JP2002353693A - Electronic component mounter and electronic component mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component mounter and an electronic component mounting method by which mounting failure can be eliminated when mounting electronic component of micro size to be supplied in tape. SOLUTION: This electronic component mounter is used to pick up an electronic component 14 in an emboss E of a tape T by a suction nozzle of a transfer head and mount it to a board. On the upstream side of the pickup position on a tape feeder for feeding the tape T, the tape T is sensed and recognized by a camera, thereby measuring a clearance between the emboss E and the electronic component 14 therein and controlling the action of the tape feeder or transfer head on the basis of the obtained measurement result. Thus, an optimal pickup action can be realized corresponding to the condition of the electronic component 14 in the emboss E and the generation of mounting failure can be reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for transferring and mounting electronic components on a substrate.

[0002]

2. Description of the Related Art A tape feeder is frequently used as a component supply method in an electronic component mounting apparatus. In the component supply by the tape feeder, the electronic component is supplied in a state of being accommodated in a concave portion formed in the tape, and the electronic component is supplied to the pickup position by the transfer head by sequentially feeding the tape. In the pick-up operation of the electronic component, the suction nozzle is lowered with respect to the upper surface of the electronic component located in the concave portion, and the electronic component is taken out of the concave portion by vacuum suction from the suction nozzle.

[0003] By the way, the miniaturization of electronic components used with the miniaturization of electronic devices has progressed, and a large number of microchips having a size smaller than 1 mm have been used. For this reason, the tape holding such a small component must be formed with a small-sized concave portion corresponding to the component.

[0004]

However, as the component size and tape size become smaller, the relative error indicating the ratio of the actual size error to these sizes increases. Therefore, the variation in the clearance between the outer surface of the electronic component and the inner surface of the concave portion in a state where the electronic component is accommodated in the concave portion of the tape becomes larger than that of the conventional electronic component of normal size. As a result, when sequentially picking up a large number of electronic components held on the same tape,
If the clearance is too large, the position and orientation of the electronic components in the recess will not be stable, causing mounting errors due to misalignment during mounting, and if the clearance is too small, suction will be performed by the suction nozzle. That was the cause of the mistake.

Accordingly, an object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method capable of reducing mounting errors in mounting micro-sized electronic components supplied by tape.

[0006]

According to a first aspect of the present invention, there is provided an electronic component mounting apparatus for picking up an electronic component in a concave portion formed on a tape by a nozzle of a transfer head and mounting the electronic component on a substrate. A tape feeder that supplies an electronic component to a pickup position by the transfer head by feeding the tape, and a gap that measures a gap between the electronic component housed in the recess and the recess upstream of the pickup position. A measuring unit; and a control unit for controlling the operation of the tape feeder and / or the transfer head based on a measurement result by the gap measuring unit.

According to a second aspect of the present invention, there is provided an electronic component mounting method in which an electronic component in a recess formed in a tape is picked up by a nozzle of a transfer head and mounted on a substrate. Prior to picking up the electronic component, a gap between the electronic component housed in the concave portion and the concave portion is measured, and the operation of the tape feeder and / or the transfer head is controlled based on a result of the measurement of the gap.

According to the present invention, prior to picking up the electronic component by the transfer head, the gap between the electronic component housed in the recess and the recess is measured, and the tape feeder and / or the transfer is measured based on the gap measurement result. By controlling the operation of the head, an appropriate pick-up operation according to the state of the electronic component in the recess can be realized, and the occurrence of mounting errors can be reduced.

[0009]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus according to one embodiment of the present invention, FIG. 2 is a cross-sectional view of the electronic component mounting apparatus according to one embodiment of the present invention, and FIG. FIG. 4 is a plan view of an electronic component supply tape of the component mounting apparatus, FIG. 4 is a block diagram illustrating a configuration of a control system of the electronic component mounting apparatus of one embodiment of the present invention, and FIG. 5 is a component of one embodiment of the present invention. FIG. 6 is a side view of the gap measuring device, and FIG. 6 is a plan view of an electronic component supply tape of the electronic component mounting device according to one embodiment of the present invention.

First, the structure of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, a plurality of tape feeders 4 are juxtaposed in a component supply section 3 for supplying electronic components. The tape feeder 4 stores a tape holding electronic components, and supplies the electronic components by feeding the tape. The tape feeder 4 is mounted on a feeder base (not shown), and the feed screw 5 is rotationally driven to move the feeder moving table 3a (see FIG. 2), whereby the tape feeder 4 moves in the horizontal direction.

A rotary head 6 is provided in front of the component supply section 3. The rotary head 6 rotates in an index around the rotation axis O, and a plurality of transfer heads 7 are provided on the circumference thereof. The transfer head 7 has a plurality of suction nozzles 7a (see FIG. 2). The electronic component is picked up from the tape feeder 4 by the lifting / lowering operation of the transfer head 7 while being located at the pick-up position P of the pick-up station. At this time, by moving the tape feeder 4 laterally with the feed screw 5, a desired electronic component can be picked up.

In the vicinity of the pickup position P, the camera 1
2 is arranged with the imaging surface facing downward (see also FIG. 2). The camera 12 captures an image of the tape T fed on the tape feeder 4 at a pitch upstream of the pickup position. Then, by performing a recognition process on the obtained image, as shown in FIG.
The gap between the electronic component 14 housed in the inside and the inner surface of the embossed portion E is measured. The camera 12 serves as a gap measuring unit that measures a gap between the electronic component 14 and the concave portion E upstream of the pickup position.

The tape T is for a small-sized component, and the shape and dimensions of the embossed portion E correspond to the small-sized electronic component 14. Since the external dimensions of the electronic component 14 and the relative accuracy of the internal dimensions of the embossed portion E have been reduced with the miniaturization of the size, the degree of variation in the gap when the electronic component 14 is accommodated in the embossed portion E is ,
It is larger than in the case where a conventional normal-size part is targeted. FIG. 3A shows a case where the size of the electronic component 14 and the embossed portion E is normal and the gap is properly maintained, whereas FIGS. 3B and 3C show the case where the gap is too small. , Indicates an excessive case.

As described above, various troubles are likely to occur when the electronic component 14 in which the gap in the embossed portion E is not appropriate is picked up by the suction nozzle 7a. Is measured in advance to detect the state of the gap, and an appropriate corresponding operation can be selected according to the state of the gap.

The transfer head 7 is disposed on a circumference around the rotation axis O of the rotary head 6.
Is rotated around its rotation axis by a rotation mechanism described later. By this rotation, selection of a plurality of suction nozzles 7a provided in the transfer head 7 and setting of the angle of the electronic component 14 held by the suction nozzle 7a in the horizontal rotation direction are performed.

The electronic components 14 picked up at the pick-up position P are sequentially moved in the direction of arrow a by the index rotation of the rotary head 6. A height measuring station 8 is provided during the movement. The height measuring station 8 measures the height of the electronic component held by the transfer head 7.

A component recognition station 9 is provided adjacent to the height measuring station 8. The electronic component 14 held by the suction nozzle of the transfer head 7 is imaged from below by a camera (not shown) at the component recognition station 9. Then, by performing image processing on the imaging result, the dimensions of the electronic component 14 in plan view, that is, the length and width dimensions are detected.

An XY table 11 is provided in front of the rotary head 6. The XY table 11 positions the substrate 1 in the horizontal direction. Therefore, the XY table 1
Reference numeral 1 denotes positioning means for positioning the substrate 1 relative to the transfer head 7. The transfer head 7 moved from the component recognition station 9 reaches the mounting position M of the mounting station located on the substrate 1, and performs an elevating operation to mount the electronic component on the substrate 1.

A camera 13 is provided adjacent to the XY table 11. By driving the XY table 11 to move the substrate 1 below the camera 13, and by positioning an arbitrary recognition point below the camera 13 and imaging the recognition point,
The position and shape of the recognition target can be detected. That is, the position of the recognition mark formed on the substrate 1 or the electronic component 1
The position of the electrode to which 4 is joined is detected.

Next, the structure of the rotary head 6 will be described with reference to FIG. FIG. 2 shows a section II of FIG. 1 (a section including the pickup position P of the component supply unit 3 and the mounting position M of the XY table 11). At the bottom,
It has a structure in which a rotor unit 21 that rotates in an index by an index driving unit (not shown) is arranged. A vertical mounting base 23 is provided on the outer periphery of the rotor section 21 at the position where the transfer head 7 shown in FIG.
A plurality of slide guides 24 are fixed to 3.

A vertical lift rail 25 is fitted to the slide guide 24 so as to be able to move up and down. A bracket 26 fixed to the upper part of the lift rail 25 is provided with two upper and lower cam followers 27. On the outer peripheral surface of the fixing portion 20,
A cam member 22 that projects in the outer peripheral direction and has a predetermined cam curved surface along the circumferential direction of the fixed portion 20 is provided in a protruding manner, and the cam followers 27 are in contact with the upper and lower surfaces of the cam member 22. Therefore, when the rotor 21 rotates by the index, the lift rail 25 moves up and down following the cam curved surface of the cam member 22.

A head mechanism 28 is provided on the outer surface of the elevating rail 25 so as to be able to move up and down.
A transfer head 7 is rotatably held at the lower end of the transfer head 7. When the transfer head 7 moves up and down in the component supply unit 3, the suction nozzle 7a of the transfer head 7 vacuum-adsorbs and picks up the electronic component 14 from the tape feeder 4. The indexing rotation of the rotary head 6 moves the transfer head 7 onto the XY table 11, where the transfer head 7 moves up and down to mount the electronic component 14 held by the suction nozzle 7a on the substrate 1. .

In the elevating operation of the transfer head 7, a descending pattern can be arbitrarily set. That is, the lowering speed and the gap between the suction nozzle 7a and the upper surface of the electronic component at the lowering limit can be changed each time. Thus, various descending patterns can be selected according to the state of the electronic component to be picked up.

Next, the configuration of a control system of the electronic component mounting apparatus will be described with reference to FIG. The control unit 30 is an overall control unit and controls operations and processes of the entire apparatus including the following units.
The program storage unit 31 stores various operation programs such as mounting operation and various processing programs such as image recognition processing and gap determination processing. The data storage unit 32 stores various data such as mounting data and threshold data used for gap determination. The recognition processing unit 33 performs recognition processing such as gap measurement by the camera 12 and board recognition by the camera 13.

The gap determination unit 34 compares the measured value of the gap between the electronic component in the recess and the recess measured by the recognition process with a threshold value, and selects an appropriate coping operation from a preset operation pattern. The mechanism control unit 35 controls the lateral movement of the tape feeder 4 in the component supply unit 3, the tape feeding operation,
The operation of the rotary head 6 is controlled. The mechanism control unit 35 controls the operation of the tape feeder 4 and the transfer head 7 of the rotary head 6 based on the determination result of the gap determination unit 34, so that an appropriate operation is performed according to the state of the gap in the embossed portion E The pattern can be selected. Therefore, the control unit 30, the gap determination unit 34, the mechanism control unit 35
Are control means for controlling the operation of the tape feeder 4 and / or the transfer head 7 based on the measurement result by the gap measuring means.

This electronic component mounting apparatus is configured as described above. Hereinafter, selection of a mounting operation based on a gap measurement result in the mounting operation will be described. In the mounting operation, the camera 12 captures an image of the tape T on the upstream side of the pickup position P on the tape feeder 4 as described above. The imaging result is subjected to recognition processing by the recognition processing unit 33, whereby the gap between the electronic component 14 and the inner surface of the embossed portion E is measured, and the gap determination unit 34 compares the measured value with the gap threshold value. , It is determined whether the gap is appropriate or too small or too large.

At this time, the gap is appropriate (see FIG. 3A).
Is determined, the components are sucked by the transfer head 7 according to the normal mounting operation. If it is determined that the gap is too small (see FIG. 3 (2)),
The descending pattern of the suction nozzle 7a at the time of pickup is selected, and suction is performed in a state where the lower end of the suction nozzle 7a is in close contact with the upper surface of the electronic component 14. Thereby, when taking out the electronic component 14 from the embossed portion E, the electronic component 14 can be held with a sufficient holding force by the suction nozzle 7a.
Is in contact with the inner surface, so that a pickup failure due to an increase in take-out resistance can be prevented.

On the other hand, the gap is too large (see FIG. 3 (3)).
If it is determined that the tape feed speed is lower than the threshold value, the drive of the tape feeder 4 is controlled by the mechanism control unit 35 to change the tape feed speed to a low speed. Thereby, the impact on the electronic component 14 at the time of feeding the tape T at the pitch is reduced, and the disturbance of the attitude of the electronic component 14 in the embossed portion E is reduced. Therefore, it is possible to prevent a displacement or a poor posture when the electronic component 14 is picked up by the suction nozzle 7a at the pickup position P.

In the above-mentioned judgment of the gap being too large or too small, if the degree of excessively large or too small is extremely large (a large variation from the gap threshold value), it is determined that the probability of occurrence of a pickup error is high. Alternatively, an option of an operation pattern for canceling the component pickup from the embossed portion E may be provided.

The above embodiment shows an example in which the gap measurement is performed at the time of the tape supply operation by the electronic component mounting apparatus, but before the tape T is mounted on the tape feeder 4 of the component supply unit 3 as described below. A gap measurement may be performed. That is, the tape used for mounting the electronic components is preliminarily shown in FIG.
The gap measurement is performed for each embossed portion E by the gap measuring device 40 shown in FIG. The gap measuring device 40 includes a tape feeder 41, a tape supply reel 42, and a tape take-up reel 43. The tape T drawn from the tape supply reel 42 is fed along the upper surface of the tape feeder 41. Is done.

Above the tape feeding section 41, a gap measuring section 44 and a mark applying section 45 are provided. The gap measuring unit 44 measures the gap between the electronic component 14 in the embossed portion E and the inner surface of the embossed portion E by imaging the tape T on the tape feeding portion 41. The measurement value measured by the gap measuring unit 44 is sent to the gap determining unit 46, and the gap determining unit 46 determines whether the measured gap is appropriate or is too large or too small.

The mark application section 45 applies a mark indicating the determination result to the vicinity of the embossed portion E based on the determination result. That is, in the tape T, the electronic component 1
4, when the size of the embossed portion E is normal and the gap is properly maintained (FIG. 6A), no mark is applied, whereas when the gap is too small or too large (FIG. 6 (1)). 2),
In (3)), the mark M1 and the mark M2 are applied.

In the electronic component mounting apparatus, a mark near each embossed portion E is recognized and identified by the camera 12 on the tape feeder 4. At the time of the pickup operation by the suction nozzle 7a, an operation pattern is selected based on the identification result in the same manner as described above. As a result, in the same manner as in the above-described example, it is possible to realize the prevention of the trouble during the mounting operation, and it is not necessary to perform the gap detection process by the image recognition in the electronic component mounting operation, so that the identification can be performed in a short time, thereby increasing the processing time. , The delay of the tact time can be prevented.

By performing such a preliminary gap measurement, it is possible to eliminate in advance the use of a tape having a high degree of failure, and to prevent the occurrence of troubles such as a mounting failure or a machine stop in the mounting apparatus, and to prevent such a gap from occurring. By accumulating data, it can be effectively used as quality control data.

[0035]

According to the present invention, the gap between the electronic component housed in the concave portion and the concave portion is measured prior to the pick-up of the electronic component by the transfer head, and the tape feeder and / or By controlling the operation of the transfer head, an appropriate pick-up operation according to the state of the electronic component in the concave portion can be realized, and the occurrence of mounting errors can be reduced.

[Brief description of the drawings]

FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a sectional view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 3 is a plan view of an electronic component supply tape of the electronic component mounting apparatus according to one embodiment of the present invention;

FIG. 4 is a block diagram showing a configuration of a control system of the electronic component mounting apparatus according to the embodiment of the present invention;

FIG. 5 is a side view of the component gap measuring device according to the embodiment of the present invention;

FIG. 6 is a plan view of an electronic component supply tape of the electronic component mounting apparatus according to one embodiment of the present invention;

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 substrate 3 component supply unit 4 tape feeder 6 rotary head 7 transfer head 7 a suction nozzle 12 camera 14 electronic component 30 control unit 33 recognition processing unit 34 gap determination unit 35 mechanism control unit E embossed unit T tape

Claims (2)

[Claims] An electronic component mounting apparatus for picking up an electronic component in a recess formed in a tape by a nozzle of a transfer head and mounting the electronic component on a substrate, wherein the tape is fed to transfer the electronic component. A tape feeder for supplying a pickup position to a head, a gap measuring unit for measuring a gap between the electronic component housed in the concave portion and the concave portion upstream of the pickup position, An electronic component mounting apparatus comprising: a tape feeder and / or control means for controlling an operation of a transfer head. 2. A method of mounting an electronic component in a concave portion formed on a tape by a nozzle of a transfer head and mounting the electronic component on a substrate, the method comprising the steps of: picking up the electronic component by the transfer head; A gap between the electronic component housed in the cavity and the concave portion, and controlling the operation of the tape feeder and / or the transfer head based on the gap measurement result.