JP2002532913A - 熱伝達増加装置 - Google Patents

熱伝達増加装置

Info

Publication number
JP2002532913A
JP2002532913A JP2000589016A JP2000589016A JP2002532913A JP 2002532913 A JP2002532913 A JP 2002532913A JP 2000589016 A JP2000589016 A JP 2000589016A JP 2000589016 A JP2000589016 A JP 2000589016A JP 2002532913 A JP2002532913 A JP 2002532913A
Authority
JP
Japan
Prior art keywords
air
cabinet
nozzle
membrane
flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000589016A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002532913A5 (enExample
Inventor
カール， ヘンリック トゥルステッド，
パトリック ベルイマン，
アンデルス エドグレン，
Original Assignee
テレフオンアクチーボラゲット エル エム エリクソン（パブル）
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by テレフオンアクチーボラゲット エル エム エリクソン（パブル） filed Critical テレフオンアクチーボラゲット エル エム エリクソン（パブル）
Publication of JP2002532913A publication Critical patent/JP2002532913A/ja
Publication of JP2002532913A5 publication Critical patent/JP2002532913A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B35/00—Piston pumps specially adapted for elastic fluids and characterised by the driving means to their working members, or by combination with, or adaptation to, specific driving engines or motors, not otherwise provided for
    • F04B35/04—Piston pumps specially adapted for elastic fluids and characterised by the driving means to their working members, or by combination with, or adaptation to, specific driving engines or motors, not otherwise provided for the means being electric
    • F04B35/045—Piston pumps specially adapted for elastic fluids and characterised by the driving means to their working members, or by combination with, or adaptation to, specific driving engines or motors, not otherwise provided for the means being electric using solenoids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F28F13/10—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by imparting a pulsating motion to the flow, e.g. by sonic vibration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/18, H10D48/04 and H10D48/07, with or without impurities, e.g. doping materials
    • H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
    • H01L21/461—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/465—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/467—Chemical or electrical treatment, e.g. electrolytic etching using masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Shaping By String And By Release Of Stress In Plastics And The Like (AREA)
  • Thermotherapy And Cooling Therapy Devices (AREA)
  • Cookers (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
JP2000589016A 1998-12-11 1999-11-23 熱伝達増加装置 Pending JP2002532913A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE9804299A SE514735C2 (sv) 1998-12-11 1998-12-11 Anordning för ökande av värmeavgivning
SE9804299-7 1998-12-11
PCT/SE1999/002166 WO2000036892A1 (en) 1998-12-11 1999-11-23 Device for increasing heat transfer

Publications (2)

Publication Number Publication Date
JP2002532913A true JP2002532913A (ja) 2002-10-02
JP2002532913A5 JP2002532913A5 (enExample) 2007-01-25

Family

ID=20413634

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000589016A Pending JP2002532913A (ja) 1998-12-11 1999-11-23 熱伝達増加装置

Country Status (10)

Country Link
US (1) US6252769B1 (enExample)
EP (1) EP1142461A2 (enExample)
JP (1) JP2002532913A (enExample)
KR (1) KR20010089446A (enExample)
CN (1) CN1201647C (enExample)
AU (1) AU2011400A (enExample)
BR (1) BR9916137A (enExample)
CA (1) CA2351687C (enExample)
SE (1) SE514735C2 (enExample)
WO (1) WO2000036892A1 (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006297295A (ja) * 2005-04-21 2006-11-02 Sony Corp 噴流発生装置及び電子機器
JP2006320892A (ja) * 2005-04-18 2006-11-30 Sony Corp 振動装置、噴流発生装置及び電子機器
JP2007527618A (ja) * 2003-07-07 2007-09-27 ジョージア テック リサーチ コーポレイション 分配された合成ジェットアクチュエータを使用する熱管理のためのシステムおよび方法
JP2008519380A (ja) * 2004-11-03 2008-06-05 ザイラテックス・テクノロジー・リミテッド ハードディスクドライブの温度制御装置およびハードディスクドライブの温度変更方法
US8325477B2 (en) 2005-04-18 2012-12-04 Sony Corporation Vibrating device, jet flow generating device, electronic device, and manufacturing method of vibrating device
JP2021528622A (ja) * 2018-06-21 2021-10-21 イェスタムプ・ハードテック・アクチエボラーグ 高温構成部材を冷却する方法およびシステム

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EP1415342B1 (de) * 2001-07-30 2006-06-07 BISTEKOS, Michael-Georg Einrichtung zur kühlung von gehausen, raumen, bauteilen, medien u. dgl
US6904968B2 (en) * 2001-09-14 2005-06-14 Hewlett-Packard Development Company, L.P. Method and apparatus for individually cooling components of electronic systems
US7061161B2 (en) * 2002-02-15 2006-06-13 Siemens Technology-To-Business Center Llc Small piezoelectric air pumps with unobstructed airflow
US6801430B1 (en) * 2003-05-09 2004-10-05 Intel Corporation Actuation membrane to reduce an ambient temperature of heat generating device
WO2004103048A2 (en) * 2003-05-09 2004-11-25 Intel Corporation An actuation membrane for application to a card slot of a system
US6937472B2 (en) * 2003-05-09 2005-08-30 Intel Corporation Apparatus for cooling heat generating components within a computer system enclosure
US7269005B2 (en) * 2003-11-21 2007-09-11 Intel Corporation Pumped loop cooling with remote heat exchanger and display cooling
US7527086B2 (en) * 2004-07-20 2009-05-05 National Taiwan University Double-acting device for generating synthetic jets
US7252140B2 (en) * 2004-09-03 2007-08-07 Nuveatix, Inc. Apparatus and method for enhanced heat transfer
CN100388872C (zh) * 2004-09-29 2008-05-14 鸿进科技有限公司 散热装置及散热方法
US8755177B2 (en) * 2005-09-16 2014-06-17 Xyratex Technology Limited Method and apparatus for controlling the temperature of a disk drive during manufacture
US20070146993A1 (en) * 2005-12-23 2007-06-28 Intel Corporation Method, apparatus and computer system for enhancement of thermal energy transfer
FR2900308B1 (fr) * 2006-04-21 2008-07-04 D Aviat Latecoere Societeanony Diaphragme dispose sur un circuit de ventilation d'un meuble electronique, meuble electronique correspondant et utilisation particuliere de ce diaphragme
US8549912B2 (en) 2007-12-18 2013-10-08 Teradyne, Inc. Disk drive transport, clamping and testing
US7996174B2 (en) 2007-12-18 2011-08-09 Teradyne, Inc. Disk drive testing
US20090262455A1 (en) 2008-04-17 2009-10-22 Teradyne, Inc. Temperature Control Within Disk Drive Testing Systems
US8102173B2 (en) 2008-04-17 2012-01-24 Teradyne, Inc. Thermal control system for test slot of test rack for disk drive testing system with thermoelectric device and a cooling conduit
US8305751B2 (en) 2008-04-17 2012-11-06 Teradyne, Inc. Vibration isolation within disk drive testing systems
US8117480B2 (en) * 2008-04-17 2012-02-14 Teradyne, Inc. Dependent temperature control within disk drive testing systems
US8041449B2 (en) 2008-04-17 2011-10-18 Teradyne, Inc. Bulk feeding disk drives to disk drive testing systems
US8238099B2 (en) 2008-04-17 2012-08-07 Teradyne, Inc. Enclosed operating area for disk drive testing systems
US7848106B2 (en) 2008-04-17 2010-12-07 Teradyne, Inc. Temperature control within disk drive testing systems
US8095234B2 (en) 2008-04-17 2012-01-10 Teradyne, Inc. Transferring disk drives within disk drive testing systems
US8160739B2 (en) 2008-04-17 2012-04-17 Teradyne, Inc. Transferring storage devices within storage device testing systems
US7945424B2 (en) 2008-04-17 2011-05-17 Teradyne, Inc. Disk drive emulator and method of use thereof
MY149779A (en) 2008-06-03 2013-10-14 Teradyne Inc Processing storage devices
EP2321443B1 (en) * 2008-08-11 2015-07-22 Veeco Instruments Inc. Vacuum deposition sources having heated effusion orifices
US8547123B2 (en) 2009-07-15 2013-10-01 Teradyne, Inc. Storage device testing system with a conductive heating assembly
US8116079B2 (en) 2009-07-15 2012-02-14 Teradyne, Inc. Storage device testing system cooling
US7995349B2 (en) 2009-07-15 2011-08-09 Teradyne, Inc. Storage device temperature sensing
US7920380B2 (en) 2009-07-15 2011-04-05 Teradyne, Inc. Test slot cooling system for a storage device testing system
US8628239B2 (en) 2009-07-15 2014-01-14 Teradyne, Inc. Storage device temperature sensing
US8687356B2 (en) 2010-02-02 2014-04-01 Teradyne, Inc. Storage device testing system cooling
US8466699B2 (en) 2009-07-15 2013-06-18 Teradyne, Inc. Heating storage devices in a testing system
US9779780B2 (en) 2010-06-17 2017-10-03 Teradyne, Inc. Damping vibrations within storage device testing systems
US8687349B2 (en) 2010-07-21 2014-04-01 Teradyne, Inc. Bulk transfer of storage devices using manual loading
US9001456B2 (en) 2010-08-31 2015-04-07 Teradyne, Inc. Engaging test slots
EP2721345A2 (en) 2011-06-20 2014-04-23 Koninklijke Philips N.V. Active cooling device with electro-statically moving electrode and method of active cooling with electro-statically moving electrode
CN103987234B (zh) * 2013-02-08 2017-08-29 台达电子工业股份有限公司 散热装置
US9459312B2 (en) 2013-04-10 2016-10-04 Teradyne, Inc. Electronic assembly test system
US20150192119A1 (en) * 2014-01-08 2015-07-09 Samsung Electro-Mechanics Co., Ltd. Piezoelectric blower
US10018429B2 (en) * 2014-08-13 2018-07-10 Asia Vital Components Co., Ltd. Apparatus body heat dissipation device
US10045461B1 (en) * 2014-09-30 2018-08-07 Apple Inc. Electronic device with diaphragm cooling
US10725091B2 (en) 2017-08-28 2020-07-28 Teradyne, Inc. Automated test system having multiple stages
US10948534B2 (en) 2017-08-28 2021-03-16 Teradyne, Inc. Automated test system employing robotics
US11226390B2 (en) 2017-08-28 2022-01-18 Teradyne, Inc. Calibration process for an automated test system
US10845410B2 (en) 2017-08-28 2020-11-24 Teradyne, Inc. Automated test system having orthogonal robots
US10983145B2 (en) 2018-04-24 2021-04-20 Teradyne, Inc. System for testing devices inside of carriers
US10775408B2 (en) 2018-08-20 2020-09-15 Teradyne, Inc. System for testing devices inside of carriers
US11754622B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Thermal control system for an automated test system
US11953519B2 (en) 2020-10-22 2024-04-09 Teradyne, Inc. Modular automated test system
US11899042B2 (en) 2020-10-22 2024-02-13 Teradyne, Inc. Automated test system
US11867749B2 (en) 2020-10-22 2024-01-09 Teradyne, Inc. Vision system for an automated test system
US11754596B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Test site configuration in an automated test system
US12007411B2 (en) 2021-06-22 2024-06-11 Teradyne, Inc. Test socket having an automated lid

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US5104626A (en) * 1990-09-07 1992-04-14 Yang Tai Her Vibrating diffusion type aromatic device
EP0601516B1 (en) * 1992-12-07 1998-10-07 Hitachi, Ltd. Cooling device
SE508435C2 (sv) * 1993-02-23 1998-10-05 Erik Stemme Förträngningspump av membranpumptyp
US5522712A (en) * 1993-12-08 1996-06-04 Winn; Ray Low-powered cooling fan for dissipating heat
DE4422743A1 (de) * 1994-06-29 1996-01-04 Torsten Gerlach Mikropumpe
JPH08330488A (ja) * 1995-05-30 1996-12-13 Sumitomo Metal Ind Ltd 圧電ファン付きヒートシンク
US5861703A (en) * 1997-05-30 1999-01-19 Motorola Inc. Low-profile axial-flow single-blade piezoelectric fan
US5901037A (en) * 1997-06-18 1999-05-04 Northrop Grumman Corporation Closed loop liquid cooling for semiconductor RF amplifier modules
US5914856A (en) * 1997-07-23 1999-06-22 Litton Systems, Inc. Diaphragm pumped air cooled planar heat exchanger
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US6043978A (en) * 1997-12-15 2000-03-28 Eaton Corporation Cooling device for circuit breakers

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007527618A (ja) * 2003-07-07 2007-09-27 ジョージア テック リサーチ コーポレイション 分配された合成ジェットアクチュエータを使用する熱管理のためのシステムおよび方法
JP2008519380A (ja) * 2004-11-03 2008-06-05 ザイラテックス・テクノロジー・リミテッド ハードディスクドライブの温度制御装置およびハードディスクドライブの温度変更方法
JP4797023B2 (ja) * 2004-11-03 2011-10-19 ザイラテックス・テクノロジー・リミテッド ハードディスクドライブの温度制御装置およびハードディスクドライブの温度変更方法
JP2006320892A (ja) * 2005-04-18 2006-11-30 Sony Corp 振動装置、噴流発生装置及び電子機器
US8325477B2 (en) 2005-04-18 2012-12-04 Sony Corporation Vibrating device, jet flow generating device, electronic device, and manufacturing method of vibrating device
JP2006297295A (ja) * 2005-04-21 2006-11-02 Sony Corp 噴流発生装置及び電子機器
JP2021528622A (ja) * 2018-06-21 2021-10-21 イェスタムプ・ハードテック・アクチエボラーグ 高温構成部材を冷却する方法およびシステム

Also Published As

Publication number Publication date
CN1201647C (zh) 2005-05-11
SE9804299L (sv) 2000-06-12
EP1142461A2 (en) 2001-10-10
US6252769B1 (en) 2001-06-26
CA2351687A1 (en) 2000-06-22
KR20010089446A (ko) 2001-10-06
SE514735C2 (sv) 2001-04-09
WO2000036892A1 (en) 2000-06-22
BR9916137A (pt) 2001-09-11
CA2351687C (en) 2007-06-12
SE9804299D0 (sv) 1998-12-11
CN1330859A (zh) 2002-01-09
AU2011400A (en) 2000-07-03
WO2000036892A8 (en) 2000-08-03

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