JP2002334651A5 - Manufacturing method of image forming apparatus - Google Patents

Description

[0001]
[Technical field to which the invention belongs]
The present invention, by performing the energization processing to the conductor relates to a manufacturing method of an image forming apparatus for imparting electron emission function in the conductive body.

That is, the present invention comprises a step of fixing the first airtight member on the first substrate on which the conductor is arranged so as to surround the conductor except for a part of the conductor.
A step of bringing a container onto the first airtight member so as to cover the conductor except for the part of the conductor, and forming an airtight atmosphere between the first substrate and the container.
A step of applying electricity from the part of the conductor to impart an electron emission function to the part of the conductor covered with the container, and
The step of removing the container from the first substrate and
A joining step of joining the second substrate on which the image forming member is arranged on the first airtight member of the first substrate, and
It is a method of manufacturing an image forming apparatus characterized by having.

The method for manufacturing the image forming apparatus of the present invention has, as a preferred embodiment, "the conductor has a wiring and a conductive film on which an electron emitting portion connected to the wiring is formed", "the above. Having a plurality of conductive films, "the plurality of conductive films are connected in a matrix by the wiring", "the energization is performed in a reduced pressure atmosphere", "the energization is performed. , "The reducing gas is hydrogen", "The energization is performed in an atmosphere where an organic substance is present", "The energization is performed in a reducing gas atmosphere" Having a first energizing step and a second energizing step in an atmosphere in which an organic substance is present ”,“ The container must have a gas inlet and a gas exhaust port ”,“ The first The airtight member of 1 is a frit glass, "" the first airtight member is an adhesive and a support frame bonded and arranged on the first substrate by the adhesive, "" the adhesive. Is a frit glass ”,“ the adhesive is indium or an alloy thereof ”,“ a second airtight member is arranged between the first airtight member and the container ”,“ the above. An organic elastic body is used as the second airtight member. ", " The joining step is performed by arranging a third airtight member between the first airtight member and the second substrate. That ", having a cleaning step of cleaning the first airtight member after the step of removing the container from the first substrate and before the joining step", "in the cleaning step , "Use MEK (methyl ethyl ketone)", "Use HFE (hydrofluoro ether) in the cleaning step", "Use MEK (methyl ethyl ketone) and HFE (hydrofluoro ether) in the cleaning step", ""Use a second adhesive as the third airtight member", "The second adhesive must be frit glass", "The second adhesive must be indium or an alloy thereof", Is included.

Claims (24)

Fixing a first hermetic member on the first substrate on which the conductor is disposed so as to surround the conductor except for a part of the conductor;
A step of bringing a container into contact with the first hermetic member so as to cover the conductor excluding the portion of the conductor and forming an airtight atmosphere between the first substrate and the container;
Conducting electricity from the part of the conductor, and providing an electron emission function to a part of the conductor covered with the container;
Removing the container from the first substrate;
A bonding step of bonding the second substrate on which the image forming member is disposed on the first hermetic member of the first substrate;
A method of manufacturing an image forming apparatus , comprising: The method of manufacturing an image forming apparatus according to claim 1, wherein the conductor includes a wiring and a conductive film on which an electron emission portion connected to the wiring is formed. The method of manufacturing an image forming apparatus according to claim 2, comprising a plurality of the conductive films. The method of manufacturing an image forming apparatus according to claim 3, wherein the plurality of conductive films are connected in a matrix by the wiring. The method for manufacturing an image forming apparatus according to claim 1, wherein the energization is performed in a reduced pressure atmosphere. The method of manufacturing an image forming apparatus according to claim 1, wherein the energization is performed in a reducing gas atmosphere. The method of manufacturing an image forming apparatus according to claim 6, wherein the reducing gas is hydrogen. The method for manufacturing an image forming apparatus according to claim 1, wherein the energization is performed in an atmosphere in which an organic substance is present. The energization image according to any one of claims 1 to 4, characterized in that a second current supply step in an atmosphere which is present in the first energizing step and the organic substances in a reducing gas atmosphere Manufacturing method of forming apparatus . The image forming apparatus manufacturing method according to claim 1, wherein the container is a container having a gas inlet and a gas exhaust port. The method of manufacturing an image forming apparatus according to claim 1, wherein the first airtight member is frit glass. The image forming apparatus according to claim 1, wherein the first hermetic member is an adhesive and a support frame that is adhered and disposed on the first substrate. Manufacturing method. The method of manufacturing an image forming apparatus according to claim 12, wherein the adhesive is frit glass. The method of manufacturing an image forming apparatus according to claim 12, wherein the adhesive is indium or an alloy thereof. The method for manufacturing an image forming apparatus according to claim 1, wherein a second hermetic member is disposed between the first hermetic member and the container. The method of manufacturing an image forming apparatus according to claim 15, wherein an organic elastic body is used as the second hermetic member. The bonding step, between the first hermetic member and the second substrate, according to any one of claims 1 to 16, characterized by being performed by placing the third airtight member Manufacturing method of the image forming apparatus. Even after the step of removing said containers from said first substrate, prior to the bonding step, one of the claims 1 to 17, characterized in that a cleaning step for cleaning the said first hermetic member A method for manufacturing the image forming apparatus according to claim 1 . 19. The method of manufacturing an image forming apparatus according to claim 18 , wherein MEK (methyl ethyl ketone) is used in the cleaning step. The method of manufacturing an image forming apparatus according to claim 18 , wherein HFE (hydrofluoroether) is used in the cleaning step. 19. The method of manufacturing an image forming apparatus according to claim 18 , wherein MEK (methyl ethyl ketone) and HFE (hydrofluoroether) are used in the cleaning step. The method for manufacturing an image forming apparatus according to claim 17 , wherein a second adhesive is used as the third hermetic member. 23. The method of manufacturing an image forming apparatus according to claim 22 , wherein the second adhesive is frit glass. 23. The method of manufacturing an image forming apparatus according to claim 22 , wherein the second adhesive is indium or an alloy thereof.