JP2002353265A - Mounting structure and method of mounting the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mounting structure and a method of mounting the structure capable of expanding a permissible current value and mounting an electronic component on a circuit board by solder, which have been difficult by a conventional flip chip mounting structure for mounting the electronic component on the circuit board or the like. SOLUTION: A surface of a metal material 10 made of aluminum or having aluminum as main component or a surface of conductive resin is coated with at least one soldering material 11 out of Au, Ag, Cu, Sn and Ni to form a bump mold 20, solder-stop material is applied or attached on a bump 14 and a bump 15, where solder-stop band has been simultaneously formed when forming the bump, or on a bump 16 formed only by the soldering material, and the bumps are connected to a terminal electrode 4 of the circuit board 3 with cream solder 13.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a mounting structure of an electronic component and a circuit board, and more particularly to a mounting structure obtained by mounting a semiconductor element on a circuit board via bumps and a mounting method thereof.

[0002]

2. Description of the Related Art With the miniaturization and high performance of electronic equipment, flip-chip mounting methods capable of shortening the connection distance are often used for mounting structures of electronic parts. A conventional mounting structure (Japanese Patent Publication No. 6-3820) will be described with reference to FIG.

An electronic component (hereinafter, referred to as a semiconductor device) 1 having a plurality of pads 2 provided on a circuit forming surface has gold bumps 5 formed on the pads 2 by a bump bonding machine. The gold bump 5 is generally formed using a gold wire and a bump bonding machine including an ultrasonic vibrator, a heating device, a pressurizing device, an intermittent continuous feeding device for the gold wire, and the like.

Next, a predetermined amount of conductive adhesive 6 is adhered to the gold bump 5 of the semiconductor element 1 on which the plurality of gold bumps 5 are formed in a predetermined manner, and then the gold bump 5 is attached to the circuit board 3. The mounting structure is formed by aligning and joining the terminal electrode 4 formed on one surface of the substrate, heating and drying and curing the conductive adhesive 6 and electrically connecting the conductive adhesive 6.

[0005]

However, in the above configuration, the conductive adhesive 6 is scattered due to the expansion and evaporation of the solvent due to rapid heating at the time of drying and curing, and an abnormal reaction of curing occurs.
There is a problem that connection strength is insufficient due to insufficient temperature or time, and connection reliability is reduced. Further, since an expensive gold wire is used, the size of the gold bump 5 is limited to use in a minute interval portion of the pad. In addition, the solder having good wettability wets along the gold bumps 5 and short-circuits between the gold bumps 5 occur. In some cases, there is a possibility that tin, which is a main component of the solder, contacts the circuit of the semiconductor element 1 via the gold bump 5 and penetrates the semiconductor element to adversely affect the circuit function. In addition, the minute space of the pad is liable to cause such a problem and is difficult to use.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and has a good effect in soldering an electronic component such as a semiconductor element to a circuit board by forming a bump stop band on a bump or applying or mounting a bump stop material. It is an object of the present invention to provide a mounting structure which enables connection and is inexpensive and has excellent connection reliability.

[0007]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a method for soldering a semiconductor element having pads formed thereon and a circuit board having terminal electrodes formed thereon, and the solder proceeds toward the semiconductor element. It has a structure that is electrically connected by using a bump formed with a solder inhibition band or a solder inhibition material to prevent that,
Thus, the connection reliability of the mounting structure obtained can be improved.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION
A bump having a soldering area and a solder stop zone on the surface is formed on the pad of the electronic component having the pad formed on the surface, and the electronic component and the circuit board or other components are formed using solder. The solder that melts when connecting to the component, due to the solder wettability, will pass through the soldering material and enter the circuit of the electronic component or damage the electronic component circuit. Has the effect of improving the quality and reliability of the connection by preventing the solder stop band.

According to a second aspect of the present invention, a bump for electrically connecting a pad on an electronic component and a terminal electrode on a circuit board is coated with a soldering material. By applying or attaching a solder blocking material such as resin or rubber that does not adhere to solder to the portion near the bump pad, without forming a solder blocking band at the time of bump formation,
Prevents the molten solder from proceeding on the coating of the soldering material due to wettability and reaching the electronic component circuit, preventing the electrical short circuit and damage of the electronic component circuit by solder, and improving the quality and reliability of the connection It has the function of peeling.

According to a third aspect of the present invention, there is provided an electronic component having a plurality of pads formed on a surface thereof, and a circuit board having a plurality of terminal electrodes formed on a surface thereof. Are electrically connected via a plurality of bumps having a soldering area and a solder stop zone on the surface, and the solder stop zone cannot be soldered between the pad of the electronic component and the terminal electrode of the circuit board to the bump. In this way, the solder melted when joining the terminal electrodes and the bumps with the solder can be prevented from penetrating the soldering material to the circuit of the electronic component due to solder wettability and damaging the circuit by electrical short-circuiting. It has the effect of improving quality and reliability.

According to a fourth aspect of the present invention, the electronic component is a semiconductor element, and the semiconductor element is one of the elements most required to form a bump and cannot be soldered between the bump and the terminal electrode. Make a stop zone,
By applying or attaching the solder blocking material, the terminal electrodes and the bumps can be joined by soldering, which has an effect that the mounting structure can be easily formed by the semiconductor element.

In particular, it is possible to prevent the circuit function from being damaged due to the penetration of tin, which is the main component of the solder, into the semiconductor element.

According to a fifth aspect of the present invention, the bump is made of aluminum or a metal material containing aluminum as a main component, and has a soft and solder-free property. Since it can be performed with a small force, it has the effect of preventing damage to the electronic component and easily forming a solder stop zone by providing a portion of the bump that is not covered with the soldering material.

According to a sixth aspect of the present invention, the bump is formed by coating a conductive resin with a soldering material, and the bump-forming body is made of aluminum or aluminum as a main component. A conductive resin is used in place of a metal material.The resin has the effect of preventing damage to semiconductor elements because it does not adhere to solder, is softened by heating, easily deformed, and can form bumps with a small force. is there.

According to a seventh aspect of the present invention, the bump has one of a spherical body, a columnar body, and a polygonal body, and the bump is made of aluminum or a metal material containing aluminum as a main component. And the use of a conductive resin makes it possible to selectively form a shape suitable for the connecting portion.

The invention according to claim 8 of the present invention is characterized in that the soldering material is at least one of gold, silver, copper, tin and nickel, or an alloy material containing at least one of the metal materials as a main component. All of the materials have extremely good solderability and have an effect of facilitating improvement of connection quality and reliability.

According to a ninth aspect of the present invention, a solder stop band is provided outside a region where a bump for electrically connecting a pad on an electronic component and a terminal electrode on a circuit board is covered with a soldering material. The use of a bump formed body having a solder stop band forming portion made of aluminum or a metal material containing aluminum as a main component or a conductive resin allows solder to be formed without forming a solder stop band by a bump forming nozzle. The blocking zone forming part prevents the melted solder from proceeding on the coating of the soldering material due to wettability and reaching the electronic component circuit, preventing electrical short circuit and damage of the electronic component circuit due to solder, and improving the connection quality, This has the effect of improving reliability.

According to a tenth aspect of the present invention, the bump is formed by using any one of a spherical body, a hemispherical body, a drum-shaped body, and a columnar body. Spherical bodies have no restriction on the adsorption position. Semi-spherical bodies and columnar bodies that have a joint to the pad are made of the same material as the pad, so that metal-to-metal bonding is easy, and drums and columns should be elongated. It is easy to respond to smaller pads and smaller pad spacing, the size of the pads and terminal electrodes to be bumped, the characteristics required for bump forming machines, mounting structures,
Since the most suitable bump forming body can be selected according to the function, there is an effect that a more reliable connection can be made.

According to the eleventh aspect of the present invention, a bump forming body in which at least a part of aluminum or a metal material containing aluminum as a main component is coated with a soldering material is sucked by a bump forming nozzle and positioned on a pad of an electronic component. A step of aligning and lowering the bump forming nozzle while adsorbing the bump formed body and applying ultrasonic vibration while pressing the bump formed body onto the pad of the electronic component, thereby removing a part of the soldering material At the same time as forming the solder stop zone, and connecting to the pad, using equipment capable of performing each step continuously and a bump-formed body of a soft plastically deformable material. Thereby, it is possible to easily form bumps of any shape with good mass productivity.

According to a twelfth aspect of the present invention, the bump forming body and the pad are connected by using a portion of the bump forming body which is not covered with a soldering material. Above all, the pads of semiconductor elements are mostly made of aluminum material, and the bump material is connected by using aluminum or a metal material mainly composed of aluminum which is not covered with soldering material. This has the effect of widening the allowable range of connection conditions and improving the quality of the connection.

According to a thirteenth aspect of the present invention, the bump forming body and the pad are connected by using a portion of the bump forming body which is covered with a soldering material. If the material is entirely covered, the connection can be made at any part of the bump formed body, so that the workability can be improved.

Hereinafter, embodiments of the present invention will be described with reference to the drawings, in which the same portions are assigned the same reference numerals.

(Embodiment 1) FIG. 1A shows a first embodiment of the present invention.
1 shows a partial cross-section of an electronic component (hereinafter, referred to as a semiconductor element) including a semiconductor element and the like and a mounting structure formed by bumps 14 according to the embodiment. As shown in the drawing, a semiconductor element 1 has a plurality of pads 2 on its surface. The bump 14 is formed on the pad 2 by the bump forming body 20. The bump forming body 20 is formed by coating aluminum or a metal material 10 containing aluminum as a main component with a soldering material 11. The bump 14 has a substantially triangular shape and is provided with a soldering material 11 at the base 10a and the vertex 10b, and has no soldering material 11 between the base 10a and the vertex 10b.
2 are formed. The pad 2 and the soldering material 11 are metal-to-metal bonded at the bottom side 10a, and are electrically connected to the semiconductor element 1.

A method for forming the bump 14 will be described with reference to FIG. FIG. 3 shows a step of forming the bumps 14 on the pads 2 of the semiconductor element 1 using the bump forming body 20.

Bump forming body 2 used for forming bump 14
Reference numeral 0 (20a, 20e) denotes a spherical or columnar body shown in FIGS. 2A and 2E, which is formed by coating a metal material 10 containing aluminum or aluminum as a main component with a soldering material 11 over the entire surface. The bump forming body 20 used for the description
Is performed using the spherical body of FIG. The description will be made below in the order of the steps of forming the bumps 14. First, in FIG. 3A, a bump forming body 20 (20a) formed by coating a soldering material 11 with aluminum or a metal material 10 containing aluminum as a main component, which is separately formed, is attached to the suction hole 3 of the bump forming nozzle 30.
1 and is positioned above the pad 2 of the semiconductor element 1, and the bump forming nozzle 30 is lowered while the bump forming body 20 (20a) is suctioned in FIG. ) Is pressed against the pad 2 and pressurized. Ultrasonic vibration is applied to the bump forming body 20 (20a) through the bump forming nozzle 30 while applying pressure.

In FIG. 3C, the bump forming body 20 (20 a) is plastically deformed into a substantially triangular shape by pressurization and ultrasonic vibration, and in the process, the soldering material 11 is in contact with the bump forming nozzle 30. Aluminum or the metal material 10 containing aluminum as a main component is exposed by being rubbed by friction with the corner portion 32 of 33, and the solder inhibition zone 12 can be formed. At the same time, between the pad 2 and the pad 2, the soldering material 11 and the pad 2 are bonded to each other.
In this embodiment, the pressurization and the ultrasonic vibration are used together. However, the solder blocking zone 12 can be formed only by the pressurization. Also, although the description has been given using the semiconductor element 1 on which the plurality of bumps 14 are formed, the bumps 14 may be a single body.

When the formation of the bumps 14 and the bonding of the pads 2 are completed, the bump forming nozzles 30 are raised and the bumps 14 are formed on the pads 2 as shown in FIG. This figure 3
A plurality of bumps 14 can be formed on the semiconductor element 1 by repeating the steps of (a), (b), (c), and (d) of FIG. In addition, as a polygonal body other than a substantially triangular shape, a shape such as a tower shape or a convex shape as shown in FIG. 5, particularly, FIGS. In this case, the bump forming section 3 of the bump forming nozzle 30
3 is formed by changing the shape.

(Embodiment 2) FIG. 1B shows a second embodiment of the present invention.
1 shows a partial cross section of a mounting structure including a semiconductor element 1 and a bump 15 according to the embodiment. As shown in the drawing, the semiconductor element 1 has a plurality of pads 2 on its surface, and a bump forming body 20 The bump 15 is formed. The bump forming body 20 is formed by covering with a soldering material 11 except one surface of aluminum or the metal material 10 containing aluminum as a main component.

The bump 15 is substantially triangular and has the soldering material 11 on the side surface (10c) and the vertex (10b).
A solder stop zone 12 having no soldering material 11 is formed between Oa) and the apex (10b). On the bottom side, the pad 2 and aluminum or a metal material 10 containing aluminum as a main component, which is a bonding portion 21 to the pad, are metal-to-metal bonded and electrically connected to the semiconductor element 1.

A method for forming the bump 15 will be described with reference to FIG. FIG. 4 is a process cross-sectional view of forming the bump 15 on the pad 2 of the semiconductor element 1 using the bump forming body 20.

Bump forming body 2 used for forming bump 15
Reference numeral 0 (20b, 20f) denotes a hemispherical body or a columnar body shown in FIGS. 2 (b) and 2 (f), and one surface of the metal material 10 mainly composed of aluminum or aluminum is used as a bonding portion 21 to the pad. Although the portion other than the joint 21 is coated with the soldering material 11, the description will be made using the hemispherical bump formed body 20 (20b) of FIG. 2B. The description will be made below in the order of the steps of forming the bumps 15. First, in FIG. 4A, one surface of aluminum or a metal material 10 containing aluminum as a main component, which is separately formed, is joined to a pad 2 by a bonding method.
The portion of the soldering material 11 of the hemispherical bump-forming body 20 (20b) designated as 1 is sucked by the suction hole 31 of the bump-forming nozzle 30 so that the bonding portion 21 to the pad and the pad 2 of the semiconductor element 1 face each other. 4B, the bump forming nozzle 30 is lowered while the bump forming body 20 (20b) is being sucked in FIG. 4B, and the bump forming body 20 (20b) is pressed against the pad 2 and pressed. Ultrasonic vibration is applied to the bump forming body 20 (20b) through the bump forming nozzle 30 while applying pressure. In FIG. 4 (c), the bump forming body 20 (20b) is plastically deformed into a substantially triangular shape by pressurization and ultrasonic vibration, and in the process, the soldering material 11 becomes a corner of the bump forming portion 33 which is a contact portion with the bump forming nozzle 30. Aluminum or the metal material 10 containing aluminum as a main component is exposed by being rubbed by the friction with the portion 32 to form the solder inhibition zone 12.

At the same time, between the pad 2 and the pad 2, aluminum or a metal material 10 containing aluminum as a main component of the bonding portion 21 to the pad and the pad 2 are inter-metal bonded.
FIG. 4 shows that the bump 15 can be formed and the pad 2 can be joined.
As shown in (d), the bump forming nozzle 30 is raised, and the bump 15 is formed on the pad 2. 4 (a), 4 (b),
A plurality of bumps 15 can be formed on the semiconductor element 1 by repeating the steps of FIGS. 4C and 4D. Note that, as a polygonal body other than the substantially triangular shape, a shape such as a tower shape or a convex shape as shown in FIG. 5, particularly, FIGS. In this case, the bump is formed by changing the shape of the bump forming portion 33 of the bump forming nozzle 30.

(Embodiment 3) FIG. 1C shows a third embodiment of the present invention.
1 shows a partial cross section of a mounting structure including a semiconductor element 1 and a bump 16 according to the embodiment. As shown in the drawing, the semiconductor element 1 has a plurality of pads 2 on its surface, and a bump forming body 20 The bump 16 is formed by using the method described above, and a solder blocking material 12a is applied or mounted on a portion close to the pad 2.

The bump forming body 20 is formed by coating aluminum or a metal material 10 containing aluminum as a main component with a soldering material 11. The bump 16 is entirely covered with a soldering material 11, and a solder blocking material 12a is applied or mounted between a connection portion between the pad 2 and the bump 16 and a convex vertex.

A method of forming the bump 16 will be described with reference to FIG. 3 assuming that the substantially triangular shape in FIG. 3 is convex and has no solder stop zone.

Bump forming body 2 used for forming bump 16
0 (20a, 20b, 20e, 20f) is a spherical body in FIG.
FIG. 2 (b) is a hemispherical body, a columnar body shown in FIGS. 2 (e) and 2 (f), which is formed by coating a metal material 10 mainly composed of aluminum or aluminum with a soldering material 11. Is performed using the spherical bump forming body 20 (20a) of FIG. The description will be made below in the order of the steps of forming the bumps 16. First, the ball-shaped bump forming body 20 (20a) separately formed in FIG. 3A is sucked by the suction hole 31 of the bump forming nozzle 30 and is positioned above the pad 2, and in FIG. The bump forming nozzle 30 is lowered while the bump forming body 20 (20a) is being sucked, and the bump forming body 20 (20a) is pressed against the pad 2 and pressed. Ultrasonic vibration is applied to the bump forming body 20 (20a) through the bump forming nozzle 30 while applying pressure. In FIG. 3 (c), the bump forming body 20 (20a) is plastically deformed into a convex shape by pressurization and ultrasonic vibration.
The soldering material 11 and the pad 2 are metal-to-metal bonded.

When the formation of the bump 16 and the bonding of the pad 2 are completed, the bump forming nozzle 30 is raised as shown in FIG. 3D, and the bump 16 is formed on the pad 2. This figure 3
A plurality of bumps 16 can be formed on the semiconductor element 1 by repeating the steps of (a), (b), (c), and (d) of FIG. As described above, the solder bumper 12a is formed by coating the solder bumper 12a or mounting the solder stopper 12a separately formed on the convex bump 16 in which the metal material 10 mainly composed of aluminum or aluminum is covered with the soldering material 11. 1 (d) can be formed in the same manner by using a hemisphere in FIG. 2 (b) and a columnar bump forming body 20 in FIG. 2 (f).

As shown in FIGS. 1D and 1E, the bump 1
Reference numeral 6 indicates that the bump-forming body 20 is composed mainly of at least one of gold, silver, copper, tin, and nickel, which are solderable metals of a spherical body and a columnar body of FIG. 2 (j). It can also be formed only with the alloy material described below.

By separately providing the solder blocking member 12a in this manner, the solder blocking portion can be easily formed without deforming the bump forming body 20 using the bump forming nozzle 30 as in the first and second embodiments. Can be provided. In addition, the solder blocking material 12a having various shapes and sizes can be formed, and the solder blocking material 12a can be formed according to the amount of the solder material and the shape and size (size, height) of the bump.

(Embodiment 4) FIG. 1 (f) shows a fourth embodiment of the present invention.
12 shows a partial cross section of a mounting structure formed by the semiconductor element 1 having the bumps 14 and the circuit board 3 in the embodiment.

The semiconductor element 1 on which the plurality of bumps 14 are formed and the circuit board 3 are connected using cream solder 13 as a connection material. For connection, a predetermined amount of cream solder 13 is applied to the terminal electrodes 4 of the circuit board 3, and bumps 14
The semiconductor element 1 is positioned with the semiconductor elements 1 facing each other, and the semiconductor element 1 is heated and connected to the circuit board 3 and the semiconductor element 1 to form a mounting structure.

The connection between the semiconductor element 1 and the circuit board 3 will be described step by step with reference to FIG.

The semiconductor device 1 according to the present embodiment is the one described in FIG. 1A described in the first embodiment. In FIG. 6A, a fixed amount of the cream solder 13 is applied to the terminal electrodes 4 of the circuit board 3 by using a printing machine, a coating machine, or the like. In FIG. 6B, the bumps 14 formed on the semiconductor element 1 are positioned above the circuit board 3 on which the cream solder 13 is applied so as to face the terminal electrodes 4 of the circuit board 3. In FIG. 6C, the bump 1 of the semiconductor element 1 is formed.
4 is lowered into the cream solder 13 until it comes into contact with the terminal electrode 4 and is installed. After installation, after heating to the melting temperature of the cream solder 13 in FIG.
After cooling and solidifying, the solder 13a can be electrically and mechanically connected to form a mounting structure. Although the method of applying the cream solder 13 to the terminal electrode 4 has been described, there is also a method of attaching the cream solder 13 to the bump 14 and installing the bump solder 14 on the terminal electrode 4.

The melted cream solder 13 proceeds along the soldering material 11 due to the solder wettability. However, the progress of the cream solder 13 to the semiconductor element 1 is prevented by the solder inhibition zone 12, and the circuit of the semiconductor element 1 is damaged. In addition, when there are a plurality of bumps, an electrical short circuit is prevented from occurring, and the quality and reliability of the connection are improved.

As shown in FIG. 7A, by setting the amount of the cream solder 13 to be within the range of the solder inhibition zone 12, the progress due to the solder wettability is stopped by the solder inhibition zone 12 and reaches the semiconductor element 1. There is no.

(Embodiment 5) FIG. 1 (g) shows a fifth embodiment of the present invention.
10 shows a partial cross section of a mounting structure including the semiconductor element 1 having the bumps 15 and the circuit board 3 according to the embodiment.

The semiconductor element 1 on which the plurality of bumps 15 are formed and the circuit board 3 are connected using cream solder 13 as a connection material. For connection, a predetermined amount of cream solder 13 is applied to the terminal electrodes 4 of the circuit board 3, and bumps 15
The semiconductor element 1 is positioned with the semiconductor elements 1 facing each other, and the semiconductor element 1 is heated and connected to the circuit board 3 and the semiconductor element 1 to form a mounting structure.

The connection between the semiconductor element 1 and the circuit board 3 will be described step by step with reference to FIG.
The description will be made with the bumps 15 in this embodiment replaced.

The semiconductor device 1 according to this embodiment is the same as that shown in FIG. 1B described in the second embodiment.

In FIG. 6A, the terminal electrodes 4 on the circuit board 3
The cream solder 13 is applied in a fixed amount, and the application method is performed using a printing machine, a coating machine, or the like.

In FIG. 6B, the bump 15 formed on the semiconductor element 1 is positioned above the circuit board 3 on which the cream solder 13 has been applied so as to face the terminal electrode 4 of the circuit board 3, and is positioned as shown in FIG. 2), the bump 15 of the semiconductor element 1 is lowered and set until it enters the cream solder 13 and contacts the terminal electrode 4. After the installation, in FIG. 6D, the solder is heated to the melting temperature of the cream solder 13 to be melted, then cooled and solidified, and electrically and mechanically connected as the solder 13a to form a mounting structure. . The method of applying the cream solder 13 to the terminal electrode 4 has been described.
There is also a way to install.

The melted cream solder 13 travels along the soldering material 11 due to the solder wettability, but the solder blocking zone 12 prevents the cream solder 13 from progressing to the semiconductor element 1 and damages the circuit of the semiconductor element 1. In addition, when there are a plurality of bumps, an electrical short circuit is prevented from occurring, and the quality and reliability of the connection are improved.

Further, as shown in FIG. 7A, when the amount of the cream solder 13 applied is within the range of the solder inhibition zone 12, the progress due to the solder wettability is stopped and the semiconductor element 1 does not reach.

(Embodiment 6) FIGS. 1 (h), 1 (i), 1
(j) shows a partial cross section of a mounting structure including the semiconductor element 1 having the bumps 16 and the circuit board 3 according to the sixth embodiment of the present invention.

The semiconductor element 1 on which the plurality of bumps 16 are formed and the circuit board 3 are connected using cream solder 13 as a connection material. For connection, a predetermined amount of cream solder 13 is applied to the terminal electrode 4, the semiconductor element 1 is positioned on the terminal electrode 4 with the bumps 16 facing each other, and the semiconductor element 1 is heated to connect the circuit board 3 and the semiconductor element 1. A structure can be formed.

The connection between the semiconductor element 1 and the circuit board 3 will be described step by step with reference to FIG.
The description will be made with the bumps 16 in this embodiment replaced.

The semiconductor device 1 in this embodiment is the one described in FIGS. 1C to 1E described in the third embodiment. In FIG. 6A, a fixed amount of the cream solder 13 is applied to the terminal electrodes 4 of the circuit board 3 by using a printing machine, a coating machine, or the like. The application amount is set within the range of the solder blocking material 12a or up to the solder blocking material 12a.

In FIG. 6B, the bumps 16 formed on the semiconductor element 1 are positioned above the circuit board 3 on which the cream solder 13 has been applied so as to face the terminal electrodes 4 of the circuit board 3. 4), the bumps 16 of the semiconductor element 1 are lowered and set until they enter the cream solder 13 and come into contact with the terminal electrodes 4. After installation, in FIG. 6 (d), the solder is heated to the melting temperature of the cream solder 13 and melted.
After solidification, the solder 13a can be electrically and mechanically connected to form a mounting structure. Although the method of applying the cream solder 13 to the terminal electrode 4 has been described, there is also a method of attaching the cream solder 13 to the bump 16 and installing the bump solder 16 on the terminal electrode 4.

The melted solder 13 proceeds along the soldering material 11 due to the wettability of the solder. As shown in FIG. 7B, the amount of the applied solder cream 13 is reduced on the solder stopper 12a or on the solder stopper 12a. And bump 16
The protrusion due to the solder wettability is stopped and the semiconductor element 1 is not reached.

(Embodiment 7) Bump formed body 2 of the present invention
0 will be described with reference to FIG. Bump formed body 20
Is composed of aluminum or a metal material 10 containing aluminum as a main component and a soldering material 11. The soldering material 11 is made of gold, silver, copper, tin, nickel, aluminum or aluminum-based metal material 1
0, nickel-gold, nickel-
Plating of silver, nickel-copper, and nickel-tin is performed to form a bump formed body 20. When a dry plating sputtering method or a vacuum deposition method is used, only one of gold, silver, copper, and tin may be used.

FIGS. 2 (a) and 2 (e) show a case where the soldering material 11 is entirely covered with aluminum or the metal material 10 containing aluminum as a main component, except for one surface of the joint 21 to the bump. 2 (b), (f), FIGS. 2 (c) and (g) coated on one side or a part of a sphere, and FIGS. 2 (d) and (h) coated on both sides Figure 2 (a),
Except for (e), the soldering material 11 is partially covered,
It is optional to form the layer by partially removing it after covering the entire surface.
2 (c), (d), (g) and (h) show a solder stop band forming portion 22 for forming a solder stop band for stopping the progress of the molten solder after the bump is formed. Obi 12
Need not be formed again. That is, the solder stop zone 12
Can be joined as they are without performing any deforming operation. As for the shape, the spherical body of FIGS. 2 (a) and 2 (c), the hemispherical body of FIG. 2 (b),
2 (e), 2 (f), 2 (g) and 2 (h), and a drum-shaped body shown in FIG. 2 (d).

The bumps 20 shown in FIGS. 2A, 2D, 2E, and 2H in which the bumps are formed with the pads 2 using the soldering material 11 are mainly made of aluminum or aluminum. Instead of the metal material 10 to be formed, a material having conductivity but not to be soldered, such as a conductive resin, can be used. When the solder blocking material 12a is used, a bump-formed body 20 made of only the soldering material 11 of a spherical body and a columnar body as shown in FIGS. 2 (i) and 2 (j) can be used.

(Embodiment 8) FIG. 8 shows a bump forming body 20 (20c, 2c) having a solder stopping band forming portion 22.
0d, 20g, 20h) is a partial cross-sectional view of the mounting structure. Aluminum or metal material 1 composed of aluminum or aluminum as a main component and soldering material 11 and composed of aluminum or aluminum as a main component
0 is a mounting structure formed using a bump forming body 20 having a solder stop band forming portion 22 formed by
In any case, the bumps are bonded to the pads 2 of the semiconductor element 1 by applying pressure and ultrasonic vibration using a bump forming nozzle.
The terminal electrodes 4 of the circuit board 3 are electrically and mechanically connected by cream solder to form a mounting structure. This mounting structure will be described with reference to the cross-sectional view of the mounting structure in FIG.

FIG. 8A shows a bump-formed body 20 (20c) obtained by coating the spherical aluminum or the metal material 10 containing aluminum as the main component of FIG. 2C with a soldering material 11 in a semicircular shape. Thus, the bonding portion 21 to the pad and the solder inhibition band forming portion 22 are formed continuously. Bonding to the pad 2 is performed when the pad 2 is bonded to aluminum or the metal material 10 containing aluminum as a main component while leaving the metal material containing aluminum or aluminum as the main component of the solder stop band forming portion 22. When connected to the terminal electrode 4 of the circuit board 3 by the cream solder 13, the mounting structure is formed by stopping the progress of the solder melted by the solder inhibition band forming portion 22. FIG. 8 (b) shows a columnar body of FIG. 2 (g) using a bump forming body 20 (20g) having a soldering material 11 on one side. Are formed continuously through the substrate. The pad 2 is a mounting structure that is formed by stopping the progress of the cream solder 13 that has been joined at the joining portion 21 to the pad and that has been melted by the solder inhibition band forming portion 22 on the side surface. FIG. 8 (c) shows the columnar body of FIG. 2 (h), the soldering material 11 on both the upper and lower surfaces, and the solder stop band forming portions 22 on the side surfaces.
The bump forming body 20 (20d) is a mounting structure formed by joining the pad 2 and the soldering material 11 and stopping the progress of the cream solder 13 melted by the solder stop band forming portion 22 on the side surface. . FIG. 8 (d) shows FIG. 2 (d).
A bump forming body 20 (20h) having a drum-shaped upper and lower soldering material 11 and a solder stopping band forming portion 22 on the side surface is used. When connecting to the circuit board 3, the solder stopping band forming portion 22 applies the cream solder 13. The progress is stopped and the mounting structure is formed by being connected to the terminal electrode 4.

[0065]

As described above, according to the present invention, a solder-blocking zone is formed at the time of bump formation by using a bump-formed body obtained by coating a bump-formed body with aluminum or a metal material containing aluminum as a main component or a conductive resin with a soldering material. By inventing a method of forming a bump and a method of applying or mounting a solder blocking material with a soldering material after the formation of a bump, it is possible to connect a semiconductor and a circuit board by soldering, and it is inexpensive and has good workability, quality, and reliability. The mounting structure can be manufactured.

[Brief description of the drawings]

FIG. 1A is a cross-sectional view of a semiconductor and bump mounting structure according to a first embodiment of the present invention. FIG. 1B is a cross-sectional view of a semiconductor and bump mounting structure according to a second embodiment of the present invention. (3) Cross-sectional view of a semiconductor-and-bump mounting structure according to the third embodiment of the present invention. (D) Cross-sectional view of a semiconductor-and-bump mounting structure according to the third embodiment of the present invention. Sectional view of the mounting structure of the semiconductor and the circuit board according to the embodiment (f) Sectional view of the mounting structure of the semiconductor and the circuit board according to the fourth embodiment of the present invention (g) According to the fifth embodiment of the present invention Sectional view of a semiconductor and circuit board mounting structure (h) Sectional view of a semiconductor and circuit board mounting structure according to a sixth embodiment of the present invention (i) Semiconductor and circuit board according to a sixth embodiment of the present invention (J) In the sixth embodiment of the present invention, Sectional view of the mounting structure of the semiconductor and the circuit board that

FIG. 2 is a sectional view of a bump formed body according to a seventh embodiment of the present invention;

FIG. 3 is a sectional view of a bump forming step according to the first embodiment of the present invention;

FIG. 4 is a sectional view of a bump forming step according to a second embodiment of the present invention;

FIG. 5 is a sectional view of a polygonal body of a bump according to another embodiment of the first to fourth embodiments of the present invention;

FIG. 6 is a connection process diagram of a semiconductor and a circuit board of the present invention using cream solder.

FIG. 7 is a cross-sectional view of a mounting structure showing a form before and after melting of a cream solder according to an embodiment of the present invention.

FIG. 8 is a cross-sectional view of a mounting structure using a bump forming body having a solder stop zone forming part according to a ninth embodiment of the present invention.

FIG. 9 is a cross-sectional view of a conventional mounting structure.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Semiconductor element (electronic component) 2 Pad 3 Circuit board 4 Terminal electrode 5 Gold bump 6 Conductive adhesive 10 Aluminum or aluminum-based metal material 10a Bottom 10b Vertex 10c Side surface 11 Soldering material 12 Solder prevention zone 12a Solder prevention Material 13 Cream solder 13a Solder 14, 15, 16 Bump 20 (a), 20 (c), 20 (i) Spherical bump formed body 20 (b), 20 (e), 20 (f), 20 (g) , 20
(H), 20 (j) Column-shaped bump forming body 20 (d) Drum-shaped bump forming body 21 Bonding part to pad 22 Solder stop band forming part 30 Bump forming nozzle 31 Suction hole 32 Corner part 33 Bump forming part

Claims (13)

[Claims] An electronic component having a pad formed on a surface thereof.
A mounting structure, wherein a bump having a soldering region and a solder stop zone on the surface is formed on the pad. 2. An electronic component having a pad formed on a surface thereof.
A mounting structure, wherein a bump having a surface coated with a soldering material is formed on the pad, and a solder blocking material is applied or mounted on the coating to form a solder blocking band. 3. An electronic component having a pad formed on a surface thereof.
A circuit board having a terminal electrode formed on a surface thereof, wherein the electronic component and the circuit board are electrically connected to each other via a bump having a soldering region and a solder stop zone on the surface. Mounting structure. 4. The mounting structure according to claim 1, wherein the electronic component is a semiconductor element. 5. The mounting structure according to claim 1, wherein the bump is made of aluminum or a metal material containing aluminum as a main component. 6. The mounting structure according to claim 1, wherein the bump is formed by coating a conductive resin with a soldering material. 7. The bump according to claim 1, wherein the bump has one of a spherical body, a columnar body, and a polygonal body.
5. The mounting structure according to any one of items 1 to 4. 8. The method according to claim 1, wherein the soldering material comprises at least one of gold, silver, copper, tin, and nickel, or an alloy material containing at least one of the metal materials as a main component. The mounting structure described in the crab. 9. The method according to claim 1, wherein a bump for electrically connecting a pad on the electronic component and a terminal electrode on the circuit board is provided with a solder stop band outside a region covered with a soldering material. 5. The mounting structure according to any one of 4. 10. The mounting structure according to claim 1, wherein the bump is formed by using any one of a spherical body, a hemispherical body, a drum-shaped body, and a columnar body. 11. A step of adsorbing a bump-formed body in which at least a part of aluminum or a metal material containing aluminum as a main component is coated with a soldering material with a bump-forming nozzle to align the bump-formed body with a pad of an electronic component; By lowering the bump forming nozzle while sucking and applying ultrasonic vibration while pressing the bump formed body on the pad of the electronic component, a part of the soldering material is peeled off to form a solder stop zone, And a step of connecting to the pad. 12. The mounting method according to claim 11, wherein the bump forming body and the pad are connected by using a portion of the bump forming body that is not covered with a soldering material. 13. The mounting method according to claim 11, wherein the bump forming body and the pad are connected by using a portion of the bump forming body covered with a soldering material.