JP2002321788A - Uncharged adhesive film and electronic parts transportation body using it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic parts transportation body, in which electronic parts are difficult to stick to a cover film covering holes in which the electronic parts are housed, so that the electronic parts are provided on site in a stable manner. SOLUTION: An uncharged adhesive film is manufactured, which comprises a support layer 11, and a seal layer 13 which has a charge prevention characteristics and whose seal surface is subjected to either or both ozone process or/and corona discharge process. The electronic parts transportation body is manufactured using the above manufactured film.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-chargeable adhesive film suitable for a cover tape or the like used for an electronic component carrier.

[0002]

2. Description of the Related Art FIGS. 3A to 3C show capacitors,
1 shows an example of an electronic component carrier for transporting electronic components such as a resistor and an IC chip along an assembling process. Hereinafter, the configuration of the electronic component carrier will be described along the assembly process. As shown in FIG. 3A, first, a tape-shaped support 1 is prepared. The support 1 is provided with rectangular through holes 1a, 1a,... And circular through holes 1b, 1b,. FIG. 3B is a sectional view taken along the line AA shown in FIG.
FIG. Then, the bottom film 2 is laminated on the lower surface of the support 1 and integrated using a suitable adhesive or the like to form the bottom surfaces of the holes 1a, 1a. Then, the electronic component 3 is stored in the holes 1a, 1a,. Then, as shown in FIG. 3C, the holes 1a, 1a of the support 1 are formed.
Are covered with the cover film 4 and the cover film 4 is integrated with the support 1 by heat sealing or the like to obtain an electronic component carrier. The electronic component carrier is wound and transported, for example, in a reel shape. At the site, an automatic assembly system in which the cover film 4 is peeled off, and the electronic components 3, 3,... In the holes 1a, 1a,. This type of electronic component transporter can transport a plurality of small electronic components collectively, and is easy to handle.

[0003]

However, conventionally,
As shown in FIG. 3 (d), when the cover film 4 is peeled off, the electronic components 3, 3,... There has been a problem that stable supply of 3,... Becomes difficult. The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide an electronic component carrier capable of stably supplying electronic components on site. Specifically, it is an object of the present invention to provide an electronic component carrier in which the electronic component is unlikely to adhere to a cover film covered by the hole in which the electronic component is stored.

[0004]

In order to solve the above-mentioned problems, the present invention uses the following means. According to a first aspect of the present invention, there is provided a non-charging adhesive comprising: a support layer; and a seal layer having an antistatic property and having a sealing surface subjected to one or both of an ozone treatment and a corona discharge treatment. Film. A second invention is the non-charging adhesive film according to the first invention, wherein the seal layer is made of a no-anchor resin. A third invention is the non-charged adhesive film according to the first invention, wherein the support layer and the seal layer are integrated via an adhesive layer. A fourth invention is the non-charging adhesive film according to the third invention, wherein the adhesive layer is made of a no-anchor resin. The fifth invention is characterized in that the adhesive layer comprises an anchor coat agent.
The non-charged adhesive film of the invention. The sixth invention is
The non-charged adhesive film according to any one of the first to fifth inventions, wherein the support layer has an antistatic property. According to a seventh aspect of the present invention, there is provided a support provided with a hole for accommodating an electronic component, and the non-charging adhesive according to any one of the first to sixth aspects laminated on the opening surface of the hole of the support. An electronic component carrier comprising a film.

[0005]

FIG. 1 shows an example of a cross-sectional view of a non-charged adhesive film of the present invention. This non-charged adhesive film 10A is in a tape shape, and a support layer 11, a seal layer 13 and Are formed integrally via an adhesive layer 12. The width and the length of the non-charged adhesive film 10A are the same as the width and the length of the support 1 when forming the electronic component carrier as the cover film 4 shown in FIG. . The width, length, and the like of the support 1 can be appropriately changed depending on the size and number of the electronic components 3, 3,... To be conveyed, and are not particularly limited. In addition, as an example of the size of the non-charged adhesive film 10A, for example, the width is 5.2.
mm and length 1000 m.

As a material of the support layer 11, for example, polyethylene terephthalate (abbreviation: PET), polyether sulfone (abbreviation: PES), or the like is suitably used from the viewpoint of transparency, elasticity, and mechanical strength. The thickness of the support layer 11 is not particularly limited, but is 5 to 50 μm. 5 μm
If it is less than 50 μm, the strength is insufficient, and if it exceeds 50 μm, it may be disadvantageous from the viewpoint of economy. The support layer 11 is preferably provided with antistatic properties. The generation of static electricity prevents dust or the like from adhering to the surface of the support layer 11, and the vibration of the electronic components during the transport of the electronic component carrier generates static electricity, and the sealing layer 1
This is to prevent the electronic components from adhering to the device 3.

The antistatic property is determined by forming the support layer 11 using a material containing an antistatic agent, or
Can be applied by a method such as applying an antistatic agent to the surface of the film. As the antistatic agent, known surfactants such as various surfactants, inorganic salts, polyhydric alcohols, metal compounds, and carbon can be used. As the support layer 11, a commercially available material having antistatic properties can be used. Specific examples of commercially available antistatic PET include, for example, trade name “Tetron” (manufactured by Teijin Dupont), trade name “Lumirror” (manufactured by Toray), and trade name “Emblecit”
(Made by Unitika).

[0008] The seal layer 13 is formed of a heat sealable material. A preferable heat sealing temperature is 140 to 200 ° C. from the viewpoint of handling, and a preferable sealing strength is 200 ± 50 gf / from the viewpoint of obtaining a sufficient sealing property.
It is about 5.2 mm. Specifically, for example, a polyethylene resin, a polypropylene resin, an ethylene-vinyl acetate copolymer (abbreviation: EVA), an ethylene- (meth) acrylate-based copolymer resin, or the like is used. In addition, (meth) acrylic acid means acrylic acid and / or methacrylic acid. Among these, polyethylene resins are preferable from the viewpoints of relatively high sealing strength, low temperature at the time of heat sealing, good handling, and the like, and among them, low-density polyethylene resin (abbreviation: LDPE) is preferable. . Specifically L
As the DPE, for example, a product name “NUC8079” (manufactured by Nippon Unicar) or the like can be used. If the environmental temperature of the ethylene-vinyl acetate copolymer, ethylene- (meth) acrylate-based copolymer resin or the like becomes 40 ° C. or higher during transportation, the electronic components adhere to the seal layer 13. It is not suitable because it may be easy or the sealing strength may be reduced. In such a case, there is a method of adding a slip agent such as amide to the above resin. Therefore, it is preferable to use a polyethylene resin, a polypropylene resin, or the like that does not easily cause such a problem even when the environmental temperature reaches, for example, about 80 ° C. at the maximum.

The seal layer 13 has an antistatic property to prevent static electricity from being generated by vibrating the electronic components during the transportation of the electronic component carrier and to prevent the electronic components from adhering to the seal layer 13. Properties are given. The antistatic property can be provided by the same means as in the case of the support layer 11.

When the non-charged adhesive film is used as the cover film 4 when forming an electronic component carrier as shown in FIG. 3C, the support 1 of the seal layer 13 is used.
The surface located on the side (seal surface) must be subjected to one or both of corona discharge treatment and ozone treatment. In general, when an antistatic property is imparted by adding an antistatic agent or the like, the seal strength tends to decrease, and it is necessary to add a pressure-sensitive adhesive to compensate for this.However, in the non-charged adhesive film of the present invention, corona is used. Since a necessary and sufficient seal strength can be obtained by the discharge treatment or the ozone treatment, it is not necessary to newly add an adhesive, and the cost can be reduced.

In the corona discharge treatment, a corona atmosphere is generated using a known corona discharge treatment device.
After the material 3 is melt-extruded into a film, it is passed through this corona atmosphere. Corona discharge density is 5 to 100 (W · min / m ² ) per area of sealing surface.
And more preferably 20 to 50 (W · min / m
² ). If it is less than 5 (W · min / m ² ), the sealing strength cannot be sufficiently improved, and 100 (W · min / m ² )
Exceeding this is inconvenient from the viewpoint of economic efficiency.

The ozone treatment is performed by, for example, melt-extruding the material of the seal layer 13 into a film shape and then blowing a gas such as air containing ozone from a predetermined outlet to the seal surface. The ozone treatment is performed by converting a gas having an ozone concentration of 5 to 50 g / Nm ³ to 0.5 to 10 Nm ³ / Hr.
This is performed by spraying at a flow rate on the processing surface. The corona discharge treatment and the ozone treatment may be performed alone or both may be performed, but both are preferably performed from the viewpoint of improving the sealing strength.

Although the thickness of the sealing layer 13 is not particularly limited, it is, for example, 5 to 50 μm from the viewpoint of sealing strength.

As the adhesive layer 12, an anchor coat agent,
A non-anchor resin or the like can be used. As the anchor coating agent, one obtained by diluting an adhesive such as an organic titanate, an organic isocyanate, or a polyethyleneimine with an organic solvent such as toluene, ethyl acetate, methanol, or hexane is used. When an anchor coat agent is used, the anchor coat agent is applied to the surface of the support layer 11 facing the seal layer 13 and dried, and the seal layer 1
3 is melt-extruded to form a seal layer 13, the support layer 11 and the seal layer 13 are integrated via an adhesive layer 12 made of an anchor coat agent, and the seal surface of the seal layer 13 on the support 1 side is further formed. Then, a corona discharge treatment or an ozone treatment is performed as described above to obtain a non-charged adhesive film.

The non-anchor resin is a so-called adhesive resin, which is an olefin-based resin such as polyethylene or polypropylene such as trade name "Adtex" (manufactured by Nippon Polyolefin) or trade name "Admer" (manufactured by Mitsui Chemicals). Examples can be given. Among them, the trade name “Adtex JH607D” (manufactured by Nippon Polyolefin) is preferred.
When the non-anchor resin is used, for example, the non-anchor resin as the adhesive layer 12 and the seal layer 1 are formed on the support layer 11.
3 is sequentially extruded into a film form, laminated and integrated, and the sealing surface of the sealing layer 13 on the support 1 side is subjected to corona discharge treatment or ozone treatment as described above to obtain a non-charged adhesive film. Can be.

In the case of using an anchor coating agent in the adhesive layer 12, a drying step for removing the organic solvent is indispensable. However, in the case of a non-anchor resin, since a solvent is not used, a drying step is not required, and Is simple. As a result, the processing speed can be increased and the production efficiency can be improved. For example, the production speed of a non-charged adhesive film when an anchor coating agent is used is about 100 to 150 m / min at the maximum, but when a non-anchor resin is used, the production speed is 1 to 1 m.
It can be 50 to 600 m / min.

The thickness of the adhesive layer 12 is not particularly limited, but is about 5 to 30 μm. In addition, conditions such as the melt extrusion temperature of each layer during processing are appropriately changed depending on the material of each layer,
It is adjustable and is not particularly limited.

FIG. 2 shows another example of the non-charged adhesive film of the present invention.
Is formed by integrating the support layer 14 and the seal layer 15. In the non-charged adhesive film 10B, the support layer 14 is the same as the support layer 11 of the non-charged adhesive film 10A shown in FIG. On the other hand, the sealing layer 15 plays the role of the adhesive layer 12 and the sealing layer 13 shown in FIG. The seal layer 15 is provided with an antistatic property, and is used to support the electronic component carrier.
The sealing surface on the side is made of a non-anchor resin subjected to one or both of corona discharge treatment and ozone treatment. The seal layer 15 can be formed from the same material as the non-anchor resin exemplified as the constituent of the adhesive layer 12 shown in FIG. 1 described above. Further, the provision of the antistatic property, and the corona discharge and the ozone treatment can be performed in the same manner as in the case of the seal layer 13 shown in FIG. The thicknesses of the support layer 14 and the seal layer 15 are not particularly limited, but for example, each is 5 to 50 μm.

The non-charged adhesive film 10B is formed, for example, by melt-extruding the material of the sealing layer 15 on the support layer 14 into a film shape, and laminating and integrating the film. It can be manufactured by performing treatment or ozone treatment. This non-charged adhesive film 1
Since OB has a two-layer structure, the material cost can be reduced, the manufacturing operation is simple, and the production efficiency can be improved.

The non-charged adhesive films 10A and 10B have a surface resistance of 1 from the viewpoint of preventing static electricity and the like.
It is preferably 0 ¹² Ω or less (measured according to JIS K6911). Therefore, in the non-charged adhesive film 10A or the non-charged adhesive film 10B, the antistatic treatment of the support layers 11, 14 and the seal layers 13, 15 is performed by selecting the type of the antistatic agent so as to satisfy this property. It is preferable to appropriately adjust the addition amount, the application amount, and the like.

Next, these non-charged adhesive films 10
An electronic component carrier using A or the non-charged adhesive film 10B will be described. Electronic component carrier of the present invention,
For example, the non-charged adhesive film 10A or the non-charged adhesive film 10B is used as the cover film 4 of the electronic component carrier having the configuration shown in FIGS. 3 (a) to 3 (c).

The support 1 is not particularly limited as long as it has self-supporting properties. For example, a tape-like one made of paper, polystyrene, polypropylene, polyethylene terephthalate or the like having a thickness of about 0.2 to 2 mm is used. Can be. The shape, size, number, and the like of the holes for storing the electronic components 3 are set according to the size of the electronic components 3, 3,... To be stored, and are not particularly limited. As an example, for example, as shown in FIG.
Are formed in a row at intervals of 2.5 mm, and in parallel with this, circular holes 1 b having a diameter of 1.5 mm are formed.
.. Are formed in a line at 2.5 mm intervals. In this example, the distance between the row of square holes and the row of circular holes is about 1.5 mm. The bottom film 2 has a thickness 3 in which a non-static sealing layer is laminated on paper, polyethylene terephthalate, or the like.
Examples thereof include a film having a thickness of about 0 to 100 μm.

Then, as shown in FIGS. 3 (a) to 3 (c), the support 1 and the bottom film 2 are integrated,
a, 1a... and holes 1b, 1b. Next, the non-charged adhesive film 10A or the non-charged adhesive film 10B is placed over the opening surfaces of the holes 1a, 1a, and 1b, 1b,. .. And holes 1b, 1b... Are heat-sealed along their lengths to form a support 1 and a non-charged adhesive film 1.
By integrating OA or the non-charged adhesive film 10B, an electronic component carrier can be obtained. In addition, in the example shown in FIGS.
a, 1a... and holes 1b, 1b... are through holes opened on the upper and lower surfaces of the support 1, but are not limited thereto, and may be holes opened only on one side of the support 1. . In this case, there is no need to provide the bottom film 2.

[0024]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to embodiments. (1) Production of Non-Charged Adhesive Film (Example 1) A 25 μm-thick antistatic PET (trade name “Tetron Film”, manufactured by Teijin) was used as a support layer, and a non-anchor resin (trade name) was used as an adhesive layer thereon. "Adtex JH607D" made by Nippon Polyolefin) with a thickness of 15
μm, and then extruded and laminated to a thickness of 0.4 μm, and LDPE (trade name “NUC
8079 "(manufactured by Nippon Unicar) and extrusion lamination to a thickness of 15 μm. Simultaneously with this extrusion, an ozone concentration of 30 g / Nm ³ and a flow rate of ³ Nm ³ / H were applied to the sealing surface of the sealing layer.
An ozone treatment was performed under the condition of r, and a corona discharge treatment was performed under the condition of 30 W · min / m ² to obtain a non-charged adhesive film.

Example 2 A non-charged adhesive film was obtained in the same manner as in Example 1 except that an anchor coat agent (trade name “Seikadyne 3600A / B”, manufactured by Dainichi Seika) was used as the adhesive layer.

Example 3 Antistatic PE having a thickness of 25 μm
T (trade name "Tetron Film", manufactured by Teijin) as a support layer, on which an anchor coat agent similar to that of Example 2 is used, and an antistatic agent-containing LDPE (trade name "NUC807")
9 ", manufactured by Nippon Unicar) and extrusion-laminated with a thickness of 30 μm, and at the same time as this extrusion, an ozone treatment was performed at an ozone concentration of 35 g / Nm ³ and a flow rate of ³ Nm ³ / Hr to obtain 30 W · min / m ^3.
Under the above conditions to obtain a non-charged adhesive film.

Example 4 A non-charged adhesive film was obtained in the same manner as in Example 2 except that EVA (trade name "VH610Z", manufactured by Nippon Polyolefin) containing an antistatic agent and a slip agent was used for the seal layer. Was.

Comparative Example 1 A non-charged adhesive film was obtained in the same manner as in Example 1 except that the corona discharge treatment and the ozone treatment were not performed on the sealing surface of the sealing layer. (Comparative Example 2) A 25 μm-thick antistatic PET (trade name “Tetron Film”, manufactured by Teijin) was used as a support layer, and the same anchor coat agent as in Example 2 was applied thereon, and the solvent was volatilized. Later, LDPE (trade name "NUC807
9 "(manufactured by Nippon Unicar) at a thickness of 30 μm. Then, EVA (trade name “VH6102”, manufactured by Nippon Polyolefin Co., Ltd.) containing an antistatic agent and a slip agent as a seal layer was extrusion-laminated to obtain a non-charged adhesive film.

(2) Evaluation method Surface resistivity: A commercially available measuring instrument (trade name "16008A", based on JIS K6911)
Hewlett-Packard). Sealing strength: One side of a paper support is brought into contact with the sealing surface of the non-charged adhesive film, and the sealing pressure is 1 kg / cm ^2.
, Sealing time 1 second, sealing temperature 160 ° C, width 5.2m
m, the distance between the chucks is 50 mm, and the pulling speed is 30.
The seal strength was measured at 0 mm / min.

Attachment of electronic parts during storage at 40 ° C., 60 ° C., and 80 ° C .: A4 size non-charged adhesive film was placed with the sealing surface facing up, and 200 electronic parts (capacitor (size 1) 0.7 x 0.9 x 0.9 mm)) 20
Sprinkle 0 pieces by hand, and at a temperature of 40, 60, 80 ° C, 30
After standing for a few minutes, the non-charged adhesive film was turned over and the number of electronic components adhering to the sealing surface was counted.

Tables 1 and 2 show the results of each evaluation together with the processing speed.

[0032]

[Table 1]

[0033]

[Table 2]

From the results shown in Tables 1 and 2, in the embodiment according to the present invention, even when the electronic components in the electronic component carrier were vibrated, the electronic components did not adhere to the non-charged adhesive film, and Since the strength is good, it is clear that the product can be supplied more stably than the comparative example. Among these examples, those using the non-anchor resin could have a higher processing speed than those using the anchor coating agent, and the production efficiency was good. Also, it was confirmed that the electronic component using LDPE for the seal layer was less likely to adhere to the electronic component even after storage at high temperature than the one using EVA.

[0035]

As described above, in the non-charged adhesive film of the present invention and the electronic component carrier using the same, antistatic properties are imparted, and the sealing surface is subjected to one of ozone treatment and corona discharge treatment. Since both the seal layers are provided, the electronic component is less likely to adhere to the non-charged adhesive film, the seal strength is good, and the electronic component can be supplied stably.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing an example of the non-charged adhesive film of the present invention.

FIG. 2 is a sectional view showing another example of the non-charged adhesive film of the present invention.

3 (a) to 3 (c) are explanatory views showing an example of an electronic component carrier along an assembling process, and FIG. 3 (d) is a drawing of a cover film from a support. It is explanatory drawing which showed the conventional state at the time of peeling.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Support, 1a, 1b ... Hole, 2 ... Bottom film, 3
... Electronic parts, 4 ... Cover film (non-charging adhesive film), 10A, 10B ... Non-charging adhesive film, 11 ...
Support layer, 12: adhesive layer, 13: seal layer, 14: support layer, 15: seal layer.

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 3E067 AB47 AC04 AC11 AC18 BA24A BA27A BB14A BB15A BB16A CA21 EA04 EA29 EA34 EB27 EC05 FA01 FC01 3E096 AA06 BA08 CA15 CC01 EA11X FA07 GA01 4F100 AK01B00 AT04A00 AT00 AT00 AT00 BA07 BA10A BA10B BA10D DC11D EH23 EJ13B EJ55B GB90 JG03 JG03B JL11C JL12B 4J004 AA07 AA08 AA10 AB05 CA06 CB03 CC07 CD08 CD09 FA05 FA06

Claims (7)

[Claims] 1. A non-charging adhesive comprising: a support layer; and a sealing layer having antistatic properties and having a sealing surface subjected to one or both of an ozone treatment and a corona discharge treatment. the film. 2. The non-charged adhesive film according to claim 1, wherein the seal layer is made of a non-anchor resin. 3. The non-charged adhesive film according to claim 1, wherein the support layer and the seal layer are integrated via an adhesive layer. 4. The non-charged adhesive film according to claim 3, wherein the adhesive layer is made of a non-anchor resin. 5. The non-charged adhesive film according to claim 3, wherein the adhesive layer comprises an anchor coat agent. 6. The non-charged adhesive film according to claim 1, wherein the support layer has an antistatic property. 7. The non-charging adhesive according to claim 1, wherein a support provided with a hole for accommodating an electronic component is provided, and the non-charging adhesive is laminated on an opening surface of the hole of the support. An electronic component carrier, comprising: a film.