JP2002366921A - Ic card and manufacture of ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC card whose surface can be subjected to smoothing processing even in the case of a thin IC card and which does not have recording irregularity by suppressing the occurrence of unevenness irregularity and is also excellent in durability to bending and a point pressure strength load, and its manufacturing method. SOLUTION: This IC card 1 formed by fixing with an adhesive a first sheet material 2 where an image receiving layer is formed on the surface, a second sheet material 3 arranged at the rear face side of the first sheet material 2 and an inlet 4 with an IC enclosed between the rear face of the first sheet material 2 and the second sheet material 3, has a particle filled layer filled with planar particles and/or acicular particles and fibrous material in the area of a thickness direction including a position where at least the IC part 40 is arranged.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to an IC card containing an IC component and a method for manufacturing the IC card.

[0002]

2. Description of the Related Art Some ID cards have, for example, a face layer having a face image and written information on the front side and a writing layer on the back side which can be written with a writing instrument or the like. Such ID cards can be easily and inexpensively made with the recent development of sublimation printing technology, and have been rapidly spreading in recent years, but have not yet been fully spread.

[0003] An IC component is built in the ID card, and the fact that the cost is increased due to the IC component is cited as the greatest obstacle to the realization of widespread use. In addition, mass production is not possible because of the lack of widespread use, and it is expensive.

[0004] On the other hand, the quantitative problem is partly due to the fact that a technology for stably producing an IC card at low cost has not yet been established. As a conventional method of manufacturing an IC card, for example, an IC card having a relatively thick thickness, an IC component and a wireless antenna are housed in a cover made of upper and lower resin molds, and a bonding surface of the upper and lower covers is heated. It is made by melting and bonding in a sheet, or a groove is cut in the sheet material, and the IC component and the radio antenna are housed in this groove and sealed with resin, and the image receiving layer is held on it. And the like, which are created by bonding sheet materials.

[0005]

By the way, the IC card created by the former method is relatively inexpensive when printing only fixed symbols without a face image or written information as a wireless tag, When printing different face images and information on each sheet, it is time-consuming to print the information on the sheet material with another machine, cut it, and attach it to the resin mold cover. It becomes handmade and very expensive.

The latter method is suitable for making a thin IC card. However, this method requires a thick sheet material because a groove is formed in the sheet material. To that extent, the thickness of the sheet material for holding the image receiving layer must be reduced. When thinner, the part sealed with resin has a different material from the other parts, and because it shrinks when cured, the surface of the sheet material corresponding to the part sealed with resin is compared to the surface of other parts , A little concave.
For this reason, when the image receiving layer is pasted on the sheet material, a depression is formed in a portion corresponding to the depression of the sheet material. Therefore, when an attempt is made to print on a portion above an antenna or an IC component, the diffusion of the ink into the image receiving layer is deteriorated due to the heating of the thermal head, and the color becomes thin or white. For this reason, the concave portion of the image receiving layer must be excluded from the printing area to lay out the card surface, and there is a disadvantage that free expression is restricted.

To cope with these problems, Japanese Patent Laid-Open No.
-131987 has an image receiving layer on one side,
And a first sheet material having a thermosetting resin layer on the other side,
A second sheet material having a writing layer on one side and a thermosetting resin layer on the other side is provided between both thermosetting resin layers.
A method is disclosed in which a C module is inserted, superposed, heated and pressed, and then punched into a predetermined shape to form a card. This method can reduce dents in a portion of the first sheet material corresponding to the IC module. In addition, an IC card that has a smooth surface, can improve printing characteristics, is inexpensive, and can be mass-produced can be obtained.

However, the I obtained by this method is
When an image is formed on a C card by thermal transfer, the image receiving layer deteriorates due to heating, which causes a problem that the image receiving sensitivity is reduced. In addition, in order to improve the flatness with respect to the transfer head at the time of image receiving and improve the image receiving property. In the case where a cushion layer is provided between the image receiving layer and the thermosetting resin layer, the cushion layer is softened to cause a slight undulation in the IC card, thereby deteriorating the flatness and causing recording unevenness. There are also problems.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned circumstances, and an object of the present invention is to make it possible to smooth the surface of a thin IC card, suppress the occurrence of uneven unevenness, eliminate recording unevenness, and prevent bending and bending. I with excellent durability due to point pressure strength load
An object of the present invention is to provide a method for manufacturing a C card and an IC card.

[0010]

Means for Solving the Problems In order to solve the above problems and achieve the object, the present invention has the following constitution.

According to the first aspect of the present invention, there is provided a first sheet material having an image receiving layer formed on a front surface thereof, a second sheet material disposed on the back side of the first sheet material, and An IC formed by fixing an inlet in which an IC component is sealed with an adhesive between a back surface of the first sheet material and the second sheet material;
An IC card characterized in that the card has a particle-filled layer filled with tabular particles and / or needle-like particles or fibrous material at least in a region in a thickness direction including a position where the IC component is arranged. ].

According to the first aspect of the present invention, at least a region in a thickness direction including a position where an IC component is disposed is filled with a flat particle and / or a needle particle or a fibrous material. By having the layer, the surface can be smoothed even with a thin IC card, the occurrence of unevenness due to IC components is suppressed, there is no recording unevenness, and the durability due to bending and point pressure strength load is excellent.

According to a second aspect of the present invention, there is provided the IC card according to the first aspect, wherein the particle-filled layer is provided on a front side and / or a back side of the first sheet. ].

According to the second aspect of the present invention, by providing the particle-filled layer on the front side and / or the back side of the first sheet, the surface on the first sheet side can be particularly smoothed, Generation of unevenness due to the IC component can be suppressed.

According to a third aspect of the present invention, there is provided an IC card according to the first aspect, wherein the particle-filled layer is provided on a front side and / or a back side of the second sheet. ].

According to the third aspect of the present invention, since the particle-filled layer is provided on the front side and / or the back side of the second sheet, the surface of the second sheet can be particularly smoothed. Generation of unevenness due to the IC component can be suppressed.

According to a fourth aspect of the present invention, there is provided an IC card according to the first aspect, wherein the particle-filled layer is provided on a front side and / or a back side of the inlet. ].

According to the fourth aspect of the invention, since the particle filling layer is provided on the front side and / or the back side of the inlet, the occurrence of unevenness due to the IC components provided in the inlet is effectively suppressed. be able to.

According to a fifth aspect of the present invention, there is provided an IC according to any one of the first to fourth aspects, wherein the adhesive contains tabular grains and / or acicular grains. card. ].

According to the fifth aspect of the present invention, since the adhesive further contains tabular particles and / or needle-like particles, the surface can be smoothed even with a thinner IC card, and the IC component can be used. The occurrence of unevenness in unevenness can be suppressed.

According to a sixth aspect of the present invention, there is provided a method according to any one of the first to fifth aspects, wherein a member having a mesh structure is provided between the IC component and the particle-filled layer. IC card. ].

According to the sixth aspect of the present invention, since a mesh-structured member is provided between the IC component and the particle-filled layer, the durability due to bending and point pressure load is further improved. ing.

According to a seventh aspect of the present invention, there is provided a method as set forth in any one of the first to sixth aspects, wherein the inlet has a structure in which an IC component is supported by a porous sheet. IC card. ].

According to the seventh aspect of the present invention, the inlet has a structure in which the IC component is supported on the porous sheet, and the degree of filling is improved by the particles being supported by the eyes of the porous sheet. Thus, a layer having high rigidity can be formed.

The invention according to claim 8 is characterized in that the inlet forms an antenna circuit on an etched antenna sheet support and connects an IC component to the etched antenna sheet support. 7. The IC card according to claim 1, wherein the IC card has an opening. ].

According to the eighth aspect of the present invention, the etched portion of the inlet antenna sheet support has an opening in a portion near the periphery of the IC component, and the adhesive enters the opening and the IC component itself has an opening. Distortion becomes smaller and becomes stronger against bending.

According to a ninth aspect of the present invention, the present invention is characterized in that a reinforcing plate is provided on the IC component, and the reinforcing plate becomes thinner toward the outer periphery of the short side of the card. An IC card according to claim 7 or claim 8. ].

According to the ninth aspect of the present invention, the IC
The component is provided with a reinforcing plate, and the reinforcing plate is thinner toward the outer peripheral direction of the card short side, so that the direction toward the outer peripheral direction of the card short side is the image recording head direction, and the reinforcing plate is an IC. In addition to reinforcing the components, it is possible to reduce the level difference due to the IC components so that the recording by the recording head is not adversely affected.

According to a tenth aspect of the present invention, there is provided an image forming apparatus comprising: a first sheet material having an image receiving layer formed on a front surface thereof; a second sheet material disposed on the back side of the first sheet material; In a method of manufacturing an IC card in which an inlet in which an IC component is sealed is inserted between the back surface of the first sheet material and the second sheet material and fixed by an adhesive, the first sheet material and the The inlet is inserted between the second sheet materials, and has an opening in a region near the position where the IC component is arranged. A method for manufacturing an IC card, comprising simultaneously inserting and bonding a hot-melt sheet having a corresponding thickness. ].

According to the tenth aspect of the present invention, an inlet is inserted between the first sheet material and the second sheet material, and an opening is formed in a region near a position where IC components are arranged. By simultaneously inserting and bonding a hot-melt sheet having a thickness corresponding to the height of the convex portion of the IC component disposed in the inlet, the adhesive corresponding to the convex portion of the IC component is opened. And the surface can be smoothed even with a thin IC card.

[0031] The invention described in claim 11 is that the member containing the high elastic material in a region larger than the opening so as to cover the opening of the hot melt sheet is made of the first sheet and / or the member. The method for manufacturing an IC card according to claim 10, wherein the IC card is provided on a second sheet side. ].

According to the eleventh aspect of the present invention, the member containing the high elasticity material in a region larger than the opening so as to cover the opening for disposing the IC component of the hot-melt sheet is formed of the first material. The adhesive provided on the sheet and / or the second sheet side allows the adhesive corresponding to the convex portion of the IC component to flow into the opening more reliably, and can even the surface of a thin IC card to be smooth, and has a high elasticity material. Is excellent in durability due to bending and point pressure strength load.

According to a twelfth aspect of the present invention, there is provided the method according to the eleventh aspect, wherein the highly elastic material is a particle-packed layer filled with tabular grains and / or needle-like grains.
Manufacturing method of C card. ].

According to the twelfth aspect of the present invention, the highly elastic material is a particle-filled layer filled with tabular grains and / or needle-shaped grains.
The surface can be smoothed even with a thin IC card, and the durability due to bending and point pressure strength load is excellent.

According to a thirteenth aspect of the present invention, there is provided the method of manufacturing an IC card according to the eleventh aspect, wherein the high elasticity material is a member having a mesh structure. ].

According to the thirteenth aspect of the present invention, the highly elastic material is a member having a mesh structure. By using the member having the mesh structure, even a thin IC card can have a smooth surface, and can be bent or bent. Excellent durability due to point pressure strength load.

According to a fourteenth aspect of the present invention, there is provided an image forming apparatus comprising: a first sheet material having an image receiving layer formed on a surface thereof; and a second sheet material disposed on the back side of the first sheet material. A method of manufacturing an IC card in which an adhesive is supplied to a back surface of the first sheet material and a back surface of the second sheet material, and then an inlet in which an IC component is encapsulated is inserted and bonded by a pressure roll. The method of manufacturing an IC card according to claim 1, wherein an inlet having an opening is inserted into an inlet base material at a width side near the periphery of the IC component or at a rear end side at the time of bonding. ].

According to the fourteenth aspect of the present invention, I
By inserting an inlet provided with an opening into the inlet base material at the width side near the periphery of the C component or at the rear end side position when bonding, an adhesive corresponding to the convex portion of the IC component is formed. It flows into the opening and the surface can be smoothed even with a thin IC card.

According to a fifteenth aspect of the present invention, there is provided an image forming apparatus comprising: a first sheet material having an image receiving layer formed on a surface thereof; and a second sheet material disposed on the back side of the first sheet material. An IC card manufacturing method comprising: supplying an adhesive to the back surface of the first sheet material and the back surface of the second sheet material; The adhesive contains tabular particles and / or needle-like particles, and at least between the adhesive supplied to the sheet material and the IC component is smaller than the particle size of the tabular particles and / or needle-like particles. A mesh member having a network structure is arranged and bonded to form a structure having a particle-filled layer at least above and below said IC component.
Manufacturing method of C card. ].

According to the fifteenth aspect of the present invention, a mesh member having a network structure smaller than the particle diameter of the tabular particles and / or the acicular particles is arranged and bonded between the adhesive and the IC component. In combination, by forming the structure having the particle filling layer at least above and below the IC component, the IC component is further reinforced by the particle filling layer and the mesh member, and the strength is improved.

In particular, the strength can be enhanced by providing a mesh structure using a mesh member and a tabular grain packed layer. When tabular particles are put into the adhesive, the flowability is deteriorated, so that a large amount cannot be put. However, according to the present invention, by using a mesh member finer than the tabular particles, the flat plate is used. The particles can be concentrated on the surface of the mesh member, and a highly packed layer of tabular grains can be formed.

The particle-filled layer filled with tabular particles and / or needle-like particles and fibrous materials used in the present invention preferably has an elastic modulus of 5 Gpa or more, more preferably 10 GPa or more.
Gpa or more, especially 50 Gpa or more is preferable.

The tabular grains preferably have an aspect ratio of 2 or more. The aspect ratio here indicates the ratio of the diameter of a circle having the same area as the projected area of a tabular grain to the distance between two parallel planes. In the present invention, the aspect ratio is preferably 2 or more and less than 100, particularly preferably 2 or more and less than 50. The tabular grains of the present invention have a thickness of 3.
It is preferably less than 0 microns, preferably less than 2.0 microns. Specifically, for example, mica, talc,
Tabular substances such as layered silicates and silver halides can be used. The tabular silica-based compound as a tabular substance refers to a layered silicate containing an alkali, an alkaline earth metal, aluminum, or the like, that is, a tabular silicate, such as kaolin mineral, mica clay mineral, And smectite.

Examples of the kaolin mineral include kaolinite, deckite, nacrite, halloysite, serpentine and the like. Examples of the mica clay mineral include pyrophyllite, talc, muscovite, swellable synthetic fluoromica, sericite, and chlorite.

Examples of the smectite include smectite, vermiculite, and swellable synthetic fluorine permiculite. There are two types of smectites, natural products and synthetic products. Examples of natural products include montmorillonite and beidellite, which can be obtained as clay called bentonite or acid clay. Examples of the synthetic smectite include, for example, Lucentite SWN (hereinafter, referred to as STT-1) and Lucentite SWF (containing 2 to 5% by weight of fluorine) (hereinafter, referred to as STT-2) manufactured by Corp Chemical Co., Ltd. ).

As tabular grains, mica is highly reflective (high rainbow
As a thin film coating that gives chromatic reflection), it is transparent and refracted in the visible range
Metal oxides or metal sulfides with a property of 2.0 or more
With, for example, Sb_TwoS_Three, Fe_TwoO_Three, Pb
O, ZnSe, CdS, Bi _TwoO_Three, TiO_Two, PbC
l_Two, CeO_Two, Ta_TwoO_Five, ZnS, ZnO, CdO, N
d_TwoO_Three, Sb_TwoO_Three, SiO and InO_ThreeA single layer of coating,
Or even those formed by coating in two layers
Good.

[0047] As such, "Iri
"odin" is a stable inorganic flake pigment in which the surface of natural mica is coated with a metal oxide having a high refractive index such as titanium oxide and iron oxide. The light reflected at the boundary with the medium also provides pearl luster.

As the tabular silver halide, AgB
r, AgCl, AgClBr, AgClBrI, AgB
rI, AgClBrI, etc. can be used arbitrarily. These are disclosed in U.S. Pat. Nos. 4,439,520 and 4,4,520.
No. 25,425 and No. 4,414,304, and can be easily obtained as target tabular grains. In the tabular grains, silver halides having different compositions can be epitaxially grown or shelled at specific surface portions.

The preferred amount of the tabular grains used in the present invention is 0.10 to 0.90 in terms of dry weight ratio to the binder of the layer to be added, particularly preferably 0.2 to 0.90.
0.8. Further, tabular particles and other fine particles may be used in combination. Further, the surface of the plate-like fine particles may be subjected to a treatment such as hydrophobicity as necessary. Such tabular grains can be used as an ink by adding a vehicle and additives.

As the binder for the particle-filled layer, waxes, a hot melt adhesive described later, a reactive hot melt adhesive, and the like can be used. Further, a binder of ordinary printing ink or UV curable ink can be used. Particle-filled layer is screen printing, gravure printing,
Normal printing such as lithographic printing, wire bar coating,
And a coating method. Further, the transfer foil may be formed in a predetermined location by thermal transfer or the like in the form of a transfer foil.

The acicular particles used in the present invention include:
Hexagonal ferrites such as barium ferrite and strontium ferrite can be given. Further, a fiber piece having a high elastic modulus such as aramid fiber may be used.

If necessary, other fine particles may be used in combination. As the other fine particles, various inorganic oxides, carbides, nitrides, and borides are preferably used. For example, silica, alumina, titania, zirconia, barium titanate, aluminum titanate, strontium titanate, magnesium titanate, calcium titanate,
Examples include zinc oxide, chromium oxide, cerium oxide, antimony oxide, tagustene oxide, tin oxide, tellurium oxide, manganese oxide, boron oxide, silicon carbide, boron carbide, titanium carbide, silicon nitride, titanium nitride, and boron nitride.

Examples of the member having a mesh structure used in the present invention include a mesh woven fabric such as a nonwoven fabric, a plain woven fabric, a twill woven fabric, a satin woven fabric, a metal such as stainless steel, and a ceramic fiber. In addition, a woven fabric having a pile called moquette, plush velor, seal, velvet, or suede can be used. Examples of the material include polyamides such as nylon 6, nylon 66, and nylon 8, proesters such as polyethylene terephthalate, polyolefins such as polyethylene, polyvinyl alcohol, polyvinylidene chloride, polyvinyl chloride, polyacrylonitrile, and acrylamide. , Acrylic resins such as methacrylamide, polyvinylidene cyanide, polyfluoroethylene, polyurethane-based synthetic resins,
One or two selected from natural fibers such as silk, face, wool, cellulose, cellulose, and cellulose ester, regenerated fibers (rayon, acetate), and aramid fibers
Fibers combining more than one species are included.

Among these fiber materials, polyamides such as nylon 6 and nylon 66, acrylics such as polyacrylonitrile, acrylamide and methacrylide, polyesters such as polyethylene terephthalate, celluloses as regenerated fibers, and cellulose esters are preferred. Rayon, acetate, and aramid fibers.

As the adhesive and the hot-melt sheet used in the present invention, those generally used can be used. As a main component of hot melt adhesive,
For example, ethylene-vinyl acetate copolymer (EVA), polyester, polyamide, thermoplastic elastomer, polyolefin and the like can be mentioned. As a polyamide-based hot melt adhesive, there is a macro melt series manufactured by Henkel Co., Ltd., and as a thermoplastic elastomer-based hot melt adhesive, Kariflex TR and Clayton series manufactured by Shell Chemical Co., Ltd., Tufprene manufactured by Asahi Kasei Corporation,
Firestone Synthetic Rubber
and Latex Tuffden, Phillip
s Petroleum Sorprene 400 series. Examples of polyolefin hot melt adhesives are Sumitomo Chemical's Sumitics, Chisso Petrochemical's Vistack, Mitsubishi Yuka's Yucatak, Henkel's Macromelt Series, Mitsui Petrochemical's Tuffmer, Ube Lexen's APAO, and Eastman Chemical's. East Bond, Hercules A-FAX, and the like.

The adhesive and the hot-melt sheet used in the present invention are preferably of a reactive type. A reactive hot-melt adhesive (hereinafter, referred to as a reactive adhesive) is a type of adhesive in which a resin is melted and bonded, and then moisture is absorbed to cure the resin. Its characteristics are that it has a hardening reaction compared to ordinary hot melt, has a long bondable time as required, and has a high softening temperature after bonding, so it is durable and suitable for processing at low temperatures. Is mentioned. As an example of the reactive adhesive, there is an adhesive whose main component is a urethane polymer containing an isocyanate group at the molecular terminal, and the isocyanate group reacts with moisture to form a crosslinked structure. The reactive adhesives usable in the present invention include TE030 and TE100 manufactured by Sumitomo 3M, Hibon 4820 manufactured by Hitachi Chemical Co., Ltd., Bondmaster 170 series manufactured by Kanebo uenusc, and Ma manufactured by Henkel.
Croplast QR 3460 and the like. As the adhesive used in the present invention, Japanese Patent Application No. Hei.
The low-temperature adhesive listed in 00-369855 can be used.

[0057]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of an IC card and a method for manufacturing an IC card according to the present invention will be described below with reference to the drawings, but the present invention is not limited to these embodiments.

FIG. 1 is a layer configuration diagram of a first embodiment of an IC card, and FIG. 2 is a plan view of an inlet. FIG. 1 (a)
FIG. 1 shows a layer structure immediately before integration of an IC card, and FIG.
(B) shows the layer configuration after the IC card is integrated.

The IC card 1 of this embodiment has a first sheet material 2 having an image receiving layer formed on the front surface thereof, and a second sheet material 3 disposed on the back side of the first sheet material 2. An inlet 4 and a hot-melt sheet 5 are fixed between the back surface of the first sheet material 2 and the second sheet material 3 with adhesive layers 6 and 7. The adhesive layers 6 and 7 are formed using, for example, a hot melt adhesive.

The inlet 4 connects the antenna 41 to the IC component 40, and the IC component 40 is reinforced by the reinforcing plate 42. In this configuration, an IC component 40, an antenna 41, and a reinforcing plate 42 are embedded in a nonwoven fabric 43, and the IC component 40 is supported by a porous sheet.

The hot melt sheet 5 includes the IC component 4
A hot melt sheet 5 having a thickness corresponding to the height of the convex portion of the IC component 40 disposed in the inlet 4 is simultaneously inserted and bonded, having an opening 50 in a region near the position where 0 is disposed. I do. The hot melt sheet 5 is preferably a reaction type.

At the time of bonding, the hot melt sheet 5 and the adhesive layer 6 are integrated by melting and flowing into the porous sheet. At this time, the adhesive layer 6 also tries to flow into the gap between the opening 50 and the IC component 40, but the flow is adjusted by the presence of the particle-filled layer 8, and the unevenness of the adhesive is sharply increased. Can be eliminated, the surface of even the thin IC card 1 can be smoothed, and the occurrence of unevenness due to the IC component 40 is suppressed, and the recording unevenness is eliminated.

Further, by providing the particle-filled layers 8 and 9 filled with tabular particles and / or needle-like particles and fibrous materials in the region in the thickness direction including the position where the IC component 40 is arranged, The smoothing process can be further performed, the occurrence of unevenness due to the IC component 40 is suppressed, and there is no recording unevenness, and the durability due to bending or point pressure strength load is excellent. Particle packed bed 8,
The elastic modulus of 9 is preferably 5 Gpa or more, more preferably 10 Gpa or more, and particularly preferably 50 Gpa or more.
The inlet 4 has a configuration in which the IC component 40 is supported by a porous sheet, and is more excellent in durability due to bending and point pressure strength load.

FIG. 3 is a layer configuration diagram of a second embodiment of the IC card. FIG. 3A shows a layer configuration immediately before the IC card is integrated, FIG. 3B shows a layer configuration after the IC card is integrated, and FIG. Is shown.

The IC card 1 of this embodiment has the same configuration as the embodiment of FIGS. 1 and 2, but additionally has a particle filling layer 80 on the back side of the first sheet 2. The particle-filled layer 90 is provided on the back side of the second sheet 3.
Since the IC card 1 has the particle-filled layers 80 and 90 in addition to the particle-filled layers 8 and 9, the smoothing process can be further performed. Also, it has excellent durability due to bending and point pressure strength load.

Further, in the area in the thickness direction including the position where the IC component 40 is disposed, the particle-filled sheets S1 and S2 are provided. As shown in FIG. It is preferable that the packing layers 8 and 9 are laminated with the porous sheets 8a and 9a.

FIGS. 4 and 5 show a third embodiment of the IC card. FIG. 4 is a diagram showing the layer structure of the IC card.
FIG. 5A is a plan view of an IC card, and FIG. 5B is an enlarged view of a particle filling layer. The IC card 1 according to this embodiment has
The inlet 4 in which the C component 40, the reinforcing plate 42, and the antenna 41 are embedded in the nonwoven fabric, the adhesive layers 6 and 7 are provided on the first sheet 2 and the second sheet 3 reinforced with the particle-filled layers 80 and 90, respectively. It is formed by sticking.

The first sheet 2 and the second sheet 3 correspond to FIG.
As shown in (b), the particle-filled layers 80 and 90 are reinforced in layers by hard particles, and deformation due to pressure during bonding is reduced, so that the surface unevenness after bonding is reduced.

When the metal sheet is partially reinforced only with a member such as a metal sheet, the difference in internal strength is remarkable. Therefore, when the sheet is repeatedly bent, the first sheet 2 or the second sheet 2 corresponding to the periphery of the metal sheet is obtained. In some cases, the load may be concentrated on 3 and cracks may occur, and it may be exposed. In this embodiment,
Since it is reinforced by the particle-filled layers 80 and 90, which hold hard tabular grains in a multilayer structure with a binder resin having good flexibility, it is configured to be resistant to both repeated bending and point pressure strength load. .

FIG. 6 is a layer configuration diagram of a fourth embodiment of the IC card. The IC card 1 according to this embodiment is similar to that shown in FIG.
And the same configuration as that of the embodiment of FIG. 5, except that a particle-filled layer is provided on the surface side of the first sheet material 2 and the second sheet material 3 corresponding to the position where the IC component 40 is arranged. 81 and 91 are provided. Thus, the first sheet material 2 has the particle-filled layers 80 and 81 on the front side and the back side,
A particle-filled layer 9 is provided on the front and back sides of the second sheet material 3.
By having 0, 91, the surfaces of the first sheet 2 and the second sheet material 3 can be further smoothed, the occurrence of unevenness is suppressed, there is no recording unevenness, and the bending and point pressure strengths are reduced. Excellent durability due to heavy loads.

Further, as shown in FIG. 6B, after a transfer image 82 such as thermal transfer is recorded on the surface of the IC card, a hardening protective layer 84 is provided via an adhesive layer 83 by foil transfer or the like. If the particle-filled layer 81 is provided in that layer, the effect is further exhibited. When the writing layer 85 is disposed on the back side of the card, the writing layer 85 is designed to withstand the external pressure due to the writing pressure.
It is preferable to provide a particle-filled layer 86 inside or between the writing layer 85 and the second sheet 3.

FIG. 7 is a layer configuration diagram of a fifth embodiment of the IC card. The IC card 1 according to this embodiment is similar to that shown in FIG.
5 is the same as that of the embodiment shown in FIG. 5, but in this embodiment, the adhesives 6 and 7 are filled with tabular particles and / or needle-like particles to be integrated with the particle filling layers 80 and 90. I have. Thus, the particle-filled layers 80, 90 are
7, the surface of the inlet 4 is provided on the front side and the back side, so that unevenness due to the IC components 40 provided in the inlet 4 can be effectively suppressed, and the surface of the thin IC card 1 can be smoothed. it can.

Further, the adhesives 6 and 7 are made of tabular grains and / or
Or by containing needle-like particles, a thinner IC
The surface of the card 1 can also be smoothed, the occurrence of unevenness is suppressed, there is no recording unevenness, and the card 1 is excellent in durability due to bending and point pressure load.

FIG. 8 is a layer configuration diagram of a sixth embodiment of the IC card. The IC card 1 according to this embodiment has a structure shown in FIG.
However, in this embodiment, as in the embodiment of FIG. 7, the adhesives 6, 7 are filled with tabular particles and / or needle-like particles to form a particle-filled layer. 8
0 and 90 are integrated.

9 and 10 show another embodiment of the inlet. FIG. 9 is a sectional view of the inlet, and FIG. 10 is a plan view of the inlet.

The inlet 4 of this embodiment is of an etched antenna type in which an antenna circuit is formed on the etched antenna sheet support 44 and an IC component 40 is connected to the antenna 41 of the antenna circuit. The IC component 40 of the inlet 4 and the reinforcing plate 42 are arranged in the opening 50 of the hot melt sheet 5, the IC card 1 is thinned, and the adhesive 6 enters the opening 50 so that the IC
The level difference due to the component 40 can be reduced and smoothed.

FIG. 11 is a sectional view showing another embodiment of the inlet. The inlet 4 of this embodiment is configured in the same manner as in FIG. 9, but the porous sheet 70 and the particle-filled layer 71 are arranged on the IC component 40, so that the step due to the IC component 40 can be reduced and smoothed.

FIGS. 12 and 13 show still another embodiment of the inlet. FIG. 12 is a sectional view of the inlet, and FIG. 13 is a plan view of the inlet.

In the inlet 4 of this embodiment, the IC component 40 and the reinforcing plate 42 are arranged in the opening 50 of the hot-melt sheet 5 and the non-woven fabric 43 of the hot-melt sheet 5
On the opposite side, a nonwoven fabric 46 is arranged. IC parts 4
0 and the reinforcing plate 42 with the opening 50 of the hot melt sheet 5.
, The IC card 1 can be thinned and smoothed.

FIG. 14 is a sectional view showing another embodiment of the inlet. The inlet 4 of this embodiment is configured in the same manner as in FIGS. 12 and 13, but as shown in FIG.
73 and particle-filled layers 74 and 75 are arranged, and FIG.
As shown in (b), the joined inlets 4 are integrated and reinforced, and can be smoothed.

FIGS. 15 and 16 show still another embodiment of the inlet. FIG. 15 is a sectional view of the inlet, and FIG. 16 is a plan view of the inlet.

The inlet 4 of this embodiment is of an etched antenna type constructed similarly to FIGS. 9 and 10, but is provided in a part near the periphery of the IC component 40 of the etched antenna sheet support 44 of the inlet 4. The opening 45 is formed so as to surround three sides of the IC component 40 except for the antenna connection portion, and the presence of the opening 45 allows the adhesive to flow therein and further reduces the distortion of the IC component 40 itself. Become stronger against bending.

FIGS. 17 and 18 show still another embodiment of the inlet. FIG. 17 is a sectional view of the inlet, and FIG. 18 is a plan view of the inlet.

The inlet 4 of this embodiment is similar to that of FIG.
16 is formed in the same manner as that of FIG. 16 except that the porous sheet 76 is covered on the etching antenna sheet support 44, and the particle filling layer 77 Is provided.

In the embodiment shown in FIG.
The C component 40 is formed on two sides except for an antenna connection portion and a portion opposed thereto. In the embodiment of FIG.
5 is formed in a portion of the IC component 40 facing the antenna connection portion, and the opening 45 in each case allows the adhesive to flow in, and furthermore, the distortion of the IC component 40 itself is reduced and the IC component 40 becomes strong against bending.

In the embodiment of FIG. 21, the structure is the same as that of FIG. 19, but the porous sheet 76 is covered on the etching antenna sheet support 44, and the opening 45 and the IC component 40 are further formed on the porous sheet 76. Is provided so as to cover the position.

In the embodiment of FIG. 22, the structure is the same as that of FIG. 20, except that the porous sheet 76 is covered on the etching antenna sheet support 44, and the opening 45 and the IC are formed on the porous sheet 76. A particle filling layer 77 is provided so as to cover the position of the component 40.

FIGS. 23 and 24 show still another embodiment of the inlet. FIG. 23 is a sectional view of the inlet, and FIG. 24 is a plan view of the inlet. In the inlet 4 of this embodiment, the IC component 40 and the reinforcing plate 42 are arranged in the opening 50 of the hot melt sheet 5, and a mesh structure member 60 is provided on the opposite side of the hot melt sheet 5 from the nonwoven fabric 43. Have been. This mesh structure member 60
Is made of, for example, a metal mesh, buried in the adhesive 6, and reinforced by disposing the mesh-structured member 60 between the IC component 40 and the particle-filled layer 80. Excellent durability.

FIGS. 25 and 26 show still another embodiment of the inlet. FIG. 25 is a sectional view of the inlet, and FIG. 26 is a plan view of the inlet. In the inlet 4 of this embodiment, an IC component 40 and a reinforcing plate 42 are arranged in an opening 45 of an etching antenna sheet support 44, and mesh members 61 and 62 are provided on both sides of the IC component 40.
Are arranged, and the IC component 40 can be further reinforced.

FIGS. 27 and 28 show an embodiment of the reinforcing plate. FIG. 27 is a plan view showing the arrangement of the reinforcing plate.
FIG. 3 is a diagram showing an embodiment in which a reinforcing plate is formed on an IC component. A reinforcing plate 42 is formed on the IC component 40 of this embodiment. The reinforcing plate 42 becomes thinner toward the outer periphery of the card short side in which the inclined surface 42a is formed on the card short side of the IC component 40. The direction toward the outer periphery of the short side of the card is the image recording head direction, and the reinforcing plate 4
2 reinforces the IC component 40 and the IC component 40
Is reduced so that the recording by the recording head is not adversely affected.

FIG. 29 is a view showing another embodiment of the reinforcing plate. In this embodiment, the reinforcing plate 42 has the same structure as that of the embodiment shown in FIGS. By embedding a part of the portion 40 in the reinforcing plate 42, a step due to the IC component 40 is reduced so that the recording by the recording head is not adversely affected.

FIG. 30 is a view showing another embodiment of the reinforcing plate. In this embodiment, the reinforcing plate 42 formed on the IC component 40 is reduced in size, and the reinforcing plate 42 is replaced with a frame-shaped reinforcing plate. 47. The frame-shaped reinforcing plate 47 has I
An inclined surface 47a is formed on the short side of the card of the C component 40 and becomes thinner toward the outer periphery of the short side of the card.

Next, a method of manufacturing an IC card will be described. In the embodiment shown in FIG. 31, the first sheet material 2
1 and 2, and an opening 50 is provided in a region near a position where the IC component 40 is arranged. The hot-melt sheet 5 having a thickness corresponding to the height of the convex portion of the IC component 40 is inserted at the same time, bonded with pressure rolls 66 and 67, and fixed with adhesives 6 and 7.

At the time of bonding with the pressure rolls 66 and 67, the adhesive 6 corresponding to the convex portion of the IC component 40 is opened.
0, and even the thin IC card 1 can smooth the surface.

In this embodiment, the particle-filled layer 8, which is a member containing a highly elastic material in a region larger than the opening 50 so as to cover the opening 50 of the hot-melt sheet 5,
9 is provided on the adhesives 6 and 7 of the first sheet 2 and the second sheet 3, so that the adhesive 6 corresponding to the convex portion of the IC component 40 can flow into the opening 50 more reliably. Further, a member having a mesh structure can be used as the highly elastic material.

FIG. 3 shows another embodiment of the manufacture of an IC card.
It is shown in FIG. In this embodiment, a first sheet material 2 and a second sheet material 3 are arranged, and adhesives 6 and 7 are supplied to the back surface of the first sheet material 2 and the back surface of the second sheet material 3. After that, as shown in FIGS. 15 to 22, an opening 45 is formed in the etched antenna sheet support 44 which is the inlet base material at the width side near the periphery of the IC component 40 or at the rear end side when bonding. The provided inlet 4 is inserted and bonded by pressure bonding rolls 66 and 67 to form.

At the time of bonding with the pressure rolls 66 and 67, the adhesives 6 and 7 corresponding to the convex portions of the IC parts are applied to the openings 4 and 7 respectively.
5, and the surface can be smoothed even with a thin IC card. In addition, the presence of the opening 45 allows the IC
The distortion of the component 40 itself becomes smaller and becomes stronger against bending.

FIG. 33 shows still another embodiment of the manufacture of an IC card. In this embodiment, the configuration is the same as that of FIG. 32 except that the adhesives 6 and 7 contain tabular particles and / or needle-like particles, and the adhesives 6 and 7 supplied to the sheet material and the IC component 40 In between, mesh members 61 and 62 having a network structure smaller than the particle diameter of the tabular particles and / or needle-like particles are arranged and bonded, and a structure having a particle filling layer at least above and below the IC component 40 is provided. I have to.

At the time of bonding with the pressure rolls 66 and 67, the adhesives 6 and 7 corresponding to the convex portions of the IC parts are applied to the openings 4 and 7 respectively.
5, the surface of even a thin IC card can be smoothed, and furthermore, mesh members 61 and 62 are arranged and bonded, and the IC component 40 is reinforced by having a particle-filled layer at least above and below the IC component 40. And the strength is improved.

FIG. 3 shows another embodiment of the manufacture of an IC card.
It is shown in FIG. In this embodiment, an adhesive layer is formed on the conveyed first sheet 2 by an adhesive layer supply die 100, and an inlet 4 is supplied by the inlet supply unit 101 onto the adhesive layer of the first sheet 2.

Similarly, an adhesive layer is formed on the transported second sheet 3 by the adhesive layer supply die 102, and the first sheet 2 and the second sheet 3 are bonded to each other with the laminating roll 103 sandwiching the inlet 4. . Before this bonding, the IC component of the inlet 4 or an infrared absorbing layer provided in the vicinity thereof is irradiated and heated in advance using the infrared local heating exposure device 104, and if necessary, the infrared heater 105 By heating the entire adhesive layer to make it flow easily, the adhesive layer particularly at the convex portion is subjected to I
It is preferable to make it easy to flow near the periphery of the C component. By combining the infrared absorption layer and the infrared irradiation, it is possible to heat only the necessary part of the adhesive layer, thereby minimizing surface irregularities. For the infrared absorbing layer, an infrared absorbing dye or pigment can be added to the adhesive layer, the particle-filled layer, or impregnated in a porous sheet, or coated on the back surface of the reinforcing plate. .

A semiconductor laser exposure device or the like can be used as the infrared irradiation device.

After the first sheet 2 and the second sheet 3 are bonded together, they are pressure-bonded and cooled by a pressure-bonding cooling device 110 and cut by a cutter 111 to produce an IC card.

[0104]

As described above, according to the first aspect of the present invention, the tabular particles and / or the acicular particles and the fibrous materials are provided at least in the thickness direction including the position where the IC component is arranged. By having a packed particle packed layer, a thin IC
Even with a card, the surface can be smoothed, the occurrence of unevenness due to IC components is suppressed, there is no recording unevenness, and the durability due to bending and point pressure load is excellent.

According to the second aspect of the present invention, by providing the particle-filled layer on the front side and / or the back side of the first sheet, the surface on the first sheet side can be particularly smoothed.
The occurrence of unevenness due to the C component can be suppressed.

According to the third aspect of the present invention, by providing the particle-filled layer on the front side and / or the back side of the second sheet, the surface on the second sheet side can be particularly smoothed.
The occurrence of unevenness due to the C component can be suppressed.

According to the fourth aspect of the present invention, since the particle-filled layer is provided on the front side and / or the back side of the inlet, the occurrence of unevenness due to the IC components provided in the inlet can be effectively suppressed. .

According to the fifth aspect of the present invention, since the adhesive further contains tabular particles and / or needle-like particles, the surface can be smoothed even with a thinner IC card.
The occurrence of unevenness due to the C component can be suppressed.

According to the sixth aspect of the present invention, there is further provided an IC
By having a mesh-structured member between the component and the particle-packed layer, durability due to bending and point pressure strength load is further improved.

In the invention according to claim 7, the inlet has a structure in which the IC component is supported by the porous sheet,
By absorbing the adhesive, even a thinner IC card can be smoothed.

According to the eighth aspect of the present invention, the etching antenna sheet support of the inlet has an opening in a part near the periphery of the IC component, and an adhesive enters the opening to reduce distortion of the IC component itself. Become stronger against bending.

According to the ninth aspect of the present invention, a reinforcing plate is provided on the IC component, and the reinforcing plate becomes thinner toward the outer peripheral direction of the card short side, so that the reinforcing plate becomes closer to the outer peripheral direction of the card short side. The direction is the image recording head direction, and the reinforcing plate reinforces the IC component, and the step due to the IC component can be reduced so that the recording by the recording head is not adversely affected.

According to the tenth aspect of the present invention, an inlet is inserted between the first sheet material and the second sheet material, and an opening is provided in a region near a position where the IC component is arranged. By simultaneously inserting and bonding a hot-melt sheet having a thickness corresponding to the height of the convex portion of the IC component disposed in the inlet, the adhesive corresponding to the convex portion of the IC component flows into the opening, The surface can be smoothed even with a thin IC card.

According to the eleventh aspect of the present invention, the member containing the high elasticity material in a region larger than the opening so as to cover the opening for disposing the IC component of the hot melt sheet is formed of the first sheet and / or the first sheet. Alternatively, the adhesive, which is provided on the second sheet side, allows the adhesive corresponding to the convex portion of the IC component to flow into the opening more reliably, and can smooth the surface even with a thin IC card, and contains a highly elastic material. Excellent durability due to bending and point pressure strength due to the member.

According to the twelfth aspect of the present invention, the highly elastic material is a particle-filled layer filled with tabular grains and / or needle-shaped grains.
Even with a card, the surface can be smoothed, and the durability due to bending and point pressure strength load is excellent.

According to the thirteenth aspect of the present invention, the highly elastic material is a member having a mesh structure. By using the member having the mesh structure, the surface can be smoothed even with a thin IC card, and the bending and point pressure strength can be improved. Excellent durability due to heavy loads.

According to the fourteenth aspect of the present invention, the IC component is formed by inserting an inlet provided with an opening into the inlet base material at the width side near the periphery of the IC component or at the rear end side at the time of bonding. The adhesive corresponding to the convex part of the IC component flows into the opening, and the surface can be smoothed even with a thin IC card.

According to the fifteenth aspect, the adhesive and the I
A mesh member having a network structure smaller than the particle diameter of the tabular particles and / or the acicular particles is arranged and bonded between the C components, and a structure having a particle filling layer at least above and below the IC component is obtained. Thereby, the IC component is further reinforced by the particle-filled layer and the mesh member, and the strength is improved.

[Brief description of the drawings]

FIG. 1 is a layer configuration diagram of a first embodiment of an IC card.

FIG. 2 is a plan view of an inlet.

FIG. 3 is a layer configuration diagram of a second embodiment of the IC card.

FIG. 4 is a layer configuration diagram showing a third embodiment of the IC card.

FIG. 5 is a plan view of the IC card.

FIG. 6 is a layer configuration diagram of a fourth embodiment of the IC card.

FIG. 7 is a layer configuration diagram of a fifth embodiment of the IC card.

FIG. 8 is a layer configuration diagram of a sixth embodiment of the IC card.

FIG. 9 is a sectional view of an inlet.

FIG. 10 is a plan view of an inlet.

FIG. 11 is a sectional view showing still another embodiment of the inlet.

FIG. 12 is a sectional view showing still another embodiment of the inlet.

FIG. 13 is a plan view of an inlet.

FIG. 14 is a cross-sectional view showing still another embodiment of the inlet.

FIG. 15 is a sectional view showing still another embodiment of the inlet.

FIG. 16 is a plan view of an inlet.

FIG. 17 is a cross-sectional view showing still another embodiment of the inlet.

FIG. 18 is a plan view of an inlet.

FIG. 19 is a plan view of an inlet.

FIG. 20 is a plan view of an inlet.

FIG. 21 is a plan view of an inlet.

FIG. 22 is a plan view of an inlet.

FIG. 23 is a sectional view showing still another embodiment of the inlet.

FIG. 24 is a plan view of an inlet.

FIG. 25 is a sectional view showing still another embodiment of the inlet.

FIG. 26 is a plan view of an inlet.

FIG. 27 is a plan view showing an arrangement state of a reinforcing plate.

FIG. 28 is a diagram showing an embodiment in which a reinforcing plate is formed on an IC component.

FIG. 29 is a view showing another embodiment of the reinforcing plate.

FIG. 30 is a view showing another embodiment of the reinforcing plate.

FIG. 31 is a diagram illustrating a method of manufacturing an IC card.

FIG. 32 is a diagram showing another method of manufacturing the IC card.

FIG. 33 is a diagram showing another method of manufacturing the IC card.

FIG. 34 is a diagram showing another method of manufacturing the IC card.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC card 2 1st sheet material 3 2nd sheet material 4 Inlet 5 Hot melt sheet 6,7 Adhesion layer 8,9 Particle filling layer 40 IC component 41 Antenna 42 Reinforcement plate 43 Nonwoven fabric 50 Opening

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Ryoji Hattori 1 Sakuracho, Hino-shi, Tokyo Konica Corporation (72) Inventor Nobuyuki Ishii 1 Sakuracho, Hino-shi, Tokyo Fonica term in Konica Corporation (reference) 2C005 MA07 MA14 MA18 PA03 PA04 5B035 BA03 BB09 CA01 CA23

Claims (15)

[Claims] A first sheet material having an image receiving layer formed on a front surface thereof; a second sheet material disposed on a back surface side of the first sheet material; a back surface of the first sheet material; An IC card formed by fixing an inlet in which an IC component is sealed between a second sheet material with an adhesive, wherein at least a region in a thickness direction including a position where the IC component is arranged is provided with tabular particles. And / or a particle-filled layer filled with needle-like particles or fibrous materials.
C card. 2. The IC card according to claim 1, wherein the particle-filled layer is provided on a front side and / or a back side of the first sheet. 3. The IC card according to claim 1, wherein the particle-filled layer is provided on a front side and / or a back side of the second sheet. 4. The IC card according to claim 1, wherein the particle-filled layer is provided on a front side and / or a back side of the inlet. 5. The IC card according to claim 1, wherein the adhesive contains tabular particles and / or needle-like particles. 6. The IC card according to claim 1, further comprising a member having a mesh structure between the IC component and the particle-filled layer. 7. The IC card according to claim 1, wherein the inlet has a structure in which an IC component is supported by a porous sheet. 8. The method according to claim 8, wherein the inlet forms an antenna circuit on the etched antenna sheet support, connects an IC component, and has an opening in a part of the etched antenna sheet support near a periphery of the IC component. The IC card according to any one of claims 1 to 6, wherein: 9. The IC component according to claim 7, wherein a reinforcing plate is provided on the IC component, and the reinforcing plate becomes thinner toward an outer peripheral direction of a short side of the card. The described IC card. 10. A first sheet material on which an image receiving layer is formed on a front surface, a second sheet material disposed on the back surface side of the first sheet material, a back surface of the first sheet material and a second sheet material. A method of manufacturing an IC card in which an inlet having an IC component inserted therein is inserted between two sheet materials and fixed by an adhesive, wherein the first sheet material and the second sheet material are disposed between the first sheet material and the second sheet material. And a hot melt having a thickness corresponding to a height of a convex portion of the IC component disposed in the inlet, having an opening in a region near a position where the IC component is disposed while inserting the inlet. A method for manufacturing an IC card, wherein sheets are simultaneously inserted and bonded. 11. The first sheet and / or the second sheet containing a high elastic material in a region larger than the opening so as to cover the opening of the hot melt sheet.
11. The device according to claim 10, wherein the device is provided on the seat side.
3. The method for manufacturing an IC card according to item 1. 12. The method for manufacturing an IC card according to claim 11, wherein the highly elastic material is a particle packed layer filled with tabular particles and / or needle-like particles. 13. The method for manufacturing an IC card according to claim 11, wherein the high elastic material is a member having a mesh structure. 14. A first sheet material having an image receiving layer formed on a front surface thereof, and a second sheet material disposed on the back surface side of the first sheet material. In a method for manufacturing an IC card, in which an adhesive is supplied to a back surface and a back surface of a second sheet material, an inlet in which an IC component is sealed is inserted, and bonded by a pressure roll, the IC card is manufactured. A method of manufacturing an IC card, comprising: inserting an inlet provided with an opening into an inlet base material at the width side or at the rear end side at the time of bonding. 15. A first sheet material having an image receiving layer formed on a front surface thereof, and a second sheet material disposed on the back side of the first sheet material. After supplying the adhesive to the back surface and the back surface of the second sheet material, the IC
A method of manufacturing an IC card formed by inserting and bonding an inlet in which parts are enclosed, wherein the adhesive contains flat particles and / or needle-like particles, and at least the adhesive supplied to the sheet material and the IC
A structure in which a mesh member having a network structure smaller than the particle size of the tabular particles and / or the acicular particles is arranged and bonded between components, and a particle filling layer is provided at least above and below the IC component. A method of manufacturing an IC card.