JP2002350484A - Circuit board sucker and circuit board inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a circuit board sucker capable of sucking and holding a circuit board without causing puckers or deflections even when the circuit board is thin. SOLUTION: The circuit board sucker 1 is provided with a circuit mounting block 11 provided with a box like case 11a with one opened face and a mounting plate 11b attached to an opening portion of the case 11a and formed with a plurality of suction holes IH, IH, etc., in a mounting area of the circuit board P, and a sucking means sucking air of an interior S of the case 11a. Suction hole communicating mechanisms 11a and 11LO are provided communicating the plurality of suction holes IH, IH, etc., with the interior S of the case 11a during suction by the sucking means, and the suction hole communicating mechanisms 11a and 11LO sequentially communicates the suction holes IH from those positioned in a one predetermined portion in the mounting area.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board suction device provided with a suction type substrate mounting table, and a circuit board inspection device configured using the circuit board suction device.

[0002]

2. Description of the Related Art FIG.
A circuit board suction device 51 used in a circuit board inspection device 61 shown in FIG. 5 is conventionally known. The circuit board suction device 51 includes a suction-type substrate mounting table 52 and a suction unit (for example, an air pump) (not shown).
Is held on the substrate mounting table 52 by suction.
In this case, the substrate mounting table 52 has a box-shaped case 11a with an open upper surface, and is mounted on the upper surface opening of the case 11a, and a plurality of suction holes IH are formed in the mounting area of the circuit board P. It comprises a mounting plate 52b and a flat porous insulating sheet 11c attached to the upper surface of the mounting plate 52b. Further, an internal space S of the substrate mounting table 52 formed by being surrounded by the case 11a and the mounting plate 52b is connected to an air pump via a suction port OH provided in the case 11a.

The circuit board inspection device 61 includes a circuit board suction device 51, inspection probes 4 attached to a moving mechanism (not shown) via probe fixing members 4a, 4a, a circuit board suction device 51, and a moving device. A control unit (not shown) that executes the operation control of the mechanism and the inspection process via the inspection probes 4 and 4 and a storage unit that temporarily stores the calculation result of the control unit and the inspection reference data absorbed from the non-defective substrate. And a ROM (not shown) for storing an operation program of the control unit.

When inspecting the circuit board P using the circuit board inspection apparatus 61, first, the circuit board P is placed on the porous insulating sheet 11c so as to be located within the placement area of the placement plate 52b. I do. Next, according to the control of the control unit,
The air pump sucks the air in the internal space S of the substrate mounting table 52 through the suction port OH. Accordingly, air taken into the internal space S through the porous insulating sheet 11c and the suction holes IH formed in the mounting plate 52b is discharged to the outside of the internal space S through the suction port OH. . In this case, since a part of the surface of the porous insulating sheet 11c is closed by the circuit board P mounted on the porous insulating sheet 11c, the amount of air exhausted is smaller than the amount of air taken into the internal space S. As a result, the inside of the internal space S becomes negative pressure. Therefore, the circuit board P mounted on the porous insulating sheet 11c is suction-held at a predetermined inspection position on the substrate mounting table 52 (specifically, the porous insulating sheet 11c). Next, the moving mechanism, under the control of the control unit,
The inspection probes 4 and 4 are respectively moved above conductor patterns (not shown) to be inspected formed on the surface of the circuit board P. Subsequently, the control unit drives the moving mechanism to move the probe fixtures 4a, 4a downward, thereby obtaining the signals shown in FIG.
As shown in FIG. 5, the tips of the inspection probes 4 and 4 are brought into contact with the conductor pattern. In this state, the control unit sequentially outputs a predetermined inspection signal to the conductor pattern via the inspection probes 4 and 4, for example, between both end points of the conductor pattern,
Alternatively, electrical characteristic data such as a resistance value between a pair of conductor patterns is measured. After that, the control unit compares the measured electrical characteristic data with the inspection reference data read from the RAM, and inspects whether there is a disconnection of the conductor pattern or short-circuit between the conductor patterns. By performing this electrical inspection sequentially on all the conductor patterns to be inspected, the quality of the circuit board P is determined.

[0005]

However, the conventional circuit board suction device 51 and the circuit board inspection device 61 using the same have the following problems. That is, in the conventional circuit board suction device 51 and the circuit board inspection device 61, when the air pump starts operating, air is simultaneously taken into the internal space S from all the suction holes IH formed in the mounting plate 52b. ing. As a result, the entire surface of the circuit board P is instantaneously adsorbed to the porous insulating sheet 52c, and as a result, when inspecting the thin circuit board P, the circuit board P is likely to be wrinkled or bent. is there.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to provide a circuit board suction device capable of sucking and holding a circuit board without causing wrinkles or bending even with a thin circuit board. The main purpose is. Another object of the present invention is to provide a circuit board inspection apparatus using the same.

[0007]

In order to achieve the above object, a circuit board suction device according to the first aspect of the present invention has a box-shaped case having an open surface, and is mounted on an opening portion of the case and has a circuit board. A circuit board suction device, comprising: a substrate mounting table provided with a mounting plate having a plurality of suction holes formed in a mounting area; and suction means for sucking air inside the case. A suction hole communication mechanism for communicating the plurality of suction holes with the inside of the case at the time of suction by the suction hole communication mechanism, and the suction hole communication mechanism sequentially communicates with the suction holes located at one predetermined portion in the placement area. It is characterized by the following.

According to a second aspect of the present invention, in the circuit board attraction device according to the first aspect, the one predetermined portion is one peripheral portion in the placement region.

According to a third aspect of the present invention, in the circuit board attraction device according to the first aspect, the one predetermined portion is a central portion in the placement area.

According to a fourth aspect of the present invention, there is provided the circuit board suction device according to any one of the first to third aspects, wherein the mounting plate is a lower mounting plate mounted on the opening of the case. And an upper mounting plate slidably disposed on the upper surface of the lower mounting plate with respect to the lower mounting plate, and one of the lower mounting plate and the upper mounting plate includes
A plurality of first suction holes are formed at a predetermined pitch, and one of the lower mounting plate and the upper mounting plate has a length from an end facing the first suction hole to an end on a predetermined direction side. A plurality of elongated second suction holes are formed so as to be closer to the one predetermined site side, and each of the suction holes is a pair of the first suction hole and the second suction hole which can communicate with each other. The suction hole communication mechanism is configured to move the lower mounting plate relative to the upper mounting plate in the predetermined direction so that the first suction hole and the second suction hole communicate with each other. It is characterized by comprising means.

According to a fifth aspect of the present invention, there is provided a circuit board inspection apparatus for performing a circuit board inspection on a circuit board sucked and held by the circuit board suction apparatus according to any one of the first to fourth aspects. And a control unit.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a circuit board suction device and a circuit board inspection device according to the present invention will be described below with reference to the accompanying drawings. Note that the same components as those of the conventional circuit board suction device 51 and the circuit board inspection device 61 and the circuit board P to be inspected are denoted by the same reference numerals, and redundant description will be omitted.

First, the configurations of the circuit board inspection apparatus 1 and the circuit board suction apparatus 2 according to the present invention will be described with reference to the drawings.

As shown in FIG. 1, a circuit board inspection apparatus 1
Is provided with a circuit board suction device 2, moving mechanisms 3 and 3, inspection probes 4 and 4, a control unit 5, a RAM 6 and a ROM 7. In this case, the probes 3 and 4 are attached to the moving mechanisms 3 and 3 via the probe fixtures 4a and 4a, respectively (see FIG. 2). Control unit 5
Controls the operation of the circuit board suction device 2 and the moving mechanisms 3 and 3;
And an inspection process using the inspection probes 4 and 4. The RAM 6 temporarily stores the calculation result of the control unit 5 and the inspection reference data absorbed from the non-defective substrate. RO
M7 stores an operation program of the control unit 5.

As shown in FIG. 1, the circuit board suction device 2 includes, for example, a suction type substrate mounting table 11, an air pump 12 as suction means, and an air cylinder forming drive means for a suction hole communication mechanism in the present invention. 13
The circuit board P is sucked and held on the board mounting table 11.

As shown in FIG. 2, the substrate mounting table 11 has a box-shaped case 11a having an open upper surface (one surface), and is mounted on an open portion of the upper surface of the case 11a. (See FIG. 3) A mounting plate 11b in which a plurality of suction holes IH are formed at a predetermined pitch (in the form of a matrix, for example), and a flat porous insulating sheet attached to the upper surface of the mounting plate 11b 11c. Further, the substrate mounting table 11 has an internal space S formed therein, and the internal space S is communicated with the air pump 12 via a suction port OH.

In this case, the case 11a is moved by a guide mechanism (not shown) in a predetermined direction (as an example, a row direction in a plurality of suction holes IH arranged in a matrix (direction of an arrow A in FIGS. 2 and 3)). ) Is supported so as to be able to move linearly. The mounting plate 11b is provided with a lower mounting plate 11LO mounted on the upper opening of the case 11a, and a lower mounting plate 11LO slidably relatively to the lower mounting plate 11LO.
And an upper mounting plate 11UP disposed on the upper surface of the upper mounting plate 11UP. Specifically, the upper mounting plate 11UP has a porous insulating sheet 11c mounted on its upper surface, and is held at a predetermined position by a holding mechanism (not shown). As shown in FIG. 3, a plurality of first suction holes IH1 forming the suction holes IH are formed in the mounting region R in a matrix at a predetermined pitch in the upper mounting plate 11UP. In this case, each first
The suction holes IH1 are formed, for example, to have the same shape in plan view (a circle as an example). Although a large number of first suction holes IH1 and second suction holes IH2 to be described later are formed, in order to facilitate understanding, FIGS. 3 to 13 and FIGS. It is assumed that nine pieces are formed in a matrix of
In FIG. 19, as an example, 2 × 5
Description will be made assuming that five are formed.

On the other hand, the lower mounting plate 11LO has a case 11a,
Together with the air pump 12, the suction hole communication mechanism of the present invention is constituted. The lower mounting plate 11LO is mounted on the case 11a in a state where the lower peripheral edge of the lower mounting plate 11LO is in close contact with the edge of the case 11a, and is moved together with the case 11a by the guide mechanism. Also, the lower mounting plate 11LO has
As shown in the figure, the suction hole IH is combined with the first suction hole IH1.
Are formed in a matrix. In this case, each of the second suction holes IH2, IH2,... Is formed at a position where the left end thereof can be opposed to the corresponding first suction hole IH1. Each second suction hole IH2 located on the right side of the lower mounting plate 11LO.
Is formed in a long hole shape extending from its left end in the right direction (the direction of the arrow A in the figure where the case 11a moves when sucked by the air pump 12, the predetermined direction side in the present invention). In this case, the hole length of the second suction hole IH2 located at the rightmost row portion (one predetermined portion) in the figure is the longest, and as the distance from the rightmost row portion increases (toward the left), the hole length increases. Is formed so as to be gradually shortened, and the second suction hole IH2 located at the leftmost column in FIG. Further, the second suction hole IH2 having the longest hole length is formed to have a hole length shorter than the row pitch of the first suction holes IH1, and as shown in FIG. 5, the lower mounting plate 11LO is in the initial position (in FIG. (Leftmost position), it is located between the first suction hole IH1 in the rightmost row and the first suction hole IH1 in the middle row in FIG. It is configured not to communicate with both.

Next, the operation of the circuit board inspection apparatus 1 when inspecting the circuit board P will be described with reference to the drawings.

First, the control unit 5 drives the air cylinder 13 to move the case 11a to the initial position. In addition,
In the state where the case 11a has already moved to the initial position,
The control by the control unit 5 becomes unnecessary. In this state,
As shown in FIG. 5, all the second suction holes IH2 are located on the left side of the corresponding first suction holes IH1, so that all the suction holes IH are moved from the upper surface of the upper mounting plate 11UP to the lower surface of the lower mounting plate 11LO. It is kept in a closed state that does not communicate with it. Next, the control unit 5 drives the air pump 12 to suck out the air in the internal space S of the substrate mounting table 11. Thus, the internal space S of the substrate mounting table 11 is maintained at a negative pressure with respect to the atmospheric pressure.

Next, the circuit board P to be inspected is mounted in the mounting area R on the substrate mounting table 11. Next, the control unit 5
Drives the air cylinder 13 to move the case 11a in a predetermined direction (the right direction of the arrow A in FIG. 5).
At this time, the lower mounting plate 11LO moves while sliding in the direction of arrow A with respect to the upper mounting plate 11UP according to the movement of the case 11a. In this case, first, as shown in FIG. 6, the first suction holes IH indicated by oblique lines formed in one predetermined portion (rightmost column).
1 are opposed to the corresponding second suction holes IH2 (the second suction holes IH2 in the rightmost row) and communicate with each other. As a result, the rightmost row of suction holes IH is formed to communicate with each other, and the upper surface of the upper mounting plate 11UP and the internal space S communicate with each other via the suction holes IH. As a result, the right side portion (the end portion in the direction of arrow A) of the circuit board P is suctioned to the upper mounting plate 11UP via the porous insulating sheet 11c. Next, when the case 11a is further moved, as shown in FIG. 7, the first suction holes IH1 formed in the middle row and indicated by the oblique lines also move to the corresponding second suction holes IH2 (the second suction holes in the middle row). IH2) and communicate with each other. As a result, the suction holes IH in the intermediate row are formed to communicate with each other, and the upper surface of the upper mounting plate 11UP and the internal space S communicate with each other through the suction holes IH. Thereby, the circuit board P
Is a porous insulating sheet 1 whose right and middle portions are
It is adsorbed on the upper mounting plate 11UP via 1c. in this case,
When the circuit board P is formed to be thin, unlike the case where the entire surface of the circuit board P is temporarily sucked, the circuit board P is moved from one predetermined portion (rightmost column) side to the opposite side to the moving direction of the circuit board P (arrow). (The left end side opposite to A), and the separation distance between the suction hole IH that has just communicated and the suction hole IH that has newly communicated is short, so that wrinkles and bending do not occur. Adsorbed.

Thereafter, when the case 11a further moves, as shown in FIG. 8, in addition to the first suction holes IH1 formed in the rightmost and middle rows, the oblique lines formed in the leftmost row. The first suction hole IH1 shown by
2 (the leftmost second suction hole IH2) and communicate with each other. As a result, all the suction holes IH are formed in communication,
The upper surface side of the upper mounting plate 11UP communicates with the internal space S via each suction hole IH. As a result, the circuit board P is attracted to the upper mounting plate 11UP over the entire surface. In other words, the circuit board P mounted on the substrate mounting table 11 is sequentially sucked to the substrate mounting table 11 from one predetermined portion side to the left end, and finally the entire surface is suctioned, and Will be retained. Subsequently, the control unit 5 stops driving the air cylinder 13 and stops moving the case 11a.

Next, the control unit 5 drives the moving mechanisms 3 and 3 to move the inspection probes 4 and 4 above the conductor patterns (not shown) formed on the circuit board P to be inspected. Let it. Subsequently, the control unit 5 drives the moving mechanisms 3 and 3 to move the inspection probes 4 and 4 downward, so that the tips of the inspection probes 4 and 4 are formed into a conductor pattern as shown in FIG. Make contact. Next, the control unit 5
Is to sequentially output a predetermined inspection signal to the conductor pattern via one inspection probe 4 and to input the inspection signal via the other inspection probe 4 so that the circuit board P
Measure the electrical characteristic data for. Next, the control unit 5 compares the measured electrical characteristic data with the inspection reference data read from the RAM 6 to check for a disconnection or short circuit between the conductor patterns. By performing this electrical inspection sequentially on all the conductor patterns to be inspected, the quality of the circuit board P is determined.
Subsequently, after determining the quality of the circuit board P, the control unit 5
The circuit board P is returned to the initial position by driving the air cylinder 13 to move the case 11a in the direction opposite to the direction of the arrow A. In this state, all the suction holes IH
Is kept closed because the first suction hole IH1 and the second suction hole IH2 are not in communication. Therefore, the suction operation of the circuit board P by the circuit board suction device 2 is released. Thereafter, the inspected circuit board P is removed from the circuit board suction device 2, and a new circuit board P is mounted.

As described above, according to the circuit board inspection apparatus 1, the circuit board P mounted on the board mounting table 11 is moved to one predetermined portion side (the moving direction (A direction) of the case 11a by the guide mechanism). Of the circuit board P from the front end of the case 11a in the direction opposite to the direction of movement (A direction) of the case 11a, and the entire surface of the circuit board P is successively sucked onto the board mounting table 11, and finally the entire surface is sucked onto the board mounting table 11. , The thin circuit board P
Can be surely adsorbed without causing wrinkles or bending on the circuit board P. Further, when the porous insulating sheet 11c is formed by using a thin paper or cloth, the generation of wrinkles in the porous insulating sheet 11c can be avoided. As a result, it is possible to sufficiently improve the reliability of the blowing with the inspection probe 4 on the circuit board P and the reliability of the final inspection.

It should be noted that the present invention is not limited to the configuration shown in the above embodiment of the present invention. For example, the lower mounting plate 1
The lower mounting plate 21LO shown in FIG. 9 may be employed instead of 1LO, and the mounting plate 21b (see FIG. 2) may be configured together with the upper mounting plate 11UP. The lower mounting plate 21LO has a first suction hole I
A third suction hole IH3 which forms a suction hole IH together with H1 is formed. The third suction hole IH3 is connected to the second suction hole IH2.
Similarly, as shown in FIG. 13, the left end is the first
It is formed at a position facing the suction hole IH1. Also,
The third suction hole IH3 located on the right side is formed in a long hole shape extending rightward from the left end (in the figure, the direction of arrow A in which the case 11a moves). In this case, the third
The suction hole IH3 is formed such that the hole length becomes longer as it is located at one predetermined portion (upper right corner portion in the figure), and the hole length becomes gradually shorter as it goes away from the one predetermined portion.
Further, the third suction holes IH3 located in the leftmost column and the bottom row
Are formed in a substantially circular shape. In addition, the third suction hole IH3, which is located at one predetermined portion and has the longest hole length, is formed to be shorter than the row pitch of the first suction holes IH1, and the lower mounting plate 11LO has moved to the initial position. At this time, the first suction holes IH1 and IH1 are located between the first suction holes IH1 located on the uppermost row of the rightmost column and the first suction holes IH1 located on the uppermost row of the intermediate column in FIG. It is configured not to communicate with both.

The substrate mounting table 21 having the mounting plate 21b
Under the control of the control unit 5, the air cylinder 13 is moved from the initial position shown in FIG. 10 in a state where all the third suction holes IH3 do not face the corresponding first suction holes IH1 to the case 11.
a is gradually and linearly moved in a predetermined direction (to the right as indicated by arrow A in FIG. 9). At this time, first, as shown in FIG. 11, the third suction hole IH3 located at one predetermined site
Communicates with the corresponding first suction holes IH1 indicated by oblique lines.
As a result, the suction hole IH located at one predetermined portion is opened, and the upper surface of the upper mounting plate 11UP and the internal space S communicate with each other through the suction hole IH. Then, the case 11a
When the is further moved, as shown in FIGS. 12 and 13, the suction holes IH in the open state sequentially spread around the periphery of the mounting region R around the suction holes IH located at one predetermined site. And finally, all the suction holes IH are opened. Therefore, similarly to the board mounting table 11, when the thin circuit board P is sucked and held, the circuit board P can be sucked without causing wrinkles or bending. FIGS. 10 to 13 show only the first suction hole IH1 formed in the upper mounting plate 11UP and the third suction hole IH3 formed in the lower mounting plate 21LO for easy understanding.

Further, the upper mounting plate 31UP shown in FIG. 14 is used instead of the upper mounting plate 11UP, and the lower mounting plate 31LO shown in FIG. 15 is used instead of the lower mounting plate 11LO.
b can also be configured. In this upper mounting plate 31UP,
First suction holes IH1 similar to the upper mounting plate 11UP are formed in a matrix (5 × 5). On the other hand, the lower mounting plate 3
In one LO, a fourth suction hole IH4 is formed in a matrix (5 ×
5) is formed. In this case, the fourth suction hole IH4
In the same manner as the second suction hole IH2, as shown in FIG. 19, its left end is formed at a position that can face the first suction hole IH1. The fourth suction hole IH4 located at the center is formed in a long hole shape extending rightward from the left end (in the direction of arrow A in which the case 11a moves in FIG. 15). In this case, the fourth suction hole IH4 has a longer hole length as it is located at one predetermined portion (the center portion in FIG. 15), and becomes farther away from the one predetermined portion (that is, toward the periphery of the lower mounting plate 31LO). The hole length is formed so as to be gradually shortened. Also, the lower mounting plate 31
The fourth suction hole IH4 located at the periphery of the LO is formed in a substantially circular shape. As shown in FIG. 16, the fourth suction hole IH4, which is located at one predetermined position and has the longest hole length, is formed to have a hole length shorter than the row pitch of the first suction holes IH1. When 31 LO moves to the initial position, FIG.
Are located between the first suction holes IH1 in the second row from the left and the first suction holes IH1 in the third row from the left.
It is configured not to communicate with both of the suction holes IH1 and IH1.

The substrate mounting table 31 having the mounting plate 31b
Under the control of the controller 5, the air cylinder 13 is moved from the initial position shown in FIG. 16 in a state where all the fourth suction holes IH4 do not face the corresponding first suction holes IH1 to the case 11 as shown in FIG.
a in a predetermined direction (right direction indicated by arrow A in FIG. 15)
Move it gradually and linearly. At this time, first, FIG.
As shown in the figure, the fourth suction holes IH4 located at one predetermined portion (central portion) correspond to the corresponding first suction holes IH indicated by oblique lines.
Communicate with 1. As a result, the suction hole IH located at one predetermined portion is opened, and the upper surface of the upper mounting plate 11UP and the internal space S communicate with each other through the suction hole IH. After that, when the case 11a is further moved, FIG.
As shown in FIG. 19, the number of the suction holes IH that are in the open state increases while gradually expanding around the suction hole IH located at one predetermined portion around the periphery of the mounting region R, and finally all the suction holes IH Is opened. Therefore, even when the thin circuit board P is sucked and held, the circuit board P can be sucked without causing wrinkles or bending. 16 to FIG.
In FIG. 9, only the first suction hole IH1 formed in the upper mounting plate 31UP and the fourth suction hole IH4 formed in the lower mounting plate 31LO are illustrated for easy understanding.

Further, a lower mounting plate 41LO shown in FIG. 20 may be employed in place of the lower mounting plate 11LO to form the mounting plate 41b together with the upper mounting plate 11UP. This lower mounting plate 41
In the LO, a fifth suction hole IH5 constituting the suction hole IH together with the first suction hole IH1 is formed in a matrix (3 × 3). In this case, as shown in FIG. 24, the fifth suction hole IH5 is formed at a position where the left end thereof can face the first suction hole IH1. Further, the fourth suction hole IH4 located on the upper right side in the figure is formed in a long hole shape extending from the left end in a predetermined direction (the moving direction of the case 11a (the direction of arrow B in FIG. 20)). I have. In this case, the fifth suction hole IH5 has a longer hole length as it is located at one predetermined portion (upper right corner portion in FIG. 20), and becomes farther from the one predetermined portion (that is, toward the lower left edge of the lower mounting plate 41LO). (According to the following). Further, the fifth suction holes IH5 located in the leftmost column and the lowermost row of the lower mounting plate 41LO are formed in a substantially circular shape. On the other hand, the mounting plate 41b is
As a result, it is moved together with the case 11a in a circular arc direction indicated by an arrow B around a predetermined center point CP (in FIG. 20, located in the upper right direction outside the lower mounting plate 41LO). For this reason, the fifth suction hole IH5 is formed to extend in an arc shape. As shown in FIG. 21, when the lower mounting plate 41LO moves to the initial position, the fourth suction hole IH4, which is located at one predetermined portion and has the longest hole length, is moved to the rightmost column in FIG. Is located diagonally upper left with respect to the first suction hole IH1 so as not to communicate with the first suction hole IH1.

The substrate mounting table 41 provided with the mounting plate 41b
Under the control of the control unit 5, the air cylinder 13 is moved from the initial position shown in FIG. 21 in a state where all the fifth suction holes IH5 are not opposed to the corresponding first suction holes IH1.
a is gradually moved in an arc shape in a predetermined direction (a lower right direction indicated by an arrow B in FIG. 20). At this time, first, as shown in FIG. 22, the fifth suction hole IH5 located at one predetermined portion (upper right corner portion) communicates with the corresponding first suction hole IH1 indicated by oblique lines. As a result, the suction hole IH located at one predetermined portion is opened, and the upper surface of the upper mounting plate 11UP and the internal space S communicate with each other through the suction hole IH.
After that, when the case 11a is further moved in an arc, as shown in FIGS.
With the suction hole IH located at one predetermined portion as the center, the diameter of the suction hole IH gradually increases and gradually increases along the periphery of the mounting region R, and finally all the suction holes IH are opened. Therefore, even when the thin circuit board P is sucked and held, the circuit board P can be sucked without wrinkling or bending. Note that FIG.
24 to 24 illustrate only the first suction hole IH1 formed in the upper mounting plate 11UP and the fifth suction hole IH5 formed in the lower mounting plate 41LO for easy understanding.

Further, in each of the above-described embodiments, the suction holes IH are sequentially opened one by one and one row (or two rows and two rows) from the suction hole IH located at one predetermined portion. For example, in the case where the suction holes IH are formed in a matrix composed of a large number of rows and columns, the configuration is such that the state is simultaneously changed from the closed state to the open state in units exceeding two columns and two rows. Can also be adopted. In addition, the arrangement of the suction holes IH can be arbitrarily arranged, for example, in a staggered arrangement instead of a matrix. Also, a configuration in which a first suction hole is formed in the lower mounting plate and a long hole (second suction hole) is formed in the upper mounting plate may be adopted. However, in the configuration in which the long hole is formed in the upper mounting plate, it is preferable that the long hole is formed in the lower mounting plate because the porous insulating sheet 11c may be sucked into the long hole. Further, it is also possible to adopt a configuration in which the suction force of the air pump 12 is gradually increased as the number of the suction holes IH to be opened increases. Further, the first suction hole IH
The shape in plan view is not limited to a circle, but can be formed into various shapes such as a polygon and an ellipse. Further, the shapes of the first suction holes IH1 need not be the same in plan view, but may be different. In the case of adopting this configuration, the second suction hole IH1 is formed so as to conform to the shape of the first suction hole IH1.
The shape of the suction hole IH2 may be specified. Case 1
A configuration in which 1a is fixed and the upper mounting plates 11UP and 31UP are moved by being driven by the air cylinder 13 may be adopted. Further, an electric motor can be used as the driving means 13 instead of the air cylinder 13.

[0032]

As described above, according to the circuit board suction device of the first to third aspects, the suction hole communication mechanism sequentially communicates with the plurality of suction holes from the suction hole located at one predetermined position. Thereby, the circuit board mounted on the substrate mounting table is sequentially attracted to the substrate mounting table from one predetermined site side,
Finally, the entire surface can be sucked and held on the substrate mounting table. Therefore, even when a thin circuit board is sucked and held, it is possible to surely hold the circuit board without wrinkling or bending while maintaining the flatness of the circuit board.

According to the circuit board suction device of the fourth aspect, the mounting plate is constituted by the lower mounting plate mounted on the opening of the case and the upper mounting plate disposed on the upper surface of the lower mounting plate. ,
A plurality of first suction holes are formed in one of the lower mounting plate and the upper mounting plate, and the other of the lower mounting plate and the upper mounting plate is provided with a suction hole in communication with the first suction hole. A plurality of elongated second suction holes that can be formed are formed, and the driving means of the suction hole communication mechanism moves the lower mounting plate relative to the upper mounting plate in a predetermined direction to form the first suction hole and the second suction hole. By making the second suction hole communicate with each other, it is possible to maintain the flatness of the circuit board without causing wrinkles and bending even when suction-holding a thin circuit board while having a relatively simple structure. Can be held.

According to a fifth aspect of the present invention, there is provided a circuit board sucking apparatus according to any one of the first to fourth aspects, and a circuit board inspection for a circuit board sucked and held by the circuit board sucking apparatus. And a control unit for performing the following operations, even when sucking and holding a thin circuit board,
The flatness of the circuit board can be maintained without causing wrinkles or bending. As a result, the reliability of the blowing on the circuit board and the reliability of the final inspection can be sufficiently improved.

[Brief description of the drawings]

FIG. 1 is a circuit board inspection apparatus 1 according to an embodiment of the present invention.
FIG. 2 is a configuration diagram showing the configuration of FIG.

FIG. 2 is an explanatory diagram for explaining a configuration of a circuit board suction device 2.

FIG. 3 is a plan view showing a configuration of an upper mounting plate 11UP of the circuit board suction device 2.

FIG. 4 is a plan view showing a configuration of a lower mounting plate 11LO of the circuit board suction device 2.

FIG. 5 is an explanatory diagram for explaining an opening and closing operation of the suction holes IH, and is an explanatory diagram when all the suction holes IH are in a closed state.

FIG. 6 is an explanatory diagram for explaining an opening / closing operation of the suction hole IH, in which only the suction hole IH located at one predetermined portion is in an open state.

FIG. 7 is an explanatory diagram for explaining an opening / closing operation of the suction hole IH, and is an explanatory diagram when the suction hole IH adjacent to one predetermined portion is also in an open state.

FIG. 8 is an explanatory diagram for explaining an opening and closing operation of the suction holes IH, and is an explanatory diagram when all the suction holes IH are in an open state.

FIG. 9 is a plan view showing a configuration of a lower mounting plate 21LO in the circuit board suction device 2.

FIG. 10 is an explanatory diagram for explaining an opening / closing operation of the suction holes IH in a configuration using the lower mounting plate 21LO, and is an explanatory diagram when all the suction holes IH are in a closed state.

FIG. 11 is an explanatory diagram for explaining an opening / closing operation of the suction hole IH in a configuration using the lower mounting plate 21LO, and is an explanatory diagram when only the suction hole IH located at one predetermined portion is in an open state. is there.

FIG. 12 is an explanatory diagram for explaining an opening / closing operation of the suction hole IH in the configuration using the lower mounting plate 21LO, and is an explanatory diagram when the suction hole IH adjacent to one predetermined portion is also in an open state. .

FIG. 13 is an explanatory diagram for explaining an opening and closing operation of the suction holes IH in a configuration using the lower mounting plate 21LO, and is an explanatory diagram when all the suction holes IH are in an open state.

FIG. 14 is a plan view showing a configuration of an upper mounting plate 31UP of the circuit board suction device 2.

FIG. 15 is a plan view showing a configuration of a lower mounting plate 31LO of the circuit board suction device 2.

FIG. 16 is an explanatory diagram for explaining an opening / closing operation of the suction holes IH in a configuration using the upper mounting plate 31UP and the lower mounting plate 31LO, and is an explanatory diagram when all the suction holes IH are in a closed state. .

FIG. 17 is an explanatory diagram for explaining the opening / closing operation of the suction holes IH in the configuration using the upper mounting plate 31UP and the lower mounting plate 31LO, where only the suction holes IH located at one predetermined portion are in an open state. FIG.

FIG. 18 is an explanatory diagram for explaining an opening / closing operation of the suction hole IH in a configuration using the upper mounting plate 31UP and the lower mounting plate 31LO, wherein the suction hole IH adjacent to one predetermined portion is also in an open state. FIG.

FIG. 19 is an explanatory diagram for explaining an opening / closing operation of the suction holes IH in a configuration using the upper mounting plate 31UP and the lower mounting plate 31LO, and is an explanatory diagram when all the suction holes IH are in an open state. .

20 is a plan view illustrating a configuration of a lower mounting plate 41LO of the circuit board suction device 2. FIG.

FIG. 21 is an explanatory diagram for explaining an opening / closing operation of the suction holes IH in a configuration using the lower mounting plate 41LO, and is an explanatory diagram when all the suction holes IH are in an open state.

FIG. 22 is an explanatory diagram for explaining an opening / closing operation of the suction hole IH in the configuration using the lower mounting plate 41LO when only the suction hole IH located at one predetermined portion is in an open state. is there.

FIG. 23 is an explanatory diagram for explaining an opening / closing operation of the suction hole IH in a configuration using the lower mounting plate 41LO, and is an explanatory diagram when the suction hole IH adjacent to one predetermined portion is also in an open state. .

FIG. 24 is an explanatory diagram for explaining an opening / closing operation of the suction holes IH in a configuration using the lower mounting plate 41LO, and is an explanatory diagram when all the suction holes IH are in an open state.

FIG. 25 is a configuration diagram showing a configuration of a conventional circuit board inspection device 61.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 circuit board inspection device 2 circuit board suction device 3 moving mechanism 4 inspection probe 5 control unit 6 RAM 7 ROM 11, 21, 31, 41 substrate mounting table 11 a case 11 b, 21 b, 31 b, 41 b mounting plate 11 UP, 31 UP Mounting plate 11LO, 21LO, 31LO, 41LO Lower mounting plate 12 Air pump 13 Air cylinder IH Suction hole IH1 First suction hole IH2 Second suction hole IH3 Third suction hole IH4 Fourth suction hole IH5 Fifth suction hole P circuit board R mounting area

Claims (5)

[Claims] 1. A substrate mounting apparatus comprising: a box-shaped case having an opening on one side; and a mounting plate mounted on an opening of the case and having a plurality of suction holes formed in a mounting area of a circuit board. A circuit board suction device comprising: a mounting table; and suction means for sucking air inside the case, wherein a suction hole communication mechanism for communicating the plurality of suction holes with the inside of the case when suction is performed by the suction means. Wherein the suction hole communication mechanism sequentially communicates with the suction holes located at one predetermined site in the placement area. 2. The circuit board suction device according to claim 1, wherein the one predetermined portion is one peripheral portion in the placement area. 3. The circuit board suction device according to claim 1, wherein the one predetermined portion is a central portion in the placement area. 4. The mounting plate according to claim 1, wherein the lower mounting plate is mounted on the opening of the case, and the upper mounting plate is slidably disposed on an upper surface of the lower mounting plate with respect to the lower mounting plate. A plurality of first suction holes are formed at a predetermined pitch in one of the lower mounting plate and the upper mounting plate, and in the other of the lower mounting plate and the upper mounting plate, A plurality of elongated second suction holes are formed so that the length from the end facing the first suction hole to the end on the predetermined direction side is closer to the one predetermined site side, The hole is formed by a pair of the first suction hole and the second suction hole which can communicate with each other, and the suction hole communication mechanism is configured to move the lower mounting plate relative to the upper mounting plate by a predetermined amount. A driver that moves the first suction hole and the second suction hole to communicate with each other 4. The method according to claim 1, wherein the step is provided with a step.
The circuit board suction device according to any one of the above. 5. A circuit board suction device according to claim 1, further comprising: a control unit configured to execute a circuit board inspection on a circuit board sucked and held by the circuit board suction device. Circuit board inspection device.