JP2002517913A5 - - Google Patents
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- Publication number
- JP2002517913A5 JP2002517913A5 JP2000553632A JP2000553632A JP2002517913A5 JP 2002517913 A5 JP2002517913 A5 JP 2002517913A5 JP 2000553632 A JP2000553632 A JP 2000553632A JP 2000553632 A JP2000553632 A JP 2000553632A JP 2002517913 A5 JP2002517913 A5 JP 2002517913A5
- Authority
- JP
- Japan
- Prior art keywords
- filler ring
- lower portion
- screws
- gap forming
- filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/095,167 US6013984A (en) | 1998-06-10 | 1998-06-10 | Ion energy attenuation method by determining the required number of ion collisions |
| US09/095,167 | 1998-06-10 | ||
| PCT/US1999/013168 WO1999064644A1 (en) | 1998-06-10 | 1999-06-10 | Ion energy attenuation |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002517913A JP2002517913A (ja) | 2002-06-18 |
| JP2002517913A5 true JP2002517913A5 (enExample) | 2006-08-10 |
| JP4933692B2 JP4933692B2 (ja) | 2012-05-16 |
Family
ID=22250357
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000553632A Expired - Fee Related JP4933692B2 (ja) | 1998-06-10 | 1999-06-10 | イオンエネルギの低減 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6013984A (enExample) |
| EP (1) | EP1097253B1 (enExample) |
| JP (1) | JP4933692B2 (enExample) |
| KR (1) | KR100626905B1 (enExample) |
| AT (1) | ATE230810T1 (enExample) |
| DE (1) | DE69904826T2 (enExample) |
| WO (1) | WO1999064644A1 (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6475336B1 (en) | 2000-10-06 | 2002-11-05 | Lam Research Corporation | Electrostatically clamped edge ring for plasma processing |
| US6896765B2 (en) * | 2002-09-18 | 2005-05-24 | Lam Research Corporation | Method and apparatus for the compensation of edge ring wear in a plasma processing chamber |
| US7252738B2 (en) * | 2002-09-20 | 2007-08-07 | Lam Research Corporation | Apparatus for reducing polymer deposition on a substrate and substrate support |
| US20060043067A1 (en) * | 2004-08-26 | 2006-03-02 | Lam Research Corporation | Yttria insulator ring for use inside a plasma chamber |
| US20070032081A1 (en) * | 2005-08-08 | 2007-02-08 | Jeremy Chang | Edge ring assembly with dielectric spacer ring |
| US20080289766A1 (en) * | 2007-05-22 | 2008-11-27 | Samsung Austin Semiconductor Lp | Hot edge ring apparatus and method for increased etch rate uniformity and reduced polymer buildup |
| WO2010062345A2 (en) * | 2008-10-31 | 2010-06-03 | Lam Research Corporation | Lower electrode assembly of plasma processing chamber |
| JP5808750B2 (ja) * | 2009-11-30 | 2015-11-10 | ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ | 傾斜側壁を備える静電チャック |
| DE202010015933U1 (de) | 2009-12-01 | 2011-03-31 | Lam Research Corp.(N.D.Ges.D.Staates Delaware), Fremont | Eine Randringanordnung für Plasmaätzkammern |
| US20110297088A1 (en) * | 2010-06-04 | 2011-12-08 | Texas Instruments Incorporated | Thin edge carrier ring |
| US9997381B2 (en) | 2013-02-18 | 2018-06-12 | Lam Research Corporation | Hybrid edge ring for plasma wafer processing |
| US10804081B2 (en) | 2013-12-20 | 2020-10-13 | Lam Research Corporation | Edge ring dimensioned to extend lifetime of elastomer seal in a plasma processing chamber |
| JP2016134572A (ja) * | 2015-01-21 | 2016-07-25 | ルネサスエレクトロニクス株式会社 | 半導体製造装置およびその管理方法、並びに半導体装置の製造方法 |
| KR102383784B1 (ko) * | 2017-12-15 | 2022-04-08 | 램 리써치 코포레이션 | 플라즈마 챔버에서 사용하기 위한 링 구조체들 및 시스템들 |
| JP2020140983A (ja) | 2019-02-26 | 2020-09-03 | キオクシア株式会社 | 半導体製造装置 |
| GB202012560D0 (en) * | 2020-08-12 | 2020-09-23 | Spts Technologies Ltd | Apparatus and method |
| KR102327270B1 (ko) * | 2020-12-03 | 2021-11-17 | 피에스케이 주식회사 | 지지 유닛, 기판 처리 장치, 그리고 기판 처리 방법 |
| JP2024514105A (ja) * | 2021-04-07 | 2024-03-28 | ラム リサーチ コーポレーション | プラズマシース特性を制御するためのシステムおよび方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59132623A (ja) * | 1983-01-20 | 1984-07-30 | Ulvac Corp | ドライエツチング用電極 |
| US5391275A (en) * | 1990-03-02 | 1995-02-21 | Applied Materials, Inc. | Method for preparing a shield to reduce particles in a physical vapor deposition chamber |
| US5298720A (en) * | 1990-04-25 | 1994-03-29 | International Business Machines Corporation | Method and apparatus for contamination control in processing apparatus containing voltage driven electrode |
| US5620525A (en) * | 1990-07-16 | 1997-04-15 | Novellus Systems, Inc. | Apparatus for supporting a substrate and introducing gas flow doximate to an edge of the substrate |
| US5539609A (en) * | 1992-12-02 | 1996-07-23 | Applied Materials, Inc. | Electrostatic chuck usable in high density plasma |
| JPH06188108A (ja) * | 1992-12-21 | 1994-07-08 | Canon Inc | 薄膜抵抗器の製造方法、成膜装置用防着板及び成膜装置 |
| GB9317170D0 (en) * | 1993-08-18 | 1993-10-06 | Applied Vision Ltd | Improvements in physical vapour deposition apparatus |
| US5606485A (en) * | 1994-07-18 | 1997-02-25 | Applied Materials, Inc. | Electrostatic chuck having improved erosion resistance |
| US5572398A (en) * | 1994-11-14 | 1996-11-05 | Hewlett-Packard Co. | Tri-polar electrostatic chuck |
| US5740009A (en) * | 1996-11-29 | 1998-04-14 | Applied Materials, Inc. | Apparatus for improving wafer and chuck edge protection |
-
1998
- 1998-06-10 US US09/095,167 patent/US6013984A/en not_active Expired - Lifetime
-
1999
- 1999-06-10 AT AT99928567T patent/ATE230810T1/de not_active IP Right Cessation
- 1999-06-10 WO PCT/US1999/013168 patent/WO1999064644A1/en not_active Ceased
- 1999-06-10 KR KR1020007013869A patent/KR100626905B1/ko not_active Expired - Lifetime
- 1999-06-10 EP EP99928567A patent/EP1097253B1/en not_active Expired - Lifetime
- 1999-06-10 JP JP2000553632A patent/JP4933692B2/ja not_active Expired - Fee Related
- 1999-06-10 DE DE69904826T patent/DE69904826T2/de not_active Expired - Fee Related
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