JP2003080658A - Substrate laminating apparatus, laminated substrate and method for manufacturing electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem that thin plate glass is easily broken and cracked during a handling process and a defective product occurs frequently in a process for forming a device by laminating a thin plate glass substrate and an opposed glass substrate. SOLUTION: Thin plate glass (first substrate) is preliminarily bonded to a support substrate (second substrate) to form a laminated substrate and, after an electronic part (device) is formed from the laminate, the support substrate (second substrate) is peeled from the electronic part (device). At this time, fine grooves are formed to the surface of one substrate or a resin reducing pressure-sensitive adhesiveness by the irradiation with specific light is used on the surface of one substrate through a spacer to make the substrate easily peelable and the support substrate (second substrate) is reused to achieve cost reduction.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding apparatus for manufacturing a bonded substrate using a thin substrate, a method for manufacturing a bonded substrate using a thin substrate, and an electronic component using the bonded substrate. The present invention relates to a method for manufacturing an electronic component in the field of image display devices, sensors, etc., which is formed by using a substrate such as a conductor, a semiconductor, or an insulator.

[0002]

2. Description of the Related Art Liquid crystal display devices, plasma display devices, EL
Various image display devices such as display devices, CCD and line sensors, various sensors such as two-dimensional array sensors and X-ray sensors, various LSIs such as RAM and MPU, electronic parts such as solar cells, semiconductors such as Si, stainless steel, etc. Conductors such as
By repeating the steps of forming a thin film on a substrate made of an insulating material such as glass or ceramic by a sputtering method or a spin coating method and forming a pattern by a photolithography method, an electronic component having a required function is manufactured. It

However, recent mobile products such as mobile phones and personal digital assistants and various applied products such as video cameras are
In order to increase the competitiveness of products, downsized and lightweight electronic components are used. For this purpose, a method has been proposed in which a substrate used for an electronic component is thinned to reduce its size and weight.

The present invention aims to reduce the thickness of this substrate. For example, conventionally, as a method of manufacturing a thin liquid crystal display device, a glass substrate on which a plurality of liquid crystal display elements (TFTs, pixel electrodes, etc.) are formed and a counter substrate on which a color filter is formed are attached to each other to form a bonded substrate. After the formation, a manufacturing method has been proposed in which the laminated glass substrate is thinned by etching the outer surface (registered No. 2722).
798 publication).

Separately from this, when forming a pattern on a thin substrate, a method of arranging the thin substrate on a supporting substrate for reinforcement so that the thin substrate is not cracked or chipped is manufactured. Proposed (JP-A-4-186816)
Issue). In the method described in Japanese Patent Laid-Open No. 4-186816, when a semiconductor electronic component is manufactured, a photolithography process is performed by interposing a photoresist to fix a thin semiconductor substrate on a semiconductor supporting substrate. There is.

Specifically, a photoresist is applied to a semiconductor support substrate and prebaked, then a thin semiconductor substrate is placed on the support substrate, and the photoresist is applied and prebaked.

Next, after exposing the electrode pattern, development is performed to form a photoresist pattern.

As a result, the process can be performed without causing cracks and chips in the thin semiconductor substrate in the photolithography manufacturing process, so that the yield can be improved.

In the case of a translucent insulating substrate as a substrate different from the above-mentioned semiconductor substrate, a method for producing a laminated glass by bonding and polymerizing the glass sheets under vacuum has been proposed as a method for joining the glass sheets. . In the method for manufacturing laminated glass under vacuum, a laminated glass manufacturing apparatus including a carriage 62 having an airtight chamber 61 containing a material for laminated glass as shown in FIG. 9 and a heating chamber 64 provided with a heater 63 for heating is provided. It is used to join glass.

Specifically, a glass plate laminated with an adhesive layer is placed in an airtight chamber 61, and at least the upper surface of the glass plate is an objective sheet having heat resistance, airtightness and stretchability. After covering, the airtight chamber 61 is pre-evacuated so that no air bubbles are present between the laminated glass plates, and a vacuum state is established to some extent.

Next, the carriage 62 is introduced into the heating chamber 64,
The vacuum exhaust valve 214 is evacuated and heated by the heater 63 to melt the adhesive layer between the glass substrates. afterwards,
The trolley is taken out of the heating chamber 64 and cooled to bond the glass substrates together, and the bonded substrate is taken out of the airtight chamber 61 to produce a laminated glass (Japanese Patent Laid-Open No. 9-
169550).

[0012]

However, as described in JP-A-4-186816, in the method of etching a glass substrate to make it thinner, the glass is melted and thinned by etching, so that the glass is effectively used. However, there is a problem that etching cost is required.

Further, in the method of interposing a photoresist for fixing the semiconductor supporting substrate and the thin semiconductor substrate like the manufacturing method described in Japanese Patent Laid-Open No. 4-186816, since the photoresist is used for bonding, the photoresist is used. When a process other than the lithography process is performed, the adhesion between the substrates is low and the substrates are separated from each other.

For example, when a photoresist is swollen or dissolved by a chemical liquid material, for example, when a wet process necessary for manufacturing electronic parts is performed, the photoresist is practically used.
There is a problem that it cannot be used in the manufacturing process.

Further, in the method for manufacturing a laminated glass of FIG. 9, since the glass substrates are firmly bonded via the adhesive layer, it is not easy to separate the bonded glass substrates. As a method of peeling each glass of the laminated glass from the adhesive layer, fine cracks are generated in the glass, and the adhesive force is reduced by including moisture in the adhesive layer through the cracks, and the glass and the adhesive layer are separated. A method is proposed in Japanese Patent Laid-Open No. 6-247752. However, in this method, since the glass is crushed, there is a problem that the separated glass substrate cannot be reused.

The present invention has been made in view of the above-mentioned conventional problems, and provides a bonding apparatus capable of easily bonding a plurality of substrates (thin first substrate and thick second substrate). To do.

Further, the present invention has been made in view of the above-mentioned problems of the prior art, and is a bonded substrate which facilitates bonding between a plurality of substrates (thin first substrate and thick second substrate). The present invention provides a method for manufacturing the same.

Further, the present invention has been made in view of the above-mentioned problems of the related art, and it is possible to easily join a plurality of substrates (a thin first substrate and a thick second substrate) and to perform the steps. The inside can hold the bonding between the plurality of substrates (the first substrate and the second substrate), and after the process is completed, the bonding layer between the first substrate and the second substrate is separated without crushing the substrate, The separated second substrate can be reused as a supporting substrate to reduce the cost.

Further, by using a thin substrate (first substrate) which is apt to be cracked or chipped to be bonded to the second substrate, cracking or chipping can be prevented during the manufacturing process and the yield can be improved. It is intended to provide a method for manufacturing a component.

[0020]

A substrate bonding apparatus for solving the above problems is a deformable objective sheet for partitioning the inside of the bonding apparatus into two spaces, and one surface of the objective sheet. It is characterized by having an applied adhesive layer and a gas suction / exhaust means for the two spaces.

Further, the laminating apparatus has a sheet reel mechanism for stretching and rewinding the objective sheet.

According to the apparatus having the above structure, the deformable objective sheet is used even in the step of bonding the thin substrate (first substrate), which is easily cracked or chipped, to the second substrate, and the pressure on both sides is applied. Since the difference is used, the bonding can be performed smoothly, so that cracking or chipping of the thin substrate can be prevented, and as a result, the yield of the bonding process can be improved.

A method for manufacturing a bonded substrate according to the present invention, which has been made to solve the above-mentioned problems, has a structure in which a bonding layer is arranged on a second substrate and the first substrate is arranged on the bonding layer. A method of manufacturing a laminated substrate, wherein the first substrate and the second substrate are arranged inside a bonding apparatus, and
Stretchable objective sheet touches almost the entire surface of the substrate,
Inside the bonding apparatus, a second space in which the first substrate and the second substrate are arranged and a first space in which the substrate is not arranged
The object sheet separates the space in the bonding apparatus.

In the step of joining the first substrate and the second substrate, a second space in which the first substrate and the second substrate are arranged and a first space in which the substrate is not arranged A partial pressure region of the first substrate is brought into contact with the second substrate through the objective sheet in contact with the first substrate by causing a pressure difference between the first substrate and the second substrate to gradually enlarge the bonding region. The bonding of the entire surfaces of the substrates is performed.

After joining the substrates, the objective sheet and the first
As for the peeling from the substrate, the adhesiveness of the objective sheet is much smaller than the adhesiveness of the bonding layer between the substrates. The spaces are separated.

According to the above method, the substrates can be bonded uniformly in a simple process, cracks and chips during the manufacturing process can be prevented, and the yield can be improved.

Further, in the present invention, in the method for manufacturing a bonded substrate having a structure in which the first substrate and the second substrate are arranged with the bonding layer interposed, the first substrate and the second substrate facing each other. At least one of the surfaces has a groove structure, and the bonding resin is arranged in the space of the groove to function as a bonding layer.

According to the above construction, the bonded substrates can be easily separated without crushing after the manufacturing process, so that the substrates can be reused and the cost can be reduced.

Further, in the present invention, in the method for manufacturing a bonded substrate having a structure in which the first substrate and the second substrate are arranged with the bonding layer interposed therebetween, the first substrate and the second substrate which face each other. The substrate has a groove structure between the substrates, the bonding resin is arranged in the adhesive region around the substrate, and the space portion of the groove region inside the peripheral adhesive region is configured in a reduced pressure state. .

According to the above structure, the bonded substrate stack can be easily separated without crushing after the manufacturing process, so that the supporting substrate can be reused and the cost can be reduced.

Further, in the present invention, in the bonded substrate manufacturing method having the structure in which the first substrate and the second substrate are arranged via the bonding layer, the opposing first substrate and second substrate are It is characterized in that a bonding resin is arranged between the substrates in a spacer and a bonding region around the substrate, and a region inside the peripheral bonding region is formed in a reduced pressure state.

According to the above structure, the bonded substrate stack can be easily separated without crushing after the manufacturing process, so that the supporting substrate can be reused and the cost can be reduced.

Further, the present invention is characterized in that in the method for manufacturing a bonded substrate, the adhesive resin in the adhesive region is formed of an adhesive resin whose adhesive force is reduced when a specific light is irradiated.

According to the above structure, the bonded substrate stack can be easily separated without crushing after the manufacturing process, so that the supporting substrate can be reused and the cost can be reduced.

According to the method of manufacturing an electronic component of the present invention, an electrode is formed on the first substrate side of the bonded substrate in which the first substrate and the second substrate are bonded, and the first substrate and the second substrate are bonded. Electrodes are also formed on the side of the first substrate of another bonded substrate, and both electrode substrates are bonded to each other at the seal portion with the electrode surface inside, with the spacer interposed therebetween.

After bonding, after injecting liquid crystal and sealing, the outer second substrate having no electrodes formed thereon is peeled off by light irradiation to form a substrate having a thin electrode pattern between the substrates. Electronic components are manufactured.

By peeling off the adhesive layer by light irradiation, it is possible to easily separate a substrate (supporting substrate) having a large substrate thickness without crushing the bonded substrate after the manufacturing process, so that the supporting substrate can be reused. The cost can be reduced.

[0038]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the method for manufacturing a bonded substrate of the present invention will be described below with reference to the drawings. However, this does not limit the embodiment.

(Embodiment 1) FIG. 1 shows the structure of a bonded substrate manufactured by the manufacturing method of the present invention.

On the second substrate 11 formed by forming the groove structure 12 on the surface of the translucent insulating substrate, the adhesive material is applied so as to be uniformly arranged in the space portion 14 of the groove. , Forming a bonding layer. A first substrate 13 made of a light-transmitting insulating substrate was bonded onto it to form a bonded substrate 10.

As the translucent insulating substrate used as the second substrate 11, a 7059 substrate manufactured by Corning was used, and a groove structure was formed by etching or blasting. Although a V-shaped structure is formed as the groove structure, it may have a rectangular shape or a semicircular shape. After applying a coupling material on the translucent insulating substrate 11 to improve the adhesion with the adhesive material, the UV curable acrylic adhesive material 41 is slotted so that it is evenly arranged in the groove portion. It was applied using the coating method.

The process of bonding the second substrate 11 and the first substrate 13 will be described with reference to FIGS. 2 to 5. In the inside of the bonding apparatus housing 21, a second space 25a in which the first substrate and the second substrate are arranged and a first space 25b in which the substrate is not arranged are spatially separated by the objective sheet 24. The airtightness of each space is maintained by the objective sheet 24. Here, as the objective sheet 24, fluororubber is used as a material having airtightness and flexibility,
Silicone rubber or butyl rubber may be used (Fig. 2).

First substrate and second to the second space 25a
The substrate is introduced by using a substrate transfer robot.
When the second substrate 11 made of an insulating substrate placed on the robot arm 22 is introduced into the second space 25a, the second substrate 11
The robot arm 22 is held by the support pins 28 that have risen from the substrate stage 26a for substrates, and only the robot arm 22 is pulled out of the housing 21 of the bonding apparatus (FIG. 3).

After that, the support pins 28 are lowered to hold the second substrate 11 on the substrate stage 26a for the second substrate. Here, the second substrate 11 is brought into close contact with the substrate stage 26a for the second substrate by the electrostatic chuck (FIG. 3). Similarly, when the first substrate 13 made of an insulating substrate placed on the robot arm 23 is introduced into the second space 25a, the robot arm 23 ascends and is placed in contact with the substrate stage 26b for the first substrate. The first substrate 13 is held on the formed objective sheet 24 (FIG. 3).

Objective sheet 24 to which the first substrate 13 adheres
An adhesive layer is formed on the surface of the first substrate 13 so that the first substrate 13 can be held. Here, the adhesive strength of the adhesive layer is set to be weaker than the adhesive strength of the adhesive layer on the second substrate. (Figure 3).

After disposing the second substrate 11 and the first substrate 13 in the second space 25a and closing the arm transfer port doors 29a and 30a, the second space 25a in which both substrates are disposed and the substrate are The first space 25b not arranged is evacuated at the same time to bring the entire inside of the casing 21 of the bonding apparatus into a vacuum state. In this state, the sheet moving unit 210 holding one end of the objective sheet 24 is moved downward.

At the same time, the objective sheet is sent out from the sheet reel unit 211, and the first substrate 13 is set obliquely with respect to the second substrate 11 as shown in FIG. At this time, since the end face of the first substrate 13 on the sheet moving unit 210 side is in contact with the substrate alignment unit 27,
The second substrate and the first substrate are arranged so as not to be displaced (FIG. 4).

Next, the second substrate 11 and the first substrate 13 are bonded to each other as shown in FIG.
With the valve 12 closed, the gas introduction valve 213 is opened to gradually increase the pressure in the first space 25b in which the substrate is not arranged, and while bending the first substrate 13, sequentially from the end of the first substrate 13, It is brought into close contact with the second substrate.

At this time, in the sheet reel unit 211, a mechanism for feeding out the objective sheet in accordance with the curved state of the substrate is provided so that the objective sheet is stretched by the pressure rise due to the gas introduction and the first substrate is not extremely curved. Have By this step, the second substrate and the first substrate can be bonded together without a gap (FIG. 5).

After the bonding, the pressure in the second space 25a is gradually made higher than the pressure in the first space 25b, and then the objective sheet 24 is peeled off from the first substrate 13 by rewinding the sheet reel section. Then, the case 2 of the laminating apparatus
After returning the inside of 1 to atmospheric pressure, the bonded substrate is taken out using the robot arm 22, and the bonding process is completed.

In the production of the bonded substrate, the second substrate 1
The thickness of 1 was 1.1 mm, and the thickness of the first substrate 13 was 0.5 mm. Since the thickness of the first substrate is thin, it is easily damaged by the ordinary method and the bonding is difficult, but by using the method of the present invention, the thin first substrate can be bonded without damage.

In the method of the present invention, the thickness of the second substrate 11 and the first substrate 13 is not limited, but the thickness of the first substrate is 1.1 mm or less, more preferably 0.5.
It is preferable to use a thickness of mm or less.

(Embodiment 2) FIG. 6 shows a process of manufacturing a liquid crystal display device (electronic component) using a bonded substrate using a first substrate and a second substrate. A transparent conductive film 32a made of ITO is formed on the bonded substrate 31a by sputtering (a). A photoresist is applied thereon, and after prebaking, the stripe pattern is exposed and developed to form a pattern, and ITO is etched to form a stripe-shaped transparent electrode 33a (b). An alignment film 34a made of a polyimide material is formed thereon by screen printing, and the alignment layer film surface is rubbed (c).
The transparent electrodes 33b and the alignment film 34b are formed on the opposite bonded substrates 31b by the same process, and the striped transparent electrodes 33a and 33b on the respective substrates are formed.
Are arranged so as to be orthogonal to each other, and the substrates 31a and 31b are attached to each other by the seal portion 36 via the spacer (d).

Next, when the entire surface of the bonded substrate stack 31a, 31b is irradiated with specific ultraviolet light, the adhesive force of the adhesive layer of the bonded substrate stack is reduced, and the second substrate 11a and the first substrate of the bonded substrate stack 31a are bonded to each other. The substrate 13a can be easily separated. Similarly, the second substrate 11b and the first substrate 13b of the bonded substrate stack 31b can be easily separated.
(E). After that, a polarizing plate 35 is attached to both substrates to strengthen the strength of the substrate surface of the thin first substrate 13a. A liquid crystal panel can be manufactured by injecting liquid crystal after the same steps are performed on the thin first substrate 13b on the opposite substrate side (f).

According to this structure, it is possible to make the device thinner than the conventional liquid crystal panel. In addition, the second substrates 11a and 11
Since b can also be separated without crushing, it can be reused and the manufacturing cost can be reduced.

Further, by disposing a plastic substrate, a sheet, and a polarizing plate on the first substrate, it is possible to prevent the glass from breaking easily, so that an electronic component which is light and strong against impact is manufactured. be able to.

(Third Embodiment) In the first embodiment, the UV curable acrylic adhesive material is applied and arranged on the entire surface of the bonded substrate 10 as a bonding medium, but the second substrate and the first substrate are arranged. Since it is necessary to irradiate specific UV light on the entire surface of the substrate to separate the components, this method should be used when electronic components are used that are susceptible to deterioration by UV light or specific light. Is difficult. In this case, as shown in FIG. 7, a UV curable acrylic adhesive material 41 is applied to the adhesive region around the second substrate, and the space portion of the groove structure inside the substrate is set to a reduced pressure state 42. By laminating, the laminated substrate 40 can be formed, and the adhesiveness can exhibit the same level of performance as in the case where the adhesive material is the entire surface (FIG. 7).

As a result, the second substrate and the first substrate can be separated by locally irradiating the substrate with the specific UV light, so that the electronic parts are deteriorated by the UV light and the specific light. Even if a member that is easy to use is used, it is possible to prevent the light from hitting. This allows the bonded substrate to be used without limiting the range of use.

As the UV-curable acrylic adhesive material, only the adhesive layer was used here, but if necessary, an adhesive layer is formed on both sides of the polyimide or polyolefin sheet, and this is used as the bonding layer. May be.

Although the UV-curing acrylic adhesive material is used as the adhesive medium, the adhesive medium is not limited to this and an adhesive material such as a silicon gel material can be used for this purpose.

Inside the bonding apparatus, the second space 25a in which the substrate is arranged and the first space 25b in which the substrate is not arranged are spatially separated by a single bag-shaped objective sheet. However, the present invention is not limited to this, and the first substrate is held and moved by the objective sheet, and the space is separated by another bag-shaped rubber having airtightness and flexibility, and a pair of two is used. Spatial separation may be achieved by combining.

(Embodiment 4) FIG. 8 shows the structure of a bonded substrate manufactured by a manufacturing method of another invention.

Second substrate 1 made of translucent insulating substrate
Spacers 53 are dispersedly arranged on the surface of No. 1 and an adhesive material is applied to the outer peripheral portion of the second thick substrate 11 to form an adhesive layer 51. Next, by a method similar to the method of bonding the second substrate and the first substrate shown in Embodiment Mode 1, the first substrate 13 having a small thickness and formed of an insulating substrate that is transparent in vacuum is The second substrate 11 was bonded to form a bonded substrate 50.

As the translucent insulating substrate used as the second substrate 11, a 7059 substrate manufactured by Corning Incorporated was used.
Further, after a coupling material is applied on the support substrate 11 made of a translucent insulating substrate to improve the adhesion with the adhesive material, the UV curable acrylic adhesive material 41 is uniformly applied to the peripheral portion of the substrate. A dispenser was applied so that the substrates were laminated to form a bonded substrate.

In the above embodiment, an insulating substrate such as glass was used as the substrate, but the substrate is not limited to this, and a semiconductor substrate such as Si or GaAs or a conductive substrate such as stainless steel or aluminum may be used. , The same effect can be obtained.

[0066]

As described above, according to the bonding apparatus of the present invention, the method of manufacturing a bonded substrate of the present invention, and the method of manufacturing an electronic component of the present invention, the first substrate (thin plate)
The bonding and peeling between the second substrate and the second substrate can be easily performed, and as a result, the bonded substrate reinforced by the second substrate can be used in the manufacturing process of the electronic component, so that cracking and chipping during the manufacturing process of the electronic component can be prevented. Therefore, the yield can be improved. Further, after the process is completed, the substrate and the adhesive layer can be separated without crushing the substrate, and the second substrate (supporting substrate) can be reused, so that the cost can be reduced.

[Brief description of drawings]

FIG. 1 is a conceptual diagram showing a configuration of a bonded substrate stack according to an embodiment of the present invention.

FIG. 2 is a conceptual diagram of a manufacturing process of a bonded substrate stack according to an embodiment of the present invention.

FIG. 3 is a conceptual diagram of a manufacturing process of a bonded substrate according to an embodiment of the present invention.

FIG. 4 is a conceptual diagram of a manufacturing process of a bonded substrate according to an embodiment of the present invention.

FIG. 5 is a conceptual diagram of a manufacturing process of a bonded substrate stack according to an embodiment of the present invention.

FIG. 6 is a conceptual diagram of a manufacturing process of an electronic component according to an embodiment of the present invention.

FIG. 7 is a conceptual diagram showing a configuration of a bonded substrate according to another embodiment of the present invention.

FIG. 8 is a conceptual diagram showing a configuration of a bonded substrate according to another embodiment of the present invention.

FIG. 9 is a conceptual diagram of a conventional bonded substrate manufacturing method.

[Explanation of symbols]

10, 31a, 31b, 40, 50 Bonded substrate 11 Second substrate 12 Groove structure 13 First substrate 21 Bonding device housings 22, 23 Robot arm 24 Objective sheet 25a First substrate, second substrate The second is placed
25b first substrate, second substrate is not placed first space 26b first substrate substrate stage 26a second substrate substrate stage 27 substrate alignment unit 29 arm transfer port 29a arm transfer port Door 30 Arm transport port 30a Arm transport port Door 32a Transparent conductive film 33a Striped transparent electrode 34a Alignment film 34b of polyimide material Alignment film of polyimide material 35 Polarizing plate 36 Bonding seal 41 UV curable acrylic adhesive 42 Decompression Part 52 Liquid crystal 53 Spacer 61 Airtight chamber 62 Carriage 63 Heating heater 64 Heating chamber 210 Sheet moving part 211 Seat reel part 212 Vacuum exhaust valve 213 Gas introduction valve 214 Vacuum exhaust valve 215 Gas introduction valve

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor, K. Hatano             22-22 Nagaikecho, Abeno-ku, Osaka-shi, Osaka             Inside the company F term (reference) 2H090 JB02 JC00 JC11 JC20                 4F100 AG00A AK01C AK25C AK52C                       AT00A AT00B BA02 BA03                       BA06 BA13 CB00C EH46                       GB41 JB14C JG04B JL02                       JL11C JL13C JL14                 4G061 AA18 AA25 BA03 CB04 CB16                       CD02 CD18 DA22 DA30 DA36                       DA51 DA61 DA67 DA68

Claims (10)

[Claims] 1. A device for laminating substrates, comprising a deformable objective sheet for partitioning the interior of the device into two spaces.
An adhesive layer provided on one surface of the objective sheet;
An apparatus for laminating substrates, characterized in that it has means for sucking and exhausting gas to and from one space. 2. The substrate bonding apparatus according to claim 1, further comprising a sheet reel mechanism for stretching and rewinding the objective sheet. 3. A deformable objective sheet for partitioning the inside of the bonding apparatus into two spaces, an adhesive layer provided on one surface of the objective sheet, and gas suction / exhaust means for the two spaces. In the method for manufacturing a bonded substrate using the substrate bonding apparatus, the first substrate is bonded to the adhesive layer surface of the objective sheet, and the suction / exhaust of gas into the two spaces is controlled, While deforming the objective sheet, the first substrate and the second substrate placed on the first substrate surface side are gradually bonded via a bonding layer that fixes the first substrate and the second substrate. A method for manufacturing a bonded substrate, which comprises: 4. The bonding layer has a structure in which at least one surface of the first substrate and the second substrate facing each other has a groove structure, and a bonding resin is arranged in a space portion of the groove. The method for manufacturing a bonded substrate according to claim 3, wherein. 5. The bonding layer has a groove structure on at least one surface of the first substrate and the second substrate facing each other, and a bonding resin is disposed in an adhesive region around the substrate, 4. The method for manufacturing a bonded substrate according to claim 3, wherein the space portion of the groove structure inside the bonding region of is formed in a reduced pressure state. 6. The bonding layer includes a spacer and a bonding resin disposed in a bonding area around the spacer between the substrates of the first substrate and the second substrate facing each other. The method for manufacturing a bonded substrate according to claim 3, wherein the inner region is formed in a reduced pressure state. 7. The method for manufacturing a bonded substrate according to claim 4, wherein the bonding resin is made of an adhesive material whose tackiness is reduced when a specific light is irradiated. . 8. An electrode substrate in which an electrode is formed on the first substrate side of a bonded substrate bonded by the manufacturing method according to any one of claims 3 to 7, and any one of claims 3 to 7. A second electrode substrate having electrodes formed on the first substrate side of the bonded substrate bonded by the manufacturing method of
A method for manufacturing an electronic component, comprising: after adhering substrates to each other and bonding them together, peeling off at least one of the outer second substrates on which electrodes are not formed. 9. The method for manufacturing a bonded substrate according to claim 3, wherein the first substrate has a substrate thickness thinner than that of the second substrate. 10. The method of manufacturing an electronic component according to claim 8, wherein the first substrate has a substrate thickness smaller than that of the second substrate.