JP2002371197A - Conductive resin composition and method for manufacturing the same - Google Patents

Conductive resin composition and method for manufacturing the same

Info

Publication number
JP2002371197A
JP2002371197A JP2002084875A JP2002084875A JP2002371197A JP 2002371197 A JP2002371197 A JP 2002371197A JP 2002084875 A JP2002084875 A JP 2002084875A JP 2002084875 A JP2002084875 A JP 2002084875A JP 2002371197 A JP2002371197 A JP 2002371197A
Authority
JP
Japan
Prior art keywords
resin
resin composition
weight
carbon fiber
carbon fibers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002084875A
Other languages
Japanese (ja)
Other versions
JP3960096B2 (en
Inventor
Yoshihiro Urata
嘉浩 浦田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ube Corp
Original Assignee
Ube Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ube Industries Ltd filed Critical Ube Industries Ltd
Priority to JP2002084875A priority Critical patent/JP3960096B2/en
Publication of JP2002371197A publication Critical patent/JP2002371197A/en
Application granted granted Critical
Publication of JP3960096B2 publication Critical patent/JP3960096B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Conductive Materials (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a conductive resin composition capable of forming a molded body having high conductivity, excellent in shielding effect against electromagnetic waves, having high rigidity and good in surface properties, especially a conductive resin composition usable as casing of an electric instrument, especially suitable as a case of a personal computer. SOLUTION: The resin composition comprises a thermoplastic resin and carbon fibers. Based on 100 pts.wt. of the resin composition, contents of the carbon fibers is 10-50 pts.wt. In the carbon fibers, the contents of fibers having fiber length of <=50 μm is 3-12 pts.wt., and that having fiber length of >50 μm is 7-38 pts.wt.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、導電性が高く電磁
波のシールド効果に優れ、剛性が高く、かつ表面性が良
い成形品とすることのできる導電性樹脂組成物に関し、
特に電気機器の筐体部品、中でもパソコンの筐体として
好適に使用できる導電性樹脂組成物に関するものであ
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive resin composition which has high conductivity, is excellent in an electromagnetic wave shielding effect, has high rigidity, and can be formed into a molded product having good surface properties.
In particular, the present invention relates to a conductive resin composition that can be suitably used as a housing component of an electric device, especially a housing of a personal computer.

【0002】[0002]

【従来の技術】パソコンの筐体やカバーなどの電磁波シ
ールド用材料として使用される樹脂組成物には、電磁波
をシールドするために高い導電性が要求される。このよ
うな要求を満たすものとして、熱可塑性樹脂のマトリク
ス中に導電性のフィラーを分散した樹脂組成物が提案さ
れている。
2. Description of the Related Art A resin composition used as an electromagnetic wave shielding material for a personal computer housing or cover is required to have high conductivity in order to shield electromagnetic waves. To satisfy such requirements, a resin composition in which a conductive filler is dispersed in a matrix of a thermoplastic resin has been proposed.

【0003】熱可塑性樹脂に配合するフィラーとして
は、導電性を有し、しかも強化剤として効果も有するこ
とから一般に炭素繊維が使用されている。熱可塑性樹脂
に炭素繊維を配合した樹脂組成物からなる成形品は、剛
性に優れ、導電性を有するものの、電磁波のシールドを
目的として使用するためには、さらに高く安定した導電
性を有する必要があり、そのためには炭素繊維を熱可塑
性樹脂に多量に配合する必要がある。
[0003] Carbon fiber is generally used as a filler to be added to a thermoplastic resin because it has conductivity and also has an effect as a reinforcing agent. Molded articles made of a resin composition in which carbon fibers are blended with a thermoplastic resin have excellent rigidity and electrical conductivity, but in order to be used for shielding electromagnetic waves, they need to have higher and more stable electrical conductivity. For this purpose, it is necessary to mix a large amount of carbon fiber with a thermoplastic resin.

【0004】しかしながら、上記のように多量に炭素繊
維を配合した樹脂組成物を成形品にすると、炭素繊維が
配向して反りが大きくなり、そのうえコスト高になると
いう問題がある。
However, when a resin composition containing a large amount of carbon fibers is formed into a molded product as described above, there is a problem that the carbon fibers are oriented and warpage is increased, and the cost is increased.

【0005】このような問題を解決するものとして、特
開平3−181532号公報には、例えば、ポリエステ
ル樹脂、ポリエチレン樹脂、ポリプロピレン樹脂、ポリ
アミド樹脂、アクリロニトリル・ブタジエン・スチレン
共重合体(以下「ABS」と称す)、ポリアセタール樹
脂、変性ポリフェニレンオキサイド樹脂、ポリカーボネ
ート樹脂などの熱可塑性樹脂に、粒径が20μm以下の
膨潤黒鉛を5〜30重量%の割合で配合した樹脂組成物
が提案されている。この樹脂組成物からなる成形品は、
反りは小さくなるものの、導電性の点で炭素繊維が配合
された成形品に較べて劣るものとなる。
To solve such problems, Japanese Patent Application Laid-Open No. 3-181532 discloses, for example, polyester resin, polyethylene resin, polypropylene resin, polyamide resin, acrylonitrile-butadiene-styrene copolymer (hereinafter referred to as "ABS"). ), A resin composition in which swollen graphite having a particle size of 20 µm or less is blended with a thermoplastic resin such as a polyacetal resin, a modified polyphenylene oxide resin, or a polycarbonate resin at a ratio of 5 to 30% by weight. Molded articles made of this resin composition,
Although the warpage is small, it is inferior to a molded article containing carbon fibers in terms of conductivity.

【0006】一方、導電性は、炭素繊維長に大きく影響
されるため、ペレット寸法=炭素繊維長である長繊維ペ
レットも使用されているが、すべてが長繊維であるため
成形品表面が荒れるという問題がある。
On the other hand, since the conductivity is greatly affected by the carbon fiber length, long fiber pellets in which the pellet size is equal to the carbon fiber length are also used. However, since all of the fibers are long fibers, the surface of the molded product is rough. There's a problem.

【0007】[0007]

【発明が解決しようとする課題】本発明は前記問題点を
解決し、導電性が高く電磁波のシールド性に優れ、剛性
が高く、かつ表面性が良い成形品とすることのできる導
電性樹脂組成物を提供するものである。
DISCLOSURE OF THE INVENTION The present invention solves the above-mentioned problems and provides a conductive resin composition having high conductivity, excellent electromagnetic wave shielding properties, high rigidity, and a molded article having good surface properties. It provides things.

【0008】[0008]

【課題を解決するための手段】本発明者らは、上記課題
を解決するために鋭意検討をした結果、熱可塑性樹脂と
炭素繊維を混練機で溶融混合するに際し、炭素繊維を2
箇所以上に分けて供給して混合することにより、50μ
m以下の微細な炭素繊維の割合を多くすることができ、
その結果導電性が高く安定し、かつ表面性が良い樹脂組
成物が得られることを見出し、本発明に至ったものであ
る。
Means for Solving the Problems The inventors of the present invention have conducted intensive studies to solve the above-mentioned problems. As a result, when the thermoplastic resin and the carbon fibers are melted and mixed by a kneading machine, two carbon fibers are mixed.
By supplying and mixing in more than one place, 50μ
m or less of fine carbon fibers,
As a result, they have found that a resin composition having high conductivity and being stable and having good surface properties can be obtained, and the present invention has been accomplished.

【0009】すなわち、本発明は、熱可塑性樹脂と炭素
繊維を含有する樹脂組成物100重量部に対し、炭素繊
維の割合が10〜50重量部であって、該炭素繊維のう
ち、繊維長が50μm以下のものが3〜12重量部、5
0μm超のものが7〜38重量部であることを特徴とす
る導電性樹脂組成物に関するものである。また、本発明
は、熱可塑性樹脂と炭素繊維を混練機で溶融混合するに
際し、炭素繊維を2箇所以上に分けて供給して混合する
ことを特徴とする前記導電性樹脂組成物の製造方法に関
するものである。
That is, according to the present invention, the ratio of the carbon fiber is 10 to 50 parts by weight based on 100 parts by weight of the resin composition containing the thermoplastic resin and the carbon fiber, and the carbon fiber has a fiber length of 10 to 50 parts by weight. 3 to 12 parts by weight of 50 μm or less;
The present invention relates to a conductive resin composition characterized in that the amount exceeding 0 μm is 7 to 38 parts by weight. Further, the present invention relates to a method for producing the conductive resin composition, wherein, when the thermoplastic resin and the carbon fiber are melt-mixed in a kneader, the carbon fiber is divided and supplied at two or more locations and mixed. Things.

【0010】[0010]

【発明の実施の形態】本発明の導電性樹脂組成物は、熱
可塑性樹脂と炭素繊維を含有する樹脂組成物100重量
部に対し、炭素繊維の割合が10〜50重量部であっ
て、該炭素繊維のうち、繊維長が50μm以下のものが
3〜12重量部、50μm超のものが7〜38重量部で
ある。
BEST MODE FOR CARRYING OUT THE INVENTION The conductive resin composition of the present invention has a carbon fiber ratio of 10 to 50 parts by weight based on 100 parts by weight of a resin composition containing a thermoplastic resin and carbon fibers. Of the carbon fibers, those having a fiber length of 50 μm or less are 3 to 12 parts by weight, and those having a fiber length of more than 50 μm are 7 to 38 parts by weight.

【0011】樹脂組成物における炭素繊維の割合が10
重量部よりも少なくなると、導電性が安定して発現せ
ず、成形品とした際の剛性に劣り、配合割合が50重量
部を超えると、炭素繊維が配向して成形品の反りが大き
くなるため外観性に劣る。
The ratio of carbon fibers in the resin composition is 10
If the amount is less than 10 parts by weight, the conductivity is not stably exhibited, and the rigidity of the molded article is inferior. If the compounding ratio exceeds 50 parts by weight, the carbon fibers are oriented and the warpage of the molded article increases. Therefore, the appearance is poor.

【0012】該炭素繊維のうち、繊維長が50μm以下
のものが3重量部よりも少なくなると、成形品表面が荒
れるため、外観性に劣る。また12重量部を超えると、
十分な導電性が得られない。一方、繊維長が50μm超
のものが7重量部よりも少なくなると、十分な導電性が
得られず、また38重量部を超えると、成形品表面が荒
れるため、外観性に劣る。
When the carbon fiber having a fiber length of 50 μm or less is less than 3 parts by weight, the surface of the molded article is roughened, resulting in poor appearance. If it exceeds 12 parts by weight,
Sufficient conductivity cannot be obtained. On the other hand, if the fiber length is more than 50 μm and less than 7 parts by weight, sufficient conductivity will not be obtained, and if it exceeds 38 parts by weight, the surface of the molded article will be rough and the appearance will be poor.

【0013】導電性樹脂組成物の主成分となる熱可塑性
樹脂としては、例えば、ナイロン6、ナイロン66やナ
イロン12などのポリアミド樹脂、ポリエチレンテレフ
タレートやポリブチレンテレフタレートなどのポリエス
テル樹脂、ポリカーボネート樹脂、ポリアリレート樹
脂、塩化ビニル樹脂、ポリエチレン樹脂、塩素化ポリエ
チレン樹脂、塩素化ポリプロピレン樹脂、ポリプロピレ
ン樹脂、ポリスチレン樹脂、アクリロニトリル・スチレ
ン系樹脂、ABS樹脂、塩化ビニリデン樹脂、酢酸ビニ
ル樹脂、熱可塑性ポリイミド樹脂、ブタジエン樹脂、ポ
リアセタール樹脂、アイオノマー樹脂、エチレン−塩化
ビニル共重合樹脂、エチレン−酢酸ビニルコポリマー樹
脂、ポリフェニレンオキサイド樹脂、変性ポリフェニレ
ンオキサイド樹脂、ポリサルホン樹脂、アクリル樹脂、
メタクリル樹脂、フェノキシ樹脂、ポリビニルホルマー
ル樹脂、ポリビニルブチラール樹脂などが挙げられ、ま
た、これらの樹脂2種以上の混合物も挙げられる。その
中でもポリアミド樹脂、ポリエステル樹脂、ポリカーボ
ネート樹脂、ポリカABS樹脂(ポリカーボネートをブ
レンドしたABS樹脂)、ポリアリレート樹脂が好まし
く、中でもポリアミド樹脂は炭素繊維との親和性が良好
である点で特に好ましい。
Examples of the thermoplastic resin as a main component of the conductive resin composition include polyamide resins such as nylon 6, nylon 66 and nylon 12, polyester resins such as polyethylene terephthalate and polybutylene terephthalate, polycarbonate resins, and polyarylate. Resin, vinyl chloride resin, polyethylene resin, chlorinated polyethylene resin, chlorinated polypropylene resin, polypropylene resin, polystyrene resin, acrylonitrile / styrene resin, ABS resin, vinylidene chloride resin, vinyl acetate resin, thermoplastic polyimide resin, butadiene resin, Polyacetal resin, ionomer resin, ethylene-vinyl chloride copolymer resin, ethylene-vinyl acetate copolymer resin, polyphenylene oxide resin, modified polyphenylene oxide resin, Risaruhon resin, acrylic resin,
Examples thereof include a methacrylic resin, a phenoxy resin, a polyvinyl formal resin, and a polyvinyl butyral resin, and a mixture of two or more of these resins. Among them, a polyamide resin, a polyester resin, a polycarbonate resin, a polycarbonate ABS resin (ABS resin blended with polycarbonate) and a polyarylate resin are preferable, and a polyamide resin is particularly preferable in that it has a good affinity for carbon fibers.

【0014】ポリアミド樹脂としては、ラクタム、アミ
ノカルボン酸及び/又はジアミンとジカルボン酸などの
モノマーを重合して得られるホモポリアミドおよびコポ
リアミドそしてこれらの混合物が挙げられる。すなわ
ち、ポリカプロアミド(ナイロン6)、ポリヘキサメチ
レンアジパミド(ナイロン66)、ポリテトラメチレン
アジパミド(ナイロン46)、ポリヘキサメチレンセバ
カミド(ナイロン610)、ポリヘキサメチレンドデカ
ミド(ナイロン612)、ポリウンデカメチレンアジパ
ミド(ナイロン116)、ポリビス(4−アミノシクロ
ヘキシル)メタンドデカミド(ナイロンPACM1
2)、ポリビス(3−メチル−4アミノシクロヘキシ
ル)メタンドデカミド(ナイロンジメチルPACM1
2)、ポリノナメチレンテレフタルアミド(ナイロン9
T)、ポリウンデカメチレンテレフタルアミド(ナイロ
ン11T)、ポリウンデカメチレンヘキサヒドロテレフ
タルアミド(ナイロン11T(H))、ポリウンデカミ
ド(ナイロン11)、ポリドデカミド(ナイロン1
2)、ポリトリメチルヘキサメチレンテレフタルアミド
(ナイロンTMDT)、ポリヘキサメチレンテレフタル
アミド(ナイロン6T)、ポリヘキサメチレンイソフタ
ルアミド(ナイロン6I)、ポリメタキシリレンアジパ
ミド(ナイロンMXD6)及びこれらの共重合物、混合
物等が挙げられ、中でも、ナイロン6、ナイロン66、
これらの共重合ポリアミドや混合ポリアミドが特に好ま
しい。
Examples of the polyamide resin include homopolyamides and copolyamides obtained by polymerizing monomers such as lactams, aminocarboxylic acids and / or diamines and dicarboxylic acids, and mixtures thereof. That is, polycaproamide (nylon 6), polyhexamethylene adipamide (nylon 66), polytetramethylene adipamide (nylon 46), polyhexamethylene sebacamide (nylon 610), polyhexamethylene dodecamide (nylon) 612), polyundecamethylene adipamide (nylon 116), polybis (4-aminocyclohexyl) methandodecamide (nylon PACM1)
2), polybis (3-methyl-4aminocyclohexyl) methandodecamide (nylon dimethyl PACM1)
2), polynonamethylene terephthalamide (nylon 9
T), polyundecamethylene terephthalamide (nylon 11T), polyundecamethylene hexahydroterephthalamide (nylon 11T (H)), polyundecamide (nylon 11), polydodecamide (nylon 1
2), polytrimethylhexamethylene terephthalamide (nylon TMDT), polyhexamethylene terephthalamide (nylon 6T), polyhexamethylene isophthalamide (nylon 6I), polymethaxylylene adipamide (nylon MXD6) and copolymers thereof , Mixtures and the like, among which nylon 6, nylon 66,
These copolymerized polyamides and mixed polyamides are particularly preferred.

【0015】なお、本発明においては上記結晶性のポリ
アミド樹脂に非晶性ポリアミドを配合すると、外観性に
優れた樹脂組成物が得られる。非晶性ポリアミド樹脂と
しては、例えば、イソフタル酸/テレフタル酸/ヘキサ
メチレンジアミン/ビス(3−メチル−4−アミノシク
ロヘキシル)メタンの重縮合体、テレフタル酸/2,
2,4−トリメチルヘキサメチレンジアミン/2,4,
4−トリメチルヘキサメチレンジアミンの重縮合体、イ
ソフタル酸/ビス(3−メチル−4−アミノシクロヘキ
シル)メタン/ω−ラウロラクタムの重縮合体、イソフ
タル酸/テレフタル酸/ヘキサメチレンジアミンの重縮
合体、イソフタル酸/2,2,4−トリメチルヘキサメ
チレンジアミン/2,4,4−トリメチルヘキサメチレ
ンジアミンの重縮合体、イソフタル酸/テレフタル酸/
2,2,4−トリメチルヘキサメチレンジアミン/2,
4,4−トリメチルヘキサメチレンジアミンの重縮合
体、イソフタル酸/ビス(3−メチル−4−アミノシク
ロヘキシル)メタン/ω−ラウロラクタムの重縮合体等
が挙げられる。また、これらの重縮合体を構成するテレ
フタル酸成分及び/又はイソフタル酸成分のベンゼン環
が、アルキル基やハロゲン原子で置換されたものも含ま
れる。さらに、これらの非晶性ポリアミドは2種以上併
用することもできる。好ましくは、イソフタル酸/テレ
フタル酸/ヘキサメチレンジアミン/ビス(3−メチル
−4−アミノシクロヘキシル)メタンの重縮合体、又は
テレフタル酸/2,2,4−トリメチルヘキサメチレン
ジアミン/2,4,4−トリメチルヘキサメチレンジア
ミンの重縮合体、又はイソフタル酸/テレフタル酸/ヘ
キサメチレンジアミン/ビス(3−メチル−4−アミノ
シクロヘキシル)メタンの重縮合体とテレフタル酸/
2,2,4−トリメチルヘキサメチレンジアミン/2,
4,4−トリメチルヘキサメチレンジアミンの重縮合体
との混合物が用いられる。
In the present invention, when an amorphous polyamide is blended with the above-mentioned crystalline polyamide resin, a resin composition having excellent appearance can be obtained. Examples of the amorphous polyamide resin include a polycondensate of isophthalic acid / terephthalic acid / hexamethylenediamine / bis (3-methyl-4-aminocyclohexyl) methane, terephthalic acid / 2,
2,4-trimethylhexamethylenediamine / 2,4
A polycondensate of 4-trimethylhexamethylenediamine, a polycondensate of isophthalic acid / bis (3-methyl-4-aminocyclohexyl) methane / ω-laurolactam, a polycondensate of isophthalic acid / terephthalic acid / hexamethylenediamine, Polycondensate of isophthalic acid / 2,2,4-trimethylhexamethylenediamine / 2,4,4-trimethylhexamethylenediamine, isophthalic acid / terephthalic acid /
2,2,4-trimethylhexamethylenediamine / 2,
A polycondensate of 4,4-trimethylhexamethylenediamine, a polycondensate of isophthalic acid / bis (3-methyl-4-aminocyclohexyl) methane / ω-laurolactam, and the like can be given. Further, those in which the benzene ring of the terephthalic acid component and / or the isophthalic acid component constituting these polycondensates is substituted with an alkyl group or a halogen atom are also included. Furthermore, two or more of these amorphous polyamides can be used in combination. Preferably, a polycondensate of isophthalic acid / terephthalic acid / hexamethylenediamine / bis (3-methyl-4-aminocyclohexyl) methane or terephthalic acid / 2,2,4-trimethylhexamethylenediamine / 2,4,4 A polycondensate of trimethylhexamethylenediamine or a polycondensate of isophthalic acid / terephthalic acid / hexamethylenediamine / bis (3-methyl-4-aminocyclohexyl) methane and terephthalic acid /
2,2,4-trimethylhexamethylenediamine / 2,
A mixture with a polycondensate of 4,4-trimethylhexamethylenediamine is used.

【0016】ポリアミド樹脂の結晶性の緩和を考慮する
と、この非晶性ポリアミド樹脂の融解熱量は、示差走査
熱量計を用いて窒素雰囲気下で16℃/分の昇温速度に
より測定したとき、1cal/g以下であることが好ま
しい。
Considering the relaxation of the crystallinity of the polyamide resin, the heat of fusion of the amorphous polyamide resin is 1 cal when measured at a heating rate of 16 ° C./min in a nitrogen atmosphere using a differential scanning calorimeter. / G or less.

【0017】結晶性ポリアミドと非晶性ポリアミドとの
配合割合は特に限定されるものではないが、(結晶性ポ
リアミド)/(非晶性ポリアミド)=50/50〜98
/2(重量比)であることが好ましい。非晶性ポリアミ
ドが2重量%より少ないと、高濃度に炭素繊維を配合し
た際に、表面平滑性すなわち光沢度が失われる傾向にあ
り、非晶性ポリアミドが50重量%より多いと、高濃度
に炭素繊維を配合した際に、非晶性ポリアミドは一般的
に溶融粘度が高いため高温の金型で成形しなければ平滑
な表面が得られず、又結晶性が低くなるため射出成形等
での成形サイクルが延び生産性が悪くなる。
The mixing ratio of the crystalline polyamide and the amorphous polyamide is not particularly limited, but (crystalline polyamide) / (amorphous polyamide) = 50 / 50-98.
/ 2 (weight ratio). If the amount of the amorphous polyamide is less than 2% by weight, the surface smoothness, that is, the glossiness tends to be lost when the carbon fiber is blended at a high concentration. When carbon fibers are blended with amorphous polyamides, amorphous polyamides generally have high melt viscosities, so a smooth surface cannot be obtained unless molded with a high-temperature mold. The molding cycle is extended and productivity is deteriorated.

【0018】本発明に用いるポリアミド樹脂の相対粘度
は、特に限定されないが、溶媒として96重量%濃硫酸
を用いて温度が25℃で濃度が1g/dlの条件で測定
した相対粘度が、1.4〜4.0の範囲であることが好
ましい。相対粘度が1.4より小さいと、低粘度の為、
溶融混練後の引き取り性が困難となり組成物に所望の物
性が得られにくくなる。また4.0より大きいと、高粘
度のため成形加工時の流動性が悪く、十分な射出圧力が
かからないため、成形品が作りにくくなる。
Although the relative viscosity of the polyamide resin used in the present invention is not particularly limited, the relative viscosity measured at a temperature of 25 ° C. and a concentration of 1 g / dl using 96% by weight concentrated sulfuric acid as a solvent is 1. It is preferably in the range of 4 to 4.0. If the relative viscosity is smaller than 1.4, the viscosity is low,
It becomes difficult to take off after melt-kneading, and it becomes difficult to obtain desired physical properties in the composition. On the other hand, if it is larger than 4.0, the fluidity during molding is poor due to high viscosity, and a sufficient injection pressure is not applied, so that it is difficult to produce a molded product.

【0019】本発明において、導電剤および強化剤とし
ての役割を果たす炭素繊維は、高強度、高導電率を有す
るポリアクリロニトリル系(PAN系)やピッチ系の炭
素繊維が挙げられる。PAN系炭素繊維としては、具体
的には、東邦レーヨン社製のベスファイト・チョップド
ファイバーやベスファイト・ミルドファイバー、東レ社
性のトレカ・チョップドファイバーやトレカ・ミルドフ
ァイバー、三菱レイヨン社製のパイロフィル、Fort
afil Fiber社製のFortafil、日本ポ
リマー産業株式会社 CFPAシリーズなどが挙げら
れ、また、ピッチ系炭素繊維としては、具体的には、大
阪ガス社製のドナカーボ・チョップドファイバーやドナ
カーボ・ミルドファイバー、クレハ化学社製のクレカ・
チョップドファイバーやクレカ・ミルドファイバーなど
が挙げられる。
In the present invention, examples of the carbon fiber that plays the role of a conductive agent and a reinforcing agent include polyacrylonitrile (PAN) and pitch carbon fibers having high strength and high electrical conductivity. As the PAN-based carbon fiber, specifically, Vesfight chopped fiber and Vesfight milled fiber manufactured by Toho Rayon Co., Ltd., Torayca chopped fiber and Torayca milled fiber manufactured by Toray Co., Ltd. Fort
afil Fiber's Fortafil, Nippon Polymer Sangyo Co., Ltd. CFPA series, and the like. Specific examples of the pitch-based carbon fiber include donacarb chopped fiber and donacarb milled fiber, Kureha Chemical Co., Ltd. manufactured by Osaka Gas Co., Ltd. Creka
Chopped fiber and Creca milled fiber are examples.

【0020】炭素繊維は、混練前の繊維長が0.1〜7
mmのものが好ましく、1〜6mmのものが特に好まし
い。また、繊維径は5〜15μmの範囲にあるものが好
ましい。
The carbon fiber has a fiber length of 0.1 to 7 before kneading.
mm, and particularly preferably 1 to 6 mm. Further, the fiber diameter is preferably in the range of 5 to 15 μm.

【0021】上記のように構成された導電性樹脂組成物
には、臭素系難燃剤あるいは赤リン系難燃剤を、樹脂組
成物100重量部に対し50重量部以下、好ましくは2
0〜40重量部の割合とすると、上記の特性に加えてさ
らに難燃性も向上できるため好ましい。配合割合が50
重量部を超えると、成形品としての機械的強度が損なわ
れる傾向にある。
The conductive resin composition having the above composition contains a bromine flame retardant or a red phosphorus flame retardant in an amount of 50 parts by weight or less, preferably 2 parts by weight, per 100 parts by weight of the resin composition.
A ratio of 0 to 40 parts by weight is preferable because flame retardancy can be further improved in addition to the above-mentioned characteristics. Mixing ratio is 50
If the amount exceeds the weight part, the mechanical strength of the molded article tends to be impaired.

【0022】本発明で用いる臭素系難燃剤は、臭素含有
率が50〜90重量%であるものが好ましい。臭素含有
率が50重量%未満では、難燃効果に乏しく多量の難燃
剤を添加する必要があり、機械的強度が損なわれる。ま
た、臭素含有率が90重量%を超えると、成形加工時に
臭素が遊離しやすいので本発明の効果を充分発揮するこ
とができない。具体的には、例えば、臭素化ポリスチレ
ン、臭素化架橋芳香族重合体、臭素化スチレン/無水マ
レイン酸共重合体、臭素化ポリフェニレンエーテル、臭
素化エポキシ樹脂、臭素化フェノキシ樹脂などがある
が、中でもとくに臭素化ポリスチレンが好適に使用でき
る。
The bromine-based flame retardant used in the present invention preferably has a bromine content of 50 to 90% by weight. When the bromine content is less than 50% by weight, the flame retardant effect is poor and a large amount of a flame retardant needs to be added, and the mechanical strength is impaired. On the other hand, when the bromine content exceeds 90% by weight, the effect of the present invention cannot be sufficiently exerted because bromine is easily released during molding. Specifically, for example, brominated polystyrene, brominated cross-linked aromatic polymer, brominated styrene / maleic anhydride copolymer, brominated polyphenylene ether, brominated epoxy resin, brominated phenoxy resin, etc. Particularly, brominated polystyrene can be suitably used.

【0023】ここで用いられる臭素化ポリスチレンとし
ては、ポリスチレンに臭素を付加させたもの、もしくは
臭素が付加したスチレンモノマーを重合したもの、ある
いはこれらの両者の混合物が挙げられ、特に、臭素を付
加したスチレンモノマーを重合したグレートレイクス社
製のPDBSや、ポリスチレンに臭素を付加させたフェ
ロ社製のパイロチェック68PBが、色調、流動性及び
耐熱性の点で好ましい。
Examples of the brominated polystyrene used herein include those obtained by adding bromine to polystyrene, those obtained by polymerizing a styrene monomer to which bromine is added, or a mixture of both of them. Particularly, brominated polystyrene is used. Great Lakes PDBS, which is obtained by polymerizing a styrene monomer, and Pyro Check 68PB, which is obtained by adding bromine to polystyrene, are preferable in terms of color tone, fluidity and heat resistance.

【0024】赤リン系難燃剤としては、赤リンの名称で
販売されている様々な色の同素体種(赤、紫または黒リ
ン)が使用できる。熱可塑性樹脂に配合する際の赤リン
の形状は特に限定されるものではないが、樹脂組成物へ
の分散性を考慮すると、一般的に微細に分割された形、
例えば200μm以下の粒子径に分割された形、好まし
くは1〜100μmの範囲の平均粒径を有する粒子の形
の赤リンを使用するのが望ましい。
As the red phosphorus-based flame retardant, allotrope species of various colors (red, purple or black phosphorus) sold under the name of red phosphorus can be used. The shape of the red phosphorus when blended in the thermoplastic resin is not particularly limited, but in consideration of the dispersibility in the resin composition, generally a finely divided form,
For example, it is desirable to use red phosphorus in the form of particles divided into particle diameters of 200 μm or less, preferably in the form of particles having an average particle diameter in the range of 1 to 100 μm.

【0025】赤リンは、赤リンのみで使用してもよい
が、赤リン粒子の表面をポリマー皮膜や無機コート材で
被覆した形状の耐熱性改善タイプが好ましい。赤リン粒
子の表面を被覆するポリマーとしては、エポキシ樹脂
や、マレイン酸、フマル酸またはアリル不飽和結合を有
するポリマーや、50〜90℃の融点でかつ10000
以下の分子量を有する不飽和ポリエステルや、ノボラッ
クタイプの熱可塑性フェノール−ホルムアルデヒド重縮
合生成物や、熱可塑性フェノール−イソブチルアルデヒ
ド重縮合生成物が挙げられ、中でも熱可塑性フェノール
−イソブチルアルデヒド重縮合生成物が好適に使用でき
る。これらのポリマーの配合量は特に限定されるもので
はないが、赤リンと被覆用ポリマーとの混合物の合計重
量に対し高々90重量%であり、一般的には、2〜50
重量%であることが好ましい。
Although red phosphorus may be used alone, it is preferable to use a red phosphorus particle whose surface is coated with a polymer film or an inorganic coating material to improve heat resistance. Examples of the polymer that coats the surface of the red phosphorus particles include an epoxy resin, a polymer having maleic acid, fumaric acid, or an allyl unsaturated bond, or a polymer having a melting point of 50 to 90 ° C and 10,000.
Unsaturated polyesters having the following molecular weights, novolak-type thermoplastic phenol-formaldehyde polycondensation products, and thermoplastic phenol-isobutyraldehyde polycondensation products include, among others, thermoplastic phenol-isobutyraldehyde polycondensation products. It can be suitably used. The blending amount of these polymers is not particularly limited, but is at most 90% by weight based on the total weight of the mixture of red phosphorus and the coating polymer, and is generally 2 to 50%.
% By weight.

【0026】また、本発明の樹脂組成物には、難燃剤の
効果を十分に引出す目的で上記の難燃剤に加えて難燃助
剤を配合しても良い。臭素系難燃剤とともに使用する難
燃助剤としては、三酸化アンチモン、アンチモン酸ナト
リウム、酸化スズ(IV)、酸化鉄(III)、酸化亜
鉛、ホウ酸亜鉛などが挙げられ、赤リン系難燃剤ととも
に使用する難燃助剤としては、ポリリン酸メラミン、メ
ラミンシアヌレート、水酸化マグネシウムなどが挙げら
れる。難燃助剤の難燃剤に対する配合割合は、重量比で
臭素系難燃剤の場合、難燃剤:難燃助剤=5:1〜1:
1、赤燐系場合、難燃剤:難燃助剤=1:2〜1:7で
あることが好ましい。
The resin composition of the present invention may contain a flame retardant aid in addition to the above-mentioned flame retardant in order to sufficiently bring out the effect of the flame retardant. Examples of the flame retardant aid used together with the bromine flame retardant include antimony trioxide, sodium antimonate, tin (IV) oxide, iron (III) oxide, zinc oxide, zinc borate, and the like. Examples of the flame retardant auxiliary used together with the above include melamine polyphosphate, melamine cyanurate, magnesium hydroxide and the like. In the case of a brominated flame retardant in terms of weight ratio, the blending ratio of the flame retardant auxiliary to the flame retardant is as follows: flame retardant: flame retardant = 5: 1 to 1:
1. In the case of red phosphorus, it is preferable that the ratio of flame retardant: flame retardant aid = 1: 2-1: 7.

【0027】また、本発明の導電性樹脂組成物には、さ
らに加えて必要に応じて離型剤、熱安定剤、酸化防止
剤、光安定剤、滑剤、顔料、可塑剤、架橋剤、耐衝撃性
向上剤、無機物、染料などの各種添加剤や炭素系や金属
系の導電助剤を添加してもよく、これらは樹脂組成物を
溶融混練もしくは溶融成形する際に加えられる。
The conductive resin composition of the present invention may further comprise a releasing agent, a heat stabilizer, an antioxidant, a light stabilizer, a lubricant, a pigment, a plasticizer, a cross-linking agent, Various additives such as impact modifiers, inorganic substances, and dyes, and carbon-based and metal-based conductive assistants may be added. These are added when the resin composition is melt-kneaded or melt-molded.

【0028】本発明の導電性樹脂組成物は、熱可塑性樹
脂と炭素繊維と、必要に応じて配合した難燃剤および各
種の添加剤とともに混練機を用いて溶融混練し、ペレッ
ト化することにより製造されるが、その際、炭素繊維を
2箇所以上に分けて供給して混合することにより製造す
ることができる。例えば、熱可塑性樹脂と、炭素繊維3
〜12重量部を混練機の先頭から供給し、炭素繊維7〜
38重量部を混練機の途中から供給して混合することに
より製造される。
The conductive resin composition of the present invention is produced by melt-kneading using a kneader with a thermoplastic resin, carbon fiber, and, if necessary, a flame retardant and various additives, and pelletizing. However, at that time, the carbon fiber can be manufactured by dividing and supplying the carbon fiber to two or more places and mixing. For example, a thermoplastic resin and carbon fiber 3
~ 12 parts by weight from the beginning of the kneading machine, carbon fiber 7 ~
It is manufactured by supplying and mixing 38 parts by weight from the middle of the kneader.

【0029】炭素繊維を1箇所から供給した場合には、
配合量が少ないと、導電性が十分ではなく、配合量を多
くすると、炭素繊維が配向して反りが大きくなり、表面
性が悪くなる。これに対し、本発明のように、炭素繊維
を2箇所以上に分けて供給することにより、最初に供給
した炭素繊維は混練の際、樹脂のせん断溶融ゾーンで強
く混錬される為切断されて50μm以下の微細な繊維と
なり、後から供給した炭素繊維は、上記混錬ゾーンを通
過しない為、50μm超の長さを維持したものとなる。
その結果、導電性が高く、かつ表面性が良い樹脂組成物
が得られる。このようにして得られた樹脂組成物により
成形品を得るためには、射出成形機を用いて、前記樹脂
組成物を射出成形するか、プレス成形機を用いてプレス
成形すれば良い。
When carbon fibers are supplied from one place,
If the compounding amount is small, the conductivity is not sufficient, and if the compounding amount is large, the carbon fibers are oriented and warpage increases, and the surface property deteriorates. On the other hand, as in the present invention, by supplying carbon fibers in two or more places, the first supplied carbon fibers are kneaded at the time of kneading because they are strongly kneaded in the shear melting zone of the resin. It becomes fine fibers of 50 μm or less, and the carbon fibers supplied later do not pass through the kneading zone, and thus maintain a length exceeding 50 μm.
As a result, a resin composition having high conductivity and good surface properties can be obtained. In order to obtain a molded article from the resin composition thus obtained, the resin composition may be injection-molded using an injection molding machine or press-molded using a press molding machine.

【0030】上記のように構成された導電性樹脂組成物
からなる成形品は、導電性が高く電磁波シールド効果に
優れ、剛性が高く、物性のばらつきの少ない表面性が良
い成形品とすることができるため、燃料系部品や電気・
電子部品や電気機器の筐体、例えば、パソコンの筐体や
カバー、メカニカル軸受けや、メカニカルパッキングシ
ール剤やフューエチューブ、フューエコネクタやクリー
ンルームの機器やプリンター、コピー機部品として好適
に使用できる。
The molded article made of the conductive resin composition constituted as described above should be a molded article having a high conductivity, an excellent electromagnetic wave shielding effect, a high rigidity, a small variation in physical properties and a good surface property. Fuel-based parts and electricity and
It can be suitably used as a housing of an electronic component or an electric device, for example, a housing or cover of a personal computer, a mechanical bearing, a mechanical packing sealant, a fue tube, a fue connector, a device of a clean room, a printer, or a copier.

【0031】[0031]

【実施例】次に実施例に基づき本発明を具体的に説明す
るが、本発明はこれらの実施例のみに限定されるもので
はない。なお、以下の実施例、比較例における各種物性
値の測定は、以下の方法により実施した。
Next, the present invention will be described in detail with reference to examples, but the present invention is not limited to these examples. In addition, the measurement of various physical property values in the following Examples and Comparative Examples was performed by the following methods.

【0032】[炭素繊維の繊維長分布の測定]炭素繊維
を含有した熱可塑性樹脂のペレットを濃度96%以上の
硫酸に溶解させ、この溶液より炭素繊維をとり顕微鏡に
て拡大写真を撮影し、その写真の中の炭素繊維の繊維長
を測定し、繊維長の分布より50μm以下、50μm超
の重量分率を算出した。
[Measurement of Fiber Length Distribution of Carbon Fiber] A pellet of a thermoplastic resin containing carbon fiber is dissolved in sulfuric acid having a concentration of 96% or more, the carbon fiber is taken from this solution, and an enlarged photograph is taken with a microscope. The fiber length of the carbon fiber in the photograph was measured, and the weight fraction of 50 μm or less and more than 50 μm was calculated from the fiber length distribution.

【0033】[導電性]住友重機工業(株)ネスタール
SG75を用いて射出成形で成形したASTM1号片に
図2で示す150mm間隔で市販の半田ごてを使用して
金属端子を加熱圧入し端子を埋め込んで、この端子間の
抵抗をHIOKI製MODEL3010のテスターで測定した。
[Conductivity] A metal terminal is heated and press-fitted into an ASTM No. 1 piece formed by injection molding using Nestal SG75 (Sumitomo Heavy Industries, Ltd.) at intervals of 150 mm as shown in FIG. 2 using a commercially available soldering iron. Was embedded, and the resistance between the terminals was measured with a HIOKI MODEL3010 tester.

【0034】[引張り強度]ASTM D638に従
い、住友重機工業(株)ネスタールSG75を用いて射
出成形で成形したASTM1号片を用いて測定した。
[Tensile strength] According to ASTM D638, the tensile strength was measured using an ASTM No. 1 piece molded by injection molding using Nestal SG75 manufactured by Sumitomo Heavy Industries, Ltd.

【0035】[表面性]JIS B0601に従い、住
友重機工業(株)ネスタールSG75を用いて射出成形
で成形したASTM1号片を用いて株式会社 東京精密
Handy Surf E-30Aを使用し中心線平行粗さ(Ra)を測定し
た。
[Surface properties] In accordance with JIS B0601, Sumitomo Heavy Industries Co., Ltd. Nestal SG75 is used to form an ASTM No. 1 piece by injection molding.
Centerline parallel roughness (Ra) was measured using Handy Surf E-30A.

【0036】実施例1 ポリアミドA(宇部興産製UBEナイロン1011FB)
70wt%および炭素繊維(日本ポリマー産業株式会社
CFPA−LC3)10wt%を図1のスクリュー構
成をもつ押出機(東芝機械(株)Tem35B)のか
ら投入し樹脂が溶融状態(樹脂温度280℃)になって
いるところに、図1のから炭素繊維(日本ポリマー産
業株式会社 CFPA−LC3)20wt%を追加投入
し、混練・ペレット化し、炭素繊維の分布長測定をし
た。また、得られたペレットを用いてASTM1号片を
住友重機工業(株)ネスタールSG75にて樹脂温度2
80℃金型温度80℃で射出成形し、導電性、引張り強
度、表面性を測定した。得られた結果を表1に示す。
Example 1 Polyamide A (UBE nylon 1011FB manufactured by Ube Industries)
70 wt% and 10 wt% of carbon fiber (Nippon Polymer Sangyo Co., Ltd. CFPA-LC3) are charged from an extruder (Toshiba Machine Co., Ltd., Tem35B) having the screw configuration of FIG. 1 and the resin is in a molten state (resin temperature 280 ° C.). In this place, 20 wt% of carbon fiber (Nippon Polymer Sangyo Co., Ltd. CFPA-LC3) was additionally charged from FIG. 1, kneaded and pelletized, and the distribution length of carbon fiber was measured. Further, using the obtained pellets, the ASTM No. 1 piece was subjected to Sumitomo Heavy Industries, Ltd.
Injection molding was performed at a mold temperature of 80 ° C. and the conductivity, tensile strength, and surface properties were measured. Table 1 shows the obtained results.

【0037】比較例1 ポリアミドA(宇部興産製UBEナイロン1011FB)
70wt%を図1のスクリュー構成をもつ押出機(東芝
機械(株)Tem35B)のから投入し樹脂が溶融状
態(樹脂温度280℃)になっているところに、図1の
から炭素繊維(日本ポリマー産業株式会社 CFPA
−LC3)が30wt%になるように投入し、混練・ペ
レット化し、炭素繊維の分布長測定をした。また、得ら
れたペレットを用いてASTM1号片を住友重機工業
(株)ネスタールSG75にて樹脂温度280℃金型温
度80℃で射出成形し、導電性、引張り強度、表面性を
測定した。得られた結果を表1に示す。
Comparative Example 1 Polyamide A (UBE Nylon 1011FB manufactured by Ube Industries)
70 wt% was supplied from an extruder (Toshiba Machine Co., Ltd., Tem35B) having the screw configuration shown in FIG. 1 and the resin was in a molten state (resin temperature 280 ° C.). Sangyo Co., Ltd. CFPA
-LC3) was added so as to be 30 wt%, kneaded and pelletized, and the distribution length of carbon fibers was measured. Using the obtained pellets, ASTM No. 1 pieces were injection-molded at a resin temperature of 280 ° C. and a mold temperature of 80 ° C. using Nestal SG75 (Sumitomo Heavy Industries, Ltd.), and the conductivity, tensile strength and surface properties were measured. Table 1 shows the obtained results.

【0038】比較例2 ポリアミドA(宇部興産製UBEナイロン1011FB)
80wt%を図1のスクリュー構成をもつ押出機(東芝
機械(株)Tem35B)のから投入し樹脂が溶融状
態(樹脂温度280℃)になっているところに、図1の
から炭素繊維(日本ポリマー産業株式会社 CFPA
−LC3)が20wt%になるように投入し、混練・ペ
レット化し、炭素繊維の分布長測定をした。また、得ら
れたペレットを用いてASTM1号片を住友重機工業
(株)ネスタールSG75にて樹脂温度280℃金型温
度80℃で射出成形し、導電性、引張り強度、表面性を
測定した。得られた結果を表1に示す。
Comparative Example 2 Polyamide A (UBE Nylon 1011FB manufactured by Ube Industries)
80 wt% was supplied from an extruder (Tem35B, Toshiba Machine Co., Ltd.) having the screw configuration shown in FIG. 1 and the resin was in a molten state (resin temperature 280 ° C.). Sangyo Co., Ltd. CFPA
-LC3) was added so as to be 20 wt%, kneaded and pelletized, and the distribution length of carbon fibers was measured. Using the obtained pellets, ASTM No. 1 pieces were injection-molded at a resin temperature of 280 ° C. and a mold temperature of 80 ° C. using Nestal SG75 (Sumitomo Heavy Industries, Ltd.), and the conductivity, tensile strength and surface properties were measured. Table 1 shows the obtained results.

【0039】実施例2 ポリアミドB(宇部興産製UBEナイロン1015B)7
5wt%およびAES樹脂(宇部サイコン(株) WX
270)10wt%及び炭素繊維(Fortafil Fiber In
c. Fortafil243)5wt%を図1のスクリュー構成をも
つ押出機(東芝機械(株)Tem35B)のから投入
し樹脂が溶融状態(樹脂温度280℃)になっていると
ころに図1のから炭素繊維(Fortafil Fiber Inc. Fo
rtafil243)10wt%を追加投入し、混練・ペレット
化し、炭素繊維の分布長測定をした。また、得られたペ
レットを用いてASTM1号片を住友重機工業(株)ネ
スタールSG75にて樹脂温度280℃金型温度80℃
で射出成形し、導電性、引張り強度、表面性を測定し
た。得られた結果を表1に示す。
Example 2 Polyamide B (UBE nylon 1015B manufactured by Ube Industries) 7
5 wt% and AES resin (Ube Sycon Corp. WX
270) 10 wt% and carbon fiber (Fortafil Fiber In
c. Fortafil243) 5 wt% is fed from an extruder (Toshiba Machine Co., Ltd., Tem35B) having the screw configuration of FIG. 1 and the carbon fiber of FIG. 1 is placed where the resin is in a molten state (resin temperature 280 ° C.). (Fortafil Fiber Inc. Fo
rtafil243) 10 wt% was additionally charged, kneaded and pelletized, and the distribution length of carbon fibers was measured. Further, using the obtained pellets, ASTM No. 1 piece was subjected to a resin temperature of 280 ° C. and a mold temperature of 80 ° C. by Nestal SG75, Sumitomo Heavy Industries, Ltd.
And the conductivity, tensile strength, and surface properties were measured. Table 1 shows the obtained results.

【0040】比較例3 ポリアミドB(宇部興産製UBEナイロン1015B)8
0wt%およびAES樹脂(宇部サイコン(株) WX
270)10wt%を図1のスクリュー構成をもつ押出
機(東芝機械(株)Tem35B)のから投入し樹脂
が溶融状態(樹脂温度280℃)になっているところ
に、図1のから炭素繊維(Fortafil Fiber Inc. Fort
afil243)が10wt%になるように投入し、混練・ペ
レット化し、炭素繊維の分布長測定をした。また、得ら
れたペレットを用いてASTM1号片を住友重機工業
(株)ネスタールSG75にて樹脂温度280℃金型温
度80℃で射出成形し、導電性、引張り強度、表面性を
測定した。得られた結果を表1に示す。
Comparative Example 3 Polyamide B (UBE nylon 1015B manufactured by Ube Industries) 8
0 wt% and AES resin (Ube Sycon Corp. WX
270) 10 wt% is supplied from an extruder (Tem35B, Toshiba Machine Co., Ltd.) having the screw configuration shown in FIG. 1 and the resin is in a molten state (resin temperature 280 ° C.). Fortafil Fiber Inc. Fort
afil243) was added at 10 wt%, kneaded and pelletized, and the distribution length of carbon fibers was measured. Using the obtained pellets, ASTM No. 1 pieces were injection-molded at a resin temperature of 280 ° C. and a mold temperature of 80 ° C. using Nestal SG75 (Sumitomo Heavy Industries, Ltd.), and the conductivity, tensile strength and surface properties were measured. Table 1 shows the obtained results.

【0041】比較例4 ポリアミドB(宇部興産製UBEナイロン1015B)8
0wt%およびAES樹脂(宇部サイコン(株) WX
270)10wt%および炭素繊維(FortafilFiber In
c. Fortafil243)10wt%を図1のスクリュー構成を
もつ押出機(東芝機械(株)Tem35B)のから投
入し樹脂温度が280℃になるように溶融・混練させ、
ペレット化し、炭素繊維の分布長測定をした。また、得
られたペレットを用いてASTM1号片を住友重機工業
(株)ネスタールSG75にて樹脂温度280℃金型温
度80℃で射出成形し、導電性、引張り強度、表面性を
測定した。得られた結果を表1に示す。
Comparative Example 4 Polyamide B (UBE Nylon 1015B manufactured by Ube Industries) 8
0 wt% and AES resin (Ube Sycon Corp. WX
270) 10 wt% and carbon fiber (FortafilFiber In
c. Fortafil243) 10 wt% from an extruder (Toshiba Machine Co., Ltd., Tem35B) having the screw configuration of FIG. 1 is melted and kneaded so that the resin temperature becomes 280 ° C.
Pellets were formed and the distribution length of carbon fibers was measured. Using the obtained pellets, ASTM No. 1 pieces were injection-molded at a resin temperature of 280 ° C. and a mold temperature of 80 ° C. using Nestal SG75 (Sumitomo Heavy Industries, Ltd.), and the conductivity, tensile strength and surface properties were measured. Table 1 shows the obtained results.

【0042】[0042]

【表1】 [Table 1]

【0043】[0043]

【発明の効果】本発明によれば、熱可塑性樹脂に繊維長
分布が広範囲である炭素繊維を所定の割合で配合するこ
とで、電磁波のシールド用に使用できる程の導電性が得
られるとともに、剛性が高く、表面性が良い樹脂組成物
が得られる。従って、導電性や剛性を必要とする電磁波
シールドとして好適に使用でき、電気機器、特にパソコ
ンの筐体やカバーとして好適に使用できる導電性樹脂組
成物を提供できる。
According to the present invention, by blending a thermoplastic resin with carbon fibers having a wide fiber length distribution at a predetermined ratio, it is possible to obtain conductivity enough to be used for shielding electromagnetic waves, A resin composition having high rigidity and good surface properties can be obtained. Therefore, it is possible to provide a conductive resin composition which can be suitably used as an electromagnetic wave shield requiring conductivity and rigidity, and which can be suitably used as a housing or cover of an electric device, particularly a personal computer.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 図1は、混練機による熱可塑性樹脂と炭素繊
維の混練操作の概要を示す図である。
FIG. 1 is a diagram showing an outline of an operation of kneading a thermoplastic resin and carbon fibers by a kneader.

【図2】 図2は、導電性の測定方法を示す概略図であ
る。
FIG. 2 is a schematic view showing a method for measuring conductivity.

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) C08L 77/00 C08L 77/00 H01B 1/00 H01B 1/00 K 1/24 1/24 Z 13/00 501 13/00 501P Fターム(参考) 4F070 AA54 AC04 AD02 AE06 FA03 FB06 FB07 FC05 4F071 AA02 AA54 AB03 AD01 AD06 AE15 AF14 AF37 AH16 BA01 BB05 BC07 4J002 AA011 BB021 BB051 BB061 BB111 BB231 BB241 BC021 BC061 BD031 BD101 BE061 BF021 BG041 BG051 BL011 BN151 CB001 CF061 CF071 CF161 CG001 CH071 CH081 CL001 CL011 CL021 CL031 CL051 CM041 CN031 DA016 FA046 FD016 FD116 FD130 GQ02 5G301 DA20 DA51 DD06 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) C08L 77/00 C08L 77/00 H01B 1/00 H01B 1/00 K 1/24 1/24 Z 13/00 501 13/00 501P F-term (reference) 4F070 AA54 AC04 AD02 AE06 FA03 FB06 FB07 FC05 4F071 AA02 AA54 AB03 AD01 AD06 AE15 AF14 AF37 AH16 BA01 BB05 BC07 4J002 AA011 BB021 BB051 BB011 BB1111 BB1111 BB1111 CB001 CF061 CF071 CF161 CG001 CH071 CH081 CL001 CL011 CL021 CL031 CL051 CM041 CN031 DA016 FA046 FD016 FD116 FD130 GQ02 5G301 DA20 DA51 DD06

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 熱可塑性樹脂と炭素繊維を含有する樹脂
組成物100重量部に対し、炭素繊維の割合が10〜5
0重量部であって、該炭素繊維のうち、繊維長が50μ
m以下のものが3〜12重量部、50μm超のものが7
〜38重量部であることを特徴とする導電性樹脂組成
物。
The present invention relates to a resin composition containing a thermoplastic resin and carbon fibers.
0 parts by weight, and the carbon fiber has a fiber length of 50 μm.
m or less, 3 to 12 parts by weight;
A conductive resin composition characterized in that the amount is from 38 to 38 parts by weight.
【請求項2】 熱可塑性樹脂が、ポリアミド樹脂である
ことを特徴とする請求項1記載の導電性樹脂組成物。
2. The conductive resin composition according to claim 1, wherein the thermoplastic resin is a polyamide resin.
【請求項3】 熱可塑性樹脂と炭素繊維を混練機で溶融
混合するに際し、炭素繊維を2箇所以上に分けて供給し
て混合することを特徴とする請求項1又は2記載の導電
性樹脂組成物の製造方法。
3. The conductive resin composition according to claim 1, wherein, when the thermoplastic resin and the carbon fiber are melt-mixed by a kneader, the carbon fiber is supplied by being divided into two or more places and mixed. Method of manufacturing a product.
【請求項4】 熱可塑性樹脂と炭素繊維を混練機で溶融
混合するに際し、熱可塑性樹脂と、炭素繊維3〜12重
量部を混練機の先頭から供給し、炭素繊維7〜38重量
部を混練機の途中から供給して混合することを特徴とす
る請求項1又は2記載の導電性樹脂組成物の製造方法。
4. When the thermoplastic resin and carbon fiber are melted and mixed by a kneading machine, 3 to 12 parts by weight of the thermoplastic resin and carbon fiber are supplied from the head of the kneading machine, and 7 to 38 parts by weight of carbon fiber are kneaded. The method for producing a conductive resin composition according to claim 1, wherein the mixture is supplied from the middle of the machine and mixed.
【請求項5】 請求項1又は2記載の導電性樹脂組成物
を成形してなる成形品。
5. A molded product obtained by molding the conductive resin composition according to claim 1 or 2.
JP2002084875A 2001-04-09 2002-03-26 Conductive resin composition and method for producing the same Expired - Fee Related JP3960096B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002084875A JP3960096B2 (en) 2001-04-09 2002-03-26 Conductive resin composition and method for producing the same

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001-109442 2001-04-09
JP2001109442 2001-04-09
JP2002084875A JP3960096B2 (en) 2001-04-09 2002-03-26 Conductive resin composition and method for producing the same

Publications (2)

Publication Number Publication Date
JP2002371197A true JP2002371197A (en) 2002-12-26
JP3960096B2 JP3960096B2 (en) 2007-08-15

Family

ID=26613269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002084875A Expired - Fee Related JP3960096B2 (en) 2001-04-09 2002-03-26 Conductive resin composition and method for producing the same

Country Status (1)

Country Link
JP (1) JP3960096B2 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004244522A (en) * 2003-02-14 2004-09-02 Nagano Japan Radio Co Method for manufacturing carbon-fiber composite material and carbon-fiber composite material
JP2005146057A (en) * 2003-11-12 2005-06-09 Polymatech Co Ltd High-thermal-conductivity molding and method for producing the same
US7575800B2 (en) 2001-11-02 2009-08-18 Kitagawa Industries Co., Ltd. Sliding parts, precision parts and timepieces and electronic equipment using the same
US8257075B2 (en) 2008-11-10 2012-09-04 Apple Inc. Carbon composite mold design
JP2013049794A (en) * 2011-08-31 2013-03-14 Toyobo Co Ltd Polyamide resin composition
WO2015174488A1 (en) * 2014-05-16 2015-11-19 東洋紡株式会社 Crystalline polyamide resin composition
WO2018123563A1 (en) * 2016-12-26 2018-07-05 ユニチカ株式会社 Polyamide resin composition, method for producing same and molded body formed from same
JP2019167502A (en) * 2018-03-26 2019-10-03 三菱ケミカル株式会社 Fiber-reinforced thermoplastic resin composition, production method thereof and injection molded article
JP2021070204A (en) * 2019-10-30 2021-05-06 住友化学株式会社 Resin pellet and resin pellet manufacturing method

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS627509A (en) * 1985-07-05 1987-01-14 Sumitomo Metal Ind Ltd Manufacture of resin composite material mixed with carbon fiber
JPH06260017A (en) * 1993-03-04 1994-09-16 Otsuka Chem Co Ltd Conductive thermoplastic resin composition
JPH09255872A (en) * 1996-03-26 1997-09-30 Nippon G Ii Plast Kk Antistatic resin composition
JPH11116825A (en) * 1997-10-09 1999-04-27 Otsuka Chem Co Ltd Resin composition
JP2000095947A (en) * 1998-09-21 2000-04-04 Unitika Ltd Conductive resin composition
JP2000218711A (en) * 1999-02-02 2000-08-08 Asahi Chem Ind Co Ltd Carbon fiber-containing thermoplastic resin molded product
JP2001059056A (en) * 1999-08-23 2001-03-06 Tokyo Printing Ink Mfg Co Ltd Electroconductive resin composition and its molded product
JP2003012945A (en) * 2001-03-28 2003-01-15 Ube Ind Ltd Conductive resin composition and its manufacturing method

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS627509A (en) * 1985-07-05 1987-01-14 Sumitomo Metal Ind Ltd Manufacture of resin composite material mixed with carbon fiber
JPH06260017A (en) * 1993-03-04 1994-09-16 Otsuka Chem Co Ltd Conductive thermoplastic resin composition
JPH09255872A (en) * 1996-03-26 1997-09-30 Nippon G Ii Plast Kk Antistatic resin composition
JPH11116825A (en) * 1997-10-09 1999-04-27 Otsuka Chem Co Ltd Resin composition
JP2000095947A (en) * 1998-09-21 2000-04-04 Unitika Ltd Conductive resin composition
JP2000218711A (en) * 1999-02-02 2000-08-08 Asahi Chem Ind Co Ltd Carbon fiber-containing thermoplastic resin molded product
JP2001059056A (en) * 1999-08-23 2001-03-06 Tokyo Printing Ink Mfg Co Ltd Electroconductive resin composition and its molded product
JP2003012945A (en) * 2001-03-28 2003-01-15 Ube Ind Ltd Conductive resin composition and its manufacturing method

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7575800B2 (en) 2001-11-02 2009-08-18 Kitagawa Industries Co., Ltd. Sliding parts, precision parts and timepieces and electronic equipment using the same
JP2004244522A (en) * 2003-02-14 2004-09-02 Nagano Japan Radio Co Method for manufacturing carbon-fiber composite material and carbon-fiber composite material
JP2005146057A (en) * 2003-11-12 2005-06-09 Polymatech Co Ltd High-thermal-conductivity molding and method for producing the same
US8257075B2 (en) 2008-11-10 2012-09-04 Apple Inc. Carbon composite mold design
US8734706B2 (en) 2008-11-10 2014-05-27 Apple Inc. Carbon composite mold design
JP2013049794A (en) * 2011-08-31 2013-03-14 Toyobo Co Ltd Polyamide resin composition
WO2015174488A1 (en) * 2014-05-16 2015-11-19 東洋紡株式会社 Crystalline polyamide resin composition
US10294366B2 (en) 2014-05-16 2019-05-21 Toyobo Co., Ltd. Crystalline polyamide resin composition
WO2018123563A1 (en) * 2016-12-26 2018-07-05 ユニチカ株式会社 Polyamide resin composition, method for producing same and molded body formed from same
JP2019167502A (en) * 2018-03-26 2019-10-03 三菱ケミカル株式会社 Fiber-reinforced thermoplastic resin composition, production method thereof and injection molded article
JP2022097549A (en) * 2018-03-26 2022-06-30 三菱ケミカル株式会社 Fiber reinforced thermoplastic resin molding material, pellets and method of manufacturing the same
JP7447930B2 (en) 2018-03-26 2024-03-12 三菱ケミカル株式会社 Fiber-reinforced thermoplastic resin molding material, pellets and manufacturing method thereof
JP7489754B2 (en) 2018-03-26 2024-05-24 三菱ケミカル株式会社 Fiber-reinforced thermoplastic resin composition, its production method, and injection molded product
JP2021070204A (en) * 2019-10-30 2021-05-06 住友化学株式会社 Resin pellet and resin pellet manufacturing method
JP7317668B2 (en) 2019-10-30 2023-07-31 住友化学株式会社 Resin pellets and method for producing resin pellets

Also Published As

Publication number Publication date
JP3960096B2 (en) 2007-08-15

Similar Documents

Publication Publication Date Title
US7026388B2 (en) Conductive resin composition and process for producing the same
JP5221876B2 (en) Conductive masterbatch and resin composition containing the same
JP2000095947A (en) Conductive resin composition
WO2006080303A1 (en) Polyamide resin composition and conductive shaft-shaped molded article
JP6490682B2 (en) Carbon fiber reinforced plastic molding material
JP3960096B2 (en) Conductive resin composition and method for producing the same
JP2003012945A (en) Conductive resin composition and its manufacturing method
JP2009532547A (en) Conductive composition based on polyamide matrix
JP2017039901A (en) Housing
TW200413458A (en) Polyamide composition, process for preparing a polyamide composition, use of a polyamide composition for preparing a moulded part, a moulded part, process for preparing an assembled part, and assembled product
CN103694698B (en) Daiamid composition of a kind of selectivity metal refining and preparation method thereof and application
JP3487034B2 (en) PBT resin molding material
JPH10219105A (en) Polyamide resin composition and housing part of electric appliance produced therefrom
JP2001172498A (en) Polyamide resin composition
JP2022509473A (en) Thermoplastic resin composition and molded products using it
JP2021113308A (en) Thermally conductive resin composition and molded article comprising the same
JPS63175058A (en) High impact strength polyamide molding material
JPH11279411A (en) Resin molding material
JP3374440B2 (en) Thermoplastic resin composition for surface mounting parts with excellent blister resistance
JP2000281896A (en) Flame-retardant conductive resin composition and molded product using the same
JP3403951B2 (en) Resin composition
JP2002309102A (en) Process for preparation of thermoplastic resin composition, and composition
JPH073070A (en) Resin composition
JP2001261975A (en) Electroconductive thermoplastic resin composition
JP2005232239A (en) Polyamide resin composition and molding consisting of the same

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040824

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050906

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20060821

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A132

Effective date: 20061107

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20070424

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20070507

R150 Certificate of patent or registration of utility model

Ref document number: 3960096

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110525

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120525

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120525

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120525

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130525

Year of fee payment: 6

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130525

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130525

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140525

Year of fee payment: 7

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees