JP5430589B2 - Exposure apparatus and exposure method - Google Patents

Description

  In the manufacture of a liquid crystal display device, the present invention relates to an alignment film exposure apparatus and exposure device that irradiates an alignment film made of a polymer compound with linearly polarized exposure light to give the alignment film alignment characteristics that align the liquid crystal alignment direction. In particular, the present invention relates to an alignment film exposure apparatus and exposure method for forming a plurality of different alignment regions in an alignment film on a single substrate.

  2. Description of the Related Art An active matrix liquid crystal display device is manufactured by enclosing liquid crystal between a TFT (Thin Film Transistor) substrate and a color filter substrate, and arranging the liquid crystal alignment direction on the surface of the TFT substrate and the color filter substrate. An alignment film is formed. The process of imparting alignment characteristics to align the alignment direction of the liquid crystal on the alignment film has been conventionally performed by a “rubbing method” in which the surface of the alignment film is rubbed with a cloth, but recently, an alignment film made of a polymer compound such as polyimide. A “photo-alignment method” has been developed in which anisotropy is generated by irradiating a linearly polarized ultraviolet light to selectively react a polymer chain in the polarization direction. In the photo-alignment method, as one method for causing the alignment film to exhibit a pretilt angle, there is a method of obliquely irradiating the alignment film with linearly polarized ultraviolet light.

  In Patent Document 1, in order to increase the viewing angle of a liquid crystal display device, to improve display quality, and to improve contrast, in a pair of substrates sandwiching a liquid crystal layer, an alignment film on each substrate has a pretilt direction of about 180 °. Each of the substrates is divided into two different alignment regions, and the two substrates are bonded so that the boundary between the alignment regions on one substrate and the alignment region on the other substrate are substantially perpendicular to each other. A forming technique is disclosed.

JP-A-11-352486

  As described in Patent Document 1, in order to form a plurality of different alignment regions on an alignment film on one substrate, it is necessary to irradiate linearly polarized ultraviolet light obliquely from different directions for each alignment region. . For this reason, conventionally, exposure is performed using a configuration similar to that of a proximity exposure apparatus that is used in photolithography technology to transfer a mask pattern to a substrate by providing a minute gap (proximity gap) between the mask and the substrate. A mask that covers a region other than the alignment region to be provided is provided, and linearly polarized exposure light is obliquely irradiated from the exposure light irradiation device to the mask.

  However, in the conventional method using a mask, it is necessary to exchange the mask for each type of substrate to be exposed. In addition, since the exposure light irradiation device used in the conventional proximity exposure apparatus cannot change the direction of exposure light irradiation, the substrate is removed from the chuck and the orientation of the substrate is rotated each time each alignment region is exposed. It is necessary to let Therefore, there is a problem that the tact time becomes long and the throughput decreases.

  An object of the present invention is to form a plurality of different alignment regions in an alignment film on one substrate without using a mask. Another object of the present invention is to shorten the tact time and improve the throughput when forming a plurality of different alignment regions in an alignment film on one substrate.

  An alignment film exposure apparatus according to the present invention includes a chuck that supports a substrate, a spatial light modulator that modulates a light beam by changing angles of a plurality of mirrors arranged in two directions, and spatial light based on drawing data. A drive circuit that drives the modulator and an irradiation optical system that irradiates the light beam modulated by the spatial light modulator, and obliquely irradiates the linearly polarized light beam from the irradiation optical system to the substrate supported by the chuck. And a moving means for relatively moving the chuck and the light beam irradiating device, and the moving means relatively moves the chuck and the light beam irradiating device so as to be inclined from the light beam irradiating device. An alignment film exposure apparatus that scans a substrate with an irradiated linearly polarized light beam and gives alignment characteristics applied to the alignment film applied to the substrate to align the alignment direction of the liquid crystal. The A plurality of illumination optical systems for supplying light beams having different incident angles to the spatial light modulator, and modulating the light beams having different incident angles supplied from the respective illumination optical systems by the spatial light modulators; A light beam having a plurality of different incident angles is irradiated onto the substrate supported by the chuck from the irradiation optical system.

  The alignment film exposure method of the present invention also includes a spatial light modulator that supports the substrate with a chuck, changes the angle of the chuck and a plurality of mirrors arranged in two directions, and modulates the light beam. And a drive circuit for driving the spatial light modulator based on the light source and an irradiation optical system for irradiating the light beam modulated by the spatial light modulator, and linearly polarized light from the irradiation optical system to the substrate supported by the chuck. The light beam irradiation device that irradiates the beam obliquely moves relatively, scans the substrate with the linearly polarized light beam obliquely emitted from the light beam irradiation device, and the liquid crystal is applied to the alignment film applied to the substrate. A plurality of illumination optical systems for supplying light beams having different incident angles to the spatial light modulator, and each of the light beam irradiation devices, Is it an illumination optical system? The light beam of the supplied different incident angles are modulated respectively by the spatial light modulator is configured to irradiate a plurality of different incident angles of the light beam to that supported from the irradiation optical system to the chuck board.

  The substrate is scanned with a linearly polarized light beam emitted obliquely from the light beam irradiation device, and the alignment characteristic applied to the alignment film applied to the substrate is imparted with alignment characteristics that align the liquid crystal alignment direction. The drawing data supplied to the driving circuit for driving the optical modulator can be changed to expose a desired position and an oriented region having a desired shape. Therefore, a plurality of different alignment regions can be formed in the alignment film on one substrate without using a mask.

  The light beam irradiation device is provided with a plurality of illumination optical systems that supply light beams having different incident angles to the spatial light modulator, and the light beams having different incident angles supplied from the respective illumination optical systems are spatially modulated. Each of the light beams having different incident angles is irradiated from the irradiation optical system to the substrate supported by the chuck, so that when forming a plurality of different alignment regions on the alignment film on one substrate, There is no need to remove the substrate from the chuck and rotate the orientation of the substrate each time the alignment area is exposed. Therefore, the tact time is shortened and the throughput is improved.

  Furthermore, in the alignment film exposure apparatus of the present invention, the light beam irradiation device divides the plurality of mirrors of the spatial light modulator into a plurality of regions corresponding to the respective illumination optical systems, and the regions corresponding to the respective illumination optical systems. A light beam having a different incident angle is supplied. Further, the alignment film exposure method of the present invention divides the plurality of mirrors of the spatial light modulator into a plurality of regions corresponding to the respective illumination optical systems, and has different incident angles from the respective illumination optical systems to the corresponding regions. A light beam is supplied.

  A plurality of mirrors of the spatial light modulator are divided into a plurality of regions corresponding to the respective illumination optical systems, and light beams having different incident angles are supplied from the respective illumination optical systems to the corresponding regions. A light beam having a different incident angle is simultaneously supplied to a corresponding region, and the light beam having a different incident angle is simultaneously modulated by a corresponding region of the spatial light modulator, so that the substrate supported by the chuck is different from the irradiation optical system. It is possible to simultaneously irradiate the places with light beams having different incident angles. Therefore, if the scanning direction of the substrate by the light beam does not affect the pretilt direction of the alignment characteristics imparted to the alignment film, depending on the pattern of exposure light, the nature of the alignment film applied to the substrate, etc. A plurality of different alignment regions can be simultaneously formed in the alignment film.

  Further, the alignment film exposure apparatus of the present invention switches the plurality of illumination optical systems of the light beam irradiation device to change the direction of the light beam irradiated to the substrate supported by the chuck, and to change the direction of the light beam. The change and the change of the relative movement direction of the chuck and the light beam irradiation device by the moving means are combined to change the pretilt direction of the alignment characteristic to be applied to the alignment film. In the alignment film exposure method of the present invention, the plurality of illumination optical systems of the light beam irradiation apparatus are switched to change the direction of the light beam applied to the substrate supported by the chuck, and to change the direction of the light beam. The change and the change of the relative movement direction of the chuck and the light beam irradiation device are combined to change the pretilt direction of the alignment characteristic imparted to the alignment film.

  Depending on the pattern of exposure light, the nature of the alignment film applied to the substrate, etc., when the scanning direction of the substrate by the light beam affects the pretilt direction of the alignment characteristics imparted to the alignment film, The desired pretilt direction can be obtained by combining the change of the relative movement direction of the chuck and the light beam irradiation device.

  According to the present invention, by scanning the substrate with a linearly polarized light beam obliquely irradiated from the light beam irradiation device, and imparting the alignment characteristics to align the alignment direction of the liquid crystal to the alignment film applied to the substrate, The drawing data supplied to the driving circuit that drives the spatial light modulator of the light beam irradiation apparatus can be changed to expose the alignment region having a desired position and a desired shape. Therefore, a plurality of different alignment regions can be formed in the alignment film on one substrate without using a mask.

  The light beam irradiation device is provided with a plurality of illumination optical systems that supply light beams having different incident angles to the spatial light modulator, and the light beams having different incident angles supplied from the respective illumination optical systems are spatially modulated. When forming a plurality of different alignment regions on an alignment film on one substrate by irradiating a plurality of light beams with different incident angles to the substrate supported by the chuck from the irradiation optical system, respectively, The tact time can be shortened and the throughput can be improved.

  Further, according to the present invention, the plurality of mirrors of the spatial light modulator are divided into a plurality of regions corresponding to the respective illumination optical systems, and light beams having different incident angles are supplied from the respective illumination optical systems to the corresponding regions. Thus, if the scanning direction of the substrate by the light beam does not affect the pretilt direction of the alignment characteristic imparted to the alignment film according to the pattern of exposure light, the nature of the alignment film applied to the substrate, etc., one substrate A plurality of different alignment regions can be simultaneously formed in the upper alignment film.

  Furthermore, according to the present invention, the plurality of illumination optical systems of the light beam irradiation apparatus are switched to change the direction of the light beam irradiated to the substrate supported by the chuck, and to change the direction of the light beam, By changing the relative tilting direction of the light beam irradiation device and changing the pretilt direction of the alignment characteristics applied to the alignment film, the pattern of the exposure light, the nature of the alignment film applied to the substrate, etc. Accordingly, when the scanning direction of the substrate by the light beam affects the pretilt direction of the alignment characteristic imparted to the alignment film, the change of the light beam direction and the relative movement direction of the chuck and the light beam irradiation device The desired pretilt direction can be obtained in combination with the change.

It is a figure which shows schematic structure of the aligner exposure apparatus by one embodiment of this invention. 1 is a side view of an alignment film exposure apparatus according to an embodiment of the present invention. FIG. 1 is a front view of an alignment film exposure apparatus according to an embodiment of the present invention. FIG. It is a figure which shows schematic structure of the light beam irradiation apparatus by one embodiment of this invention. It is a figure which shows an example of the mirror part of DMD. It is a figure explaining operation | movement of a laser length measurement system. It is a figure which shows schematic structure of a drawing control part. It is a figure which shows the area | region where DMD was divided | segmented. It is a figure explaining the exposure method of the alignment film by one embodiment of this invention. It is a figure explaining the exposure method of the alignment film by other embodiment of this invention. It is a figure explaining the exposure method of the alignment film by other embodiment of this invention. It is a figure which shows schematic structure of the light beam irradiation apparatus by further another embodiment of this invention. It is a top view of the light beam irradiation apparatus by further another embodiment of this invention. It is a figure which shows the area | region where DMD was divided | segmented. It is a figure explaining the exposure method of the alignment film by further another embodiment of this invention.

  FIG. 1 is a diagram showing a schematic configuration of an alignment film exposure apparatus according to an embodiment of the present invention. 2 is a side view of an alignment film exposure apparatus according to an embodiment of the present invention, and FIG. 3 is a front view of the alignment film exposure apparatus according to an embodiment of the present invention. The exposure apparatus includes a base 3, an X guide 4, an X stage 5, a Y guide 6, a Y stage 7, a θ stage 8, a chuck 10, a gate 11, a light beam irradiation device 20, linear scales 31, 33, encoders 32, 34, A laser length measurement system, a laser length measurement system control device 40, a stage drive circuit 60, and a main control device 70 are included. 2 and 3, the laser light source 41 of the laser measurement system, the laser measurement system control device 40, the stage drive circuit 60, and the main control device 70 are omitted. In addition to these, the exposure apparatus includes a substrate transfer robot that loads the substrate 1 into the chuck 10 and unloads the substrate 1 from the chuck 10, a temperature control unit that performs temperature management in the apparatus, and the like.

  Note that the XY directions in the embodiments described below are examples, and the X direction and the Y direction may be interchanged.

  1 and 2, the chuck 10 is in a delivery position for delivering the substrate 1. At the delivery position, the substrate 1 is carried into the chuck 10 by a substrate carrying robot (not shown), and the substrate 1 is carried out of the chuck 10 by a substrate carrying robot (not shown). The chuck 10 supports the back surface of the substrate 1 by vacuum suction. An alignment film made of a polymer compound such as polyimide is applied to the surface of the substrate 1.

  A gate 11 is provided across the base 3 above the exposure position where the substrate 1 is exposed. A plurality of light beam irradiation devices 20 are mounted on the gate 11. Although the present embodiment shows an example of an exposure apparatus using eight light beam irradiation apparatuses 20, the number of light beam irradiation apparatuses is not limited to this, and the present invention is one or two or more. The present invention is applied to an exposure apparatus using a light beam irradiation apparatus.

  FIG. 4 is a diagram showing a schematic configuration of a light beam irradiation apparatus according to an embodiment of the present invention. The light beam irradiation apparatus 20 of the present embodiment has two illumination optical systems that supply a light beam to the DMD. The light beam irradiation device 20 includes a first illumination optical system, a second illumination optical system, a DMD (Digital Micromirror Device) 25, projection lenses 26 a and 26 b, and a DMD drive circuit 27. The first illumination optical system includes an optical fiber 22a, a lens 23a, a mirror 24, a polarizer 28, and a prism 29. The second illumination optical system includes an optical fiber 22b, a lens 23b, a mirror 24, a polarizer 28, and a prism 29. The mirror 24, the polarizer 28, and the prism 29 are shared by the first illumination optical system and the second illumination optical system.

  The optical fiber 22a of the first illumination optical system introduces an ultraviolet light beam generated from the laser light source unit 21a into the light beam irradiation device 20. The light beam emitted from the optical fiber 22a passes through the lens 23a and the prism 29, then passes through the polarizer 28, becomes linearly polarized light, is reflected by the mirror 24, and is irradiated onto the DMD 25. The optical fiber 22b of the second illumination optical system introduces the light beam of ultraviolet light generated from the laser light source unit 21b into the light beam irradiation device 20. The light beam emitted from the optical fiber 22b passes through the lens 23b and the prism 29, then passes through the polarizer 28, becomes linearly polarized light, is reflected by the mirror 24, and is irradiated onto the DMD 25. By the action of the prism 29, the first illumination optical system and the second illumination optical system supply light beams having different incident angles to the DMD 25 as shown in FIG.

  The DMD 25 is a spatial light modulator configured by arranging a plurality of minute mirrors that reflect a light beam in two orthogonal directions, and modulates the light beam by changing the angle of each mirror. The light beam modulated by the DMD 25 is irradiated from the head unit 20a including the projection lenses 26a and 26b. The DMD drive circuit 27 changes the angle of each mirror of the DMD 25 based on the drawing data supplied from the main controller 70.

  The polarizer 28 is not limited to be disposed between the prism 29 and the mirror 24, and can be installed at an arbitrary position in the optical path of the light beam within the light beam irradiation device 20.

  2 and 3, the chuck 10 is mounted on the θ stage 8, and a Y stage 7 and an X stage 5 are provided below the θ stage 8. The X stage 5 is mounted on an X guide 4 provided on the base 3 and moves in the X direction along the X guide 4. The Y stage 7 is mounted on a Y guide 6 provided on the X stage 5 and moves in the Y direction along the Y guide 6. The θ stage 8 is mounted on the Y stage 7 and rotates in the θ direction. The X stage 5, Y stage 7, and θ stage 8 are provided with drive mechanisms (not shown) such as ball screws and motors, linear motors, etc., and each drive mechanism is driven by a stage drive circuit 60 of FIG. The

  By rotation of the θ stage 8 in the θ direction, the substrate 1 mounted on the chuck 10 is rotated so that two orthogonal sides are directed in the X direction and the Y direction. As the X stage 5 moves in the X direction, the chuck 10 is moved between the delivery position and the exposure position. When the X stage 5 moves in the X direction at the exposure position, the light beam irradiated from the head unit 20a of each light beam irradiation apparatus 20 scans the substrate 1 in the X direction. In addition, as the Y stage 7 moves in the Y direction, the scanning region of the substrate 1 by the light beam emitted from the head unit 20a of each light beam irradiation device 20 is moved in the Y direction. In FIG. 1, the main controller 70 controls the stage drive circuit 60 to rotate the θ stage 8 in the θ direction, move the X stage 5 in the X direction, and move the Y stage 7 in the Y direction. .

  FIG. 5 is a diagram illustrating an example of a DMD mirror unit. The DMD 25 of the light beam irradiation device 20 is disposed at a predetermined angle θ with respect to the scanning direction (X direction) of the substrate 1 by the light beam from the light beam irradiation device 20. When the DMD 25 is arranged to be inclined with respect to the scanning direction, any one of the plurality of mirrors 25a arranged in two orthogonal directions covers a portion corresponding to the gap between the adjacent mirrors 25a, so that the alignment film is exposed. Can be performed without gaps.

  In the present embodiment, the substrate 10 is scanned by the light beam from the light beam irradiation device 20 by moving the chuck 10 in the X direction by the X stage 5, but the light beam irradiation device 20 is moved. By doing so, the substrate 1 may be scanned by the light beam from the light beam irradiation device 20. In the present embodiment, the scanning region of the substrate 1 by the light beam from the light beam irradiation device 20 is changed by moving the chuck 10 in the Y direction by the Y stage 7, but the light beam irradiation device 20. , The scanning region of the substrate 1 by the light beam from the light beam irradiation device 20 may be changed.

  1 and 2, the base 3 is provided with a linear scale 31 extending in the X direction. The linear scale 31 is provided with a scale for detecting the amount of movement of the X stage 5 in the X direction. The X stage 5 is provided with a linear scale 33 extending in the Y direction. The linear scale 33 is provided with a scale for detecting the amount of movement of the Y stage 7 in the Y direction.

  1 and 3, an encoder 32 is attached to one side surface of the X stage 5 so as to face the linear scale 31. The encoder 32 detects the scale of the linear scale 31 and outputs a pulse signal to the main controller 70. 1 and 2, an encoder 34 is attached to one side surface of the Y stage 7 so as to face the linear scale 33. The encoder 34 detects the scale of the linear scale 33 and outputs a pulse signal to the main controller 70. Main controller 70 counts the pulse signal of encoder 32, detects the amount of movement of X stage 5 in the X direction, counts the pulse signal of encoder 34, and moves the amount of Y stage 7 in the Y direction. Is detected.

  FIG. 6 is a diagram for explaining the operation of the laser length measurement system. In FIG. 6, the gate 11 and the light beam irradiation device 20 shown in FIG. 1 are omitted. The laser length measurement system is a known laser interference type length measurement system, and includes a laser light source 41, laser interferometers 42 and 44, and bar mirrors 43 and 45. The bar mirror 43 is attached to one side surface of the chuck 10 that extends in the Y direction. The bar mirror 45 is attached to one side surface of the chuck 10 extending in the X direction.

  The laser interferometer 42 irradiates the laser beam from the laser light source 41 onto the bar mirror 43, receives the laser beam reflected by the bar mirror 43, and the laser beam reflected from the laser beam source 41 and the laser beam reflected by the bar mirror 43. Measure interference. This measurement is performed at two locations in the Y direction. The laser length measurement system control device 40 detects the position and rotation of the chuck 10 in the X direction from the measurement result of the laser interferometer 42 under the control of the main control device 70.

  On the other hand, the laser interferometer 44 irradiates the laser beam from the laser light source 41 to the bar mirror 45, receives the laser beam reflected by the bar mirror 45, and the laser beam reflected from the laser source 41 and the bar mirror 45. Measure interference with light. The laser length measurement system control device 40 detects the position of the chuck 10 in the Y direction from the measurement result of the laser interferometer 44 under the control of the main control device 70.

  In FIG. 4, the main controller 70 has a drawing controller that supplies drawing data to the DMD drive circuit 27 of the light beam irradiation device 20. FIG. 7 is a diagram illustrating a schematic configuration of the drawing control unit. The drawing control unit 71 includes a memory 72, a bandwidth setting unit 73, a center point coordinate determination unit 74, and a coordinate determination unit 75. The memory 72 stores drawing data to be supplied to the DMD driving circuit 27 of each light beam irradiation apparatus 20 using the XY coordinates as addresses.

  The bandwidth setting unit 73 sets the Y-direction bandwidth of the light beam emitted from the head unit 20 a of the light beam irradiation device 20 by determining the range of the Y coordinate of the drawing data read from the memory 72.

  The laser length measurement system control device 40 detects the position of the chuck 10 in the X and Y directions before the exposure of the substrate 1 at the exposure position is started. The center point coordinate determination unit 74 determines the XY coordinates of the center point of the chuck 10 before starting the exposure of the substrate 1 from the position in the XY direction of the chuck 10 detected by the laser length measurement system control device 40. In FIG. 1, when scanning the substrate 1 with the light beam from the light beam irradiation device 20, the main control device 70 controls the stage drive circuit 60 to move the chuck 10 in the X direction by the X stage 5. When moving the scanning area of the substrate 1, the main controller 70 controls the stage drive circuit 60 to move the chuck 10 in the Y direction by the Y stage 7. In FIG. 7, the center point coordinate determination unit 74 counts the pulse signals from the encoders 32 and 34, detects the amount of movement of the X stage 5 in the X direction and the amount of movement of the Y stage 7 in the Y direction, The XY coordinates of the center point of the chuck 10 are determined.

  The coordinate determination unit 75 determines the XY coordinates of the drawing data supplied to the DMD drive circuit 27 of each light beam irradiation device 20 based on the XY coordinates of the center point of the chuck 10 determined by the center point coordinate determination unit 74. The memory 72 inputs the XY coordinates determined by the coordinate determination unit 75 as an address, and outputs the drawing data stored at the input XY coordinate address to the DMD drive circuit 27 of each light beam irradiation apparatus 20.

  Hereinafter, an alignment film exposure method according to an embodiment of the present invention will be described. In FIG. 4, the light beam supplied from the first illumination optical system and the light beam supplied from the second illumination optical system enter the DMD 25 at different incident angles. The plurality of mirrors 25a of the DMD 25 are divided into two regions corresponding to each illumination optical system. FIG. 8 is a diagram showing a divided area of the DMD. In FIG. 8, a plurality of mirrors 25a of the DMD 25 are divided into two areas A and B. The area A is irradiated with the light beam supplied from the first illumination optical system, and the area B is The light beam supplied from the second illumination optical system is irradiated.

  FIG. 9 is a diagram illustrating an alignment film exposure method according to an embodiment of the present invention. This embodiment is an example of the case where the scanning direction of the substrate by the light beam does not affect the pretilt direction of the alignment characteristic imparted to the alignment film, depending on the pattern of exposure light, the nature of the alignment film applied to the substrate, etc. It is. In the case where the scanning direction of the substrate by the light beam does not affect the pretilt direction of the alignment characteristic imparted to the alignment film, the light beam irradiation device 20 uses the first illumination optical system and the second illumination optical system to correspond to the region corresponding to the DMD 25. Light beams having different incident angles are simultaneously supplied to A and B, respectively.

  In FIG. 9, the light beam supplied from the first illumination optical system to the corresponding region A of the DMD 25 is reflected by each mirror 25a in the region A, and is obliquely projected from the upper right to the projection lens 26a with respect to its optical axis. Incident obliquely. Then, the light beam that has passed through the projection lens 26 b is applied to the substrate 1 supported by the chuck 10 from the upper left side. The light beam supplied from the second illumination optical system to the corresponding region B of the DMD 25 is reflected by each mirror 25a in the region B, and obliquely from the upper left to the projection lens 26a with respect to the optical axis. Is incident on. Then, the light beam that has passed through the projection lens 26 b is applied to the substrate 1 supported by the chuck 10 from the upper right side. The exposure apparatus relatively moves the chuck 10 and the light beam irradiation device 20, and scans the substrate 1 in the scanning direction indicated by the arrow by the linearly polarized light beam irradiated obliquely from the light beam irradiation device 20.

  Since the substrate 1 is scanned with the linearly polarized light beam obliquely irradiated from the light beam irradiation device 20, the alignment characteristics applied to the alignment film applied to the substrate 1 are imparted with alignment characteristics that align the liquid crystal alignment direction. The drawing data supplied to the DMD driving circuit 27 that drives the 20 DMDs 25 can be changed to expose the alignment region having a desired position and a desired shape. Therefore, a plurality of different alignment regions can be formed in the alignment film on one substrate without using a mask.

  The light beam irradiation device 20 is provided with a plurality of illumination optical systems that supply light beams having different incident angles to the DMD 25, and the light beams having different incident angles supplied from the respective illumination optical systems are modulated by the DMD 25, respectively. Since the substrate 1 supported by the chuck 10 is irradiated with a plurality of light beams having different incident angles from the projection lens 26b, each alignment region is exposed when forming a plurality of different alignment regions on the alignment film on one substrate. There is no need to remove the substrate from the chuck each time and rotate the orientation of the substrate. Therefore, the tact time is shortened and the throughput is improved.

  Further, the plurality of mirrors 25a of the DMD 25 are divided into a plurality of regions corresponding to the respective illumination optical systems, and light beams having different incident angles are supplied from the respective illumination optical systems to the corresponding regions. A light beam having a different incident angle is simultaneously supplied to a region to be processed, and the light beam having a different incident angle is simultaneously modulated by a corresponding region of the DMD 25, so that the projection lens 26b and a different location on the substrate 1 supported by the chuck 10 are respectively modulated. Light beams with different incident angles can be irradiated simultaneously. Therefore, if the scanning direction of the substrate 1 by the light beam does not affect the pretilt direction of the alignment characteristic imparted to the alignment film according to the pattern of exposure light, the nature of the alignment film applied to the substrate 1, etc., one substrate A plurality of different alignment regions can be simultaneously formed in the upper alignment film.

  10 and 11 are views for explaining an alignment film exposure method according to another embodiment of the present invention. This embodiment is an example of the case where the scanning direction of the substrate by the light beam affects the pretilt direction of the alignment characteristic imparted to the alignment film depending on the pattern of exposure light, the nature of the alignment film applied to the substrate, etc. It is. When the scanning direction of the substrate by the light beam affects the pretilt direction of the alignment characteristic imparted to the alignment film, the light beam irradiation device 20 switches between the first illumination optical system and the second illumination optical system, and the DMD 25 Light beams having different incident angles are sequentially supplied to the corresponding regions A and B, respectively.

  In FIG. 10, the main controller 70 turns on the laser light source unit 21a and turns off the laser light source unit 21b. The light beam supplied from the first illumination optical system to the corresponding area A of the DMD 25 is reflected by each mirror 25a in the area A, and enters the projection lens 26a obliquely with respect to its optical axis from the upper right. To do. Then, the light beam that has passed through the projection lens 26 b is applied to the substrate 1 supported by the chuck 10 from the upper left side. The exposure apparatus relatively moves the chuck 10 and the light beam irradiation device 20, and scans the substrate 1 in the scanning direction indicated by the arrow by the linearly polarized light beam irradiated obliquely from the light beam irradiation device 20. At this time, when the pretilt direction is along the traveling direction of the exposure light according to the pattern of the exposure light, the nature of the alignment film applied to the substrate 1, etc., the pretilt direction is on the right side of the drawing in the alignment film of the substrate 1. Orientation characteristics are imparted. Further, when the pretilt direction is along the direction opposite to the traveling direction of the exposure light, the alignment film of the substrate 1 is given an alignment characteristic in which the pretilt direction is the left side of the drawing.

  In FIG. 11, main controller 70 turns laser light source unit 21a off and laser light source unit 21b on. The light beam supplied from the second illumination optical system to the corresponding region B of the DMD 25 is reflected by each mirror 25a in the region B, and enters the projection lens 26a obliquely with respect to its optical axis from the upper left. To do. Then, the light beam that has passed through the projection lens 26 b is applied to the substrate 1 supported by the chuck 10 from the upper right side. The exposure apparatus relatively moves the chuck 10 and the light beam irradiation device 20, and scans the substrate 1 in the scanning direction indicated by the arrow by the linearly polarized light beam irradiated obliquely from the light beam irradiation device 20. At this time, when the pretilt direction is along the traveling direction of the exposure light according to the pattern of the exposure light, the nature of the alignment film applied to the substrate 1, etc., the pretilt direction is on the left side of the drawing in the alignment film of the substrate 1. Orientation characteristics are imparted. Further, when the pretilt direction is along the direction opposite to the traveling direction of the exposure light, the alignment film of the substrate 1 is given an alignment characteristic with the pretilt direction on the right side of the drawing.

  The combination of the direction in which the light beam is applied to the substrate 1 and the scanning direction of the substrate 1 by the light beam is not limited to the example shown in FIGS. 10 and 11, and the pattern of exposure light and the orientation applied to the substrate 1. It is determined appropriately according to the properties of the film.

  The plurality of illumination optical systems of the light beam irradiation device 20 are switched to change the direction of the light beam applied to the substrate 1 supported by the chuck 10, to change the direction of the light beam, and to the chuck 10 and the light beam irradiation. In combination with the change in the direction of movement relative to the apparatus 20, the pretilt direction of the alignment characteristic imparted to the alignment film is changed, so according to the pattern of exposure light, the nature of the alignment film applied to the substrate, etc. When the scanning direction of the substrate 1 by the light beam affects the pretilt direction of the alignment characteristic imparted to the alignment film, the change of the direction of the light beam and the change of the relative movement direction of the chuck 10 and the light beam irradiation device 20 are performed. And a desired pretilt direction can be obtained.

  In the embodiment described above, two types of alignment region groups having different pretilt directions by 180 degrees are formed in the alignment film of the substrate. However, four types of alignment region groups having different pretilt directions by approximately 90 degrees are formed. In this case, after the substrate is scanned with the light beam as shown in FIG. 9 or 10 and 11, the substrate is rotated by approximately 90 degrees and then again shown in FIG. The substrate may be scanned with a light beam as shown in FIG.

  FIG. 12 is a diagram showing a schematic configuration of a light beam irradiation apparatus according to still another embodiment of the present invention. FIG. 13 is a top view of a light beam irradiation apparatus according to still another embodiment of the present invention. The light beam irradiation apparatus 20 ′ of this embodiment has four illumination optical systems that supply a light beam to the DMD. Each illumination optical system includes an optical fiber 22, a lens 23, a mirror 24, and a polarizer 28. The mirror 24 and the polarizer 28 are shared by each illumination optical system.

  The four illumination optical systems are arranged in the vertical direction of FIG. 12 and two in the depth direction of FIG. 12, and FIG. 12 shows two illumination optical systems on the front side of the drawing. FIG. 13 shows two illumination optical systems on the upper side of FIG. The optical fiber 22 of each illumination optical system introduces an ultraviolet light beam generated from each laser light source unit 21 into the light beam irradiation device 20 '. The light beam emitted from each optical fiber 22 passes through each lens 23, then passes through the polarizer 28, becomes linearly polarized light, is reflected by the mirror 24, and is applied to the DMD 25. Each illumination optical system supplies light beams having different incident angles to the DMD 25 as shown in FIGS.

  The plurality of mirrors 25a of the DMD 25 are divided into four regions corresponding to each illumination optical system. FIG. 14 is a diagram showing a divided area of the DMD. In FIG. 14, a plurality of mirrors 25a of the DMD 25 are divided into four regions indicated by broken lines, and the light beam reflected by each mirror 25a in each region passes through the projection lenses 26a and 26b, and then the chuck 10 As shown by the arrows, the substrate 1 supported on the substrate 1 is irradiated obliquely in different directions by about 90 degrees.

  FIG. 15 is a diagram for explaining an alignment film exposure method according to still another embodiment of the present invention. This embodiment is an example of the case where the scanning direction of the substrate by the light beam does not affect the pretilt direction of the alignment characteristic imparted to the alignment film, depending on the pattern of exposure light, the nature of the alignment film applied to the substrate, etc. It is. When the scanning direction of the substrate by the light beam does not affect the pretilt direction of the alignment characteristic imparted to the alignment film, the light beam irradiating device 20 ′ has different incident angles of light from each illumination optical system to the corresponding region of the DMD 25. Supply beams simultaneously. The exposure apparatus relatively moves the chuck 10 and the light beam irradiation apparatus 20 ′, and scans the substrate 1 in the scanning direction indicated by the arrow by the linearly polarized light beam irradiated obliquely from the light beam irradiation apparatus 20 ′. .

  The light beam irradiation device 20 ′ is provided with four illumination optical systems for supplying light beams with different incident angles to the DMD 25, and the plurality of mirrors 25a of the DMD 25 are divided into four regions corresponding to the respective illumination optical systems, A substrate 1 supported on the chuck 10 from the projection lens 26b by simultaneously supplying light beams of different incident angles from the illumination optical system to the corresponding regions, and simultaneously modulating the light beams of different incident angles by the corresponding regions of the DMD 25. Since four light beams having different incident angles are irradiated, four different alignment regions can be simultaneously formed on the alignment film on one substrate.

  In the embodiment described above, the pretilt direction is parallel to the long side or short side of the substrate. However, as a characteristic of the display panel, the pretilt direction is inclined with respect to the long side or short side of the substrate. If necessary, a desired pretilt direction can be obtained by scanning the substrate with a light beam while rotating the substrate with respect to the XY directions.

  According to the embodiment described above, the alignment direction of the liquid crystal is applied to the alignment film applied to the substrate 1 by scanning the substrate 1 with the linearly polarized light beam obliquely irradiated from the light beam irradiation devices 20, 20 ′. By providing the alignment characteristics for adjusting the image, the drawing data supplied to the DMD driving circuit 27 for driving the DMD 25 of the light beam irradiation devices 20 and 20 ′ is changed to expose the alignment region having a desired position and a desired shape. be able to. Therefore, a plurality of different alignment regions can be formed in the alignment film on one substrate without using a mask.

  A plurality of illumination optical systems for supplying light beams with different incident angles to the DMD 25 are provided in the light beam irradiation devices 20 and 20 ', and the light beams with different incident angles supplied from the respective illumination optical systems are modulated by the DMD 25, respectively. When a plurality of different alignment regions are formed on the alignment film on one substrate by irradiating the substrate 1 supported by the chuck 10 from the projection lens 26b with a plurality of light beams having different incident angles, And throughput can be improved.

  Furthermore, according to the embodiment shown in FIGS. 9 and 15, the plurality of mirrors 25a of the DMD 25 are divided into a plurality of regions corresponding to the respective illumination optical systems, and different incidents are made from the respective illumination optical systems to the corresponding regions. By supplying a light beam of an angle, the scanning direction of the substrate 1 by the light beam is changed to the pretilt direction of the alignment characteristic imparted to the alignment film according to the pattern of the exposure light, the properties of the alignment film applied to the substrate, and the like. When not affected, a plurality of different alignment regions can be simultaneously formed in the alignment film on one substrate.

  Further, according to the embodiment shown in FIGS. 10 and 11, the direction of the light beam irradiated to the substrate 1 supported by the chuck 10 is changed by switching the plurality of illumination optical systems of the light beam irradiation device 20. In addition, by combining the change of the direction of the light beam and the change of the relative movement direction of the chuck 10 and the light beam irradiation device 20, the exposure is performed by changing the pretilt direction of the alignment characteristic imparted to the alignment film. Changing the direction of the light beam when the scanning direction of the substrate 1 by the light beam affects the pretilt direction of the alignment characteristic imparted to the alignment film, depending on the light pattern, the nature of the alignment film applied to the substrate 1, etc. A desired pretilt direction can be obtained by combining the change of the relative movement direction between the chuck 10 and the light beam irradiation device 20.

DESCRIPTION OF SYMBOLS 1 Board | substrate 3 Base 4 X guide 5 X stage 6 Y guide 7 Y stage 8 θ stage 10 Chuck 11 Gate 20, 20 'Light beam irradiation apparatus 20a Head part 21,21a, 21b Laser light source unit 22,22a, 22b Optical fiber 23, 23a, 23b Lens 24 Mirror 25 DMD (Digital Micromirror Device)
26a, 26b Projection lens 27 DMD drive circuit 28 Polarizer 29 Prism 31, 33 Linear scale 32, 34 Encoder 40 Laser measurement system controller 41 Laser light source 42, 44 Laser interferometer 43, 45 Bar mirror 60 Stage drive circuit 70 Main control Device 71 Drawing control unit 72 Memory 73 Bandwidth setting unit 74 Center point coordinate determination unit 75 Coordinate determination unit

Claims (6)

A chuck for supporting the substrate;
It is modulated by a spatial light modulator that modulates the light beam by changing the angle of a plurality of mirrors arranged in two directions, a drive circuit that drives the spatial light modulator based on drawing data, and a spatial light modulator. A light beam irradiation device that irradiates a linearly polarized light beam obliquely from the irradiation optical system to the substrate supported by the chuck;
A moving means for relatively moving the chuck and the light beam irradiation device;
An alignment film applied to the substrate by relatively moving the chuck and the light beam irradiation device by the moving means, scanning the substrate with a linearly polarized light beam obliquely irradiated from the light beam irradiation device. An alignment film exposure apparatus that imparts alignment characteristics to align the liquid crystal alignment direction to
The light beam irradiation apparatus includes a plurality of illumination optical systems that supply light beams having different incident angles to the spatial light modulator, and the light beams having different incident angles supplied from the respective illumination optical systems are spatial light. An alignment film exposure apparatus characterized by irradiating a plurality of light beams having different incident angles from an irradiation optical system onto a substrate supported by the chuck, each modulated by a modulator.   The light beam irradiation apparatus divides a plurality of mirrors of the spatial light modulator into a plurality of regions corresponding to the respective illumination optical systems, and supplies light beams having different incident angles from the respective illumination optical systems to the corresponding regions. The alignment film exposure apparatus according to claim 1, wherein:   Switching a plurality of illumination optical systems of the light beam irradiation device to change the direction of the light beam irradiated to the substrate supported by the chuck, and changing the direction of the light beam, and the chuck by the moving means 3. The alignment film according to claim 1, wherein a pretilt direction of an alignment characteristic imparted to the alignment film is changed in combination with a change in a moving direction relative to the light beam irradiation apparatus. Exposure device. Support the substrate with a chuck,
A spatial light modulator that modulates a light beam by changing the angles of a chuck and a plurality of mirrors arranged in two directions, a drive circuit that drives the spatial light modulator based on drawing data, and a spatial light modulator A light beam irradiation device that irradiates a linearly polarized light beam obliquely from the irradiation optical system to the substrate supported by the chuck, and relatively moves the irradiation optical system that irradiates the light beam modulated by
An alignment film exposure method for imparting alignment characteristics to align an alignment direction of liquid crystals on an alignment film applied to the substrate by scanning the substrate with a linearly polarized light beam obliquely irradiated from a light beam irradiation device,
The light beam irradiation device is provided with a plurality of illumination optical systems for supplying light beams having different incident angles to the spatial light modulator, and the light beams having different incident angles supplied from the respective illumination optical systems are provided by the spatial light modulator. An alignment film exposure method comprising: modulating each of the light beams and irradiating a substrate supported by the chuck with a plurality of light beams having different incident angles.   The plurality of mirrors of the spatial light modulator are divided into a plurality of regions corresponding to the respective illumination optical systems, and light beams having different incident angles are supplied from the respective illumination optical systems to the corresponding regions. 5. An exposure method for an alignment film according to 4.   By switching the plurality of illumination optical systems of the light beam irradiation device, the direction of the light beam irradiated to the substrate supported by the chuck is changed, the direction of the light beam is changed, and the relative relationship between the chuck and the light beam irradiation device is changed. 6. The alignment film exposure method according to claim 4, wherein the pretilt direction of the alignment characteristic imparted to the alignment film is changed in combination with a change in the moving direction.

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