JP2012094727A - Electronic component mounting method and electronic component mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To stabilize a sucking and taking-out operation, and to improve efficiency of work by an operator.SOLUTION: Before a sucking operation of an objective electronic component, a substrate recognizing camera 19 photographs a storage recess Cc of a storage tape C at a component sucking and taking-out position PU of a component supply unit 5 for supplying the electronic component, a recognition processing device 23 performs recognition processing, and a CPU 20 grasps the center position of the storage recess Cc. When the center position can be grasped, the CPU 20 compares the pocket size of the storage recess Cc with the component size of the electronic component. Then, the CPU 20 computes clearances between the electronic component and the storage recess Cc in an X direction and a Y direction respectively. Whether the computed clearances ▵X and ▵Y exceed an allowable value Xa or not is determined. If they exceed the value, the CPU 20 performs setting not to implement the automatic tracking function of the taking-out and sucking position, and if they do not exceed the value, the CPU 20 controls so that the automatic tracking function of the taking-out and sucking position is implemented.

Description

  The present invention takes out an electronic component stored in a storage portion of a storage tape loaded in a component supply unit and supplied to a pick-up suction position with a component holder, and performs position recognition with respect to the component holder with a component recognition device. Thereafter, the electronic component is mounted at a desired position on the substrate based on the position recognition result, and the pickup position is corrected based on the recognition result when the electronic component is subsequently taken out. The present invention relates to an electronic component mounting method and an electronic component mounting apparatus that use an automatic tracking function.

  As this kind of electronic component mounting apparatus, the one described in Patent Document 1 is known, but according to this prior art, the positional deviation of the electronic component taken out by the component holder with respect to this component holder is recognized as a component. The recognition result is used by the device to correct the misalignment when the electronic component is mounted, and the electronic component supplied by the component supply device based on the recognition result when the electronic component is subsequently taken out. It is also used when correction is performed so that the pick-up suction position becomes an appropriate position (for example, the part center position) (take-off pick-up position automatic tracking function).

Japanese Utility Model Publication No. 5-33600

  However, if the size of the storage recess of the storage tape that stores the electronic component is larger than the size of the electronic component, the position of the electronic component is not determined in the storage recess, so the adsorbed electronic component And the component holder are easily misaligned. Using the recognition processing result of the electronic parts sucked in this way, if correction is performed so that it can be picked up and picked up at an appropriate position, if picking up and picking up at this corrected picking up position, Abnormalities, for example, a situation where the robot is sucked in a standing state, that is, a posture that is not supposed to be sucked, or sometimes cannot be taken out easily.

  For this reason, in the case of electronic components that have a poor suction rate, the operator resets the use of the take-out suction position automatic follow-up function described above without correcting the suction take-out position, Since the suction removal is performed at the center of the storage recess, it is a burden on the operator and the work efficiency cannot be improved.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to stabilize the suction extraction operation and to improve the efficiency of work by an operator.

Therefore, according to the first aspect of the present invention, the electronic component stored in the storage portion of the storage tape loaded in the component supply unit and supplied to the take-out suction position is taken out by the component holder, and the component recognition device applies the electronic component to the component holder. After performing the position recognition, the electronic component is mounted at a desired position on the substrate based on the position recognition result, and the take-out suction position is corrected based on the recognition result when the electronic component is subsequently taken out. In the electronic component mounting method that uses the automatic suction position tracking function,
Recognize and recognize the size of the storage unit at the take-out suction position by a storage unit recognition device,
Calculate the clearance between the electronic component and the storage unit from the size of the storage unit and the size of the electronic component,
When the clearance does not exceed a predetermined allowable value, the suction position automatic tracking function is set.

According to a second aspect of the present invention, the electronic component stored in the storage portion of the storage tape loaded in the component supply unit and supplied to the take-out suction position is taken out by the component holder, and the position recognition for the component holder is performed by the component recognition device. After performing the above, the electronic component is mounted at a desired position on the substrate based on the position recognition result, and the take-out suction position is corrected based on the recognition result when the electronic component is subsequently taken out. In the electronic component mounting method that uses the suction position automatic tracking function,
Recognize and recognize the size of the storage unit at the take-out suction position by a storage unit recognition device,
Calculate the clearance between the electronic component and the storage unit from the size of the storage unit and the size of the electronic component,
The suction position automatic tracking function is set when the clearance does not exceed a predetermined allowable value, and the suction position automatic tracking function is not set when the clearance exceeds the allowable value.

According to a third aspect of the present invention, the electronic component stored in the storage portion of the storage tape loaded in the component supply unit and supplied to the take-out suction position is taken out by the component holder, and the position recognition for the component holder is performed by the component recognition device. After performing the above, the electronic component is mounted at a desired position on the substrate based on the position recognition result, and the take-out suction position is corrected based on the recognition result when the electronic component is subsequently taken out. In the electronic component mounting method that uses the suction position automatic tracking function,
Calculating the amount of deviation of the electronic component relative to the component holder based on the result of the recognition of the electronic component taken out from the component supply unit, and storing it as a statistical sample in the storage device;
When the number of statistical samples reaches a predetermined number, the average value of the deviation amount of the electronic component for the number of statistical samples is calculated, and the maximum value and the minimum deviation amount of the electronic component for the statistical sample number are calculated. Calculate the difference from the value,
When the difference is less than the allowable value, the extraction suction position is corrected based on the average value without using the suction position automatic tracking function.

According to a fourth aspect of the present invention, the electronic component stored in the storage portion of the storage tape loaded in the component supply unit and supplied to the take-out suction position is taken out by the component holder, and the position recognition for the component holder is performed by the component recognition device. After performing the above, the electronic component is mounted at a desired position on the substrate based on the position recognition result, and the take-out suction position is corrected based on the recognition result when the electronic component is subsequently taken out. In the electronic component mounting method that uses the suction position automatic tracking function,
Calculating the amount of deviation of the electronic component relative to the component holder based on the result of the recognition of the electronic component taken out from the component supply unit, and storing it as a statistical sample in the storage device;
When the number of statistical samples reaches a predetermined number, the average value of the deviation amount of the electronic component for the number of statistical samples is calculated, and the maximum value and the minimum deviation amount of the electronic component for the statistical sample number are calculated. Calculate the difference from the value,
When this difference exceeds an allowable value, the suction position automatic tracking function is not used.

According to a fifth aspect of the present invention, the electronic component stored in the storage portion of the storage tape loaded in the component supply unit and supplied to the take-out suction position is taken out by the component holder, and the position recognition for the component holder is performed by the component recognition device. After performing the above, the electronic component is mounted at a desired position on the substrate based on the position recognition result, and the take-out suction position is corrected based on the recognition result when the electronic component is subsequently taken out. In the electronic component mounting method that uses the suction position automatic tracking function,
Calculating the amount of deviation of the electronic component relative to the component holder based on the result of the recognition of the electronic component taken out from the component supply unit, and storing it as a statistical sample in the storage device;
When the number of statistical samples reaches a predetermined number, the average value of the deviation amount of the electronic component for the number of statistical samples is calculated, and the maximum value and the minimum deviation amount of the electronic component for the statistical sample number are calculated. Calculate the difference from the value,
If this difference exceeds an allowable value, the suction position automatic follow-up function is used, but only a fixed correction amount is used.

According to a sixth aspect of the present invention, the electronic component stored in the storage portion of the storage tape loaded in the component supply unit and supplied to the take-out suction position is taken out by the component holder, and the position recognition for the component holder is performed by the component recognition device. After performing the above, the electronic component is mounted at a desired position on the substrate based on the position recognition result, and the take-out suction position is corrected based on the recognition result when the electronic component is subsequently taken out. In the electronic component mounting device that uses the suction position automatic tracking function,
A storage unit recognition device for recognizing and grasping the size of the storage unit at the take-out suction position;
Calculating means for calculating a clearance between the electronic component and the storage portion from the size of the storage portion and the size of the electronic component;
Setting means for setting the suction position automatic follow-up function when the clearance does not exceed a predetermined allowable value is provided.

According to a seventh aspect of the present invention, the electronic component stored in the storage portion of the storage tape loaded in the component supply unit and supplied to the take-out suction position is taken out by the component holder, and the position recognition for the component holder is performed by the component recognition device. After performing the above, the electronic component is mounted at a desired position on the substrate based on the position recognition result, and the take-out suction position is corrected based on the recognition result when the electronic component is subsequently taken out. In the electronic component mounting device that uses the suction position automatic tracking function,
A storage unit recognition device for recognizing and grasping the size of the storage unit at the take-out suction position;
Calculating means for calculating a clearance between the electronic component and the storage portion from the size of the storage portion and the size of the electronic component;
The suction position automatic tracking function is set when the clearance does not exceed a predetermined allowable value, and setting means is provided so as not to set the suction position automatic tracking function when the clearance exceeds the allowable value. It is characterized by that.

According to an eighth aspect of the present invention, the electronic component stored in the storage portion of the storage tape loaded in the component supply unit and supplied to the take-out suction position is taken out by the component holder, and the position recognition for the component holder is performed by the component recognition device. After performing the above, the electronic component is mounted at a desired position on the substrate based on the position recognition result, and the take-out suction position is corrected based on the recognition result when the electronic component is subsequently taken out. In the electronic component mounting device that uses the suction position automatic tracking function,
First calculation means for calculating a deviation amount of the electronic component with respect to the component holder based on a result of the component recognition device recognizing the electronic component taken out from the component supply unit;
A storage device for storing the deviation amount calculated by the first calculation means as a statistical sample;
A second calculating means for calculating an average value of a deviation amount of the electronic component of the statistical sample number when the statistical sample number reaches a predetermined number;
Third calculation means for calculating a difference between a maximum value and a minimum value of the deviation amount of the electronic component of the statistical sample number;
When the difference is less than the allowable value, control means is provided for performing control so as to correct the extraction suction position based on the average value without using the suction position automatic tracking function.

According to a ninth aspect of the present invention, the electronic component stored in the storage portion of the storage tape loaded in the component supply unit and supplied to the take-out suction position is taken out by the component holder, and the position recognition for the component holder is performed by the component recognition device. After performing the above, the electronic component is mounted at a desired position on the substrate based on the position recognition result, and the take-out suction position is corrected based on the recognition result when the electronic component is subsequently taken out. In the electronic component mounting device that uses the suction position automatic tracking function,
First calculation means for calculating a deviation amount of the electronic component with respect to the component holder based on a result of the component recognition device recognizing the electronic component taken out from the component supply unit;
A storage device for storing the deviation amount calculated by the first calculation means as a statistical sample;
A second calculating means for calculating an average value of a deviation amount of the electronic component of the statistical sample number when the statistical sample number reaches a predetermined number;
Third calculation means for calculating a difference between a maximum value and a minimum value of the deviation amount of the electronic component of the statistical sample number;
Control means is provided for controlling not to use the suction position automatic follow-up function when this difference exceeds an allowable value.

According to a tenth aspect of the present invention, the electronic component stored in the storage portion of the storage tape loaded in the component supply unit and supplied to the take-out suction position is taken out by the component holder, and the position recognition for the component holder is performed by the component recognition device. After performing the above, the electronic component is mounted at a desired position on the substrate based on the position recognition result, and the take-out suction position is corrected based on the recognition result when the electronic component is subsequently taken out. In the electronic component mounting device that uses the suction position automatic tracking function,
First calculation means for calculating a deviation amount of the electronic component with respect to the component holder based on a result of the component recognition device recognizing the electronic component taken out from the component supply unit;
A storage device for storing the deviation amount calculated by the first calculation means as a statistical sample;
A second calculating means for calculating an average value of a deviation amount of the electronic component of the statistical sample number when the statistical sample number reaches a predetermined number;
Third calculation means for calculating a difference between a maximum value and a minimum value of the deviation amount of the electronic component of the statistical sample number;
When this difference exceeds an allowable value, there is provided control means for controlling so as to use a suction position automatic follow-up function but keep a fixed correction amount.

  According to the present invention, it is possible to stabilize the suction extraction operation and to improve the efficiency of the work performed by the operator.

The schematic plan view of an electronic component mounting apparatus is shown. It is the longitudinal cross-sectional view of the components supply unit typically represented and the principal part. It is a top view of the storage tape connected with the connection tape. It is a side view of the storage tape connected with the connection tape. It is a front view of a seam detection device. It is a side view of a seam detection device. It is a control block diagram. It is a figure which shows mounting data. It is a figure which shows component arrangement | positioning information. It is a figure which shows parts library data. It is a figure which shows the installation status and use status information of the current component supply unit. It is a figure which shows the flowchart which concerns on the timing which starts pocket recognition. It is a figure which shows the flowchart which concerns on the setting of the taking-out adsorption | suction position automatic tracking function at the time of pocket recognition. It is a figure which shows the flowchart which concerns on operation | movement when it determines with pocket recognition being impossible.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus 1, and component supply devices 3A, 3B, 3C, and 3D are divided into four blocks on the front and rear of the apparatus main body 2 of the electronic component mounting apparatus 1, and a plurality of them are arranged in parallel. It is installed. The component supply device 3A has a lane number (arrangement number of a component supply unit 5 described later) in the 100s, the component supply device 3B has a lane number in the 200s, and the component supply device 3C has a lane number in the 300s. The component supply device 3D has a lane number in the 400s.

  Each of the component supply devices 3A, 3B, 3C, and 3D has a large number of component supply units 5 arranged in parallel on a feeder base of a cart base that is a mounting base. When the cart base is properly attached to the apparatus main body 2, power is supplied to the component supply unit 5 mounted on the cart base so as to face the road. Further, when the connection tool is released and the handle is pulled, it can be moved by a caster provided on the lower surface.

  Each of the component supply devices 3A, 3B, 3C, and 3D is disposed so that the tip of the component supply side faces the pickup area of the mounting head 6, and each component supply unit 5 is freely rotatable on the cart table. Rotate a feed sprocket whose teeth are fitted into feed holes Cb opened at predetermined intervals on a storage tape C that is sequentially delivered in a state of being wound around a supply reel placed on the supply reel, thereby rotating the storage tape C to an electronic component D. A tape feed mechanism that intermittently feeds to the component suction / extraction position PU by a feed motor, and a cover tape peeling mechanism for peeling the cover tape Co from the carrier tape Ca in front of the component suction / extraction position PU by driving the peeling motor. The cover tape Co is peeled off by the cover tape peeling mechanism and loaded into the storage recesses Cc formed at predetermined intervals on the carrier tape Ca. It can be taken out by the suction nozzle 29 as a component holder from the distal end portion of the electronic component D which are sequentially supplied to the CC suction pickup position PU.

  As shown in FIG. 2 which is an enlarged longitudinal sectional view of the component supply unit 5 and its main part schematically shown, the storage tape C fed out from the supply reel goes under the suppressor 30 and It is sent to the component suction / extraction position PU. The suppressor 30 is provided with a component extraction port 31 for pickup by the suction nozzle 29. The suppressor 30 is formed with a slit 32, and the cover tape Co is peeled off from the carrier tape Ca of the storage tape C from the slit 32 and stored in a cover tape storage section provided in the component supply unit 5. The That is, the electronic component D mounted on the storage tape C is sent to the component suction / extraction position PU in a state where the cover tape Co is peeled off from the carrier tape Ca, and is sucked by the suction nozzle 29 through the component extraction port 31. Will be taken out.

The suppressor 30 is rotatable about the support shaft, and when the front portion of the storage tape C in the traveling direction is locked, the suppressor 30 is urged downward, and after the storage tape C and the cover tape Co are peeled off. The carrier tape Ca is always pressed against the tape guide chute so that the feed hole Cb of the carrier tape Ca does not come off from the tape feed teeth of the sprocket constituting the tape feed mechanism. Between the 3B and 3D and the back side component supply devices 3A and 3C, there are provided two supply conveyors, positioning units 8 and 8 (having a conveyor), and a discharge conveyor that constitute the substrate transfer mechanism. Each supply conveyor transports each printed circuit board P as a substrate received from upstream to each positioning unit 8, and an electronic component D is mounted on each substrate P positioned by the positioning mechanism in each positioning unit 8. Then, it is conveyed to each discharge conveyor, and is conveyed to a downstream apparatus after that.

  Each beam 10 that moves along the guide rail 9 by the Y-axis drive motor 11 in the Y direction is provided with a mounting head 6 that moves by the X-axis drive motor 13 along the beam 10 in the longitudinal direction, that is, in the X direction. The mounting head 6 is provided with, for example, 14 suction nozzles 29. Therefore, in one pick-up cycle of one mounting head 6, that is, one electronic head picking and mounting operation of one mounting head 6 is 14 by a maximum of 14 suction nozzles 29.

  The mounting head 6 is equipped with a vertical axis drive motor 14 for moving the suction nozzle 29 up and down, and a θ-axis drive motor 15 for rotating around the vertical axis. Therefore, the suction nozzle of the mounting head 6 can move in the X direction and the Y direction, can rotate about the vertical axis, and can move up and down.

  Reference numeral 12 denotes a component recognition camera that images the electronic component from below in order to recognize the position of the electronic component with respect to the suction nozzle 29 in terms of the XY direction and rotation angle. Reference numeral 19 denotes a substrate recognition camera provided on the mounting head 6, which images a substrate position recognition mark attached to the printed circuit board P.

  The storage tape C stores the electronic component D in storage recesses Cc formed at predetermined intervals on the carrier tape Ca in a state where the electrode on the lower surface is in contact with the bottom surface of the storage recess Cc. Cover tape Co is bonded onto carrier tape Ca so as to cover it. The carrier tape Ca has feed holes Cb formed at predetermined intervals.

  Here, the splicing will be described. First, by performing the mounting operation of the electronic component, the electronic component is taken out from the component supply unit 5 by the suction nozzle 29, so that the remaining number of electronic components is reduced. For this reason, when the remaining number of electronic components is equal to or less than the predetermined number, the work manager is notified using the notification means, and the component supply unit 5 is fixed on the cart table and does not move. In the component supply unit 5, splicing is performed to connect and supply a new storage tape C to be connected with a storage tape C with a small remaining number of electronic components currently supplied by the connection tape.

  3 and FIG. 4, specifically, the work manager who has determined that the parts are almost out of use by the notification means, the storage tape C of the component supply unit 5 in which the remaining number of electronic components has decreased. Is removed from the feeder base of the cart base, the storage tape C wound around the supply reel is removed, and the carrier tape Ca near the end of the old storage tape C wound around the supply reel is removed. And the cover tape Co are cut by a cutter at the same surface position and in the middle of the adjacent feed holes Cb and at the center position in the feed direction of the storage recess Cc.

  Next, the carrier tape Ca is positioned between the adjacent feed holes Cb at the start end of a new storage tape C wound on a supply reel that is different from the supply reel on which the storage tape C that is nearly out of components is wound. It is cut by a cutter at the center position in the feed direction of the storage recess Cc and cut so that the cover tape Co is longer than the carrier tape Ca. Then, the new storage tape C and the old storage tape C whose parts are nearly cut are matched with the cut-side end surfaces so that the semicircular feed holes Cb become circular feed holes Cb, and the cover of the old storage tape C is covered. Polymerization is performed so as to cover the cover tape Co of the new storage tape C on the tape Co, and the old storage tape C and the new storage tape C are connected by the connecting tapes 40A, 40B, and 40C.

  5 and 6, reference numeral 42 denotes a seam detection device for the storage tape C, which is provided at the rear end of the component supply unit 5. This seam detection device 42 has a device body 44 in which the light emitting element 42A and the light receiving element 42B are provided at an interval of 8 millimeters, a prism 45 is provided at the upper end, and the cross section has a U-shape, The intermediate portion is constituted by a passage forming body 47 provided with a tape passage opening 46 through which the storage tape C passes.

  That is, as the storage tape C is fed, in the seamless storage tape C, the light from the light emitting element 4A is recursively reflected by the prism 45 through the feed holes (opened at intervals of 4 millimeters) Cb. Since light is received by the light receiving element 42B, the seam detection device 42 can detect the absence of a seam. In the storage tape C connected by splicing operation and having a seam, the light from the light emitting element 42A is sent along the feed operation. Light is shielded by the connecting tape 40A covering Cb and is not received by the light receiving element 42B, and the presence of a joint is detected.

  Reference numeral 39A denotes a counter which counts the number of times the storage tape C is fed after the joint detection device 42 detects the connecting tape 40A. When the counter 39A counts a predetermined number of times, it can be determined that the electronic component at the joint when the joint detecting device 42 detects the connecting tape 40A has reached the component suction / extraction position PU.

  Next, the control block diagram of FIG. 7 will be described. The electronic component mounting apparatus 1 includes a control unit that performs overall control of the mounting apparatus 1, a CPU (Central Processing Unit) 20 as a calculation unit, and the CPU 20 Are provided with a RAM (Random Access Memory) 21 and a ROM (Read Only Memory) 22 connected to each other via a bus line. The CPU 20 controls the operation related to the component mounting operation of the electronic component mounting apparatus 1 according to the program stored in the ROM 22 based on the data stored in the RAM 21. That is, the CPU 20 controls the drive of the Y-axis drive motor 11, the X-axis drive motor 13, the vertical axis drive motor 14, the θ-axis drive motor 15 and the like via the interface 24 and the drive circuit 27 and each component supply unit. 5 is controlled. In FIG. 2, for convenience of explanation, even if there are a plurality of them, for example, the mounting head 6 and the component supply unit 5 are omitted as one.

  The RAM 21 stores mounting data for each type of printed circuit board P related to component mounting. For each mounting order (step number), the X direction (indicated by X) in the printed circuit board P, Y Information on direction (indicated by Y) and angle (indicated by Z), arrangement number information of each component supply unit 5 and the like are stored (see FIG. 8).

  Further, in the RAM 21, as shown in FIG. 9, the type (component ID) of each electronic component corresponding to the component supply unit arrangement number (lane number) of each component supply unit 5 for each type of printed circuit board P. Information, i.e., component arrangement information, is stored. This component arrangement information is data relating to which part supply unit 5 is mounted at which position on the cart table.

  Furthermore, component library data relating to the characteristics of the electronic component is stored for each component ID. That is, as shown in FIG. 10, the component library data includes the size in the X direction and the Y direction for each component ID, the type of storage tape C (embossed tape, paper tape), and the clearance between the electronic component and the storage recess Cc. Consists of allowable values. The allowable value is stored as component library data for each electronic component type, but may be stored for each type of suction nozzle 29.

  A recognition processing device 23 is connected to the CPU 20 via an interface 24. The recognition processing device performs recognition processing of an image captured by the component recognition camera 12 or an image captured by the board recognition camera 19. The processing result is sent to the CPU 20. That is, the CPU 21 performs recognition processing (calculation of the amount of displacement of the electronic component sucked and held by the suction nozzle 18 or the position of the printed board P positioned) by the image captured by the board recognition camera 8 or the component recognition camera 12. An instruction is output to the recognition processing device 29 and a recognition processing result is received from the recognition processing device 29.

  Reference numeral 25 denotes a monitor as a display means for displaying a part image and a screen for setting various data. The monitor 25 is provided with various touch panel switches 26 as input means, and an operator operates the touch panel switch 26. Thus, various settings can be made.

  Reference numeral 28 denotes a line sensor as a component presence / absence detecting device for detecting the presence / absence of the electronic component D sucked and held by the suction nozzle 29. The line sensor 28 receives a light projector 28A that emits a light beam that goes straight in the horizontal direction and the light beam. As possible, it is constituted by a light receiver 28B in which a large number of CCD elements are arranged in parallel on a straight line in the vertical direction, and is provided in the mounting head 6, but may be provided in the apparatus main body 2. About 1000 CCD elements are juxtaposed in a vertical width of about 10 mm, and the light receiver 28B can be realized. Each CCD element can detect the amount of light received, and can be used as an ON / OFF sensor by determining the threshold of the amount of light received, and the portion shielded from light by the electronic component D by the ON / OFF output is thick. It is possible to detect the presence or absence of a component adsorbed by the adsorption nozzle 29 and the surface that should not be adsorbed is adsorbed and not normally adsorbed. Can be detected.

  The component supply unit 5 is provided with the other connector 36B for connecting to one connector 36A provided on the front surface of the feeder base.

  The CPU 20 is connected to each component supply unit 5 via an interface 24 and connectors 36A and 36B. Accordingly, since the CPU 20 is connected to a power source (not shown), the power can be supplied to the component supply unit 5 by attaching the component supply unit 5 to the feeder base and connecting 36B to the connector 36A. Conversely, when the component supply unit 5 is removed from the feeder base and the connection between the connectors 36A and 36B is released, the power supply to the component supply unit 5 is cut off to zero volts, and the CPU 20 can detect this cut-off state. As a result, it is possible to detect the connection state (power supply state) and non-connection state (power cutoff state) of the component supply unit 5 to the feeder base.

  As shown in FIG. 11, the RAM 21 stores the current installation status / use status information of the component supply unit 5 corresponding to the component supply unit arrangement number (lane number) of each component supply unit 5. In other words, if this information is “0”, it means that the component supply unit 5 is not attached on the feeder base corresponding to this component supply unit arrangement number. The connection state of the component supply unit 5 attached to the feeder base corresponding to the component supply unit arrangement number to the feeder base has been detected, but the electronic component has not yet been taken out from the component supply unit 5 after the attachment. In the case of “2”, it is mounted on the feeder base corresponding to this component supply unit arrangement number. Ri electronic components from the component supply unit 5 after attaching means that fetched.

  With the above configuration, at the timing when the substrate recognition camera 19 images the storage recess Cc at the component suction / extraction position PU of the component supply unit 5 and activates pocket recognition for recognizing the position, size, etc. of the storage recess Cc. This flowchart will be described with reference to FIG. First, the CPU 20 makes a pocket recognition activation determination for a suction target component (step S01). Specifically, according to the mounting data shown in FIG. 8, the electronic component at the component suction / extraction position PU of the component supply unit 5 according to step number 0001 is sucked and taken out. It is determined whether it is.

  In this case, the placement number of the step number 0001 from the mounting data is “101” (see FIG. 8), the component ID of the placement number “101” is “AAAAA” (see FIG. 9), and the component supply unit layout. It is determined from the current unit state information “1” corresponding to the number “101” that the electronic component is the first picked-up electronic component. That is, when the component supply unit 5 is attached to the feeder base and 36B is connected to the connector 36A, power is supplied to the component supply unit 5, and the CPU 20 detects this power supply state and the component supply unit after being attached to the feeder base. Since the electronic component has not been taken out from 5, the current unit status information is “1”.

  In addition, regarding the pocket recognition activation timing of the suction target component, the electronic component to be taken out when the component supply unit 5 is newly attached to the feeder base is not limited to the first picked-up electronic component, and new storage is performed by the splicing operation. When the tape C is connected, it may be an electronic component that is first picked up when the tape is switched to the new storage tape C. That is, the counter 39A counts the number of feeds of the storage tape C after the joint detection device 42 detects the connecting tape 40A, and when it reaches a predetermined number of times, the first take when the storage tape C is switched to a new one. It can be determined that the sucked electronic component has reached the component picking / extracting position PU.

  In addition, when a suction position deviation exceeding the allowable range is detected in the previous electronic component suction extraction operation, that is, when the amount of deviation in the X and Y directions between the suction nozzle center and the electronic component center exceeds the allowable value, The pocket recognition activation timing may also be used when the angle bend of the sucked electronic component exceeds an allowable value.

  Furthermore, even when it is determined that the suction abnormality is a so-called standing state, oblique suction state, or a state where suction cannot be performed, it can also be determined that this is the pocket recognition activation timing of the suction target component. That is, based on the result of imaging the electronic component sucked by the suction nozzle 29 by the component recognition camera 12 and the recognition processing by the recognition processing device 23, and based on the detection result by the line sensor 28, the CPU 20 It can be determined that it is the pocket recognition start timing.

  As described above, the CPU 20 determines the pocket recognition activation of the part to be attracted (step S01), and determines whether or not it is the pocket recognition activation timing based on the determination result (step S02).

  If it is determined that it is the pocket recognition activation timing, pocket recognition is executed before the target electronic component suction operation (step S03). That is, before the target electronic component suction operation, the storage concave portion Cc of the storage tape C at the component suction extraction position PU of the component supply unit 5 that supplies the target electronic component and the electronic component D stored in the storage concave portion Cc. The board recognition camera 19 captures an image, the recognition processing device 23 performs a recognition process, and the CPU 20 grasps the center position and dimensions of the storage recess Cc. Also, it is determined whether or not the automatic pickup position tracking function is set.

  The electronic component take-out suction position automatic follow-up function recognizes a position shift of the electronic component taken out from the component supply unit 5 by the suction nozzle 29 with respect to the suction nozzle 29 by a component recognition device 29 described later, and the recognition result is In addition to being used for correcting misalignment at the time of mounting the electronic component, when the electronic component D is taken out from the component supply unit 5 based on the recognition result, the component suction / extraction position PU of the component supply unit 5 is an appropriate position (for example, This is a function used for correction such as (part center position).

  If it is determined that it is not the pocket recognition activation timing described above, the pocket recognition is not performed, and if it is determined that it is the pocket recognition activation timing, the pocket recognition is performed and the pickup suction position automatic tracking function is performed. After determining whether or not there is a setting, control is performed to perform the component suction operation (step S04).

  In this case, when it is determined whether or not the take-out suction position automatic tracking function is set, the CPU 20 sets the center position of the storage recess Cc of the storage tape C at the component suction / take-out position PU based on the pocket recognition result. As described above, the X-axis drive motor 13 and the Y-axis drive motor 11 are corrected and controlled so that the suction nozzle 29 sucks and takes out the electronic components in the storage recess Cc (step S04). In other words, the CPU 20 corrects and controls the X-axis drive motor 13, the Y-axis drive motor 11, and the θ-axis drive motor 15, and the electronic components are reliably adsorbed and taken out from the storage recess Cc.

  Then, it is determined whether or not there is another electronic component to be attracted to the mounting head 6 (step S05). If it is determined that there is another electronic component, the process returns to step S01 and is controlled as described above. Repeat the suction and extraction operation for other electronic components.

  If it is determined that there is nothing else, the mounting head 6 moves so as to mount the electronic component at a predetermined position on the printed circuit board P positioned by the positioning unit 8. The electronic components picked up and held by all the suction nozzles 29 provided in the mounting head 6 when passing the upper position of the component recognition camera 12 are imaged by the component recognition camera 11, and the electronic component is captured with respect to the captured image of the electronic component. The amount of misalignment with respect to the suction nozzle 29 is sucked and held by the recognition processing device 23 for the XY direction and the rotation angle (step S06).

  Therefore, based on the recognition processing result of the electronic component and the recognition processing result of the printed circuit board P obtained by imaging the substrate position recognition mark attached to the printed circuit board P by the substrate recognition camera 19 and recognized by the recognition processing device 23. Then, an electronic component is mounted on the printed circuit board P (step S07).

  Then, it is determined whether or not there is another electronic component to be mounted on the mounting head 6 (step S08). If it is determined that there is another electronic component, the process returns to step S07, and as described above, the other electronic component is returned. Repeat the mounting operation.

  If all the electronic components are mounted and it is determined that there are no other components, it is then determined whether there are other electronic components that are attracted to the mounting head 6 (step S09), and it is determined that there are other components. In such a case, the process returns to step S01, and the control is performed as described above so that the removal and mounting of the electronic components are repeated. When all the electronic components to be mounted on the printed circuit board P are mounted, the printed circuit board P is conveyed from the positioning unit 8 to the discharge conveyor and then to the downstream device.

  Next, setting of the take-out suction position automatic tracking function when pocket recognition is performed will be described based on the flowchart of FIG. First, pocket recognition processing is performed (step S11). That is, before the target electronic component suction operation, the substrate recognition camera 19 images the storage recess Cc of the storage tape C at the component suction extraction position PU of the component supply unit 5 that supplies the target electronic component. 23 performs a recognition process, and the CPU 20 grasps the center position of the storage recess Cc.

  Next, it is determined whether or not the pocket can be recognized (step S12). For example, if the edge of the storage recess Cc cannot be detected, it is determined that the pocket cannot be recognized, and the process proceeds to the flowchart shown in FIG. Description is omitted. When the pocket cannot be recognized, the black embossed tape is used, and the electronic component is black, or the transparent embossed tape is used, and the edge of the storage recess Cc cannot be detected.

  If the edge is detected, the CPU 20 determines the pocket size [Xp, Yp] (the length in the X direction is Xp and the length in the Y direction is Yp), which is the size of the storage recess Cc, and the electronic component. [XX1, YY1] (the length in the X direction is XX1, and the length in the Y direction is YY1) (step S13). That is, the pocket size [Xp, Yp] of the storage recess Cc is obtained based on the recognition processing result by the recognition processing device 23 of the storage recess Cc of the storage tape C at the component suction / extraction position PU, and the component dimensions [XX1, YY1]. ] Refers to the component library data of the electronic component (component ID: AAAAA) stored in the RAM 21, and the pocket dimension [Xp, Yp] (the length in the X direction is Xp and the length in the Y direction is Yp). .) And the component dimensions [XX1, YY1] of the electronic component.

  Then, the CPU 20 calculates the clearance between the electronic component and the storage recess Cc for each of the X and Y directions (step S14). It is determined whether or not the calculated clearance ΔX in the X direction exceeds the allowable value Xa constituting the component library data of the electronic component (step S15). If it exceeds, the CPU 20 makes a setting for not performing the automatic pickup position tracking function (X direction) (step S16). If not, the CPU 20 executes the automatic pickup position tracking function (X direction). Control is performed so as to perform setting (step S17).

  Further, it is determined whether or not the calculated clearance ΔY in the Y direction exceeds the allowable value Ya constituting the component library data of the electronic component (step S18). If it has exceeded, the CPU 20 makes a setting for not performing the automatic pickup position tracking function (Y direction) (step S19). If not, the CPU 20 performs the automatic pickup position tracking function (Y direction). Control is performed so as to perform setting (step S20).

  Based on the pocket recognition result, the CPU 20 corrects and controls the X-axis drive motor 13 and the Y-axis drive motor 11 so that the center position of the storage recess Cc of the storage tape C at the component suction extraction position PU is set as the suction position. (Step S21), the suction nozzle 29 is controlled so as to suck and take out the electronic component in the storage recess Cc.

  As described above, regarding the clearance between the pocket dimension and the dimension of the electronic component, the X direction and the Y direction are independently determined independently of whether or not the take-out suction position automatic tracking function is set. Alternatively, if any of the clearances in the Y direction exceeds the allowable value, the pickup suction position automatic tracking function may not be set as a set in both the X direction and the Y direction.

  When the setting for carrying out the function of automatically picking up the suction position as described above is made, the component recognition device 29 recognizes the positional deviation of the electronic component taken out from the component supply unit 5 by the suction nozzle 29 with respect to the suction nozzle 29 last time. Based on the recognized result, when the next electronic component D is taken out from the component supply unit 5, the CPU 20 is arranged so that the component suction / extraction position PU of the component supply unit 5 becomes an appropriate position (for example, the component center position). Thus, the Y-axis drive motor 11, the X-axis drive motor 13 and the θ-axis drive motor 15 are corrected and controlled. Accordingly, when the pocket recognition is performed and the follow-up execution allowable value related to the clearance between the electronic component and the storage recess Cc is less than the permissible follow-up function, the suction position automatic follow-up function is performed. The electronic component can be taken out from the storage recess Cc at the position PU.

  In addition, when the follow-up execution allowable value is not less, the suction position automatic follow-up function is not performed, and the suction position is set to the center position of the storage recess Cc at the component suction / extraction position PU, so that it is relatively stable. In this state, the electronic component can be taken out. And since the said adsorption | suction position automatic follow-up function was set automatically or not to set, a burden on an operator can be reduced and work efficiency can be achieved.

  Next, an operation when it is determined in FIG. 13 that pocket recognition cannot be performed when the edge of the storage recess Cc cannot be detected will be described based on the flowchart shown in FIG. First, after the suction nozzle 29 is taken out from the storage recess Cc of the storage tape C of the component suction extraction position PU of the component supply unit 5 that supplies the target electronic component, an image captured by the component recognition camera 12 is recognized. The device 23 performs recognition processing, and the CPU 20 analyzes the recognition processing result, and calculates the amount of deviation between the center of the suction nozzle 29 and the center of the electronic component held by suction (step S31).

  Next, the CPU 20 stores the calculated deviation amount [Xr, Yr] (X direction deviation amount is Xr and Y direction deviation amount is Yr) in the statistical processing data table of the RAM 21. Control (step S32). Then, when the counter 39B sequentially stores the number of times of determination and determines that the number of statistical processing samples has been reached (step S33), the sampling data relating to the stored amount of deviation is analyzed, the arithmetic average value is calculated, A range is calculated (step S34).

  That is, the arithmetic average value in the X direction is calculated from (Xr1 + Xr2 + Xr3 +... + Xrn) / n, and the arithmetic average value in the Y direction is (Yr1 + Yr2 + Yr3 +... + Yrn) / n. Is calculated from Further, the range in the X direction is a value obtained by subtracting the minimum shift amount from the maximum shift amount in the X direction of the sampling data related to the stored shift amount, and the range in the Y direction is the sampling data related to the stored shift amount. This is a value obtained by subtracting the minimum shift amount from the maximum shift amount in the Y direction.

  Next, it is determined whether or not the statistical processing values of the respective ranges in the X direction and the Y direction are less than the tracking execution allowable value Xa stored in the RAM 21 in advance or less than Ya (step S35). In this case, if it is determined that the tracking execution allowable value is less than Xa and less than Ya, a value obtained by multiplying the arithmetic average value described above by the correction count (K) is taken out, and the feedback value is updated to the correction value of the suction position. Control is terminated (step S36).

  Accordingly, when the pocket recognition cannot be performed and the clearance between the electronic component and the storage recess Cc of the storage tape C is large, the application of the suction position automatic tracking function is not preferable, and the suction position automatic tracking function is set. It is possible to cancel automatically, reduce the burden on the operator, and improve the efficiency of the work.

  Further, when it is determined that the statistical processing value of each range is not less than the follow-up execution allowable value Xa or less than Ya, the CPU 20 performs control so that exception processing is performed (step S37). In this case, as the exception processing, when the monitor 25 and other notification means notify that the variation in the suction position of the electronic component of the suction nozzle 29 is large, and the automatic suction position tracking function is set to be implemented. It is conceivable to cancel the setting on the screen displayed on the monitor 25 and perform processing so as to maintain the state as it is without updating the correction value of the extraction suction position.

  In addition, as an exception process other than this, the monitor 25 and other notification means notify that the variation in the suction position of the electronic component of the suction nozzle 29 is large, and the correction execution range is determined when the take-out suction position automatic tracking function is performed. It is also conceivable to carry out processing so that the correction amount is a predetermined limit value. The correction execution range may be implemented by storing each dimension uniquely in the X direction and the Y direction, and in this case, it may be stored as part library data of this electronic part. It may be stored for each suction nozzle used.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 5 Component supply unit 6 Mounting head 12 Component recognition camera 19 Board | substrate recognition camera 23 Recognition processing apparatus 29 Adsorption nozzle C Storage tape Cc Storage recessed part PU Component adsorption extraction position

Claims (10)

After the electronic component stored in the storage portion of the storage tape loaded in the component supply unit and supplied to the take-out suction position is taken out by the component holder, the position of the component holder is recognized by the component recognition device. A suction position automatic tracking function for mounting the electronic component at a desired position on the substrate based on the position recognition result and correcting the picked-up suction position based on the recognition result when taking out the electronic component thereafter. In the electronic component mounting method used,
Recognize and recognize the size of the storage unit at the take-out suction position by a storage unit recognition device,
Calculate the clearance between the electronic component and the storage unit from the size of the storage unit and the size of the electronic component,
When the clearance does not exceed a predetermined allowable value, the suction position automatic tracking function is set. After the electronic component stored in the storage portion of the storage tape loaded in the component supply unit and supplied to the take-out suction position is taken out by the component holder, the position of the component holder is recognized by the component recognition device. A suction position automatic tracking function for mounting the electronic component at a desired position on the substrate based on the position recognition result and correcting the picked-up suction position based on the recognition result when taking out the electronic component thereafter. In the electronic component mounting method used,
Recognize and recognize the size of the storage unit at the take-out suction position by a storage unit recognition device,
Calculate the clearance between the electronic component and the storage unit from the size of the storage unit and the size of the electronic component,
The suction position automatic tracking function is set when the clearance does not exceed a predetermined allowable value, and the suction position automatic tracking function is not set when the clearance exceeds the allowable value. Component mounting method. After the electronic component stored in the storage portion of the storage tape loaded in the component supply unit and supplied to the take-out suction position is taken out by the component holder, the position of the component holder is recognized by the component recognition device. A suction position automatic tracking function for mounting the electronic component at a desired position on the substrate based on the position recognition result and correcting the picked-up suction position based on the recognition result when taking out the electronic component thereafter. In the electronic component mounting method used,
Calculating the amount of deviation of the electronic component relative to the component holder based on the result of the recognition of the electronic component taken out from the component supply unit, and storing it as a statistical sample in the storage device;
When the number of statistical samples reaches a predetermined number, the average value of the deviation amount of the electronic component for the number of statistical samples is calculated, and the maximum value and the minimum deviation amount of the electronic component for the statistical sample number are calculated. Calculate the difference from the value,
When this difference is less than an allowable value, the electronic component mounting method is characterized in that the picked-up suction position is corrected based on the average value without using a suction position automatic tracking function. After the electronic component stored in the storage portion of the storage tape loaded in the component supply unit and supplied to the take-out suction position is taken out by the component holder, the position of the component holder is recognized by the component recognition device. A suction position automatic tracking function for mounting the electronic component at a desired position on the substrate based on the position recognition result and correcting the picked-up suction position based on the recognition result when taking out the electronic component thereafter. In the electronic component mounting method used,
Calculating the amount of deviation of the electronic component relative to the component holder based on the result of the recognition of the electronic component taken out from the component supply unit, and storing it as a statistical sample in the storage device;
When the number of statistical samples reaches a predetermined number, the average value of the deviation amount of the electronic component for the number of statistical samples is calculated, and the maximum value and the minimum deviation amount of the electronic component for the statistical sample number are calculated. Calculate the difference from the value,
An electronic component mounting method characterized in that the suction position automatic tracking function is not used when the difference exceeds an allowable value. After the electronic component stored in the storage portion of the storage tape loaded in the component supply unit and supplied to the take-out suction position is taken out by the component holder, the position of the component holder is recognized by the component recognition device. A suction position automatic tracking function for mounting the electronic component at a desired position on the substrate based on the position recognition result and correcting the picked-up suction position based on the recognition result when taking out the electronic component thereafter. In the electronic component mounting method used,
Calculating the amount of deviation of the electronic component relative to the component holder based on the result of the recognition of the electronic component taken out from the component supply unit, and storing it as a statistical sample in the storage device;
When the number of statistical samples reaches a predetermined number, the average value of the deviation amount of the electronic component for the number of statistical samples is calculated, and the maximum value and the minimum deviation amount of the electronic component for the statistical sample number are calculated. Calculate the difference from the value,
An electronic component mounting method characterized in that, when this difference exceeds an allowable value, the suction position automatic follow-up function is used, but the amount of correction is limited. After the electronic component stored in the storage portion of the storage tape loaded in the component supply unit and supplied to the take-out suction position is taken out by the component holder, the position of the component holder is recognized by the component recognition device. A suction position automatic tracking function for mounting the electronic component at a desired position on the substrate based on the position recognition result and correcting the picked-up suction position based on the recognition result when taking out the electronic component thereafter. In the electronic component mounting device used,
A storage unit recognition device for recognizing and grasping the size of the storage unit at the take-out suction position;
Calculating means for calculating a clearance between the electronic component and the storage portion from the size of the storage portion and the size of the electronic component;
An electronic component mounting apparatus comprising: a setting unit configured to set the suction position automatic tracking function when the clearance does not exceed a predetermined allowable value. After the electronic component stored in the storage portion of the storage tape loaded in the component supply unit and supplied to the take-out suction position is taken out by the component holder, the position of the component holder is recognized by the component recognition device. A suction position automatic tracking function for mounting the electronic component at a desired position on the substrate based on the position recognition result and correcting the picked-up suction position based on the recognition result when taking out the electronic component thereafter. In the electronic component mounting device used,
A storage unit recognition device for recognizing and grasping the size of the storage unit at the take-out suction position;
Calculating means for calculating a clearance between the electronic component and the storage portion from the size of the storage portion and the size of the electronic component;
The suction position automatic tracking function is set when the clearance does not exceed a predetermined allowable value, and setting means is provided so as not to set the suction position automatic tracking function when the clearance exceeds the allowable value. An electronic component mounting apparatus characterized by that. After the electronic component stored in the storage portion of the storage tape loaded in the component supply unit and supplied to the take-out suction position is taken out by the component holder, the position of the component holder is recognized by the component recognition device. A suction position automatic tracking function for mounting the electronic component at a desired position on the substrate based on the position recognition result and correcting the picked-up suction position based on the recognition result when taking out the electronic component thereafter. In the electronic component mounting device used,
First calculation means for calculating a deviation amount of the electronic component with respect to the component holder based on a result of the component recognition device recognizing the electronic component taken out from the component supply unit;
A storage device for storing the deviation amount calculated by the first calculation means as a statistical sample;
A second calculating means for calculating an average value of a deviation amount of the electronic component of the statistical sample number when the statistical sample number reaches a predetermined number;
Third calculation means for calculating a difference between a maximum value and a minimum value of the deviation amount of the electronic component of the statistical sample number;
When the difference is less than the allowable value, the electronic component mounting is provided with a control unit that controls to correct the take-out suction position based on the average value without using the suction position automatic tracking function apparatus. After the electronic component stored in the storage portion of the storage tape loaded in the component supply unit and supplied to the take-out suction position is taken out by the component holder, the position of the component holder is recognized by the component recognition device. A suction position automatic tracking function for mounting the electronic component at a desired position on the substrate based on the position recognition result and correcting the picked-up suction position based on the recognition result when taking out the electronic component thereafter. In the electronic component mounting device used,
First calculation means for calculating a deviation amount of the electronic component with respect to the component holder based on a result of the component recognition device recognizing the electronic component taken out from the component supply unit;
A storage device for storing the deviation amount calculated by the first calculation means as a statistical sample;
A second calculating means for calculating an average value of a deviation amount of the electronic component of the statistical sample number when the statistical sample number reaches a predetermined number;
Third calculation means for calculating a difference between a maximum value and a minimum value of the deviation amount of the electronic component of the statistical sample number;
An electronic component mounting apparatus comprising: control means for controlling not to use the suction position automatic follow-up function when the difference exceeds an allowable value. After the electronic component stored in the storage portion of the storage tape loaded in the component supply unit and supplied to the take-out suction position is taken out by the component holder, the position of the component holder is recognized by the component recognition device. A suction position automatic tracking function for mounting the electronic component at a desired position on the substrate based on the position recognition result and correcting the picked-up suction position based on the recognition result when taking out the electronic component thereafter. In the electronic component mounting device used,
First calculation means for calculating a deviation amount of the electronic component with respect to the component holder based on a result of the component recognition device recognizing the electronic component taken out from the component supply unit;
A storage device for storing the deviation amount calculated by the first calculation means as a statistical sample;
A second calculating means for calculating an average value of a deviation amount of the electronic component of the statistical sample number when the statistical sample number reaches a predetermined number;
Third calculation means for calculating a difference between a maximum value and a minimum value of the deviation amount of the electronic component of the statistical sample number;
An electronic component mounting apparatus comprising: a control unit that controls to use a suction position automatic follow-up function but keep a fixed correction amount when the difference exceeds an allowable value.

Images