JP2002531933A5 - - Google Patents

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Publication number
JP2002531933A5
JP2002531933A5 JP2000585032A JP2000585032A JP2002531933A5 JP 2002531933 A5 JP2002531933 A5 JP 2002531933A5 JP 2000585032 A JP2000585032 A JP 2000585032A JP 2000585032 A JP2000585032 A JP 2000585032A JP 2002531933 A5 JP2002531933 A5 JP 2002531933A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2000585032A
Other versions
JP2002531933A (ja
Filing date
Publication date
Priority claimed from US09/201,928 external-priority patent/US6103628A/en
Application filed filed Critical
Publication of JP2002531933A publication Critical patent/JP2002531933A/ja
Publication of JP2002531933A5 publication Critical patent/JP2002531933A5/ja
Withdrawn legal-status Critical Current

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JP2000585032A 1998-12-01 1999-11-19 装填可能なハウジングを備えた反転可能な線形ポリッシャー Withdrawn JP2002531933A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/201,928 US6103628A (en) 1998-12-01 1998-12-01 Reverse linear polisher with loadable housing
US09/201,928 1998-12-01
PCT/US1999/027477 WO2000032356A1 (en) 1998-12-01 1999-11-19 Reverse linear polisher with loadable housing

Publications (2)

Publication Number Publication Date
JP2002531933A JP2002531933A (ja) 2002-09-24
JP2002531933A5 true JP2002531933A5 (ja) 2007-01-18

Family

ID=22747860

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000585032A Withdrawn JP2002531933A (ja) 1998-12-01 1999-11-19 装填可能なハウジングを備えた反転可能な線形ポリッシャー

Country Status (10)

Country Link
US (2) US6103628A (ja)
EP (1) EP1135236B1 (ja)
JP (1) JP2002531933A (ja)
KR (1) KR100638798B1 (ja)
CN (1) CN1131765C (ja)
AT (1) ATE280014T1 (ja)
AU (1) AU1629900A (ja)
DE (1) DE69921354T2 (ja)
TW (1) TW425332B (ja)
WO (1) WO2000032356A1 (ja)

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US6607425B1 (en) 2000-12-21 2003-08-19 Lam Research Corporation Pressurized membrane platen design for improving performance in CMP applications
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US6503131B1 (en) 2001-08-16 2003-01-07 Applied Materials, Inc. Integrated platen assembly for a chemical mechanical planarization system
US7121919B2 (en) * 2001-08-30 2006-10-17 Micron Technology, Inc. Chemical mechanical polishing system and process
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US6776693B2 (en) 2001-12-19 2004-08-17 Applied Materials Inc. Method and apparatus for face-up substrate polishing
US6722946B2 (en) * 2002-01-17 2004-04-20 Nutool, Inc. Advanced chemical mechanical polishing system with smart endpoint detection
US20030146102A1 (en) * 2002-02-05 2003-08-07 Applied Materials, Inc. Method for forming copper interconnects
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US6939203B2 (en) 2002-04-18 2005-09-06 Asm Nutool, Inc. Fluid bearing slide assembly for workpiece polishing
US7799200B1 (en) 2002-07-29 2010-09-21 Novellus Systems, Inc. Selective electrochemical accelerator removal
US7138039B2 (en) * 2003-01-21 2006-11-21 Applied Materials, Inc. Liquid isolation of contact rings
US7087144B2 (en) * 2003-01-31 2006-08-08 Applied Materials, Inc. Contact ring with embedded flexible contacts
US7025861B2 (en) * 2003-02-06 2006-04-11 Applied Materials Contact plating apparatus
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US8158532B2 (en) 2003-10-20 2012-04-17 Novellus Systems, Inc. Topography reduction and control by selective accelerator removal
US8530359B2 (en) 2003-10-20 2013-09-10 Novellus Systems, Inc. Modulated metal removal using localized wet etching
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US20050218000A1 (en) * 2004-04-06 2005-10-06 Applied Materials, Inc. Conditioning of contact leads for metal plating systems
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US8168540B1 (en) 2009-12-29 2012-05-01 Novellus Systems, Inc. Methods and apparatus for depositing copper on tungsten
JP2017148931A (ja) * 2016-02-19 2017-08-31 株式会社荏原製作所 研磨装置および研磨方法
KR102339948B1 (ko) * 2019-07-02 2021-12-17 (주)미래컴퍼니 연마 시스템 및 연마 방법
CN111955945A (zh) * 2020-08-27 2020-11-20 代永金 一种中医药柜的驱动装置
CN116833900B (zh) * 2023-07-31 2024-01-26 广东工业大学 一种用于半导体晶片化学机械抛光的磁流变弹性抛光垫、制备方法及其应用

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