JP2002329685A - Dicing apparatus - Google Patents
Dicing apparatusInfo
- Publication number
- JP2002329685A JP2002329685A JP2001131713A JP2001131713A JP2002329685A JP 2002329685 A JP2002329685 A JP 2002329685A JP 2001131713 A JP2001131713 A JP 2001131713A JP 2001131713 A JP2001131713 A JP 2001131713A JP 2002329685 A JP2002329685 A JP 2002329685A
- Authority
- JP
- Japan
- Prior art keywords
- work
- water
- rotary blade
- dicing apparatus
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cleaning By Liquid Or Steam (AREA)
- Dicing (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明はダイシング装置に関
し、 特に該ダイシング装置で加工するワークの上面に切
削屑が付着し難いダイシング装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dicing apparatus, and more particularly, to a dicing apparatus in which cutting chips hardly adhere to an upper surface of a workpiece processed by the dicing apparatus.
【0002】[0002]
【従来の技術】従来のダイシング装置の加工部拡大図を
図5に示す。この従来のダイシング装置の加工部は、ワ
ークWを加工する回転刃21を先端に取付けた高周波モ
ータ内蔵型のスピンドル22が図のY−Yで示すY方向
にインデックス送りされるようになっている。また、ワ
ークWは図示しないワークテーブルに載置されて、図の
X−Xで示すX方向に切削送りされる。更に回転刃21
を覆うフランジカバー23がスピンドル22に取付けら
れており、このフランジカバー23には切削水ノズル2
4と、一対の冷却水ノズル25、25が回転刃21を前
後で挟むように取付けられている。この切削水ノズル2
4は切削水供給管24Aと、また一対の冷却水ノズル2
5、25は冷却水供給管25Aと夫々フランジカバー2
3内で連通している。2. Description of the Related Art FIG. 5 is an enlarged view of a processing portion of a conventional dicing apparatus. In the processing section of this conventional dicing apparatus, a spindle 22 with a built-in high-frequency motor having a rotary blade 21 for processing a work W attached to the tip is index-fed in the Y direction indicated by Y-Y in the drawing. . The work W is placed on a work table (not shown) and cut and fed in the X direction indicated by XX in the figure. Furthermore, the rotary blade 21
A flange cover 23 for covering the cutting water nozzle 2 is attached to the spindle 22.
4 and a pair of cooling water nozzles 25, 25 are attached so as to sandwich the rotary blade 21 in front and rear. This cutting water nozzle 2
4 is a cutting water supply pipe 24A and a pair of cooling water nozzles 2
5 and 25 are a cooling water supply pipe 25A and a flange cover 2 respectively.
It communicates within 3.
【0003】この従来のダイシング装置でワークWを加
工するときは、先ず高速で回転する回転刃21がY方向
に送られて最初の加工ラインに位置決めされる。次いで
切削水が切削水供給管24Aを通って切削ノズル24か
ら回転刃21の刃先に供給されると共に、冷却水が冷却
水供給管を通って一対の冷却水ノズル25、25から回
転刃21の側面に供給される。この状態でワークWがX
方向に切削送りされることにより、最初の1ラインの加
工が行われる。次に回転刃21はY方向に1ピッチイン
デックス送りされ、次のラインが加工される。この動作
を繰り返して全てのラインが加工されるが、加工中に発
生する切削屑は切削水と冷却水とによってワークWの表
面から流し去られる。[0003] When processing a workpiece W with this conventional dicing apparatus, first, a rotating blade 21 rotating at a high speed is fed in the Y direction and positioned on a first processing line. Next, the cutting water is supplied from the cutting nozzle 24 to the cutting edge of the rotary blade 21 through the cutting water supply pipe 24A, and the cooling water is supplied from the pair of cooling water nozzles 25, 25 through the cooling water supply pipe. Supplied to the side. In this state, the work W
The first line is processed by being cut and fed in the direction. Next, the rotary blade 21 is fed by one pitch index in the Y direction, and the next line is processed. By repeating this operation, all the lines are machined, but the cutting chips generated during the machining are washed away from the surface of the workpiece W by the cutting water and the cooling water.
【0004】[0004]
【発明が解決しようとする課題】しかし、切削屑は完全
に流し去られるわけではなく、残留した切り屑がワーク
Wの表面に付着する。この場合、従来の切削水ノズル、
冷却水ノズルは回転刃21側に取り付けられているの
で、加工当初の部分に残存した切削屑は、切削水、冷却
水から離れるので時間の経過と共に乾燥してしまう。こ
の加工中に発生する切削屑は非常に細かい粉末であっ
て、一度乾燥してこびりついてしまうと容易に落ち難い
性質を持っている。このように、最初の頃に加工したラ
インの付近に付着した切削屑は終わりの方のラインを加
工する頃には乾燥してしまい、ダイシング後のスピン洗
浄でも完全には除去できない。特にワークWが半導体ウ
エーハの場合には、この表面の汚れは品質の低下をきた
し問題が大きい。しかもこの問題はワークWが大型化す
るほど顕著であり、直径300mmの半導体ウエーハでは
どうしても解決しなければならない問題である。However, the cutting chips are not completely washed away, and the remaining chips adhere to the surface of the work W. In this case, the conventional cutting water nozzle,
Since the cooling water nozzle is attached to the rotary blade 21 side, the cutting chips remaining in the initial portion of the processing are separated from the cutting water and the cooling water, so that the chips are dried over time. The cutting waste generated during the processing is a very fine powder, and has a property that once dried and adhered, it is hard to fall off. As described above, the cutting chips adhering to the vicinity of the line processed at the beginning are dried when the line at the end is processed, and cannot be completely removed by spin cleaning after dicing. In particular, when the work W is a semiconductor wafer, the contamination on the surface lowers the quality and is a problem. In addition, this problem becomes more remarkable as the size of the work W increases, and must be solved for a semiconductor wafer having a diameter of 300 mm.
【0005】本発明は、このような事情に鑑みてなされ
たもので、大型ワークであっても切削屑等の汚れが表面
に付着しない、コンタミネーションフリーのダイシング
装置を提供することを目的とする。The present invention has been made in view of such circumstances, and has as its object to provide a contamination-free dicing apparatus in which dirt such as cutting chips does not adhere to the surface of a large workpiece. .
【0006】[0006]
【課題を解決するための手段】本発明は、前記目的を達
成するために、請求項1に記載のように、ワークを加工
する回転刃と、該ワークを載置して前記回転刃に対して
相対的にX及びY方向に移動するワークテーブルとを有
するダイシング装置において、前記ワークの上面全面を
覆う水の膜又は水の流れを形成するための洗浄水ノズル
が前記ワークテーブル外周近傍に設けられており、前記
洗浄水ノズルは前記ワークテーブルと一緒に前記回転刃
に対してX及びY方向に相対移動することを特徴として
いる。According to the present invention, in order to achieve the above object, a rotary blade for processing a work, and a rotary blade for mounting the work on the rotary blade are provided. A work table moving relatively in the X and Y directions, a washing water nozzle for forming a water film or a flow of water covering the entire upper surface of the work is provided near the outer periphery of the work table. The cleaning water nozzle moves relative to the rotary blade in the X and Y directions together with the work table.
【0007】この請求項1に記載の発明によれば、ワー
クの加工中はワークの上面全面が常に水の膜で覆われて
いるか又は水の流れが形成されているので、切削屑がワ
ーク表面に付着することがない。According to the first aspect of the present invention, during processing of the work, the entire upper surface of the work is always covered with the water film or the flow of the water is formed, so that the cutting debris is generated on the work surface. Does not adhere to
【0008】また、請求項2に記載のように、前記洗浄
水ノズルは、前記回転刃に供給された切削水が前記ワー
ク上面で流れる方向と同じ方向に向けて洗浄水を供給す
るように設けられていることを特徴としている。The cleaning water nozzle is provided so as to supply the cleaning water in the same direction as the direction in which the cutting water supplied to the rotary blade flows on the work upper surface. It is characterized by being.
【0009】この請求項2に記載の発明によれば、ワー
ク上面において切削水が流れる方向と同じ方向に洗浄水
が流れるので、効率よく切削屑や汚れを流すことができ
る。According to the second aspect of the present invention, since the cleaning water flows in the same direction as the direction in which the cutting water flows on the upper surface of the work, cutting chips and dirt can be efficiently flown.
【0010】更に、請求項3に記載のように、前記洗浄
水ノズルには、供給する洗浄水に振動を伝える超音波発
信源が組み込まれていることを特徴としている。Further, as set forth in claim 3, the cleaning water nozzle is characterized in that an ultrasonic transmission source for transmitting vibration to the supplied cleaning water is incorporated.
【0011】この請求項3に記載の発明によれば、洗浄
水に超音波振動が伝わっているので、切削屑や汚れがワ
ーク表面に付着し難く、且つ流され易いため、コンタミ
ネーションが残らない。According to the third aspect of the present invention, since ultrasonic vibrations are transmitted to the cleaning water, cutting debris and dirt hardly adhere to the work surface and are easily washed away, so that no contamination remains. .
【0012】[0012]
【発明の実施の形態】以下添付図面に従って本発明に係
るダイシング装置の好ましい実施の形態について詳説す
る。尚各図において、同一の部材については同一の番号
又は記号を付している。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a dicing apparatus according to the present invention will be described below in detail with reference to the accompanying drawings. In the drawings, the same members are given the same numbers or symbols.
【0013】図1はダイシング装置の外観を示す斜視図
である。ダイシング装置1は、先端に回転刃21が取付
けられた高周波モータ内蔵型のスピンドル22、22と
ワークWを吸着保持するワークテーブル31とを有する
加工部2と、加工済みのワークWをスピン洗浄する洗浄
部52と、多数枚のワークWを収納したカセットを載置
するロードポート51と、ワークWを搬送する搬送手段
53等とから構成されている。 加工部2の構造は、図2
に示すように、Xベース36に設けられたXガイド3
4、34でガイドされ、リニアモータ35によって図の
X−Xで示すX方向に駆動されるXテーブル33があ
り、Xテーブル33にはθ方向に回転する回転テーブル
32を介してワークテーブル31が設けられている。一
方、Yベース44の側面には、Yガイド42、42でガ
イドされ、図示しないステッピングモータとボールスク
リューによって図のY−Yで示すY方向に駆動されるY
テーブル41、41があり、Yテーブル41、41には
夫々図示しない駆動手段によってZ方向に駆動されるZ
テーブル43が設けられ、Zテーブル43には先端に回
転刃21が取付けられた高周波モータ内蔵型のスピンド
ル22が固定されている。加工部2の構造は以上のよう
になっているので、回転刃21はY方向にインデックス
送りされると共にZ方向に切込み送りされ、ワークテー
ブル31はX方向に切削送りされる。FIG. 1 is a perspective view showing the appearance of a dicing apparatus. The dicing apparatus 1 has a processing unit 2 having spindles 22 and 22 with a built-in high-frequency motor having a rotary blade 21 attached to the tip and a work table 31 for suction-holding the work W, and spin-cleans the processed work W. The cleaning unit 52 includes a cleaning unit 52, a load port 51 on which a cassette containing a large number of works W is placed, and conveyance means 53 for conveying the works W. The structure of the processing part 2 is shown in FIG.
The X guide 3 provided on the X base 36 as shown in FIG.
4 and 34, there is an X table 33 driven in the X direction indicated by XX in the figure by a linear motor 35. The X table 33 has a work table 31 via a rotary table 32 that rotates in the θ direction. Is provided. On the other hand, on the side surface of the Y base 44, Y guides 42 are guided by Y guides 42, and are driven by a stepping motor and a ball screw (not shown) in the Y direction shown by YY in the drawing.
There are tables 41, 41, and each of the Y tables 41, 41 is driven in the Z direction by driving means (not shown).
A table 43 is provided, and a high-frequency motor built-in spindle 22 having a rotary blade 21 attached to the tip is fixed to the Z table 43. Since the structure of the processing section 2 is as described above, the rotary blade 21 is index-fed in the Y direction and cut and fed in the Z direction, and the work table 31 is cut and fed in the X direction.
【0014】次に、図3及び図4にて本願発明の主要部
分の構成について説明する。図3に示すように、回転刃
21は前面と下部に開口部を有するフランジカバー23
で覆われている。フランジカバー23には切削水ノズル
24と回転刃21の手前側と奥側(スピンドル側)とで
回転刃21を挟み込むようにした一対の冷却水ノズル2
5、25とが設けられている。切削水ノズル24は切削
水供給管24Aと、一対の冷却水ノズル25、25は冷
却水供給管25Aと夫々フランジカバー23内で連通し
ている。一方、ダイシング装置で加工されるワークW
は、ダイシングシートSを介してリング状のフレームF
に一体的に貼着されており、ワークテーブル31に吸着
保持される。ワークテーブル31はθ方向の回転テーブ
ル32を介してXテーブル33上に載置されている。こ
のXテーブル33には図3上でワークテーブル31の右
側に、取付けブロック28を介して洗浄水ノズル26が
設けられている。この洗浄水ノズル26が取り付けられ
ている位置は、ワークテーブル31の外周近傍でフレー
ムFに近接した位置となっており、ワークテーブル31
が移動しても一緒に動くので、ワークテーブル31との
相対位置が変わらない位置となっている。またこの洗浄
水ノズル26は内部に空洞部26Aがあり、側面に設け
られた多数の小孔26B、26B、…と連通すると共に
洗浄水供給管27に連通している。洗浄水ノズル26の
形状は、図4の斜視図で示すように、多数の小孔26
B、26B、…の開口面がフレームFを取り囲むような
円形の一部を成し、ワークWの全面に洗浄水を供給する
のに十分な奥行きを有した板状となっており、多数の小
孔26B、26B、…は夫々X方向に平行に形成されて
いる。また、図3に示すように、この洗浄水ノズル26
の空洞部26Aには超音波発信源61が組み込まれてお
り、供給する洗浄水に超音波振動を伝播する。超音波発
信源61としてはピエゾ素子等の圧電素子が用いられて
いるが、これに限らず既知の種々の超音波発信手段を組
み込んでもよい。Next, the configuration of the main part of the present invention will be described with reference to FIGS. As shown in FIG. 3, the rotary blade 21 has a flange cover 23 having an opening at the front surface and a lower portion.
Covered with. The flange cover 23 has a pair of cooling water nozzles 2 that sandwich the rotary blade 21 between the cutting water nozzle 24 and the front and rear sides (spindle side) of the rotary blade 21.
5 and 25 are provided. The cutting water nozzle 24 communicates with the cutting water supply pipe 24A, and the pair of cooling water nozzles 25, 25 communicates with the cooling water supply pipe 25A in the flange cover 23, respectively. On the other hand, the work W processed by the dicing device
Is a ring-shaped frame F via a dicing sheet S
And is adsorbed and held on the work table 31. The work table 31 is placed on an X table 33 via a rotation table 32 in the θ direction. The X table 33 is provided with a washing water nozzle 26 via a mounting block 28 on the right side of the work table 31 in FIG. The position where the cleaning water nozzle 26 is attached is a position near the outer periphery of the work table 31 and close to the frame F.
Are moved together even if they move, so that the position relative to the work table 31 does not change. The washing water nozzle 26 has a hollow portion 26A inside, and communicates with a number of small holes 26B, 26B,. The cleaning water nozzle 26 has a number of small holes 26 as shown in the perspective view of FIG.
The opening surfaces of B, 26B,... Form a part of a circle surrounding the frame F, and have a plate shape having a depth sufficient to supply cleaning water to the entire surface of the work W. The small holes 26B are formed in parallel with the X direction. In addition, as shown in FIG.
The ultrasonic transmission source 61 is incorporated in the hollow portion 26A, and propagates ultrasonic vibration to the supplied cleaning water. Although a piezoelectric element such as a piezo element is used as the ultrasonic transmission source 61, the invention is not limited thereto, and various known ultrasonic transmission units may be incorporated.
【0015】以上のように構成された本発明に係るダイ
シング装置1の作用を説明する。先ず、多数枚のワーク
Wを収納したカセットがロードポート51に載置される
と、ワークWは搬送手段53によってカセットから引出
されて加工部2へ搬送される。加工部2では高速で回転
する回転刃21がY方向に送られて最初の加工ラインに
位置決めされる。次いで切削水が切削水供給管24Aを
通って切削ノズル24から回転刃21の刃先に供給され
ると共に、冷却水が冷却水供給管を通って一対の冷却水
ノズル25、25から回転刃21の側面に供給される。
回転刃21の先端に供給された切削水は、回転刃21に
乗って加工ポイントに供給された後回転刃21の遠心力
によって図3で見た左側に流れてゆく。また一対の冷却
水ノズル25、25から回転刃21の両側面に供給され
た冷却水は、回転刃21が加工熱のため温度上昇するの
を防ぎ、供給された後は切削水の流れに合流して図3上
の左側に流れてゆく。更に、洗浄水ノズル26から切削
水の流れと同じ向きに洗浄水が供給され、ワークWの上
面全面に水の膜を形成するか、あるいは水量を多くして
ワークWの上面全面に切削水の流れと同じ向きに洗浄水
の流れを形成する。また、この洗浄水には超音波発信源
61で発生した超音波振動が伝播されている。この状態
でワークWがX方向に切削送りされることにより、最初
の1ラインの加工が行われる。次に回転刃21はY方向
に1ピッチインデックス送りされ、次のラインが加工さ
れる。この動作を繰り返して全てのラインが加工され
る。加工中に発生する切削屑は、大部分は切削水と冷却
水との流れによって流し去られるが、流しきれずに残っ
た切削屑もワークWの上面全面に形成された洗浄水の流
れによって流し去られる。あるいは、洗浄水の水膜のみ
が形成されている場合であっても、ワークWの上面全面
が乾燥することがないので、切削屑がこびりつくことが
なく、加工の後のスピン洗浄で洗い落とされる。更に洗
浄水に伝播されている超音波振動が切削屑の付着を抑え
て、流し去る効果を一層高めている。洗浄水の流れを形
成するか、水膜のみとするかは、ワークWの品種や加工
条件に合わせて適宜選択される。The operation of the dicing apparatus 1 according to the present invention configured as described above will be described. First, when a cassette containing a large number of works W is placed on the load port 51, the works W are pulled out of the cassette by the conveyance means 53 and conveyed to the processing section 2. In the processing section 2, the rotary blade 21 rotating at a high speed is fed in the Y direction and positioned on the first processing line. Next, cutting water is supplied from the cutting nozzle 24 to the cutting edge of the rotary blade 21 through the cutting water supply pipe 24A, and cooling water is supplied from the pair of cooling water nozzles 25 and 25 to the rotary blade 21 through the cooling water supply pipe. Supplied to the side.
The cutting water supplied to the tip of the rotary blade 21 is supplied to the processing point on the rotary blade 21 and then flows to the left side in FIG. 3 due to the centrifugal force of the rotary blade 21. Further, the cooling water supplied from the pair of cooling water nozzles 25, 25 to both sides of the rotary blade 21 prevents the rotary blade 21 from rising in temperature due to processing heat, and after being supplied, merges into the flow of cutting water. Then, it flows to the left side in FIG. Further, the cleaning water is supplied from the cleaning water nozzle 26 in the same direction as the flow of the cutting water, and a water film is formed on the entire upper surface of the work W, or the amount of the water is increased and the cutting water is supplied on the entire upper surface of the work W. Form a stream of wash water in the same direction as the stream. In addition, ultrasonic vibration generated by the ultrasonic transmission source 61 is propagated to the cleaning water. In this state, the workpiece W is cut and fed in the X direction, thereby processing the first one line. Next, the rotary blade 21 is fed by one pitch index in the Y direction, and the next line is processed. By repeating this operation, all lines are processed. Most of the cuttings generated during processing are washed away by the flow of the cutting water and the cooling water, but the remaining cuttings that cannot be completely removed are also washed away by the flow of the cleaning water formed on the entire upper surface of the work W. Left. Alternatively, even when only the water film of the cleaning water is formed, the entire upper surface of the workpiece W does not dry, so that the cutting chips do not stick and are washed off by spin cleaning after processing. . Further, the ultrasonic vibration transmitted to the cleaning water suppresses the attachment of the cutting chips and further enhances the effect of flowing away the chips. Whether to form the flow of the cleaning water or only the water film is appropriately selected according to the type of the workpiece W and the processing conditions.
【0016】加工が終了すると搬送手段53で洗浄部5
2へ搬送されスピン洗浄される。 洗浄が終わったワーク
Wは再び搬送手段53によって元のカセットに戻され
る。 以上がダイシング装置1で加工される一枚のワーク
Wの流れである。When the processing is completed, the cleaning unit 5
It is transported to 2 and spin-cleaned. The work W after the cleaning is returned to the original cassette by the transport means 53 again. The flow of one work W processed by the dicing apparatus 1 has been described above.
【0017】以上説明したように、本発明によれば、ダ
イシング装置1で加工されるワークWは切削屑等で汚染
されることがなく、品質低下をきたさない。As described above, according to the present invention, the work W processed by the dicing apparatus 1 is not contaminated by cutting chips and the like, and does not cause quality deterioration.
【0018】尚、本発明の実施の形態では、洗浄水ノズ
ル26をXテーブル33に取付ブロック28を介して設
けたが、これに限らずワークテーブル31と一緒に移動
する部位であれば他の部位に取り付けてもよい。In the embodiment of the present invention, the washing water nozzle 26 is provided on the X table 33 via the mounting block 28. However, the present invention is not limited to this. It may be attached to the site.
【0019】[0019]
【発明の効果】以上説明したように本発明によれば、加
工中のワークは上面全面が常時水の膜で覆われているか
又は水の流れが形成されているので、切削屑がワーク表
面に付着することがない。As described above, according to the present invention, the work being processed is always covered with a water film on the entire upper surface or a water flow is formed, so that cutting chips are formed on the surface of the work. Does not adhere.
【0020】また、ワーク上面において切削水が流れる
方向と同じ方向に洗浄水が流れるので、効率よく切削屑
や汚れを流すことができる。Further, since the washing water flows in the same direction as the direction in which the cutting water flows on the upper surface of the work, cutting chips and dirt can be efficiently flown.
【0021】更に、洗浄水に超音波振動が伝わっている
ので、切削屑や汚れがワーク表面に付着し難く、且つ流
され易いため、コンタミネーションが残らない。Furthermore, since ultrasonic vibrations are transmitted to the cleaning water, cutting chips and dirt hardly adhere to the work surface and are easily washed away, so that no contamination remains.
【0022】従って、大型ワークであっても切削屑等の
汚れが表面に付着しない、コンタミネーションフリーの
ダイシング装置が得られる。Accordingly, a contamination-free dicing apparatus can be obtained in which dirt such as cutting chips does not adhere to the surface of a large workpiece.
【図1】本発明の実施の形態に係るダイシング装置の外
観斜視図FIG. 1 is an external perspective view of a dicing apparatus according to an embodiment of the present invention.
【図2】本発明の実施の形態に係るダイシング装置の加
工部の構造を説明する斜視図FIG. 2 is a perspective view illustrating a structure of a processing unit of the dicing apparatus according to the embodiment of the present invention.
【図3】本発明の実施の形態に係るダイシング装置の主
要部分を説明する正面図FIG. 3 is a front view illustrating a main part of the dicing apparatus according to the embodiment of the present invention;
【図4】本発明の実施の形態に係るダイシング装置の洗
浄水ノズルの形状を説明する斜視図FIG. 4 is a perspective view illustrating a shape of a cleaning water nozzle of the dicing apparatus according to the embodiment of the present invention.
【図5】従来のダイシング装置の加工部拡大図FIG. 5 is an enlarged view of a processing portion of a conventional dicing apparatus.
W…ワーク、1…ダイシング装置、21…回転刃、24
…切削水ノズル、25…冷却水ノズル、26…洗浄水ノ
ズル、31…ワークテーブル、61…超音波発信源W: Work, 1: Dicing device, 21: Rotating blade, 24
... cutting water nozzle, 25 ... cooling water nozzle, 26 ... washing water nozzle, 31 ... work table, 61 ... ultrasonic transmission source
───────────────────────────────────────────────────── フロントページの続き (72)発明者 金子 貴幸 東京都三鷹市下連雀9丁目7番1号 株式 会社東京精密内 Fターム(参考) 3B201 AA03 AB03 BB21 BB83 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Takayuki Kaneko 9-7-1, Shimorenjaku, Mitaka-shi, Tokyo F-term (reference) 3B201 AA03 AB03 BB21 BB83
Claims (3)
置して前記回転刃に対して相対的にX及びY方向に移動
するワークテーブルとを有するダイシング装置におい
て、洗浄水ノズルが前記ワークテーブル外周近傍に設け
られ、前記洗浄水ノズルは前記ワークテーブルと一緒に
前記回転刃に対してX及びY方向に相対的に移動して、
前記ワークの加工が終了するまで常時ワークの上面全面
に水の膜又は水の流れを形成することを特徴とするダイ
シング装置。1. A dicing apparatus comprising: a rotary blade for processing a work; and a work table on which the work is placed and which moves in the X and Y directions relative to the rotary blade. Provided in the vicinity of the outer periphery of the work table, the washing water nozzle moves relatively to the rotary blade in the X and Y directions together with the work table,
A dicing apparatus wherein a water film or a flow of water is constantly formed on the entire upper surface of the work until the processing of the work is completed.
れた切削水が前記ワーク上面で流れる方向と同じ方向に
向けて洗浄水を供給するように設けられていることを特
徴とする請求項1に記載のダイシング装置。2. The cleaning water nozzle according to claim 1, wherein the cleaning water nozzle is provided to supply the cleaning water in the same direction as the direction in which the cutting water supplied to the rotary blade flows on the work upper surface. Item 7. A dicing apparatus according to Item 1.
振動を伝える超音波発信源が組み込まれていることを特
徴とする請求項1又は請求項2に記載のダイシング装
置。3. The dicing apparatus according to claim 1, wherein an ultrasonic wave transmission source for transmitting vibration to the supplied cleaning water is incorporated in the cleaning water nozzle.
Priority Applications (1)
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JP2001131713A JP3885224B2 (en) | 2001-04-27 | 2001-04-27 | Dicing machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001131713A JP3885224B2 (en) | 2001-04-27 | 2001-04-27 | Dicing machine |
Publications (2)
Publication Number | Publication Date |
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JP2002329685A true JP2002329685A (en) | 2002-11-15 |
JP3885224B2 JP3885224B2 (en) | 2007-02-21 |
Family
ID=18979851
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JP2001131713A Expired - Fee Related JP3885224B2 (en) | 2001-04-27 | 2001-04-27 | Dicing machine |
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Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006073828A (en) * | 2004-09-02 | 2006-03-16 | Tokyo Seimitsu Co Ltd | Dicing device |
JP2006080220A (en) * | 2004-09-08 | 2006-03-23 | Tokyo Seimitsu Co Ltd | Dicing apparatus |
JP2006231474A (en) * | 2005-02-25 | 2006-09-07 | Disco Abrasive Syst Ltd | Cutting device |
JP2007188974A (en) * | 2006-01-11 | 2007-07-26 | Tokyo Seimitsu Co Ltd | Dicing equipment |
JP2009027052A (en) * | 2007-07-23 | 2009-02-05 | Disco Abrasive Syst Ltd | Processing method for piezoelectric element |
JP2010205898A (en) * | 2009-03-03 | 2010-09-16 | Disco Abrasive Syst Ltd | Ultrasonic vibration cutting device |
JP2011020260A (en) * | 2010-10-25 | 2011-02-03 | Tokyo Seimitsu Co Ltd | Dicing apparatus |
JP2012061597A (en) * | 2011-12-26 | 2012-03-29 | Disco Corp | Cutting apparatus |
JP2013187471A (en) * | 2012-03-09 | 2013-09-19 | Tokyo Seimitsu Co Ltd | Dicing device |
JP2014180738A (en) * | 2013-03-21 | 2014-09-29 | Disco Abrasive Syst Ltd | Cutting device |
KR20160105298A (en) | 2015-02-27 | 2016-09-06 | 가부시기가이샤 디스코 | Cutting apparatus |
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2001
- 2001-04-27 JP JP2001131713A patent/JP3885224B2/en not_active Expired - Fee Related
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006073828A (en) * | 2004-09-02 | 2006-03-16 | Tokyo Seimitsu Co Ltd | Dicing device |
JP2006080220A (en) * | 2004-09-08 | 2006-03-23 | Tokyo Seimitsu Co Ltd | Dicing apparatus |
JP4649917B2 (en) * | 2004-09-08 | 2011-03-16 | 株式会社東京精密 | Dicing machine |
JP2006231474A (en) * | 2005-02-25 | 2006-09-07 | Disco Abrasive Syst Ltd | Cutting device |
JP2007188974A (en) * | 2006-01-11 | 2007-07-26 | Tokyo Seimitsu Co Ltd | Dicing equipment |
JP2009027052A (en) * | 2007-07-23 | 2009-02-05 | Disco Abrasive Syst Ltd | Processing method for piezoelectric element |
JP2010205898A (en) * | 2009-03-03 | 2010-09-16 | Disco Abrasive Syst Ltd | Ultrasonic vibration cutting device |
JP2011020260A (en) * | 2010-10-25 | 2011-02-03 | Tokyo Seimitsu Co Ltd | Dicing apparatus |
JP2012061597A (en) * | 2011-12-26 | 2012-03-29 | Disco Corp | Cutting apparatus |
JP2013187471A (en) * | 2012-03-09 | 2013-09-19 | Tokyo Seimitsu Co Ltd | Dicing device |
JP2014180738A (en) * | 2013-03-21 | 2014-09-29 | Disco Abrasive Syst Ltd | Cutting device |
KR20160105298A (en) | 2015-02-27 | 2016-09-06 | 가부시기가이샤 디스코 | Cutting apparatus |
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