like member for performing a laminating process for protecting the semiconductor component built-in core module component 101 having the circuit pattern 119, and is an example that functions as a third base material and a fourth base material. A certain third thermoplastic resin substrate and a certain fourth thermoplastic resin substrate.

Below, the semiconductor component mounted component 101 is mounted.
The manufacturing method of the non-contact IC card 100 including the manufacturing method of 1. will be described with reference to the drawings. In the step 101 (indicated by “S” in the figure) shown in FIG. 11, gold, copper, and the like are deposited on the electrode 117 of the semiconductor component 104 shown in FIG.
Alternatively, the bump 113 is formed by a wire bonding method using a metal wire made of solder or the like. In addition, bump 1
The forming method of 13 is not limited to the above-mentioned wire bonding method, but may be a plating method. Reference numeral 112 shown in FIG. 3 is a passivation film for protecting the active surface of the semiconductor component 104.

In the next step 102, the bump 11
3, the semiconductor component 104 in which 3 is formed, and the semiconductor component 10
4, the first semiconductor component reinforcing member 11 shown in FIG. 4 provided in contact with the back surface 104a facing the active surface.
6 is a sheet-like first thermoplastic resin serving as a first base material, which is formed of a thermoplastic resin having electrical insulation properties such as polyethylene terephthalate, vinyl chloride, polycarbonate, or acrylonitrile butadiene styrene. It is placed on the back surface 122a of the base material 122 as shown in FIG. The first semiconductor component reinforcing member 116 is
In this embodiment, the back surface 104 a of the semiconductor component 104 is used.
And has an area equal to or larger than that of the semiconductor component 104. The first semiconductor component reinforcing member 116 is formed of metal such as stainless steel, nickel, copper, or aluminum, or plastic, and the shape thereof is a quadrangle shown in FIG. 4 or a circle as shown in FIG. It may have a shape and is not particularly limited. Further, the thickness thereof varies depending on the thicknesses of the first thermoplastic resin base material 122 and the semiconductor component 104, but generally 50 to 2
It is preferably about 00 μm. That is, the material, shape, and thickness of the first semiconductor component reinforcing member 116 are determined from the viewpoint of preventing damage to the semiconductor component 104 due to external force.

The thickness t of the first thermoplastic resin substrate 122.
In the case of the present embodiment, 1 is the bump 113 as described later.
The circuit pattern forming surface 1 of the first thermoplastic resin substrate 122
Since it is necessary to expose from 23, the thickness of the semiconductor component 104, the height of the bump 113, and the first semiconductor component reinforcement are basically not less than the combined thickness of the semiconductor component 104 and the first semiconductor component reinforcing member 116. It is desirable that the total thickness of the members 116 be less than or equal to the total thickness. For example, when the thickness of the semiconductor component 104 is 180 μm, the height of the bump 113 is 40 μm, and the thickness of the first semiconductor component reinforcing member 116 is 50 μm, the thickness of the first thermoplastic resin base material 122 is preferably 250 μm.

In the next step 103, as shown in FIG. 7, the first thermoplastic resin substrate 1 on which the semiconductor component 104 with the bump 113 and the first semiconductor component reinforcing member 116 are mounted.
22 is sandwiched between the flat surfaces of the heat press plates 171 and 172,
While the semiconductor component 104 with bumps 113, the first semiconductor component reinforcing member 116, and the first thermoplastic resin base material 122 are heated by the hot press plates 171, 172, they are relatively pressed, and as shown in FIG. As shown in the semiconductor component 104
And the first semiconductor component reinforcing member 116 is embedded in the first thermoplastic resin base material 122. In FIG. 7, 173,
174 is the hot press plates 171, 17 for the pressing operation.
2 are moving devices for moving 2 and 175 and 176 are
A heating device for heating the hot press plates 171 and 172, respectively. The conditions of the hot pressing are, for example, when the first thermoplastic resin substrate 122 made of polyethylene terephthalate is used, the pressure is 30 × 10 ⁵ Pa, the temperature is 160 ° C., and the pressing time is 1 minute. The temperature and pressure are changed depending on the material of the first thermoplastic resin base material 122.

In the present embodiment, since the electrode exposed surface 115 of the bump 113 where the bump 113 will come into contact with the hot press plate 171 is pressed until it reaches the hot press plate 171, as shown in FIG. By the pressing operation, the electrode exposed surface 115 is exposed on the circuit pattern forming surface 123 which is a contact surface of the first thermoplastic resin substrate 122 with the hot press plate 171. At this time,
In the present embodiment, the second semiconductor component reinforcing member 116
The surface 116b and the back surface 122a of the first thermoplastic resin substrate 122 facing the pattern forming surface 123 are made to be the same surface as shown in the drawing, but the invention is not limited to this. That is, depending on the semiconductor component mounted parts to be manufactured, the above-mentioned first thermoplastic resin base material 122 is used.
Of the first thermoplastic resin substrate 1 depending on the adjustment or shape of the thickness t1 of the sheet and the pressing force of the hot press plates 171 and 172.
22 from the back surface 122a of the first semiconductor component reinforcing member 116
The second surface 116b may be recessed or projected.

In the next step 105, the electrode exposed surface 115 of the bump 113 exposed on the pattern forming surface 123 of the first thermoplastic resin substrate 122 is brought into contact with the surface.
The circuit pattern 11 is formed by using a conductive paste such as silver or copper.
9 is formed on the circuit pattern forming surface 123. The circuit pattern 119 is generally formed by the conductive paste by screen printing, offset printing, gravure printing, or the like. For example, in the case of screen printing, 16
A conductive paste is printed through a mask having a mesh size of 5 mesh / inch and an emulsion thickness of 10 μm to form a circuit pattern 119 having a conductor thickness of about 30 μm. Then, the conductive paste is cured under curing conditions of 100 ° C. and about 15 minutes.
Of course, the circuit pattern 119 is formed in a form corresponding to the function of the semiconductor component mounted component as a manufactured product. In this way, the circuit pattern 119 and the semiconductor component 104 are electrically connected, and the semiconductor component component built-in core module component 101 shown in FIG. 1 is formed. Furthermore, by executing the following steps, that is, by executing the method for manufacturing a semiconductor component-mounted finished product, the semiconductor component-mounted finished product, in the present embodiment, the contactless IC card 100 is manufactured.

In the next step 106, as shown in FIG. 9, the semiconductor component built-in core module component 101 is electrically insulated from the thickness direction by a sheet such as polyethylene terephthalate, vinyl chloride, polycarbonate, or acrylonitrile butadiene styrene. -Shaped third thermoplastic resin base material 124 and fourth thermoplastic resin base material 125
Then, the semiconductor module built-in core module component 101 is sealed by sandwiching and laminating. The laminating process is performed by heating the flat press plates 201 and 202.
By heating and pressurizing. The treatment conditions are, for example, a pressure of 30 × 10 ⁵ Pa and a temperature of 16 when the first thermoplastic resin substrate 122 made of polyethylene terephthalate is used.
0 ° C., press pressurization time 1 minute, pressure holding time 1 minute.
In FIG. 9, 205 and 206 are moving devices for moving the flat press plates 201 and 202 for the pressing operation, and 207 and 208 are flat press plates 201 and 2 respectively.
02 is a heating device for heating each.

The laminating process may be carried out by the roll pressing method shown in FIG. In FIG. 10, 203 and 204 are heated rollers. A sheet-shaped third thermoplastic resin base material 124 and a fourth electrically-insulating sheet such as polyethylene terephthalate, vinyl chloride, polycarbonate, or acrylonitrile butadiene styrene sandwiching the semiconductor component built-in core module component 101 from the thickness direction. The thermoplastic resin base material 125 is supplied between the rollers 203 and 204 and laminated. The processing conditions are, for example, a pressure of 30 × 10 ⁵ Pa, a temperature of 160 ° C., and a laminating speed of 0.1 m / min, when the thermoplastic resin substrates 124 and 125 made of polyethylene terephthalate are used. In addition, an adhesive sheet may be supplied between the thermoplastic resin base materials 124 and 125 and the semiconductor component built-in core module component 101 to perform a laminating process. In addition, in FIG.
9, 210 are rollers 203, 20 for the pressing operation.
4 are drive devices for rotating 4, and 211 and 212 are
A heating device for heating each of the rollers 203 and 204. Through the above steps, as shown in FIG. 2, the semiconductor component-mounted component as a module in which the semiconductor component 104 and the first semiconductor component reinforcing member 116 are mounted, or the semiconductor component-mounted component as in the case of the present embodiment. Non-contact IC card 100 corresponding to an example that functions as a finished product
Is completed.

As described above, according to this embodiment, after the semiconductor component 104 and the first semiconductor component reinforcing member 116 are embedded in the first thermoplastic resin substrate 122 in advance, the circuit pattern 119 is formed and modularized. . Therefore, the semiconductor component-mounted component 1 to be completed is completed because the semiconductor component 3 and the semiconductor component reinforcing member 15 having a projecting shape on the substrate 1 are not laminated as in the conventional case.
The surface of 01 has a flat shape. Therefore, when the card is formed, since the convex portions are absorbed as shown in FIG. 34 in the conventional example, it is not necessary to provide the hollow hole 14 formed by hollowing out a part of the second base material 12, and the hollow hole 14 is formed. The process for forming is unnecessary, and high productivity and cost reduction are possible. Since the semiconductor component 104 and the first semiconductor component reinforcing member 116 are fixed by the embedding operation as described above, the adhesive 7 for mounting the semiconductor component reinforcing member 15 as shown in FIG. It is unnecessary.
Therefore, the steps for coating and curing are unnecessary, the productivity is improved, and the material cost of the adhesive 7 and the cost can be reduced.

Second Embodiment: In the above-mentioned first embodiment,
As shown in FIGS. 6 and 7, the first thermoplastic resin substrate 122
Above the semiconductor component 104 and the first semiconductor component reinforcing member 11
6 is placed, then sandwiched between the heat press plates 171 and 172,
The semiconductor component 104 and the first semiconductor component reinforcing member 116 were embedded in the first thermoplastic resin base material 122 by hot pressing, but in the second embodiment, the semiconductor component 104 and the first semiconductor component 104 are embedded.
The embedding process of the semiconductor component reinforcing member 116 is different from that in the first embodiment. The process will be described with reference to the flowchart shown in FIG.

In step 201 shown in FIG. 12, the bumps 11 are formed on the semiconductor component 104 in the same manner as step 101 described above.
3 is formed. Next, in steps 202 to 204,
As shown in FIG. 13, the process is different from that of the first embodiment in that only the semiconductor component 104 is embedded in the first thermoplastic resin base material 122 in advance. Here, in the case of the second embodiment, the thickness t1 of the first thermoplastic resin substrate 122 is basically because the bump 113 needs to be exposed from the circuit pattern forming surface 123 of the first thermoplastic resin substrate 122. It is desirable that the thickness is equal to or larger than the thickness of the semiconductor component 104 and equal to or smaller than the total thickness of the semiconductor component 104 and the height of the bump 113. For example, the thickness of the semiconductor component 104 is 180 μ
m and the height of the bump 113 is 40 μm, the thickness t1 of the first thermoplastic resin substrate 122 is preferably 200 μm.
The embedding process using the hot press is the same as that of the first embodiment described with reference to FIG. 7. Step 203
Then, the electrode exposed surface 115 of the bump 113 where the bump 113 will come into contact with the hot press plate 171 is
Since the pressing operation is performed until reaching 1, the electrode exposing surface 115 is the circuit pattern forming surface 123 which is a contact surface of the first thermoplastic resin substrate 122 with the hot press plate 171 by the pressing operation. Will be exposed to.

Next, in steps 205 to 206,
As shown in FIG. 14, the first semiconductor component reinforcing member 116 is placed on the semiconductor component 104 such that the first surface 116a of the first semiconductor component reinforcing member 116 contacts the back surface 104a of the semiconductor component 104 and covers the semiconductor component 104. Thermoplastic resin base material 12
The second thermoplastic resin base material 222 having substantially the same size as the second thermoplastic resin base material 222
Is placed on the first semiconductor component reinforcing member 116. Then, hot pressing similar to the step shown in FIG. 7 is performed. As a result, as shown in FIG. 15, in the state where the semiconductor component 104 and the first semiconductor component reinforcing member 116 are in contact with each other on the back surface 104a, the first semiconductor component reinforcing member 116 is inside the second thermoplastic resin base material 222. The first thermoplastic resin base material 122 and the second thermoplastic resin base material 222 are fused and integrally molded. In this case, when the first semiconductor component reinforcing member 116 is embedded in the second thermoplastic resin base material 222, as shown in FIG. 15, a first semiconductor component reinforcing member 116 facing the first surface 116a may be provided. Two sides 116b
Is not exposed on the outer surface of the second thermoplastic resin substrate 222. In addition, as shown in FIG. 16, the second thermoplastic resin substrate 2
In order to expose the first surface 116a of the first semiconductor component reinforcing member 116 to the surface 222a of the second semiconductor component 22, the first semiconductor component reinforcing member 116 is embedded in the second thermoplastic resin base material 222 in a separate process in advance. , The first semiconductor component reinforcing member 1
The first surface 116 a of the 16 is the back surface 1 of the semiconductor component 104.
04a and cover the semiconductor component 104 so as to cover the semiconductor component 104.
Alternatively, the first thermoplastic resin base material 122 and the second thermoplastic resin base material 222 may be fused and integrated with each other.

After embedding the first semiconductor component reinforcing member 116,
In step 207, the circuit pattern forming surface 12
3, a circuit pattern 119 is formed, a semiconductor component mounted component is completed, and further sandwiched by a third thermoplastic resin base material 124 and a fourth thermoplastic resin base material 125 as shown in FIG. 17 and laminated. To obtain a completed semiconductor component mounted product.

As described above, according to the method of the second embodiment,
This is different from the case shown in FIG. 8 in that the second thermoplastic resin base material 222 also exists on the second surface 116b of the first semiconductor component reinforcing member 116. According to the semiconductor component mounted component and the semiconductor component mounted finished product in the second embodiment,
The resin base material for sealing the first semiconductor component reinforcing member 116 can be omitted as compared with the case of the above-described first embodiment.

As a modification, step 204 described above is used.
Then, after embedding the semiconductor component 104, the circuit pattern 119 may be formed on the circuit pattern forming surface 123, and then the steps 205, 206, and 208 may be performed. Note that, as in the case shown in FIG. 15, the second thermoplastic resin base material 222 exists on the second surface 116b side of the first semiconductor component reinforcing member 116, and the first semiconductor component reinforcing member 116 is completely sealed. From the second thermoplastic resin substrate 22
The third thermoplastic resin base material 124 may not be further provided on the second. As described above, whether or not the third thermoplastic resin base material 124 is further provided on the second thermoplastic resin base material 222 depends on the thickness required for the completed semiconductor component mounted product and the second thermoplastic resin base material. It is determined by the correlation with the thickness of 222. Thus, the third thermoplastic resin substrate 1
24 can be used for adjusting the thickness of the completed semiconductor component mounted product.

Third Embodiment: In the above-described second embodiment,
As shown in FIG. 14, after the semiconductor component 104 is embedded in the first thermoplastic resin substrate 122, the back surface 104 of the semiconductor component 104 is removed.
The first surface 116a of the first semiconductor component reinforcing member 116 is brought into contact with a, the first semiconductor component reinforcing component 116 is arranged, and the second thermoplastic resin base material 222 is placed, but in the third embodiment, As shown in FIG. 18, the fifth thermoplastic resin substrate 2 is provided between the semiconductor component 104 embedded in the first thermoplastic resin substrate 122 and the first semiconductor component reinforcing member 116.
The difference is that 50 is provided. With the configuration shown in FIG.
The same hot pressing as the step shown in FIG.
As shown in FIG. 3, the semiconductor component 104 and the first semiconductor component reinforcing member 116 have the first thermoplastic resin with the fifth thermoplastic resin base material 250 interposed between the semiconductor component 104 and the first semiconductor component reinforcing member 116. The semiconductor component-mounted component 105 in a form embedded in the resin substrate 122, the fifth thermoplastic resin substrate 250, and the second thermoplastic resin substrate 222 is obtained.

As a modification, as in the second embodiment, as shown in FIG. 20, the second thermoplastic resin base material 22 is used.
The second surface 116a of the first semiconductor component reinforcing member 116 is exposed to the surface 222a of the second semiconductor component reinforcing member 116, and the first semiconductor component reinforcing member 1 is previously formed on the second thermoplastic resin base material 222 in another step.
It is also possible to adopt the step of burying 16. Further, FIG.
As shown in FIG. 5, the back surface 222a of the second thermoplastic resin base material 222 having the first surface 116a of the first semiconductor component reinforcing member 116 exposed on the front surface 222a is brought into contact with the back surface 104a of the semiconductor component 104, and It is also possible to adopt a structure in which the fifth thermoplastic resin substrate 250 is brought into contact with 222a. However, in this case, the first semiconductor component reinforcing member 116 is
The back surface 222b of the second thermoplastic resin substrate 222 is embedded so as not to be exposed. Subsequent steps of forming a semiconductor component-mounted component and a semiconductor component-mounted finished product are the same as those described in the second embodiment. The fifth
The thermoplastic resin base material 250 may be omitted and the laminating process may be performed only with the third thermoplastic resin base material 124 in step 208.

As described above, in the third embodiment, the back surface 104a of the semiconductor component 104 and the first semiconductor component reinforcing member 116 are different from the configuration shown in FIG. 15 in the second embodiment.
The difference is that a thermoplastic resin is interposed between and. Thus, the semiconductor component 104 and the first semiconductor component reinforcing member 1
By interposing a resin having a lower elastic modulus than the semiconductor component 104 and the first semiconductor component reinforcing member 116 between the semiconductor component 104 and the semiconductor component 104, the semiconductor component 104 against bending in the semiconductor component-mounted component and the semiconductor component-mounted finished product. The effect of preventing cracking is increased.

Fourth Embodiment; First to Third Embodiments Above
In the embodiment, the first semiconductor component reinforcing member 116 is arranged only on the back surface 104a side of the semiconductor component 104, but in the fourth embodiment, the semiconductor component reinforcing member is provided on both sides in the thickness direction of the semiconductor component 104. A method of manufacturing a completed semiconductor component-mounted product to be arranged will be described. That is, the semiconductor component 10
A first semiconductor component reinforcing member 116 and a second semiconductor component reinforcing member 215 described below are provided with 4 in between. In the fourth embodiment, step 207 shown in FIG.
The processes up to are the same as the processes in the above-described first to third embodiments. Therefore, the characteristic step in the fourth embodiment is that the second semiconductor component reinforcing member 215 is placed in the laminating process in step 208.

As shown in FIGS. 22 and 24, the method of installing the second semiconductor component reinforcing member 215 is such that the second semiconductor component reinforcing member 215 is formed on the surface 125a of the fourth thermoplastic resin substrate 125 in advance in another step. So that the second semiconductor component reinforcing member 215 is embedded in the fourth thermoplastic resin base material 125 so that the parts are exposed, or as shown in FIG. 23, facing the semiconductor component 104 of the semiconductor component mounted component 101. There is a method of arranging the second semiconductor component reinforcing member 215 itself.
In the case of FIG. 24, the exposed surface 125a of the second semiconductor component reinforcing member 215 constitutes the outer surface of the semiconductor component-mounted component, so the exposed second semiconductor component reinforcing member 215 is sealed. In order to stop, it is necessary to arrange the sixth thermoplastic resin base material 255. The second semiconductor component reinforcing member 215 can be basically the same in shape and material as the first semiconductor component reinforcing member 116 described above, but the configuration of FIGS. 22 and 23 is used. Since the second semiconductor component reinforcing member 215 and the circuit pattern 119 may come into direct contact with each other, in this case,
The semiconductor component reinforcing member 215 needs to be made of a material having electrical insulation and rigidity enough to reinforce the semiconductor component 104. In addition, as an application of the configuration shown in FIG.
As shown in FIG. 25, the seventh thermoplastic resin base material 260 may be arranged between the second semiconductor component reinforcing member 215 and the semiconductor component mounted component 101.

In each of the configurations shown in FIGS. 22 to 25, a pressing process is performed along the thickness direction of the semiconductor component mounted component 101, and a laminating process is further performed, so that the semiconductor component is mounted as shown in FIG. The semiconductor component mounted completed product 106 in which the semiconductor component reinforcing members 116 and 215 are arranged on both sides in the thickness direction of 104 is completed. According to the completed semiconductor component-mounted product 106, the number of semiconductor component reinforcing members is twice that of the completed semiconductor component-mounted products in the above-described first to third embodiments, so that the semiconductor component 104 is protected. Can be performed more reliably. or,
By arranging the seventh thermoplastic resin base material 260 as shown in FIG. 25, the semiconductor component 10 against bending in the completed semiconductor component mounted product as in the case of the third embodiment described above.
The effect of preventing cracking in No. 4 is large.

Fifth Embodiment: The completed semiconductor component-mounted product of this embodiment is different from the above-described fourth embodiment in that the first semiconductor component reinforcing member 116 is not mounted and only the second semiconductor component reinforcing member 215 is provided. It has a structure. The fifth
FIG. 27 shows the completed semiconductor component-mounted product 107 of the embodiment. It is also possible to manufacture a completed semiconductor component-mounted product having a single-sided reinforcing structure in which the second semiconductor component reinforcing member 215 is arranged on the active surface side of the semiconductor component 104 like the semiconductor component-mounted completed product 107.

As described above, according to the above embodiment, the semiconductor component is embedded in the resin base material, and the semiconductor component reinforcing member is also embedded in the resin base material. An adhesive for bonding and is unnecessary. Therefore, the steps for applying and curing the adhesive are unnecessary, the productivity is better than in the past, and the material cost of the adhesive can be reduced. In addition, as described above, the semiconductor component and the semiconductor component reinforcing member are embedded in the resin base material without using the adhesive agent and the semiconductor component reinforcing member is arranged with respect to the semiconductor component. Thus, the outer surfaces of the manufactured semiconductor component mounted component and the finished semiconductor component mounted component can be flattened. Further, since the semiconductor component and the semiconductor component reinforcing member are embedded in the resin base material as described above, it is not necessary to provide the conventional hollow hole 14, and the productivity and the cost can be reduced as compared with the conventional one. You can As described above, according to each of the above-described embodiments, a high-quality, high-productivity, low-cost manufacturing method of semiconductor component-mounted components, manufacturing method of semiconductor component-mounted components, and semiconductor component-mounted components are provided. can do.

[0042]

As described above in detail, according to the method of manufacturing a semiconductor component-mounted component in the first aspect of the present invention, the first component is kept in contact with the semiconductor component and the first semiconductor component reinforcing member. Since it is embedded in the material, an adhesive for adhering the semiconductor component and the first semiconductor component reinforcing member is unnecessary, the steps for applying and curing the adhesive can be eliminated, and the cost can be reduced by reducing the material cost. Can be achieved. Further, it is not necessary to provide a conventional hollow hole. Therefore, it is possible to provide a method of manufacturing a semiconductor component-mounted component which has improved productivity and is less expensive than conventional ones. Further, as described above, the semiconductor component and the semiconductor component reinforcing member are embedded in the resin base material without using the adhesive to dispose the semiconductor component reinforcing member with respect to the semiconductor component, and thus the semiconductor component mounted component manufactured And, it is possible to flatten the outer surface of the completed semiconductor component mounted product,
It is possible to provide a method of manufacturing a component having a semiconductor component mounted thereon, which has higher quality than the conventional method.

Further, according to the method of manufacturing a semiconductor component-mounted component of the second aspect of the present invention, the semiconductor component embedded in the first base material is first embedded in the second base material in advance. By placing the component reinforcing members in contact with each other, it is possible to omit the resin base material for sealing the first semiconductor component reinforcing member, which is higher in quality than the conventional one, and productivity can be improved. Moreover, it is possible to provide an inexpensive semiconductor component mounted component.

According to the semiconductor component-mounted component of the third aspect of the present invention and the semiconductor component-mounted component of the fifth aspect of the present invention, the semiconductor component-mounted component and the semiconductor component-mounted component are: Since it is manufactured by the manufacturing method of the first aspect and the second aspect described above, it is possible to obtain a high-quality, highly productive and inexpensive semiconductor component-mounted component.

Further, according to the method for manufacturing a completed semiconductor component-mounted product of the fourth aspect of the present invention, the semiconductor component-mounted parts provided in the completed semiconductor component-mounted product are the above-mentioned first and second aspects.
Since it is manufactured by the manufacturing method according to the aspect, it is possible to provide a finished product on which semiconductor parts are mounted, which is higher in quality, improved in productivity, and cheaper than conventional products.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a semiconductor component built-in core module component according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view of a non-contact IC card having the core module component with a built-in semiconductor component shown in FIG.

FIG. 3 is a diagram for explaining a manufacturing process of the semiconductor component built-in core module component shown in FIG. 1 and the semiconductor component mounted completed product shown in FIG. 2, and is a diagram showing a semiconductor component.

FIG. 4 is a diagram for explaining a manufacturing process of the semiconductor module built-in core module component shown in FIG. 1 and the semiconductor component mounted completed product shown in FIG. 2, and a perspective view of a semiconductor component reinforcing member.

5 is a perspective view of a modified example of the semiconductor component reinforcing member shown in FIG.

FIG. 6 is a diagram for explaining a manufacturing process of the semiconductor module-embedded core module component shown in FIG. 1 and the semiconductor component-mounted finished product shown in FIG. 2, in which the semiconductor component and the semiconductor component are provided on the first thermoplastic resin substrate. It is a figure which shows the state which mounted the 1st semiconductor component reinforcement member.

FIG. 7 is a diagram for explaining a manufacturing process of the semiconductor module-embedded core module component shown in FIG. 1 and the semiconductor component-mounted completed product shown in FIG. It is a figure which shows the state pressed in to a thermoplastic resin base material.

8 is a view for explaining a manufacturing process of the semiconductor module built-in core module component shown in FIG. 1 and the semiconductor component mounted completed product shown in FIG. 2, in which the semiconductor component and the semiconductor component reinforcing member are made of the first thermoplastic resin; It is a figure which shows the state embedded in the resin base material.

FIG. 9 is a diagram for explaining the manufacturing process of the completed semiconductor component-mounted product shown in FIG. 2, and is a diagram showing a state where the core module component with a built-in semiconductor component is laminated by a flat press.

FIG. 10 is a diagram for explaining the manufacturing process of the completed semiconductor component-mounted product shown in FIG. 2, and is a diagram showing a state where the core module component with a built-in semiconductor component is laminated by a roller.

FIG. 11 is a flowchart showing a method for manufacturing a completed semiconductor component-mounted product according to the embodiment of the present invention.

FIG. 12 is a flowchart showing another method for manufacturing a completed semiconductor component-mounted product according to the embodiment of the present invention.

13 is a view for explaining the manufacturing process of the completed semiconductor component-mounted product manufactured by the manufacturing method shown in FIG. 12, showing a state of the semiconductor component embedded in the first thermoplastic resin substrate. FIG.

FIG. 14 is a view for explaining the manufacturing process of the completed semiconductor component-mounted product manufactured by the manufacturing method shown in FIG. 12, showing a state in which the first semiconductor component reinforcing member is placed on the semiconductor component. FIG.

15 is a view for explaining the manufacturing process of the completed semiconductor component-mounted product manufactured by the manufacturing method shown in FIG. 12, showing a state in which the semiconductor component and the first semiconductor component reinforcing member are sealed. FIG.

16 is a view for explaining the manufacturing process of the completed semiconductor component-mounted product manufactured by the manufacturing method shown in FIG. 12, and is a cross-sectional view showing a modified example of the manufacturing process shown in FIG.

FIG. 17 is a diagram for explaining the manufacturing process of the completed semiconductor component-mounted product manufactured by the manufacturing method shown in FIG. 12, showing a state in which the semiconductor component-mounted components shown in FIG. 15 are laminated. FIG.

FIG. 18 is a modification of the manufacturing method shown in FIG.
It is a figure for demonstrating the case where a 5th thermoplastic resin base material is provided between a semiconductor component and a 1st semiconductor component reinforcement member.

19 is a cross-sectional view of a semiconductor component mounted component manufactured by the manufacturing method shown in FIG.

FIG. 20 is a modification of the manufacturing method shown in FIG.
It is a figure for demonstrating the case where the 5th thermoplastic resin base material is provided between the resin base material in which the 1st semiconductor component reinforcement member was embedded beforehand, and a semiconductor component.

FIG. 21 is a diagram for explaining a modified example of the manufacturing method shown in FIG. 20.

FIG. 22 is a diagram showing the second step of manufacturing a completed semiconductor component mounted product including the semiconductor component mounted component shown in FIG.
It is a figure which shows the case where a semiconductor component reinforcement member is provided.

FIG. 23 is a diagram for explaining a modified example of the method for manufacturing the completed semiconductor component-mounted product shown in FIG. 22.

FIG. 24 is a diagram for explaining a modified example of the method for manufacturing the completed semiconductor component-mounted product shown in FIG. 22.

FIG. 25 is a diagram for explaining a modified example of the method for manufacturing the completed semiconductor component-mounted product shown in FIG. 22.

FIG. 26 is a cross-sectional view of a completed semiconductor component-mounted product manufactured by the manufacturing method shown in FIGS. 23 to 25.

FIG. 27 is a sectional view of a modified example of the completed semiconductor component-mounted product shown in FIG. 26.

FIG. 28 is a cross-sectional view showing a conventional semiconductor component mounted component.

FIG. 29 is a flowchart showing a manufacturing process of a conventional semiconductor component mounted component.

FIG. 30 is a diagram showing a semiconductor component included in a conventional semiconductor component mounted component.

FIG. 31 is a diagram for explaining the manufacturing process of the conventional semiconductor component-mounted component, showing the state in which the anisotropic conductive sheet is placed on the substrate.

FIG. 32 is a view for explaining a conventional manufacturing process of a semiconductor component mounted component, which is a cross-sectional view showing a state in which a circuit pattern and a semiconductor component are electrically connected through an anisotropic conductive sheet. is there.

FIG. 33 is a diagram for explaining the conventional manufacturing process of the semiconductor component mounted component, showing the state in which the adhesive is provided on the semiconductor component mounted on the substrate.

FIG. 34 is a diagram for explaining a manufacturing process of a conventional completed semiconductor component-mounted product.

FIG. 35 is a cross-sectional view showing a conventional completed semiconductor component-mounted product.

[Explanation of symbols]

100 ... Non-contact IC card, 101 ... Core module component with built-in semiconductor component, 104 ... Semiconductor component, 104a ... Back surface, 113 ... Bump, 116 ... First semiconductor component reinforcing member, 122 ... First thermoplastic resin base material, 124 ... Third thermoplastic resin base material, 125 ... Fourth thermoplastic resin base material, 222
... A second thermoplastic resin base material.

Claims (7)

[Claims] 1. A back surface (104) of a semiconductor component (104).
The first semiconductor component reinforcing member (116) for reinforcing the semiconductor component is provided in contact with a), and the semiconductor component and the first semiconductor component are in contact with the semiconductor component and the first semiconductor component reinforcing member. A semiconductor component is mounted, wherein the component reinforcing member and the first base material (122) are relatively pressed to embed the semiconductor component and the first semiconductor component reinforcing member in the first base material. Manufacturing method of parts. 2. After the burying operation, a circuit forming surface (123) of the first base material, from which an electrode portion (113) formed on an active surface of the semiconductor component facing the back surface is exposed, A circuit pattern (119) is formed by contacting the electrode portion with a conductive paste or metal plating,
A method of manufacturing a semiconductor component-mounted component according to claim 1. 3. A semiconductor component (104) and a first substrate (12).
2) is relatively pressed to embed the semiconductor component in the first base material, and the second base material (1) in which the first semiconductor component reinforcing member (116) for reinforcing the semiconductor component is embedded in advance. 222) to the back surface (10) of the semiconductor component embedded in the first base material.
4a) side, the semiconductor component and the first semiconductor component reinforcing member are arranged so as to overlap with each other, the first base material and the second base material are joined, and after the joining, they face the back surface. The electrode part (113) formed on the active surface of the semiconductor component is exposed to the circuit forming surface (123) of the first base material by contacting the electrode part with a conductive paste or metal plating. A method of manufacturing a semiconductor component mounted component, comprising forming a circuit pattern (119). 4. A semiconductor component-mounted component manufactured by the method for manufacturing a semiconductor component-mounted component according to claim 2 or 3. 5. A semiconductor component-mounted component is manufactured by the method for manufacturing a semiconductor component-mounted component according to claim 2 or 3, and a third substrate (124) and a fourth component are formed in the thickness direction of the first substrate. A method of manufacturing a completed semiconductor component-mounted product, comprising laminating the semiconductor component-mounted component on a base material (125). 6. When the fourth base material is arranged on the circuit forming surface side of the first base material, the second semiconductor component reinforcing member (in advance) is provided on the fourth base material so as to face the semiconductor component. 21
The method for manufacturing a completed semiconductor component-mounted product according to claim 5, wherein 5) is embedded. 7. A completed semiconductor component-mounted product manufactured by the method for manufacturing a completed semiconductor component-mounted product according to claim 5 or 6.