JP2002350858A - Light orientation device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To irradiate and expose a large substrate and to enable the irradiation and exposure in a specific pixel area even through divisional orientation. SOLUTION: This light orientation device has irradiation heads arranged in a plurality of multi-head stages and exposes the substrate by passing it below the irradiation heads, and is equipped with a mechanism which moves the substrate by a specified distance for the divisional orientation so that the specific pixel area is irradiated and exposed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to an optical alignment device capable of high-speed large-screen exposure by arranging a large number of irradiation heads or an optical alignment device capable of dividing and aligning fine pixels.

[0002]

2. Description of the Related Art Instead of the conventional contact-type alignment by rubbing, a non-contact type optical alignment method for controlling the alignment of liquid crystal molecules by irradiating linearly polarized ultraviolet rays to a photoreactive or photodegradable polymer film. Are being considered.

[0003] The materials are still at the development level, such as polyimide, polyvinyl cinnamate, and azo dyes. However, the orientation performance of these series of materials depends on their own characteristics, coating drying conditions, coating film thickness, or It has been found that the characteristics are influenced by the properties (wavelength, degree of linear polarization, parallelism) of the ultraviolet light to be irradiated, irradiation energy, irradiation angle, substrate temperature at the time of irradiation, and the like. Among them, the properties (wavelength, degree of linear polarization, parallelism) of the ultraviolet light to be irradiated are determined by the components used such as the ultraviolet light source, polarizer, collimator, and cut filter. In addition, irradiation energy, angle,
The substrate temperature is the only condition that can be set at the time of actual exposure, but is a factor that greatly affects the alignment characteristics, and is an important factor when the device is manufactured.

[0004]

However, for example, when a strong irradiation energy is required, a light beam obtained by condensing the polarized ultraviolet light to be emitted is required. The target product is limited to a small substrate. Also, when exposing a large substrate, a structure is considered in which a magnifying light is used to increase an exposure area by using a reflection mirror or the like. Not practical.

In addition, the irradiation angle on the alignment film surface can be arbitrarily controlled for the pretilt angle, and a so-called multi-domain alignment (divided alignment) that gives a different pretilt for each pixel is possible. Variation of the gap between the mask and the substrate due to the angle, position control and division mask,
At present, it is extremely difficult in practical use due to a large influence of a temperature change of a mask or a substrate. Furthermore, when measuring the gap between the mask and the substrate, contamination on the surface of the substrate affects the gap measurement, making accurate measurement difficult.

[0006] The present invention has been made in view of the above circumstances, and when performing irradiation exposure even on a large substrate,
It is an object of the present invention to provide an optical alignment device which eliminates variations in illuminance, enables efficient irradiation exposure, and eliminates illuminance change at the irradiation angle of the alignment film surface.

[0007]

In order to achieve the above object, an invention according to claim 1 is an optical alignment device for aligning a substrate, comprising: Irradiating head, the substrate is mounted, a movable substrate stage, comprising, irradiating from the multiple irradiation head toward the substrate, adjusting the output of each irradiation head,
After ensuring uniformity of the illuminance, the substrate stage on which the substrate is mounted is moved to orient the substrate.

Accordingly, according to the first aspect of the present invention,
By connecting a plurality of irradiation heads, an exposure area corresponding to one side of the substrate is secured, and by scanning the substrate under the irradiation head at a predetermined speed, it is possible to irradiate the entire area of the substrate. become. In addition, it is possible to increase the size of the substrate to be oriented by increasing the number of connected irradiation heads.

The invention described in claim 2 is the first invention.
In addition to the configuration described above, a plurality of the multiple irradiation heads are arranged to face each other.

Therefore, according to the second aspect of the present invention,
Since a plurality of connected irradiation heads are arranged one on top of the other (arranged in multiple stages), the energy of the irradiated light (integrated light amount) is dispersed in each stage, and as a result, scanning exposure on the substrate is performed at high speed. It becomes possible to do.

Further, the invention according to claim 3 is characterized in that each of the multiple irradiation heads can adjust the illuminance.

Therefore, according to the third aspect of the present invention,
By using irradiation heads that can adjust the illuminance, it is possible to adjust the illuminance of each irradiation head and to secure uniformity of the illuminance, which is important for the orientation.

According to a fourth aspect of the present invention, there is provided a light irradiation apparatus comprising: a mask holder for holding a mask; and a unit transport unit having a mask holder that moves on a traveling rail. In the mask holder, a substrate stage for arranging the substrate, a driving unit for driving the substrate stage, and an irradiation head for irradiating the substrate with ultraviolet light from above the mask through the mask, The rotation center axis of the irradiation head is set on the surface of the alignment film of the substrate, and the rotation center axis is set at 0 ° to 55 ° with respect to the rotation center axis.
The irradiation head can be adjusted within the range of で.

Therefore, according to the invention described in claim 4,
Since the center of the rotation angle of the irradiation head is provided on the substrate surface, it is possible to eliminate a change in illuminance at the time of setting the irradiation head angle.

Further, the invention according to claim 5 is a light irradiation apparatus comprising a mask holder for holding a mask, and a unit transport unit having a mask holder that moves on a traveling rail. In the mask holder,
A substrate stage for arranging the substrate, a driving unit for driving the substrate stage, an irradiation head for irradiating the substrate with ultraviolet light from above the mask through the mask, and for initial alignment of the substrate At least a plurality of photographing mechanisms provided above the mask, a gap detection mechanism for measuring a gap between the mask and the substrate, and a temperature control mechanism for suppressing a positional shift due to a rise in the temperature of the mask and the substrate during irradiation. And Then, the substrate stage on which the substrate is mounted is driven by the driving unit, and a gap between the mask and the substrate is formed with a predetermined gap width, and a horizontal plane for irradiation with ultraviolet light having an arbitrary angle emitted from the irradiation head. The position is controlled. Since the mask is quartz and the substrate is glass, and the ratio of the linear expansion coefficient between quartz and glass is 1:10, the glass substrate expands by 10 times the linear expansion of the mask due to the temperature rise. For this reason, the pixel to be irradiated is displaced from the mask. Therefore, it is necessary to keep the cooling temperature constant.

Therefore, according to the fifth aspect of the present invention,
A movable substrate stage, a plurality of image mechanisms and a gap detection mechanism for initial alignment of the mask substrate, and a mask air cooling mechanism and a substrate cooling mechanism for eliminating an error due to a temperature rise during irradiation are provided. Eliminates pattern misalignment and expansion / contraction errors between the mask and substrate due to elevation, and enables accurate exposure to the pixel area to be irradiated by moving the substrate by a predetermined distance at any irradiation angle and gap. .

According to a sixth aspect of the present invention, there is provided a method for measuring a gap between a mask and a substrate by passing a contact through a hole provided in a mask opposed to the substrate mounted on the substrate stage. A leg for supporting the contact is arranged in contact with the periphery of the hole of the mask, the contact is extended from the center of the leg, the contact is inserted into the hole, and the contact is formed. A gap between the mask and the substrate is measured based on the contact position of the leg and the contact position of the contact element.

Therefore, according to the invention described in claim 6,
Since the gap between the mask and the substrate is detected by mechanical contact of the contact with the substrate, accurate gap measurement is possible even if the substrate is dirty.

[0019]

Embodiments of the present invention will be described below with reference to the drawings.

(Example 1) FIGS. 1 (1) and (2) and FIG.
(1) and (2) respectively show states in which the irradiation head performs irradiation exposure on the substrate. Originally, as shown in FIG. 1A, one irradiation head 1 irradiates and exposes the substrate 2 within the irradiation range. In this case, since the substrate 2 is within the irradiation range of the irradiation head 1, the substrate 2 can be irradiated and exposed without moving the irradiation head 1.

FIG. 1B shows a state in which a large substrate 3 exceeding the irradiation range of one irradiation head is irradiated. In this case, the plurality of irradiation heads 1 are connected in multiples. Specifically, a plurality of irradiation heads 1 are arranged above the large substrate 3 so as to correspond to the length of one side of the large substrate 3. This is so that each irradiation head 1 can irradiate a large substrate 3 without irradiating one side of the large substrate 3. In the present embodiment, as shown in FIG. 1 (2), five irradiation heads 1 are arranged.

Next, the irradiation is performed from the multiple irradiation heads 10 toward the large substrate 3. The variation in the illuminance at the time of irradiation is shown in FIG. The illuminances L1, L2, L3, L4, and L5 of the irradiation heads 1 are L1, L, respectively.
1 ′, L1 ″, L1 ″ ′, and L1 ″ ″, and the illuminance is varied for each irradiated portion of the large substrate 3, and the illuminance is large. Therefore, it is necessary to adjust the output of each irradiation head 1 to maintain uniformity of illuminance, which is important for the orientation. Figure 2 shows the required illuminance width
As shown in (1), the illuminance width (L1) when one substrate 2 is irradiated with one irradiation head 1 is obtained. Therefore, the illuminance is adjusted by the illuminance adjustment mechanism of each irradiation head 1 to achieve uniform illuminance.

The result is shown in FIG.
Variation in illuminance has been eliminated. Specifically, the illuminances L1, L2, L3, L4, and L5 of the respective irradiation heads 1 are all equal, and the required illuminance width is obtained. Then, after achieving uniformity of the illuminance, a substrate stage (not shown) on which the large substrate 3 is mounted is moved at a predetermined speed (FIG. 1).
(In the direction of the arrow) to scan the large substrate 3, so that the entire area of the large substrate 3 can be irradiated and exposed. In addition, it is possible to increase the size of the substrate to be oriented by increasing the number of connected irradiation heads 1 (by increasing the size of the multiple irradiation heads 10).

(Example 2) FIG. 3 shows a configuration in which a large number of irradiation heads 1 shown in FIG. 1 and FIG. 2 are arranged in multiple stages in a connected state (multiple irradiation heads 10). As shown in FIG. 3, one side of the substrate 4 falls within the irradiation range.
Five irradiation heads 1 are arranged side by side along one side of the substrate 4 (multiple connection is arranged). Then, a plurality of multi-connected irradiation heads are arranged opposite to the multi-connected irradiation heads 10 (multi-staged irradiation heads are arranged).
In the present embodiment, the multiple irradiation heads 10 are arranged in three stages, but the invention is not limited to three stages, and any number of stages can be arranged if necessary. Also, in Example 2,
As in Example 1, each irradiation head 1 is provided with an illuminance adjustment mechanism for maintaining uniformity of illuminance, which is important for the orientation, and when irradiating the substrate 4, uniformity of illuminance is maintained. .

As shown in FIG. 3, the substrate 4 is moved at a predetermined speed (in the direction of the arrow in FIG. 3), and passes through the area where the multiple irradiation heads 10 arranged in three stages are irradiating. In addition, the speed at which the substrate 4 is oriented depends on the energy (integrated light quantity) of the irradiated light, and the orientation performance of the substrate 4 requires that the light energy (integrated light quantity) be irradiated without excess or deficiency. In this embodiment, since the multiple irradiation heads are arranged in three stages, the substrate 4 is irradiated three times, so that it is possible to irradiate the light energy (integrated light amount) without excess or deficiency. become. As a result, the scanning speed of the substrate 4 can be increased, and the productivity of irradiation exposure to the substrate can be improved.

(Example 3) FIG. 4 shows a photo-alignment apparatus which embodies a proximity exposure method for irradiating a mask pattern onto a substrate by irradiating the substrate with light obliquely through a mask. . The mask holder 34 is mounted on the unit transport section 38. The unit transport section 38 can travel by traveling on a travel rail 39.

A mask 30 is set on the mask holder 34, and the mask 30 is
The substrate 32 is arranged so as to face. The substrate 32 is supported by a substrate stage 37. Substrate stage 3
7 is provided with a driving unit 36 for driving, an X horizontal driving unit 36a for driving the substrate stage 37 in the X direction (perpendicular to the plane of FIG. 4), and the Y direction (FIG. 4), a Y horizontal driving unit 36b for driving the substrate stage 37 in the Z direction (in a direction approaching the mask 30).
A vertical drive unit 36c and a ψ rotation drive unit 36d for rotating the substrate stage 37 are provided. In order to rotate the entire mask holder 34, the mask holder 34 is rotated.
A unit Φ rotating unit is provided between the unit and the unit transport unit 38.

Further, the mask 30 is located above the mask 30.
There is provided an irradiation head 31 for irradiating ultraviolet rays toward. The center axis of rotation of the irradiation head 31 is set on the surface of the alignment film of the substrate 32 and can be adjusted within a range of 0 ° to 55 ° with respect to the center axis of rotation.

Next, the operation of the photo-alignment device of the present invention will be described. In order to dispose the substrate 32 below the mask 30, the X horizontal driving unit 36 a of the driving unit 36 and the Y horizontal driving unit 3
6b, the Z vertical drive unit 36c and the ψ rotation drive unit 36d are appropriately driven to bring the substrate 32 on the substrate stage 37 close to the mask 30, and a predetermined gap width is provided between the mask 30 and the substrate 32. Then, an irradiation head 31 irradiates the surface of the alignment film of the substrate 32 with ultraviolet rays to perform irradiation exposure. At this time, the irradiation head 31 can be changed from 0 ° to 55 ° from a direction perpendicular to the substrate 32 which is the rotation center axis. As described above, by setting the rotation center axis on the surface of the alignment film of the substrate, it is possible to eliminate a change in illuminance at an arbitrary angle.

(Example 4) In Example 4 shown in FIG. 5, the mask holder 37, the unit transport section 38 and the irradiation head 31 which are the mechanisms of Example 3 are the same. In this example, the substrate 32 is divided into an alignment station and an exposure station, the substrate 32 is positioned at the alignment station, and the substrate 32 is irradiated and exposed at the exposure station. A unit transport section 38 is disposed on the traveling rail 39 to move between them.

In the alignment station, CCD cameras as photographing mechanisms 41 and 43 are provided at two places above the mask 30, and the displacement of the projection position of the mask pattern on the substrate 32 (positioning of the substrate 32 with respect to the mask 30). ). Further, a gap detector 45 for measuring a gap amount between the mask 30 and the substrate 32 is provided on the mask 30.

The processing operation in the alignment station will be described. In the alignment station, as shown in FIG. 5, a gap is provided between the mask 30 and the substrate 32, and the positions of the mask 30 and the substrate 32 are captured by the CCD cameras 41 and 43. Mask 30 and substrate 3
In order to perform the alignment with the substrate 2, it is necessary to move the substrate 32 in the vertical and horizontal directions. In that case, the X horizontal drive unit 36a and the Y horizontal drive unit 3 in the mask holder 34
6b, the substrate stage 37 on which the substrate 32 is mounted is adjusted using the Z horizontal drive unit 36c and the ψ rotation drive unit 36d. By the adjustment, the gap amount between the mask 30 and the substrate 32 becomes a predetermined amount, and when the positioning between the mask 30 and the substrate 32 is completed, the processing in the alignment station is completed. In the positioning at this time, the mask 30
It is necessary that the portion where the shielding film 30a is not provided and the portion of the alignment film of the substrate 32 to be irradiated and exposed face each other.

Next, the mask holder 34 on which the mask 30 is placed is moved on the traveling rail 39 by the unit transport section 38 and moves to the exposure station. In the exposure station, an irradiation head 30 is arranged above the mask 30. As shown in FIG. 5, the irradiation head 31 includes a UV light source 31a as an ultraviolet light source, a polarizer 31b, and a collimator 3.
1c, a cut filter 31d, and a temperature control unit 31e for cooling (air cooling) the mask 30 in order to eliminate an error due to a rise in temperature during irradiation.

Next, a description will be given of a divisional alignment performed by the exposure station, in which a different alignment is performed for each pixel by changing the irradiation condition of the substrate 32 with ultraviolet rays. As shown in FIG. 6, regions A and B (A domain and B domain) are provided alternately on (the alignment film of) the substrate 32. Different orientations are provided for the alternately provided A domain and B domain. The mask 30 is made of quartz, and shielding films 30a are provided at predetermined intervals on the substrate 32 side.

A method of irradiating only the A domain First, when irradiating the A domain, the irradiation head 31 is used.
When the incident angle of the ultraviolet ray from the substrate is + θ and the ultraviolet ray is incident on the mask 30, the ultraviolet ray passes through the mask 30 from a portion of the mask 30 where the shielding film 30 a is not provided. The ultraviolet light passing through reaches the alignment film on the substrate 30. At this time, as shown in FIG. 6A, the ultraviolet rays irradiate (the alignment film of) the substrate 30 across the A domain and the B domain, so that a correction for this is necessary. FIG.
The substrate stage 37 is moved by the driving unit 36 in the direction of the arrow in FIG. 3B, and the region irradiated with the ultraviolet rays is positioned so as to be within the A domain. In this way, as shown in FIG. 6B, by irradiating only the inside of the A domain, the orientation of the A domain is completed.

Method of irradiating only B domain When irradiating and irradiating the B domain, the orientation is performed at an incident angle of the ultraviolet ray from the irradiation head 31 of -θ. Incident angle is -θ
Ultraviolet rays enter the mask 30, and the ultraviolet rays pass through the mask 30 from a portion where the shielding film 30a is not provided.
Then, the ultraviolet rays reach (the alignment film of) the substrate 30. At this time, similarly to the orientation to the A domain, as shown in FIG. 7A, the ultraviolet rays irradiate the substrate 30 (or an alignment film thereof) across the A domain and the B domain. Yes, correction is required. Therefore, the substrate stage 37 is moved by the driving unit 36 in the direction of the arrow in FIG. 7B, and the region irradiated with the ultraviolet rays is positioned so as to be within the B domain. In this way, FIG.
As shown in (1), by irradiating and exposing only the inside of the B domain, the orientation of the B domain is completed.

Next, the split orientation will be described in detail taking the orientation of the A domain as an example. FIG. 8 (1) corresponds to FIG. 6 (a), and the ultraviolet light is applied to the substrate 3 over the A domain and the B domain.
The state where the alignment film of No. 0 is irradiated is shown. FIG.
As shown in (1), assuming that the thickness of the shielding film 30a is d, the opening width which is the width of the portion where the shielding film 30a is not provided is X, and the gap width is D, The length up to the alignment film is Dd. If the domain width of the A domain is X, the width of the portion of the A domain that is not irradiated with ultraviolet light is Dtanθ, and the width of the portion of the B domain that is irradiated with ultraviolet light is (D−d) ta
nθ, and the following relationship is established between the actual exposure width and the domain width X.

[0038]

(Equation 1)

FIG. 8 (2) corresponds to FIG. 6 (b).
This shows a state in which the substrate 32 is moved so that only the A domain can be irradiated with ultraviolet rays. In FIG. 8B, the amount of movement of the substrate is Dtan θ, and the exposure range for irradiation exposure is biased. That is, a range (D-d) tan θ in which one end of the A domain is not exposed to light is formed. As shown in FIG. 8 (3), a method of obtaining the amount of movement of the substrate 32 (the amount of movement of the substrate stage 37) for equalizing the area where one end of the domain is not irradiated and exposed is not biased. ing. Assuming that ΔX is the optimum value of the movement amount of the substrate stage, it is expressed by the following equation, and makes the exposure range of the irradiation exposure uniform (see FIG. 8 (3)).

[0040]

(Equation 2)

(Example 5) FIG. 9 shows a mechanism for detecting a gap. As shown in FIG. 9 (2), a hole 70a is provided at an end of the mask 70, and gap detection (gap depth) is performed using this hole 70a (detection at the cutout portion is also possible). The hole 70a may be a hole or a notch as shown in FIG. 9 (2). The configuration of the contact gap detector 80 of the present invention is shown in FIG. In the gap detection method, first, the leg portion 80b is placed in contact with the periphery of the hole 70a. By arranging the legs 80b in this manner, the movement of the contact is maintained perpendicular to the substrate 72, and the contact 80a can be prevented from tilting. Next, pressure is applied to the head of the contact type gap detector 80 to
The contact 80a is extended from the center of b (the center of the contact gap detector 80), the contact 80a is inserted into the hole 70a, and the contact 80a is brought into contact with the substrate 72. The detection unit 80c also moves according to the extension of the contact 80a. Then, based on the contact position of the leg portion 80b and the contact position of the contact 80a, the amount obtained by subtracting the mask thickness and the movement amount of the detection section 80c become the gap detection amount.

According to this method, the mask 101 and the substrate 10 are formed using the conventional linear sensor 100 shown in FIG.
The laser beam reflected by applying laser light to 2 makes it easier to obtain a more accurate gap detection amount than a method of obtaining a gap detection amount. Irradiate conventional laser light etc.
In the method of measuring the amount of reflected return light, the mask 10
If one surface and the surface of the substrate 102 are contaminated, accurate measurement is difficult.

[0043]

According to the first aspect of the present invention, when irradiating a large substrate, a plurality of irradiation heads are connected to each other to secure an exposure area corresponding to one side, and the irradiation head is provided. By scanning the substrate under a predetermined speed at a predetermined speed, the entire area of the substrate can be exposed to light.

According to the second aspect of the present invention, since a plurality of connected irradiation heads are arranged in multiple stages, the energy (integrated light amount) of the irradiated light is dispersed in each stage.
As a result, it becomes possible to speed up the scanning exposure on the substrate.

According to the third aspect of the present invention, since each irradiation head capable of adjusting the illuminance is used, it is possible to ensure the uniformity of the illuminance, which is important for the orientation.

According to the fourth aspect of the present invention, since the center of the rotation angle of the irradiation head is provided on the substrate surface, the change in illuminance at the time of setting the irradiation head angle is eliminated, and the uniformity of irradiation exposure is improved. It becomes possible to plan.

According to the fifth aspect of the present invention, there are provided a movable substrate stage, a plurality of image mechanisms for initial alignment of a mask substrate, and a gap detection mechanism, and further eliminates errors due to a rise in temperature during irradiation. Providing a mask air cooling mechanism and a substrate cooling mechanism enables accurate exposure of a predetermined pixel at an arbitrary irradiation angle and gap.

According to the invention described in claim 6, since the detection mechanism is a mechanical contact, the gap detection amount varies depending on the surface condition such as contamination of the substrate in the conventional non-contact method such as laser light. However, such a change in the gap detection amount can be prevented.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing a state in which a large-sized substrate is subjected to irradiation exposure by a multiple irradiation head, and FIG.
FIG. 2 is an explanatory diagram showing irradiation exposure to a substrate by one irradiation head, and FIG. 2B is an explanatory diagram showing irradiation exposure to a large substrate by multiple irradiation heads.

FIG. 2A is an explanatory diagram showing variations in illuminance with respect to a substrate, and FIG. 2B is an explanatory diagram showing that illuminance is uniform with respect to a substrate.

FIG. 3 is an explanatory diagram showing a state in which irradiation exposure of a large substrate is performed by a multi-stage and multi-stage irradiation head.

FIG. 4 is an explanatory diagram of a photo-alignment apparatus that embodies a proximity exposure method.

FIG. 5 is an explanatory diagram showing an alignment station and an exposure station of the optical alignment device.

FIGS. 6A and 6B are explanatory diagrams showing a split orientation, and FIGS. 6A and 6B are explanatory diagrams showing the split orientation at an incident angle + θ, respectively.

FIGS. 7A and 7B are explanatory views showing the split orientation, and FIGS. 7A and 7B are explanatory views showing the split orientation at an incident angle of −θ, respectively.

8A and 8B are explanatory diagrams showing a state of movement of a substrate in divided orientation, where FIG. 8A is an explanatory diagram showing an irradiation state of ultraviolet rays before the substrate moves, and FIG. FIG. 8 is an explanatory view showing the state of irradiation of ultraviolet rays after the movement of FIG.
(3) is an explanatory view showing a substrate offset method.

FIG. 9 is an explanatory view showing a method of detecting a gap between a mask and a substrate. FIG. 9A is a sectional view of a contact type gap detector according to the present invention, and FIG. FIG. 3 is an explanatory diagram illustrating a positional relationship between a mask and a substrate.

FIG. 10 is a cross-sectional view of a conventional non-contact type gap detector.

[Description of Symbols] 1 ... irradiation head, 3 ... large substrate, 10 ... multiple irradiation head, 30 ... mask, 31 ... irradiation head, 32 ... substrate, 34 ... mask holder, 36 ......
Driving unit, 37: substrate stage, 38: unit transport unit.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Yoshimasa Saito, Inventor 6-7-35 Kita-Shinagawa, Shinagawa-ku, Tokyo Inside Sony Corporation (72) Inventor Shin Yoshizawa 6-35, Kita-Shinagawa, Shinagawa-ku, Tokyo No. Sony Corporation F term (reference) 2H090 HB08Y HC13 HC17 HC18 HC20 HD14 MA13 MB12

Claims (6)

[Claims] 1. An optical alignment device for aligning a substrate, comprising: an irradiation head having a plurality of illuminated beams for reducing the luminous flux and increasing illuminance; and a movable substrate stage on which the substrate is mounted. Irradiation is performed from the serialized irradiation head toward the substrate, the output of each irradiation head is adjusted, and after ensuring uniformity of illuminance, the substrate stage on which the substrate is mounted is moved to adjust the orientation of the substrate. A photo-alignment device characterized by performing: 2. The photo-alignment device according to claim 1, wherein a plurality of the multiple irradiation heads are arranged to face each other. 3. The photo-alignment device according to claim 1, wherein each of the multiple irradiation heads is capable of adjusting the illuminance. 4. A light irradiation device comprising: a mask holder for holding a mask; and a unit transport unit having a mask holder that moves on a running rail, wherein a substrate is disposed in the mask holder. Substrate stage, a driving unit for driving the substrate stage, an irradiation head for irradiating the substrate with ultraviolet light from above the mask through the mask, the rotation center axis of the irradiation head A light irradiation apparatus, wherein the irradiation head can be set in the range of 0 ° to 55 ° with respect to the rotation center axis, set on the alignment film surface of the substrate. 5. A light irradiation apparatus comprising: a mask holder for holding a mask; and a unit transport unit having a mask holder that moves on a traveling rail, wherein a substrate is disposed in the mask holder. A stage for driving the substrate stage, a driving unit for driving the substrate stage, an irradiation head for irradiating the substrate with ultraviolet light from above the mask, and an upper part of the mask for initial alignment of the substrate. At least a plurality of photographing mechanisms provided in, a gap detection mechanism for measuring the gap between the mask and the substrate, and a temperature control mechanism for suppressing the temperature rise of the mask and the substrate during irradiation, A substrate stage on which a substrate is mounted is driven by the driving unit to form a predetermined gap width between the mask and the substrate, and is emitted from the irradiation head. A light irradiation device for controlling a horizontal position for irradiation with ultraviolet light having an arbitrary angle. 6. A method for measuring a gap between a mask and a substrate by passing a contact through a hole provided in a mask opposed to a substrate mounted on a substrate stage, the method comprising supporting the contact. The contact is arranged in contact with the periphery of the hole of the mask, a contact is extended from the center of the leg, the contact is inserted into the hole, the contact is brought into contact with the substrate, and the leg is Measuring the gap between the mask and the substrate based on the contact position of the part and the contact position of the contact.