JP2002338332A - Sintering assistant - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sintering assistant by which a densified dielectric porcelain composition can be obtained without injuring characteristics even when sintered at low temperature. SOLUTION: The sintering assistant has a first component containing two or more kinds of M1 compounds (M1 is an alkaline metal, however), a second component containing a M2 compound (M2 is an element in Group V and Group VI, however), a third component containing a M3 compound (M3 is at least one selected among Ba, Ca, Sr, Mg, Mn, B, Al and Zn, however) and a fourth component containing oxide of Si or a compound becoming the oxide of Si by calcination. When the composition ratio from the first component to the fourth component: (the first component, the second component, the third component, the fourth component) is expressed by a tetrahedron composition diagram expressed by a point A: (100, 0, 0, 0), a point B: (0, 100, 0, 0), a point C: (0, 0, 100, 0) and a point D: (0, 0, 0, 100), the sintering assistant is characterized by that the composition ratio is satisfactorily located in a region except on a BCD face surrounded by the point B, the point C and the point D.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a sintering aid suitable for producing, for example, a dielectric porcelain composition.

[0002]

2. Description of the Related Art Conventional dielectric ceramic compositions constituting a multilayer ceramic capacitor as an example of an electronic component include barium titanate (BaTiO ₃ ) as a ferroelectric and strontium titanate (paraelectric) as a dielectric. SrTi
O ₃ ), calcium titanate (CaTiO ₃ ), calcium strontium zirconate (CaSrZrO)
₃ ), calcium zirconate (CaZrO ₃ ), strontium zirconate (SrZrO ₃ ), titanium oxide (TiO ₂ ), neodymium titanate (NdTi)
It has a main component containing various dielectric oxides such as O ₃ ).

[0003] Since this kind of dielectric porcelain composition is difficult to sinter as it is, it is added with various sintering aids to obtain a sintering material.
It was fired at a temperature exceeding 00 ° C. In addition, this type of dielectric ceramic composition has a property of being reduced to a semiconductor when fired in a neutral atmosphere or a reducing atmosphere having a low oxygen partial pressure. When manufacturing a multilayer ceramic capacitor using such a material, it has been necessary to fire it in an oxidizing atmosphere having a high oxygen partial pressure.

For this reason, the internal electrode material fired at the same time as the dielectric ceramic composition has a melting point as high as not melting at the temperature at which the dielectric ceramic composition is sintered, and is fired in an oxidizing atmosphere. It is necessary to use a noble metal (for example, palladium, platinum, or the like) having such characteristics as not being oxidized.

However, since noble metals are generally expensive, the cost of the internal electrode material occupying the capacitor accounts for a considerable proportion of the whole, which hinders the cost reduction of the manufactured multilayer ceramic capacitor. I was coming.

[0006] When the firing temperature is high, (1) the cost of the firing furnace itself is high, and the firing furnace to be used is severely damaged, so that the maintenance and management costs of the firing furnace gradually increase with use time. At the same time, the energy cost required for porcelain becomes enormous. (2) Stress tends to accumulate due to the difference in thermal expansion coefficient between the dielectric ceramic composition and the internal electrode material, which causes inconveniences such as generation of cracks and lowering of the relative dielectric constant.

Therefore, firing can be performed at a low temperature, and even if firing is performed in a neutral atmosphere or a reducing atmosphere using an inexpensive base metal (for example, nickel or copper) as a material for the internal electrode, it does not turn into a semiconductor. It is necessary to develop a dielectric ceramic composition having excellent reduction resistance and having a sufficient relative dielectric constant and excellent dielectric properties after firing.

Various proposals have heretofore been made for this kind of dielectric ceramic composition.

For example, Japanese Patent No. 2997236
(JP-A-10-335169) describes the following invitation.
An electric porcelain composition is disclosed. This dielectric porcelain composition
Is ｛(Ca_xSr_1-x) O｝_m｛(Ti_y
Zr_1-y) O₂Dielectric oxide of composition shown by｝
(However, 0 ≦ x ≦ 1, 0 ≦ y ≦ 0.10, 0.75 ≦
m ≦ 1.04) as a main component, and a predetermined
Contains minor amounts of subcomponents. The subcomponent is 0.2 in MnO conversion.
~ 5 mol% of Mn oxide and Al₂O₃0 in conversion.
1 to 10 mol% of Al oxide and 0.5 to 15 mol% of Al oxide
｛(Ba_zCa _1-z) O｝_vSiO₂(However
0 ≦ z ≦ 1, 0.5 ≦ v ≦ 4.0)
You. That is, Mn oxide, Al oxide, and silicate
Lithium / calcium is contained as a sintering aid.

Japanese Patent Application Laid-Open No. 5-17222 discloses the following.
A dielectric porcelain composition is disclosed. This dielectric porcelain set
The product is ｛(Ca_xSr_1-x) O｝_m｛(Ti
_yZr_1-y) O₂Dielectric oxidation of the composition indicated by｝
Object (however, 0.35 ≦ x ≦ 0.5, 0.9 ≦ y, 1.
00 ≦ m ≦ 1.04) as the main component.
To contain a predetermined amount of subcomponents. The subcomponent is 0.01 to
0.05 mol% Li ₂SiO₃And 0.01 ~
0.05 mol% MF₂(However, M is Ca, Sr,
At least one element selected from Ba and Mg) and
It is composed of That is, lithium silicate and alkali
An earth metal fluoride is contained as a sintering aid.

In Japanese Patent Application Laid-Open No. Hei 5-217426,
The illustrated dielectric porcelain composition is disclosed. This dielectric porcelain
The composition is ｛(Ca_xSr_1-x) O｝_m｛(T
i_y Zr_1-y) O₂Dielectric acid with composition indicated by｝
(Where 0 ≦ x ≦ 1.0, 0 ≦ y ≦ 0.2, 0.
9 ≦ m ≦ 1.1) as a main component.
And a predetermined amount of subcomponents. The secondary component is LiO
_1/2A mol% in conversion (where a is 0.01 to 0.
8) and a mole% in terms of MO (where a
Is 0.01 to 0.8) M oxide (where M is Ca,
At least one element selected from Sr and Ba)
And BO_3/2(1-a) mol% of B oxide in conversion
And SiO₂(1-a) mol% of Si oxide in conversion
It is composed of That is, Li oxide, M oxide,
B oxide and Si oxide are contained as sintering aids.
You.

In Japanese Patent Application Laid-Open No. 4-206109,
The illustrated dielectric porcelain composition is disclosed. This dielectric porcelain
The composition is ｛(Ca_xSr_1-x) O｝_m｛(T
i_y Zr_1-y) O₂Dielectric acid with composition indicated by｝
(However, 0.30 ≦ x ≦ 0.50, 0.80 ≦ y
≦ 1.00, 0.95 ≦ m ≦ 1.08) as main components,
The main component contains a predetermined amount of subcomponent. Minor component
Is B₂O₃, SiO₂And Li₂Select from O
At least one compound. Sand
Selected from B oxide, Si oxide and Li oxide
At least one compound contained as a sintering aid.
You.

JP-A-63-131412 discloses the following:
The following discloses a dielectric ceramic composition. This dielectric magnet
The container composition is ｛(Ca_xSr_1-x) O｝
_m｛(Ti _yZr_1-y) O₂組
Dielectric oxide (where x = 0, 0.01 ≦ y ≦
0.25, 0.8 ≦ m ≦ 1.3) as the main component.
Contains a predetermined amount of sub-components with respect to the components. The minor component is B
₂O₃, SiO₂And MO (where M is C
a, Sr, Ba, Mg and Zn
Is also contained in a specific ratio. That is, B
Oxide, Si oxide and M oxide as sintering aid
It is contained.

[0014]

The dielectric porcelain compositions described in these publications can be fired at a temperature of 1300 ° C. or lower, but all of them have electrical characteristics such as CR product and dielectric loss. Had worsened. Since the sintering temperature often relatively affects the cost, it is desirable to set the firing temperature as low as possible.

On the other hand, if the firing temperature is too low, the ceramic cannot be densified for porcelain formation, and a dielectric ceramic composition having sufficient characteristics cannot be obtained.

Therefore, there has been a need to develop a sintering aid which can be fired at a lower temperature without impairing the densification of the dielectric ceramic composition.

An object of the present invention is to provide a sintering aid capable of obtaining a densified dielectric porcelain composition without impairing various electric properties even when fired at a low temperature.

[0018]

In order to achieve the above object, in the invention according to the first aspect, a sintering method comprising a first component containing two or more compounds of M1 (where M1 is an alkali metal). Auxiliaries are provided.

Preferably, the compound of M2 (provided that M2
Has a second component containing a group V element and a group VI element).

Preferably, a compound of M3 (provided that M3
Are Ba, Ca, Sr, Mg, Mn, B, Al and Zn
And at least one component selected from the group consisting of:

Preferably, the semiconductor device further includes a fourth component containing an oxide of Si or a compound which becomes an oxide of Si by firing.

Further, according to the invention according to a second aspect, there is provided a sintering aid having a first component and at least one component selected from a second component, a third component, and a fourth component, One component comprises two or more compounds of M1 (provided that M1
1 is an alkali metal), the second component is a compound of M2 (where M2 is a Group V element and a Group VI element), and the third component is a compound of M3 (where M3 is B
a, Ca, Sr, Mg, Mn, B, Al and Zn), and the fourth component is S
A sintering aid containing an oxide of i or a compound that becomes an oxide of Si upon firing is provided.

Further, in the invention according to the third aspect, two or more compounds of M1 (where M1 is an alkali metal)
, A second component including a compound of M2 (where M2 is a Group V element and a Group VI element), and a compound of M3 (where M3 is Ba, Ca, Sr, Mg, Mn,
A sintering aid comprising a third component containing at least one selected from B, Al and Zn) and a fourth component containing a Si oxide or a compound that becomes a Si oxide by firing. The composition ratio of these first to fourth components: (first, second, third, and fourth) is determined by the point A: (100, 0, 0,
0), point B: (0, 100, 0, 0), point C: (0,
0,100,0) and point D: (0,0,0,100)
When represented by a tetrahedral composition diagram represented by the composition ratio,
There is provided a sintering aid that fills a region excluding on a BCD plane (composition of the first component = 0) surrounded by the points B, C, and D.

Preferably, in addition to the BCD plane, the composition ratio is A, which is further surrounded by the points A, B and C.
The area except for the BC plane (the composition of the fourth component = 0) is satisfied.

The compounds in the present invention include, in addition to oxides, compounds that become oxides upon firing (eg, carbonates, nitrates, oxalates, etc.). Of course, a combination of an oxide and a compound that becomes an oxide by firing may be used.

Preferably, the two or more compounds of M1 contain at least an oxide of Li and an oxide of Na.

Preferably, the compound of M2 contains at least one selected from an oxide of V, an oxide of Mo, and an oxide of W.

Preferably, the compound of M2 contains at least two selected from oxides of V, oxides of Mo, and oxides of W.

Preferably, the sintering aid according to the present invention has a melting point of 1200 ° C. or less.

The sintering aid of the present invention can be suitably used when producing a dielectric ceramic composition used for a dielectric layer of a multilayer ceramic capacitor as an example of an electronic component.

[0031]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on embodiments shown in the drawings.

FIG. 1 is a sectional view of a multilayer ceramic capacitor according to one embodiment of the present invention, FIG. 2 is a tetrahedral composition diagram showing the composition ratio of a sintering aid of the present invention, and FIG. L
i, Na)-(Ba, Ca, Mn, Al) -Si-O and the amount of (Ba, Ca, Mn, Al) according to Comparative Example 2
FIG. 4 is a graph showing the relationship between the sintering temperature and the density when the amount of -Si-O added was changed, and FIG. 4 shows the addition of (Li, Na)-(Mn, Al) -Si-O according to Example 2. (Ba, Ca, Mn, Al) -Si according to Comparative Example 2
FIG. 5 is a graph showing the relationship between the sintering temperature and the density when the amount of -O added was changed, and FIG.
i, Na) -W- (Ba, Ca, Mn, Al) -Si-
The amount of O added and (Ba, Ca, Mn, A
l) A graph showing the relationship between the sintering temperature and the density when the amount of -Si-O added was changed. FIG. 6 shows Li- (Ba, Ca, Mn, Al) -Si-O according to Comparative Example 1. And the amount of (Ba, Ca, Mn, Al) − according to Comparative Example 2.
FIG. 7 is a graph showing the relationship between the sintering temperature and the density when the amount of Si—O added is changed, and FIG. 7 shows (Li, Na) — (Ba, Ca, Mn, Al) —Si— according to Example 1.
The amount of O added and (Ba, Ca, Mn, A
l) A graph showing the relationship between the firing temperature and the CR product when the amount of -Si-O added was changed, and FIG.
(Li, Na)-(Mn, Al) -Si-O according to Comparative Example 2 and (Ba, Ca, Mn, Al)-
FIG. 9 is a graph showing the relationship between the firing temperature and the CR product when the amount of Si—O added is changed, and FIG. 9 shows (Li, Na) —W— (Ba, Ca, Mn, Al) according to Example 3. -S
The amount of i-O added and (Ba, Ca, M
FIG. 10 is a graph showing the relationship between the firing temperature and the CR product when the amount of addition of (n, Al) —Si—O is changed. FIG. 10 is a graph showing Li— (Ba, Ca, Mn, Al) — according to Comparative Example 1. S
The amount of i-O added and (Ba, Ca, M
FIG. 11 is a graph showing the relationship between the sintering temperature and the CR product when the amount of (n, Al) —Si—O added is changed. FIG. 11 shows the temperatures of Sample 1 of Example 1 and Sample 31 of Comparative Example 2. FIG. 12 is a graph showing the relationship between the dielectric loss and the dielectric loss.
FIG. 13 is a graph showing the relationship between temperature and dielectric loss in Sample 7 of Comparative Example 2 and Sample 31 of Comparative Example 2. FIG.
FIG. 14 is a graph showing the relationship between the temperature and the dielectric loss of Sample No. 4 and Sample 31 of Comparative Example 2. FIG.
13 is a graph showing the relationship between temperature and dielectric loss in Sample 31 of Comparative Example 2.

As shown in FIG. 1, a multilayer ceramic capacitor 1 as an example of an electronic component according to the present embodiment includes a capacitor element body 10 having a structure in which dielectric layers 2 and internal electrode layers 3 are alternately laminated. Have. Capacitor element body 1
A pair of external electrodes 4 that are electrically connected to the internal electrode layers 3 alternately arranged inside the element body 10 are formed at both ends of the element main body 10. The shape of the capacitor element body 10 is not particularly limited, but is generally a rectangular parallelepiped. The size is not particularly limited, and may be an appropriate size according to the application. Usually, the size is (0.6 to 5.6 mm) × (0.3 to 5.0).
mm) × (0.3 to 1.9 mm). The internal electrode layer 3 has two end faces facing each other of the capacitor element body 10.
It is laminated so as to be exposed alternately on the surface of the end. The pair of external electrodes 4 are formed at both ends of the capacitor element body 10 and connected to the exposed end faces of the alternately arranged internal electrode layers 3 to form a capacitor circuit.

The composition of the dielectric layer 2 is not particularly limited in the present invention.
Not composed of, for example, the following dielectric porcelain composition:
It is. The dielectric ceramic composition of the present embodiment is, for example, a set
Formula ｛(Ba_(1-xy)Ca_x Sr_y) O｝
_A(Ti_(1-z)Zr _z)_BO₂ Represented by
It has a main component containing a dielectric oxide. Symbol A, symbol
B, the symbol x, the symbol y, and the symbol z are arbitrary ranges.
, For example, 0.990 ≦ A / B ≦ 1.01
0, 0 ≦ x ≦ 0.80, 0 ≦ y ≦ 0.5, 0.01 ≦ z
It is preferred that ≦ 0.98.

The dielectric ceramic composition of the present embodiment contains the sintering aid according to the first to third aspects of the present invention as an auxiliary component.

In this embodiment, the content of the sintering aid is preferably 0.1 to 25 mol%, more preferably 1 to 15 mol%, based on 100 mol% of the whole dielectric ceramic composition.
It is. By setting the amount of the sintering additive within this range, firing can be performed at a lower temperature without lowering the relative dielectric constant.

The melting point of the sintering aid of the present invention is preferably 1
The temperature is 200 ° C or lower, more preferably 1000 ° C or lower.
When the melting point is 1200 ° C. or less, firing at a low temperature becomes easy.

The sintering aid according to the first aspect has a first component containing at least two or more compounds of M1 (where M1 is an alkali metal). This first component acts as a substance that lowers the sintering temperature. Examples of M1 (alkali metal) include Li, Na, K, Rb, Cs and Fr.
Among them, a combination of Li and Na is preferable. That is, as the first component, an oxide of Li (Li ₂ O) and an oxide of Na (Na
Preferably contains at least ₂ O).

In the first aspect, the compound of M2 (provided that
M2 preferably further includes a second component containing a group V element and a group VI element). The second component, when combined with the first component, acts as a substance that lowers the sintering temperature and improves various electrical properties. M2 (Group V element and Group VI element) includes V,
At least one element selected from Nb, Ta, Cr, Mo and W may be used.
At least one element selected from o and W is preferred, and more preferably at least two elements selected from V, Mo and W. That is, as the second component, an oxide of V (V ₂ O ₅ ) and an oxide of Mo (Mo
O ₃ ) and an oxide of W (WO ₃ ).

In a first aspect, the compound of M3 (provided that
M3 preferably further includes a third component containing at least one selected from Ba, Ca, Sr, Mg, Mn, B, Al, and Zn). The third component, when combined with the first component, acts as a substance that improves the wettability with the base material and lowers the sintering temperature.

From the first viewpoint, it is preferable to further include a fourth component containing an oxide of Si or a compound that becomes an oxide of Si by firing. This fourth component, when combined with the first component, acts as a substance that further lowers the sintering temperature.

The sintering aid according to the second aspect contains at least the above-mentioned first component, and further has at least one component selected from the above-mentioned second, third and fourth components.

The sintering aid according to the third aspect has the above-mentioned first component, second component, third component and fourth component in a specific composition ratio.

In the present invention, the composition ratio of the first to fourth components: (first, second, third, and fourth) is determined by the point A: (10
0, 0, 0, 0), point B: (0, 100, 0, 0), point C: (0, 0, 100, 0), and point D: (0, 0, 0).
0, 100), the composition ratio is the BCD plane surrounded by the points B, C and D (the composition of the first component = 0). Fill the area except the top.

Preferably, the composition ratio of the first to fourth components is such that the ratio of ABC surrounded by points A, B and C is
The region except for the surface (the composition of the fourth component = 0) is filled.

More preferably, the composition ratio of the first to fourth components satisfies an area within a pentahedron surrounded by points D, E, F, G, H, and I (described later). , A DEF surface surrounded by points D, E and F (second component = 0
Ex)).

Point D: (0, 0, 0, 100), Point E: (90, 0, 0, 10), Point F: (0, 0, 90, 10), Point G: (0, 30, 0, 70), point H: (60, 30, 0, 10), point I: (0, 30, 60, 10).

In the sintering aid according to the first to third aspects, other components including at least one selected from compounds of Y, Gd, Tb, Dy, Sn and P are further contained. There may be. In this case, the content of the other components in the sintering aid is preferably 0.05 to 5
It is about mol%.

Various conditions such as the number of layers and the thickness of the dielectric layer 2 shown in FIG. 1 may be appropriately determined according to the purpose and application. In the present embodiment, the thickness of the dielectric layer 2 is 6 μm. Or less, preferably 5 μm or less, more preferably less than 3 μm. The dielectric layer 2 is composed of grains and a grain boundary phase, and the average grain size of the grains of the dielectric layer 2 is 0.1 mm.
It is preferably about 1 to 5 μm. The grain boundary phase is usually composed of an oxide of a material constituting the dielectric material or the internal electrode material, an oxide of a separately added material, and an oxide of a material mixed as an impurity during the process, and Usually made of glass or vitreous.

The conductive material contained in the internal electrode layer 3 is not particularly limited, but a base metal can be used since the constituent material of the dielectric layer 2 has reduction resistance. As the base metal used as the conductive material, Ni or a Ni alloy is preferable. As the Ni alloy, an alloy of one or more elements selected from Mn, Cr, Co, and Al and Ni is preferable, and the Ni content in the alloy is preferably 95% by weight or more. In addition, P or F is contained in Ni or Ni alloy.
Various minor components such as e and Mg may be contained in an amount of about 0.1% by weight or less. The thickness of the internal electrode layer may be appropriately determined according to the application and the like, but is usually 0.5 to 5 μm, particularly 1 to 5 μm.
It is preferably about 2.5 μm.

The conductive material contained in the external electrode 4 is not particularly limited, but is usually Cu or Cu alloy, Ni or N
An i alloy or the like is used. In addition, Ag, Ag-Pd alloy, etc.
Of course, it can be used. In the present embodiment, inexpensive Ni, Cu, or an alloy thereof is used. The thickness of the external electrode may be appropriately determined according to the application or the like.
It is preferably about 0 to 50 μm.

The multilayer ceramic capacitor 1 using the dielectric porcelain composition having the sintering aid of the present invention can be formed into a green chip by a usual printing method or a sheet method using a paste, similarly to a conventional multilayer ceramic capacitor. It is manufactured by manufacturing and firing this, and then printing or transferring the external electrode and firing. Hereinafter, the manufacturing method will be specifically described.

First, a dielectric ceramic composition powder contained in the dielectric layer paste is prepared and made into a paint to prepare a dielectric layer paste.

The dielectric layer paste may be an organic paint obtained by kneading a dielectric material and an organic vehicle, or may be an aqueous paint.

As the dielectric raw material, a raw material constituting the main component and a raw material constituting the first to fourth components and other components are used according to the composition of the above-described dielectric ceramic composition according to the present invention. .

As the main component materials, Ti, Ba, Sr,
Oxides of Ca or Zr, and Ti, B
A compound that becomes an oxide of a, Sr, Ca or Zr is used.

As the first component raw material of the sintering aid, Li,
Examples include oxides of Na, K, Rb, Cs or Fr, and compounds that become oxides of Li, Na, K, Rb, Cs or Fr upon firing. From the viewpoint of safety, etc., preferably Li, Na and K are used. This first
The component raw materials include two or more alkali metal compounds.

As the second component raw material of the sintering aid, V, N
An oxide of b, Ta, Cr, Mo, or W and a compound that becomes an oxide of V, Nb, Ta, Cr, Mo, or W by firing are used.

As the third component raw material of the sintering aid, Ba,
Oxides of Ca, Sr, Mg, Mn, B, Al or Zn, and Ba, Ca, Sr, Mg, Mn,
A compound which becomes an oxide of B, Al or Zn is used.

As the fourth component raw material of the sintering aid, an oxide of Si or a compound which becomes an oxide of Si by firing is used.

The other components of the sintering aid include:
An oxide of Y, Gd, Tb, Dy, Sn or P and a compound which becomes an oxide of Y, Gd, Tb, Dy, Sn or P by firing are used.

The raw materials of each component constituting the sintering aid are not particularly limited in the form of addition, but a sintering aid is previously blended, and this is heat-treated and melted to form a compound glass component. The pulverized material may be added to the main component material and mixed.

The compound which becomes an oxide upon firing includes, for example, carbonates, nitrates, oxalates, and organometallic compounds. Of course, an oxide and a compound which becomes an oxide by firing may be used in combination. The content of each compound in the dielectric raw material may be determined so that the composition of the dielectric ceramic composition described above after firing is obtained.

These raw material powders usually have an average particle size of about 0.0005 to 5 μm.

The organic vehicle is obtained by dissolving a binder in an organic solvent, and the binder used for the organic vehicle is not particularly limited, and may be appropriately selected from ordinary various binders such as ethyl cellulose and polyvinyl butyral. In addition, the organic solvent used at this time is not particularly limited, and may be appropriately selected from organic solvents such as terpineol, butyl carbitol, acetone, and toluene depending on a method such as a printing method or a sheet method.

In the case where the dielectric layer paste is an aqueous paint, an aqueous vehicle in which a water-soluble binder or dispersant is dissolved in water may be kneaded with a dielectric material. The water-soluble binder used for the aqueous vehicle is not particularly limited, and for example, polyvinyl alcohol, cellulose, a water-soluble acrylic resin, or the like may be used.

The paste for an internal electrode is obtained by kneading the above-mentioned organic vehicle with the above-mentioned conductive material comprising various conductive metals or alloys or various oxides, organometallic compounds, resinates, etc. which become the above-mentioned conductive material after firing. It is prepared by The external electrode paste is also prepared in the same manner as the internal electrode paste.

The content of the organic vehicle in each of the above-mentioned pastes is not particularly limited, and may be a usual content, for example, about 1 to 5% by weight of a binder and about 10 to 50% by weight of a solvent. Each paste may contain additives selected from various dispersants, plasticizers, dielectrics, insulators, and the like, as necessary. The total content of these is preferably 10% by weight or less.

When the printing method is used, a dielectric chip and an internal electrode paste are laminated and printed on a substrate such as polyethylene terephthalate, cut into a predetermined shape, and then separated from the substrate to obtain a green chip. On the other hand, when the sheet method is used, a green sheet is formed using a dielectric paste, an internal electrode paste is printed thereon, and these are laminated to form a green chip.
Then, the green chip is subjected to binder removal processing and firing.

The binder removal treatment may be appropriately determined according to the type of the conductive material in the internal electrode layer paste. When a base metal such as Ni or a Ni alloy is used as the conductive material, the oxygen content in the binder removal atmosphere is reduced. the pressure ¹⁰ -45 ^~10 5 P
a is preferred. When the oxygen partial pressure is less than the above range, the binder removal effect decreases. When the oxygen partial pressure exceeds the above range, the internal electrode layer tends to be oxidized.

As other conditions for removing the binder, the rate of temperature rise is preferably 5 to 300 ° C./hour, more preferably 10 to 100 ° C./hour, and the holding temperature is preferably 180 to 400 ° C., more preferably 200-350 ° C,
The temperature holding time is preferably 0.5 to 24 hours, more preferably 2 to 20 hours. The firing atmosphere is preferably air or a reducing atmosphere. As the atmosphere gas in the reducing atmosphere, for example, N ₂ and H ₂ are used.
It is preferable to use a mixed gas of No. ₂ and humidified gas.

The firing atmosphere of the green chip is the internal electrode
If properly determined according to the type of conductive material in the layer paste
Good. However, the conductive material in the internal electrode layer paste is Ni
When a base metal such as Ni or Ni alloy is used, oxygen partial pressure is preferable.
Preferably 10^-10-10 ^-3Firing in Pa atmosphere
Do. When using a base metal as the conductive material of the internal electrode layer
If the oxygen partial pressure of the firing atmosphere is less than the above range, the internal
The conductive material of the electrode layer may break due to abnormal sintering.
When the oxygen partial pressure of the firing atmosphere exceeds the above range
The internal electrode layers tend to oxidize.

The firing temperature of the green chip is sufficient to make the green chip denser, and the electrodes are interrupted due to abnormal sintering of the internal electrode layer, the capacitance-temperature characteristic is deteriorated due to diffusion of the internal electrode layer constituent material, or the dielectric material is heated. It is appropriately determined within a range where reduction of the porcelain composition does not occur. This is because if the firing temperature is too low, the green chip will not be dense, and if the firing temperature is too high, the internal electrodes will be interrupted, the capacity-temperature characteristics will deteriorate due to the diffusion of the conductive material, and the reduction of the dielectric will occur. is there.

Conventionally, in order to sufficiently densify the green chip, it was necessary to fire at a temperature exceeding 1300 ° C. In the present embodiment, the sintering agent capable of sintering at a low temperature as described above is contained. Therefore, the heat treatment can be performed at a low temperature of preferably less than 1300 ° C., more preferably 1260 ° C. or less, and further preferably 1180 ° C. or less. Accordingly, damage to the firing furnace can be prevented, maintenance and management costs, and thus energy costs can be effectively suppressed, and inconveniences such as generation of cracks and a decrease in relative permittivity can also be prevented. The lower limit of the firing temperature is preferably about 600 ° C.

As other firing conditions, the heating rate is preferably 50 to 500 ° C./hour, more preferably 20 to 500 ° C./hour.
0 to 300 ° C./hour, the temperature holding time is preferably 0.5
-8 hours, more preferably 1-3 hours, the cooling rate is preferably 50-500 ° C./hour, more preferably 200-500 ° C./hour.
300 ° C./hour. The firing atmosphere is preferably a reducing atmosphere. As the atmosphere gas, for example, a mixed gas of N ₂ and H ₂ is preferably used after being humidified.

When firing in a reducing atmosphere, it is preferable to anneal the sintered body of the capacitor chip (capacitor element body). Annealing is a process for re-oxidizing the dielectric layer, which can significantly increase the IR life, thereby improving reliability.

The oxygen partial pressure in the annealing atmosphere is 1 × 10
^-4 Pa or more, particularly preferably 1 × 10 ⁻⁴ to 10 ⁻¹ Pa. When the oxygen partial pressure is less than the above range, it is difficult to reoxidize the dielectric layer, and when the oxygen partial pressure exceeds the above range, the internal electrode layer tends to be oxidized.

The holding temperature at the time of annealing is preferably 1200 ° C. or less, particularly preferably 500 to 1200 ° C. If the holding temperature is lower than the above range, the oxidation of the dielectric layer becomes insufficient, so that the IR is low and the IR life tends to be short. On the other hand, when the holding temperature exceeds the above-mentioned range, not only the internal electrode layer is oxidized and the capacity is reduced, but also the internal electrode layer reacts with the dielectric substrate, so that the capacity-temperature characteristic deteriorates and I
A reduction in R and a reduction in IR life are likely to occur. Note that the annealing may include only the temperature increasing process and the temperature decreasing process. That is, the temperature holding time may be set to zero. In this case, the holding temperature is synonymous with the maximum temperature.

As other annealing conditions, the temperature holding time is preferably 0 to 20 hours, more preferably 2 to 20 hours.
For 10 hours, the cooling rate is preferably 50 to 500 ° C./hour, more preferably 100 to 300 ° C./hour. It is preferable to use, for example, humidified N ₂ gas or the like as an atmosphere gas for annealing.

In the above-mentioned binder removal treatment, firing and annealing, for example, a wetter or the like may be used to humidify the N ₂ gas or the mixed gas. in this case,
The water temperature is preferably about 5 to 75C.

The binder removal processing, firing and annealing are performed as follows.
It may be performed continuously or independently. When these are continuously performed, after removing the binder, the atmosphere is changed without cooling, and then the temperature is raised to the holding temperature at the time of firing, firing is performed, and then cooling is performed, and the temperature reaches the holding temperature of annealing. It is preferable to perform the annealing while changing the atmosphere. On the other hand, when performing these independently, at the time of firing, after raising the temperature under N ₂ gas atmosphere with N ₂ gas or wet to the holding temperature of the binder removal processing, further continuing the heating to change the atmosphere After cooling to the holding temperature at the time of annealing, it is preferable to change to an N ₂ gas or humidified N ₂ gas atmosphere again and continue cooling. In annealing, N ₂
After the temperature is raised to the holding temperature in the gas atmosphere, the atmosphere may be changed, or the entire annealing process may be performed in a humidified N ₂ gas atmosphere.

The fired capacitor body obtained as described above is subjected to end surface polishing by, for example, barrel polishing or sandblasting, and the external electrode paste is printed or transferred and fired to form the external electrode 4. The firing conditions for the external electrode paste are preferably, for example, about 10 minutes to 1 hour at 600 to 800 ° C. in a humidified mixed gas of nitrogen gas and hydrogen gas. Then, if necessary, a coating layer (pad layer) is formed on the surface of the external electrode 4 by plating or the like.

The ceramic capacitor 1 of the present embodiment manufactured as described above is mounted on a printed circuit board by soldering or the like, and is used for various electronic devices.

Although the embodiments of the present invention have been described above, the present invention is not limited to these embodiments at all, and can be implemented in various modes without departing from the gist of the present invention. Of course.

For example, in the above-described embodiment, a multilayer ceramic capacitor has been exemplified as the electronic component according to the present invention. However, the electronic component according to the present invention is not limited to the multilayer ceramic capacitor, but may be a dielectric ceramic composition having the above composition. Any material may be used as long as it has a dielectric layer made of a material.

[0086]

EXAMPLES Next, the present invention will be described in more detail with reference to examples which embody the embodiments of the present invention. However, the present invention is not limited to only these examples.

Example 1 First, the composition formula ｛(Ca _0.70 S
r _0.30 ) O- (Zr _0.97 Ti _0.03 )
Each oxide or carbonate (CaCO ₃ , SrCO ₃ , ZrO) is obtained so as to obtain a dielectric oxide represented by O ₂ ｝.
₂ , TiO ₂ ) to obtain a main component raw material base material.

Next, with respect to the obtained main component base material,
And the sintering aid prepared in advance: (Li, Na)-
(Ba, Ca, Mn, Al) -Si-O is
And wet-mix with a ball mill and dry.
As a result, a dielectric material (dielectric ceramic composition) was obtained. (L
i, Na)-(Ba, Ca, Mn, Al) -Si-O
The addition amount is a ratio shown in Table 1 with respect to 100 mol% of the base material.
(5.13 mol%, 7.00 mol%, 8.87 mol%)
And Note that (Li, Na)-(Ba, Ca, Mn,
Al) -Si-O was produced as follows. Ma
The oxides and carbonates of each component
Salt or hydroxide (eg, Li ₂O, N
a₂O, SiO₂Etc.). Next,
After wet mixing with a ball mill for 16 hours and pulverization,
I let you. The obtained powder is baked at 1000 ° C. in air for 2 hours.
Done. Then, finely pulverized, the average particle size is about 1-2 μm
A glass component powder was obtained.

Next, to the obtained dielectric material, polyvinyl alcohol as a binder was added so as to be 0.6% by weight, and the binder and the dielectric material were mixed so as to be granulated. Then, about 0.3 g of the granular dielectric material was weighed and pressed at a pressure of 1.3 ton / cm ² to obtain a disc-shaped molded body having a diameter of 12 mm and a thickness of 0.7 mm.

Next, the obtained disc-shaped molded body was subjected to binder removal processing, firing and annealing to obtain a diameter of about 10 m.
m, a disc-shaped fired body having a thickness of about 0.5 mm was obtained.

In the binder removal treatment, the temperature was raised at a rate of 300 ° C. /
Time, holding temperature: 500 ° C., holding time: 2 hours, atmosphere: in air.

The firing was performed at a rate of temperature rise: 200 ° C./hour, holding temperature: the temperature shown in Table 1, holding time: 2 hours, cooling rate:
300 ° C./hour, atmosphere: humidified N ₂ + H ₂ mixed gas atmosphere (oxygen partial pressure: 10 ⁻¹¹ to 10 ⁻⁶ P)
a) The conditions were as follows.

The annealing was performed under the following conditions: holding temperature: 1050 ° C., holding time: 2 hours, cooling rate: 300 ° C./hour, atmosphere: nitrogen gas atmosphere.

In addition, a wetter with a water temperature of 35 ° C. was used for humidifying the atmosphere gas during the binder removal treatment and the firing.

Next, on both sides of the obtained disc-shaped fired body,
An electrode having a diameter of 6 mm was formed by applying an In-Ga alloy to prepare a disk-shaped sample.

Example 2 (Li, Na)-(Ba, Ca, Mn, Al) -Si-
Instead of O, (Li, Na)-(Mn, Al) -Si
-O was used, and the amount of addition was as shown in Table 1 with respect to 100 mol% of the base material (4.13 mol%, 5.96 mol%, 1
A dielectric material was obtained in the same manner as in Example 1 except that 0.51 mol%) was used. Using the obtained dielectric material, a disk-shaped sample was produced in the same manner as in Example 1.

Example 3 (Li, Na)-(Ba, Ca, Mn, Al) -Si-
Instead of O, (Li, Na) -W- (Ba, Ca, M
n, Al) -Si-O, and the amount of the
The ratio shown in Table 1 with respect to the mol% (4.56 mol%, 5.
A dielectric material was obtained in the same manner as in Example 1, except that the amounts were 27 mol%, 5.98 mol%, and 7.76 mol%). Using the obtained dielectric material, a disk-shaped sample was produced in the same manner as in Example 1. Note that (Li, Na) -W- (B
a, Ca, Mn, Al) -Si-O were produced as follows. First, oxides, carbonates, hydroxides, and the like (eg, Li ₂ O, Na ₂ O, WO _{3 and the} like) of each component were prepared so as to obtain a predetermined composition. Next, this was wet-mixed with a ball mill for 16 hours, pulverized, and then evaporated to dryness. The obtained powder was calcined at 450 ° C. in air for 2 hours. Then, it was pulverized to obtain a powder having an average particle size of about 1 to 2 μm.

Example 4 (Li, Na)-(Ba, Ca, Mn, Al) -Si-
Instead of O, (Li, Na) -Mo- (Ba, Ca,
Mn, Al) —Si—O, and the amount of addition was
A dielectric material was obtained in the same manner as in Example 1 except that the ratio shown in Table 1 (4.72 mol%) was used with respect to 0 mol%.
Using the obtained dielectric material, a disk-shaped sample was produced in the same manner as in Example 1. (Li, Na) -Mo
-(Ba, Ca, Mn, Al) -Si-O was produced as follows. First, oxides, carbonates, hydroxides, and the like (eg, Li ₂ O, Na ₂ O, MoO ₃ ) of each component were prepared so as to obtain a predetermined composition. Next, this was wet-mixed with a ball mill for 16 hours, pulverized, and then evaporated to dryness. 4
It was calcined in air at 70 ° C. for 2 hours. Then, pulverize,
A powder having an average particle size of about 1-2 μm was obtained.

Comparative Example 1 (Li, Na) — (Ba, Ca, Mn, Al) —Si—
Instead of O, Li- (Ba, Ca, Mn, Al) -S
Using i-O, the addition amount is shown in Table 1 with respect to 100 mol% of the base material (8.20 mol%, 12.20 mol%).
A dielectric material was obtained in the same manner as in Example 1 except that the above conditions were satisfied. Using the obtained dielectric material, a disk-shaped sample was produced in the same manner as in Example 1.

Comparative Example 2 (Li, Na) — (Ba, Ca, Mn, Al) —Si—
Instead of O, (Ba, Ca, Mn, Al) -Si-O
And a dielectric material was obtained in the same manner as in Example 1 except that the amount of addition was set to the ratio shown in Table 1 (4.20 mol%) with respect to 100 mol% of the base material. Using the obtained dielectric material, a disk-shaped sample was produced in the same manner as in Example 1.

Comparative Example 3 (Li, Na) — (Ba, Ca, Mn, Al) —Si—
Instead of O, (Mn, Al) -O was used, and the amount of addition was shown in Table 1 with respect to 100 mol% of the base material (1.40).
Mol%) to obtain a dielectric material in the same manner as in Example 1. Using the obtained dielectric material, a disk-shaped sample was produced in the same manner as in Example 1.

Using the disk-shaped samples obtained in Examples 1 to 4 and Comparative Examples 1 to 3, the porcelain characteristics (shrinkage ratio, density), the electric characteristics (relative permittivity ε, insulation resistance IR, CR product,
The characteristics of dielectric loss (tan δ) were evaluated. Table 1 shows the results.

The porcelain characteristics (shrinkage ratio, density) were evaluated as follows. The porcelain density was calculated from the dimensions and mass of the disk-shaped sample. Then, the reference density (true density = 4.7)
The relative density with respect to 98 g / cm ³ ) was determined.

As an evaluation, the relative density is preferably 96
% (Density: 4.6 g / cm ³ ) or more, more preferably 98% (density: 4.7 g / cm ³ ) or more.

Electric characteristics (relative permittivity ε, insulation resistance IR, C
R product, dielectric loss) were evaluated as follows.

The disc-shaped sample was measured at a reference temperature of 25 ° C. using a digital LCR meter (4274A manufactured by YHP).
Frequency 1 kHz, input signal level (measurement voltage) 1 Vrm
Under the condition of s, the capacitance was measured. Then, a relative dielectric constant (no unit) was calculated from the obtained capacitance, the electrode dimensions of the disk-shaped sample, and the distance between the electrodes. afterwards,
Using an insulation resistance meter (R8340A manufactured by Advantest), apply 50 V DC at 25 ° C. to the disc-shaped sample.
The insulation resistance IR after applying for 0 seconds was measured, and the specific resistance ρ (unit: Ωcm) was calculated from the measured value and the electrode area and thickness of the disc-shaped sample.

The CR product was represented by the product of the capacitance (C, μF) and the insulation resistance (R, MΩ).

The dielectric loss (tan δ) was measured at 125 ° C. with a digital LCR meter (4274A manufactured by YHP) at a frequency of 1 kHz and an input signal level (measured voltage) of 1 V.
It was measured under rms conditions.

As an evaluation, the relative dielectric constant ε is an important characteristic for producing a small-sized and high-dielectric-constant capacitor. The insulation resistance IR is preferably 2 × 10 ¹⁴ Ωcm or more. The CR product is preferably 500 MΩ · μF or more, more preferably 2000 MΩ · μF or more. The dielectric loss was preferably less than 1%, and more preferably less than 0.5%.

These characteristic values were determined from the average of the values measured using n = 10 disk samples.

[0111]

[Table 1]

In Table 1, in the numerical value of the insulation resistance IR,
“ME + n” means “m × 10 ^{+ n} ”. Table 1 confirms the following.

As shown in Table 1, the amount of the sintering aid added was smaller in Examples 1 to 4 (Samples 1 to 19) than in Comparative Example 1 (Samples 21 to 28). It was confirmed that sintering was possible with the added amount. Further, with respect to the firing temperature, it was also confirmed that firing can be performed at a lower temperature in Examples 1 to 4 than in Comparative Examples 2 and 3.

Further, regarding the electric characteristics, in the first embodiment,
It was confirmed that the dielectric loss can be improved as compared with Comparative Example 1. In Examples 2 to 4, it was confirmed that the CR product was improved in addition to the dielectric loss as compared with Comparative Example 1. That is,
In Examples 1 to 4, since the sintering aid of the present invention was added, the sintering aid was added in a small amount, and was fired at a low temperature of less than 1300 ° C, preferably 1260 ° C or less, more preferably 1180 ° C or less. However, it was possible to sufficiently densify the chip while maintaining the electrical characteristics. Further, Examples 1 to
In No. 4, since the insulation resistance could be improved without deteriorating the dielectric constant, the CR product could be improved, and further the dielectric loss could be improved.

Example 5 Using the disc-shaped samples of Example 1 and Comparative Example 2, the relationship between firing temperature and density (see FIG. 3) and the relationship between firing temperature and CR product (see FIG. 7) were determined. evaluated. In addition, the relationship between temperature and dielectric loss (see FIG. 11) was evaluated using the sample 1 of Example 1 and the sample of disk 31 of Comparative Example 2.

Example 6 Using the disc-shaped samples of Example 2 and Comparative Example 2, the relationship between firing temperature and density (see FIG. 4) and the relationship between firing temperature and CR product (see FIG. 8) were determined. evaluated. In addition, the relationship between temperature and dielectric loss (see FIG. 12) was evaluated using Sample 7 of Example 2 and a disc-shaped sample of Sample 31 of Comparative Example 2.

Example 7 Using the disc-shaped samples of Example 3 and Comparative Example 2, the relationship between the firing temperature and the density (see FIG. 5) and the relationship between the firing temperature and the CR product (see FIG. 9) were determined. evaluated. Further, the relationship between temperature and dielectric loss (see FIG. 13) was evaluated using the sample 14 of Example 3 and the disk-shaped sample of Sample 31 of Comparative Example 2.

Comparative Example 4 Using the disc-shaped samples of Comparative Examples 1 and 2, the relationship between the firing temperature and the density (see FIG. 6) and the relationship between the firing temperature and the CR product (see FIG. 10) were determined. evaluated. The relationship between temperature and dielectric loss (see FIG. 14) was evaluated using the sample 22 of Comparative Example 1 and the sample of disk 31 of Comparative Example 2.

Regarding the density, as shown in FIGS.
In the sample of each example, since the sintering aid of the present invention was added, it was confirmed that even when firing was performed at a low temperature of less than 1300 ° C., a change in relative density was small and a dense chip could be obtained. did it. Regarding the CR product and the dielectric loss, as shown in FIGS. 7 to 14, in the samples of the examples, since the sintering aid of the present invention was added, even if firing at a low temperature of less than 1300 ° C. It was confirmed that a suitable value was obtained.

[0120]

As described above, according to the present invention, even when fired at a low temperature, the dielectric material is densified without impairing various electric characteristics (such as relative dielectric constant, insulation resistance, CR product, and dielectric loss). A sintering aid capable of obtaining a body porcelain composition is provided.

The sintering aid of the present invention can be suitably used when producing a dielectric ceramic composition used for a dielectric layer of a multilayer ceramic capacitor as an example of an electronic component.

[Brief description of the drawings]

FIG. 1 is a sectional view of a multilayer ceramic capacitor according to an embodiment of the present invention.

FIG. 2 is a tetrahedral composition diagram showing the composition ratio of the sintering aid of the present invention.

FIG. 3 shows (Li, Na)-(B) according to Example 1.
a, Ca, Mn, Al) —Si—O and the sintering temperature and density when the amount of (Ba, Ca, Mn, Al) —Si—O according to Comparative Example 2 was changed. 6 is a graph showing the relationship of.

FIG. 4 shows (Li, Na)-(M) according to Example 2.
n, Al) -Si-O and (B) according to Comparative Example 2
4 is a graph showing the relationship between the firing temperature and the density when the amount of (a, Ca, Mn, Al) —Si—O is changed.

FIG. 5 shows (Li, Na) -W- according to Example 3.
Firing temperature and density when the amount of (Ba, Ca, Mn, Al) -Si-O and the amount of (Ba, Ca, Mn, Al) -Si-O according to Comparative Example 2 are changed. 6 is a graph showing a relationship with the graph.

FIG. 6 shows Li- (Ba, Ca,
The relationship between the sintering temperature and the density when the amount of (Mn, Al) -Si-O and the amount of (Ba, Ca, Mn, Al) -Si-O according to Comparative Example 2 are changed is shown. It is a graph.

FIG. 7 shows (Li, Na)-(B) according to Example 1.
a, Ca, Mn, Al) —Si—O and the calcination temperature and CR product when the amount of (Ba, Ca, Mn, Al) —Si—O according to Comparative Example 2 was changed. 6 is a graph showing a relationship with the graph.

FIG. 8 shows (Li, Na)-(M) according to Example 2.
n, Al) -Si-O and (B) according to Comparative Example 2
5 is a graph showing the relationship between the firing temperature and the CR product when the amount of (a, Ca, Mn, Al) -Si-O is changed.

FIG. 9 shows (Li, Na) -W- according to Example 3.
The firing temperature and CR when the amount of (Ba, Ca, Mn, Al) -Si-O and the amount of (Ba, Ca, Mn, Al) -Si-O according to Comparative Example 2 were changed. It is a graph which shows the relationship with a product.

FIG. 10 shows Li- (Ba, C) according to Comparative Example 1.
a, Mn, Al) -Si-O and the firing temperature and CR product when the amount of (Ba, Ca, Mn, Al) -Si-O according to Comparative Example 2 was changed. It is a graph which shows a relationship.

FIG. 11 is a graph showing the relationship between temperature and dielectric loss in Sample 1 of Example 1 and Sample 31 of Comparative Example 2.

FIG. 12 is a graph showing the relationship between temperature and dielectric loss in Sample 7 of Example 2 and Sample 31 of Comparative Example 2.

FIG. 13 shows a sample 14 of Example 3 and Comparative Example 2
7 is a graph showing the relationship between the temperature and the dielectric loss in the sample 31 of FIG.

FIG. 14 shows Sample 22 of Comparative Example 1 and Comparative Example 2
7 is a graph showing the relationship between the temperature and the dielectric loss in the sample 31 of FIG.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 multilayer ceramic capacitor 10 capacitor element body 2 dielectric layer 3 internal electrode layer 4 external electrode

Continuing from the front page (72) Inventor Takeshi Nomura 1-13-1 Nihonbashi, Chuo-ku, Tokyo FDT term in TDK Corporation 4G030 AA01 AA02 AA03 AA07 AA08 AA09 AA10 AA15 AA24 AA25 AA32 AA35 AA36 AA37 BA09 BA20 GA09 GA15 GA27 4G031 AA04 AA05 AA11 AA12 BA09 GA02 GA07 5E001 AE01 AE02 AE03 AH09 AJ02 5G303 AA01 AB15 BA12 CA01 CB01 CB02 CB03 CB06 CB08 CB10 DA CB14 CB16 CB30 CB30 CB30 CB30 CB30 CB30 CB30 CB21 CB24

Claims (11)

[Claims] (1) a compound of two or more kinds of M1,
1 is a first component containing an alkali metal); a second component containing a compound of M2 (where M2 is a group V element and a group VI element); and a compound of M3 (where M3 is Ba, Ca, Sr, M
g, Mn, B, at least one selected from Al and Zn), and a sintering aid having a fourth component containing an oxide of Si or a compound that becomes an oxide of Si by firing. The composition ratio of these first to fourth components: (first, second, third, and fourth) is calculated as follows: Point A: (100, 0, 0, 0), Point B:
(0,100,0,0), point C: (0,0,100,
0) and point D: when represented by a tetrahedral composition diagram represented by (0, 0, 0, 100), the composition ratio is expressed by the BCD plane (first plane) surrounded by points B, C, and D. A sintering aid characterized by filling a region excluding the above (component = 0 composition). 2. The method according to claim 1, wherein the composition ratio satisfies, in addition to the BCD plane, a region excluding an ABC plane (composition of a fourth component = 0) surrounded by the points A, B, and C. The sintering aid according to claim 1, wherein 3. The method according to claim 2, wherein the two or more compounds of M1 are Li
The sintering aid according to claim 1, comprising an oxide of Na and an oxide of Na. 4. A sintering aid comprising a first component and at least one component selected from a second component, a third component, and a fourth component, wherein the first component comprises two or more types of M1 Of the compound (provided that
M1 includes an alkali metal; the second component includes a compound of M2 (where M2 includes a group V element and a group VI element); and the third component includes a compound of M3 (where M3 is Ba,
At least one selected from Ca, Sr, Mg, Mn, B, Al and Zn), wherein the fourth component is an oxide of Si or Si by firing.
A sintering aid containing a compound that becomes an oxide of sintering. 5. Compounds of two or more types of M1 (provided that M
1 is a sintering aid having a first component containing an alkali metal). 6. The sintering aid according to claim 5, further comprising a second component containing a compound of M2 (where M2 is a group V element and a group VI element). 7. The compound of M2 is an oxide of V, Mo
At least one selected from oxides of
The sintering aid according to claim 6, comprising: 8. The compound of M2 is an oxide of V, Mo
At least 2 selected from oxides of
The sintering aid according to claim 7, comprising: 9. A compound of M3 (where M3 is Ba, C
The sintering aid according to any one of claims 5 to 8, further comprising a third component containing at least one selected from a, Sr, Mg, Mn, B, Al, and Zn). 10. An oxide of Si or, by firing, Si
The sintering aid according to any one of claims 5 to 9, further comprising a fourth component containing a compound that becomes an oxide. 11. The method according to claim 1, wherein the melting point is 1200 ° C. or less.
The sintering aid according to any one of claims 10 to 10.