JP2002526794A5 - - Google Patents
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- Publication number
- JP2002526794A5 JP2002526794A5 JP2000572721A JP2000572721A JP2002526794A5 JP 2002526794 A5 JP2002526794 A5 JP 2002526794A5 JP 2000572721 A JP2000572721 A JP 2000572721A JP 2000572721 A JP2000572721 A JP 2000572721A JP 2002526794 A5 JP2002526794 A5 JP 2002526794A5
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- JP
- Japan
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Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10269498P | 1998-10-01 | 1998-10-01 | |
| US60/102,694 | 1998-10-01 | ||
| US09/406,007 US6127086A (en) | 1998-10-01 | 1999-09-24 | Photosensitive resin compositions |
| US09/406,007 | 1999-09-24 | ||
| PCT/US1999/022618 WO2000019275A1 (en) | 1998-10-01 | 1999-09-29 | Novel photosensitive resin compositions |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002526794A JP2002526794A (ja) | 2002-08-20 |
| JP2002526794A5 true JP2002526794A5 (US07585860-20090908-C00083.png) | 2005-12-22 |
| JP4088910B2 JP4088910B2 (ja) | 2008-05-21 |
Family
ID=26799635
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000572721A Expired - Fee Related JP4088910B2 (ja) | 1998-10-01 | 1999-09-29 | 新規な感光性樹脂組成物 |
Country Status (8)
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6214516B1 (en) * | 1998-10-01 | 2001-04-10 | Arch Specialty Chemicals, Inc. | Photosensitive resin compositions |
| EP1554033A4 (en) | 2002-02-06 | 2007-12-05 | Fujifilm Electronic Materials | IMPROVED COMPOSITIONS FOR REMOVING BORED BEADS OF SEMICONDUCTOR LOADING BUFFER COATINGS AND METHOD FOR THEIR USE |
| JP4317870B2 (ja) * | 2003-03-11 | 2009-08-19 | フジフィルム・エレクトロニック・マテリアルズ・ユーエスエイ・インコーポレイテッド | 新規な感光性樹脂組成物 |
| WO2004081057A2 (en) * | 2003-03-11 | 2004-09-23 | Arch Specialty Chemicals, Inc. | Novel photosensitive resin compositions |
| KR20060002768A (ko) * | 2003-03-11 | 2006-01-09 | 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. | 새로운 감광성 수지 조성물들 |
| US7195849B2 (en) * | 2003-03-11 | 2007-03-27 | Arch Specialty Chemicals, Inc. | Photosensitive resin compositions |
| KR101067825B1 (ko) * | 2003-06-05 | 2011-09-27 | 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. | 신규한 포지티브 감광성 수지 조성물들 |
| TW200512543A (en) * | 2003-08-06 | 2005-04-01 | Sumitomo Bakelite Co | Polyamide resin, positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device |
| TWI363249B (en) * | 2003-10-15 | 2012-05-01 | Fujifilm Electronic Materials | Novel photosensitive resin compositions |
| JP2008546204A (ja) * | 2005-06-03 | 2008-12-18 | フジフィルム・エレクトロニック・マテリアルズ・ユーエスエイ・インコーポレイテッド | 前処理組成物 |
| JP4530949B2 (ja) * | 2005-08-29 | 2010-08-25 | 富士フイルム株式会社 | 感光性樹脂組成物及びそれを用いた半導体装置の製造方法 |
| US20090111050A1 (en) * | 2007-10-16 | 2009-04-30 | Naiini Ahmad A | Novel Photosensitive Resin Compositions |
| US11634529B2 (en) | 2017-06-16 | 2023-04-25 | Fujifilm Electronic Materials U.S.A., Inc. | Multilayer structure |
Family Cites Families (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2931297A1 (de) * | 1979-08-01 | 1981-02-19 | Siemens Ag | Waermebestaendige positivresists und verfahren zur herstellung waermebestaendiger reliefstrukturen |
| JPS57202536A (en) * | 1981-06-09 | 1982-12-11 | Fujitsu Ltd | Positive type resist composition |
| US4684597A (en) * | 1985-10-25 | 1987-08-04 | Eastman Kodak Company | Non-precipitating quinone diazide polymer containing photoresist composition with o-quinone diazide trisester as dissolution inhibitor |
| US5037720A (en) * | 1987-07-21 | 1991-08-06 | Hoechst Celanese Corporation | Hydroxylated aromatic polyamide polymer containing bound naphthoquinone diazide photosensitizer, method of making and use |
| US4957846A (en) * | 1988-12-27 | 1990-09-18 | Olin Hunt Specialty Products Inc. | Radiation sensitive compound and mixtures with trinuclear novolak oligomer with o-naphthoquinone diazide sulfonyl group |
| EP0388482B1 (de) * | 1989-03-20 | 1994-07-06 | Siemens Aktiengesellschaft | Lichtempfindliches Gemisch |
| JPH087434B2 (ja) * | 1989-10-30 | 1996-01-29 | 日本ゼオン株式会社 | ポジ型レジスト組成物 |
| JP2813033B2 (ja) * | 1990-05-25 | 1998-10-22 | 東京応化工業株式会社 | ポジ型感光性樹脂組成物 |
| DE69131529T2 (de) * | 1990-05-29 | 2000-01-20 | Sumitomo Bakelite Co | Positiv arbeitende lichtempfindliche Harzzusammensetzung |
| JP2877895B2 (ja) * | 1990-05-29 | 1999-04-05 | 住友ベークライト株式会社 | ポジ型感光性樹脂組成物 |
| JPH087436B2 (ja) * | 1990-07-06 | 1996-01-29 | 住友ベークライト株式会社 | 感光性ジアゾキノン化合物及びそれを用いたポジ型感光性樹脂組成物 |
| JPH04251849A (ja) * | 1991-01-29 | 1992-09-08 | Fuji Photo Film Co Ltd | 感電離放射線性樹脂組成物 |
| JP3000705B2 (ja) * | 1991-03-20 | 2000-01-17 | 日本ゼオン株式会社 | ポジ型レジスト組成物 |
| JPH0548063A (ja) * | 1991-03-25 | 1993-02-26 | Hitachi Ltd | カラー固体撮像素子及びその製造方法 |
| JP2817441B2 (ja) * | 1991-03-29 | 1998-10-30 | 日本ゼオン株式会社 | ポジ型レジスト組成物 |
| JP2981024B2 (ja) * | 1991-07-05 | 1999-11-22 | 住友ベークライト株式会社 | ポジ型感光性樹脂組成物 |
| JPH0537720A (ja) * | 1991-07-31 | 1993-02-12 | Kuraray Co Ltd | 光学読取り装置用のパツド |
| US5296330A (en) * | 1991-08-30 | 1994-03-22 | Ciba-Geigy Corp. | Positive photoresists containing quinone diazide photosensitizer, alkali-soluble resin and tetra(hydroxyphenyl) alkane additive |
| US5302489A (en) * | 1991-10-29 | 1994-04-12 | E. I. Du Pont De Nemours And Company | Positive photoresist compositions containing base polymer which is substantially insoluble at pH between 7 and 10, quinonediazide acid generator and silanol solubility enhancer |
| JP2626479B2 (ja) * | 1993-06-29 | 1997-07-02 | 日本ゼオン株式会社 | ポジ型レジスト組成物 |
| JPH07168355A (ja) * | 1993-12-13 | 1995-07-04 | Sumitomo Chem Co Ltd | ポジ型レジスト組成物 |
| JPH0895240A (ja) * | 1994-07-26 | 1996-04-12 | Nippon Zeon Co Ltd | ポジ型レジスト組成物 |
| US5541033A (en) * | 1995-02-01 | 1996-07-30 | Ocg Microelectronic Materials, Inc. | Selected o-quinonediazide sulfonic acid esters of phenolic compounds and their use in radiation-sensitive compositions |
| JP3499032B2 (ja) * | 1995-02-02 | 2004-02-23 | ダウ コーニング アジア株式会社 | 放射線硬化性組成物、その硬化方法及びパターン形成方法 |
| JP3664334B2 (ja) * | 1995-04-27 | 2005-06-22 | 富士写真フイルム株式会社 | ポジ型フォトレジスト組成物 |
| JPH0915853A (ja) * | 1995-04-27 | 1997-01-17 | Fuji Photo Film Co Ltd | ポジ型フォトレジスト組成物 |
| JP3467118B2 (ja) * | 1995-05-24 | 2003-11-17 | 富士写真フイルム株式会社 | ポジ型フォトレジスト組成物 |
| JPH09127690A (ja) * | 1995-10-30 | 1997-05-16 | Shin Etsu Chem Co Ltd | ポジ型フォトレジスト材料 |
| US5856065A (en) * | 1996-03-27 | 1999-01-05 | Olin Microelectronic Chemicals, Inc. | Negative working photoresist composition based on polyimide primers |
| US6051358A (en) * | 1997-11-04 | 2000-04-18 | Shipley Company, L.L.C. | Photoresist with novel photoactive compound |
| JP3449933B2 (ja) * | 1997-12-09 | 2003-09-22 | 住友ベークライト株式会社 | ポジ型感光性樹脂組成物及びそれを用いた半導体装置 |
| JP3992351B2 (ja) * | 1998-03-12 | 2007-10-17 | 住友ベークライト株式会社 | ポジ型感光性樹脂組成物及びそれを用いた半導体装置 |
| JP3369471B2 (ja) * | 1998-05-29 | 2003-01-20 | 東京応化工業株式会社 | ポジ型ホトレジスト組成物およびレジストパターンの形成方法 |
| JP2000019724A (ja) * | 1998-06-30 | 2000-01-21 | Fuji Photo Film Co Ltd | 感光性樹脂組成物 |
-
1999
- 1999-09-24 US US09/406,007 patent/US6127086A/en not_active Expired - Lifetime
- 1999-09-29 AT AT99950005T patent/ATE385324T1/de not_active IP Right Cessation
- 1999-09-29 JP JP2000572721A patent/JP4088910B2/ja not_active Expired - Fee Related
- 1999-09-29 WO PCT/US1999/022618 patent/WO2000019275A1/en active IP Right Grant
- 1999-09-29 EP EP99950005A patent/EP1171802B1/en not_active Expired - Lifetime
- 1999-09-29 DE DE69938082T patent/DE69938082T2/de not_active Expired - Lifetime
- 1999-09-29 KR KR1020017004132A patent/KR100767197B1/ko not_active IP Right Cessation
- 1999-11-17 TW TW088116829A patent/TWI229238B/zh not_active IP Right Cessation
