JP2002319596A - Connecting method and connecting structure employing wire bonding - Google Patents

Connecting method and connecting structure employing wire bonding

Info

Publication number
JP2002319596A
JP2002319596A JP2001123007A JP2001123007A JP2002319596A JP 2002319596 A JP2002319596 A JP 2002319596A JP 2001123007 A JP2001123007 A JP 2001123007A JP 2001123007 A JP2001123007 A JP 2001123007A JP 2002319596 A JP2002319596 A JP 2002319596A
Authority
JP
Japan
Prior art keywords
wire
bonding
connection
vibration
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001123007A
Other languages
Japanese (ja)
Inventor
Yukihiro Maeda
幸宏 前田
Takashi Nagasaka
長坂　　崇
Yuji Otani
祐司 大谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2001123007A priority Critical patent/JP2002319596A/en
Publication of JP2002319596A publication Critical patent/JP2002319596A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
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    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a connecting method employing wire bonding in which strength at a primary bonding part is prevented from lowering due to vibration applied to a wire at the time of secondary bonding. SOLUTION: Forward end part of a wire bonding tool 10 is connected with a first member 1 and then the wire 3 is routed to a second member 2 by means of the tool 10. Under a state where a part of the wire 3 between the joint to the first member 1 and the joint to the second member 2 is supported using a retaining jig 11, the wire 3 is connected with the second member 2 being applied with ultrasonic vibration.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、ワイヤボンディン
グを用いた接続方法およびその接続構造並びにワイヤボ
ンディング装置に関する。The present invention relates to a connection method using wire bonding, a connection structure thereof, and a wire bonding apparatus.

【０００２】[0002]

【従来の技術】従来の一般的なワイヤボンディングを用
いた接続方法を図７を用いて説明する。ワイヤボンディ
ング用のツール１０に線材（ワイヤ）３を保持し、第１
の部材１に線材３の先端部を、図中の矢印Ｆに示す様
に、超音波振動を加えながら接続する（１次ボンディン
グ）。2. Description of the Related Art A conventional connection method using general wire bonding will be described with reference to FIG. The wire (wire) 3 is held by a wire bonding tool 10 and the first
As shown by the arrow F in the figure, the distal end of the wire 3 is connected to the member 1 while applying ultrasonic vibration (primary bonding).

【０００３】次に、ツール１０を第２の部材２まで移動
させることにより、線材３を第２の部材２にまで引き回
す。そして、第２の部材２に線材３を押し当てて、線材
３に沿った方向（線材３の長手軸方向）に超音波振動を
加えながら、線材３を第２の部材２に接続する（２次ボ
ンディング）。[0003] Next, the wire 3 is routed to the second member 2 by moving the tool 10 to the second member 2. Then, the wire 3 is pressed against the second member 2 to connect the wire 3 to the second member 2 while applying ultrasonic vibration in a direction along the wire 3 (longitudinal axis direction of the wire 3) (2). Next bonding).

【０００４】[0004]

【発明が解決しようとする課題】ところで、本発明者等
の検討によれば、上記接続方法においては、次のような
問題が生じることがわかった。すなわち、２次ボンディ
ング時に線材３に沿った方向へ振動が線材３に加わり、
線材３の長さや高さによっては、図７中の破線に示す様
に、線材３が軸方向へ共振振動する。According to the study by the present inventors, it has been found that the following problems occur in the above connection method. That is, vibration is applied to the wire 3 in the direction along the wire 3 during the secondary bonding,
Depending on the length and height of the wire 3, the wire 3 resonates and vibrates in the axial direction as shown by the broken line in FIG.

【０００５】そして、この共振振動により１次ボンディ
ング部４における線材３のネック部３ａに振動疲労によ
るクラックが発生し、線材３の強度が低下し、最悪、ネ
ック部３ａにて断線する。実際に、破断面を観察したと
ころ、線材３の長手軸方向の振動により破断しているこ
とが確認された。[0005] The resonance vibration causes cracks in the neck portion 3a of the wire 3 in the primary bonding portion 4 due to vibration fatigue, and the strength of the wire 3 is reduced. In the worst case, the wire 3 is disconnected at the neck 3a. Actually, when the fracture surface was observed, it was confirmed that the wire 3 was fractured due to vibration in the longitudinal axis direction.

【０００６】本発明は、上記した本発明者等が見出した
問題に鑑みてなされたものであり、ワイヤボンディング
を用いた接続方法において、２次ボンディング時に線材
に加わる振動による１次ボンディング部の強度低下を防
止することを目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems found by the present inventors, and in a connection method using wire bonding, the strength of a primary bonding portion due to vibration applied to a wire during secondary bonding. The purpose is to prevent reduction.

【０００７】[0007]

【課題を解決するための手段】上記目的を達成するた
め、請求項１に記載の発明では、ワイヤボンディング用
のツール（１０）に保持された線材（３）の先端部を第
１の部材（１）に接続し、第１の部材に接続された線材
を、ツールによって第２の部材（２）まで引き回した
後、超音波振動を印加しながら第２の部材に接続する接
続方法において、第１の部材に接続された線材のうち、
第１の部材への接続部位と第２の部材へ接続されるべき
部位との間に、線材が支持された支持部（３ｂ）を形成
した後、線材を第２の部材に接続することを特徴として
いる。In order to achieve the above object, according to the first aspect of the present invention, the tip of a wire (3) held by a wire bonding tool (10) is attached to a first member (1). In the connection method of connecting to the first member, the wire connected to the first member is routed to the second member (2) by a tool, and then connected to the second member while applying ultrasonic vibration. Of the wires connected to one member,
After forming a supporting portion (3b) supporting a wire between a connecting portion to the first member and a portion to be connected to the second member, connecting the wire to the second member. Features.

【０００８】それによれば、１次ボンディングを行った
後、１次ボンディング部（４）と２次ボンディング部
（５）になるべき部位との間にて線材が支持された状態
で、２次ボンディングを行うことになる。そのため、２
次ボンディングによる線材の共振振動は線材の支持部
（３ｂ）にて抑制され、当該振動の１次ボンディング部
への伝達が抑制される。According to the method, after performing the primary bonding, the secondary bonding is performed in a state where the wire is supported between the primary bonding part (4) and the part to be the secondary bonding part (5). Will be performed. Therefore, 2
Resonant vibration of the wire due to the next bonding is suppressed by the supporting part (3b) of the wire, and transmission of the vibration to the primary bonding part is suppressed.

【０００９】よって、本発明によれば、ワイヤボンディ
ングを用いた接続方法において、２次ボンディング時に
線材に加わる振動による１次ボンディング部の強度低下
を防止することができる。Therefore, according to the present invention, in the connection method using wire bonding, it is possible to prevent a decrease in the strength of the primary bonding portion due to vibration applied to the wire during the secondary bonding.

【００１０】また、請求項２に記載の発明においては、
第１の部材（１）に接続された線材（３）のうち第１の
部材への接続部位と第２の部材へ接続されるべき部位と
の間の部位を、治具（１１）を用いて支持した状態で、
線材を第２の部材に接続することを特徴としている。[0010] In the second aspect of the present invention,
Using a jig (11), a part of the wire (3) connected to the first member (1) between a part connected to the first member and a part to be connected to the second member is used. While supporting it,
It is characterized in that the wire is connected to the second member.

【００１１】それによれば、１次ボンディングを行った
後、１次ボンディング部（４）と２次ボンディング部
（５）との間にて線材が治具によって支持された状態
で、２次ボンディングを行うことになる。そのため、治
具による線材の支持により、２次ボンディングによる線
材の共振振動は抑制され、当該振動の１次ボンディング
部への伝達が抑制される。According to this, after the primary bonding is performed, the secondary bonding is performed in a state where the wire is supported between the primary bonding portion (4) and the secondary bonding portion (5) by the jig. Will do. Therefore, by supporting the wire by the jig, resonance vibration of the wire due to the secondary bonding is suppressed, and transmission of the vibration to the primary bonding portion is suppressed.

【００１２】よって、本発明によれば、ワイヤボンディ
ングを用いた接続方法において、２次ボンディング時に
線材に加わる振動による１次ボンディング部の強度低下
を防止することができる。Therefore, according to the present invention, in the connection method using wire bonding, it is possible to prevent a decrease in the strength of the primary bonding portion due to vibration applied to the wire during secondary bonding.

【００１３】また、請求項３に記載の発明においては、
第１の部材（１）のうち線材（３）と接続される部位お
よび第２の部材（２）のうち線材と接続される部位の少
なくとも一方の部位の近傍に、線材に加わる振動を吸収
可能な振動吸収部材（２０）を設け、振動吸収部材に線
材を接触させた状態で、線材に超音波振動を印加しなが
ら第２の部材に接続することを特徴としている。Further, in the invention according to claim 3,
Vibration applied to the wire can be absorbed in the vicinity of at least one of the portion of the first member (1) connected to the wire and the portion of the second member (2) connected to the wire. A vibration absorbing member (20) is provided, and the wire is connected to the second member while applying ultrasonic vibration to the wire in a state where the wire is in contact with the vibration absorbing member.

【００１４】それによれば、線材のうち１次ボンディン
グ部（４）および２次ボンディング部（５）の少なくと
も一方の近傍部分が、振動吸収部材に接した状態で、２
次ボンディングを行うことになる。そのため、２次ボン
ディングによる線材の共振振動は振動吸収部材に吸収さ
れて抑制され、当該振動の１次ボンディング部への伝達
が抑制される。According to this, at least one of the wires near the primary bonding part (4) and the secondary bonding part (5) is in contact with the vibration absorbing member.
The next bonding will be performed. Therefore, the resonance vibration of the wire caused by the secondary bonding is absorbed and suppressed by the vibration absorbing member, and the transmission of the vibration to the primary bonding portion is suppressed.

【００１５】よって、本発明によれば、ワイヤボンディ
ングを用いた接続方法において、２次ボンディング時に
線材に加わる振動による１次ボンディング部の強度低下
を防止することができる。Therefore, according to the present invention, in the connection method using wire bonding, it is possible to prevent a decrease in the strength of the primary bonding portion due to vibration applied to the wire during the secondary bonding.

【００１６】また、請求項４に記載の発明においては、
線材（３）と第２の部材（２）との接続を２回行うもの
であって、１回目は、２回目よりも弱い超音波振動を印
加しながら線材を第２の部材に接続し、２回目は、１回
目の接続部（５ａ）とは異なる部位にて、１回目よりも
強い超音波振動を印加しながら線材を第２の部材に接続
することを特徴としている。Further, in the invention according to claim 4,
The connection between the wire (3) and the second member (2) is performed twice, and the first is to connect the wire to the second member while applying a weaker ultrasonic vibration than the second time, The second time is characterized in that the wire is connected to the second member while applying a stronger ultrasonic vibration than in the first time at a site different from the first connection portion (5a).

【００１７】それによれば、線材と第２の部材との接続
部すなわち２次ボンディング部（５ａ、５ｂ）は２箇所
形成される。ここにおいて、１回目の接続では、比較的
弱い超音波振動を印加するため、１次ボンディング部
（４）へ伝達される線材の共振振動は、１次ボンディン
グ部にクラックが発生しない程度に小さいものにでき
る。According to this, two connecting portions (5a, 5b) between the wire and the second member are formed. Here, in the first connection, a relatively weak ultrasonic vibration is applied, so that the resonance vibration of the wire transmitted to the primary bonding portion (4) is small enough that no crack occurs in the primary bonding portion. Can be.

【００１８】そして、２回目の接続では、比較的強い超
音波振動を印加して確実に接続を行うことができるが、
このときの強い振動は、１回目の接続部（５ａ）によっ
て止まり、１次ボンディング部（４）側へは伝達されな
い。In the second connection, a relatively strong ultrasonic vibration can be applied to make a reliable connection.
The strong vibration at this time is stopped by the first connection portion (5a) and is not transmitted to the primary bonding portion (4).

【００１９】このように、本発明によっても、２次ボン
ディングによる線材の共振振動を抑制できるため、２次
ボンディング時に線材に加わる振動による１次ボンディ
ング部の強度低下を防止することができる。As described above, also according to the present invention, the resonance vibration of the wire due to the secondary bonding can be suppressed, so that the strength reduction of the primary bonding portion due to the vibration applied to the wire during the secondary bonding can be prevented.

【００２０】ここにおいて、請求項５に記載の発明で
は、線材（３）と第２の部材（２）との２回目の接続
は、線材（３）における１回目の接続部（５ａ）と第１
の部材（１）への接続部（４）との両接続部を結ぶ線に
対して、線材を交差する方向に引き回した状態で行うこ
とを特徴としている。Here, in the invention according to claim 5, the second connection between the wire (3) and the second member (2) is performed by connecting the first connection portion (5a) of the wire (3) to the second member (5). 1
This is characterized in that the connection is performed in a state where the wire is drawn in a direction intersecting with a line connecting both the connection part with the connection part (4) to the member (1).

【００２１】それによれば、２回目の２次ボンディング
の際に加わる振動を、線材と第１の部材との接続部に伝
達しにくくできるため、好ましい。According to this, vibration applied during the second secondary bonding can be hardly transmitted to the connection between the wire and the first member, which is preferable.

【００２２】また、請求項６に記載の発明では、ワイヤ
ボンディング用の線材（３）をツール（１０）に保持し
つつ線材の先端部を第１の部材（１）に接続し、第１の
部材に接続された線材を、ツールによって第２の部材
（２）まで引き回した後、超音波振動を印加しながら第
２の部材に接続するボンディング装置において、第１の
部材に接続された線材のうち、第１の部材への接続部位
と第２の部材へ接続されるべき部位との間の部位を、治
具（１１）を用いて支持した状態で、線材を第２の部材
に接続するようになっていることを特徴としている。In the invention according to claim 6, the tip of the wire is connected to the first member (1) while holding the wire (3) for wire bonding on the tool (10). After the wire connected to the member is routed to the second member (2) by the tool, the wire is connected to the second member while applying ultrasonic vibration to the bonding device. The wire is connected to the second member while a portion between the portion connected to the first member and the portion to be connected to the second member is supported using the jig (11). It is characterized by that.

【００２３】それによれば、請求項２に記載の接続方法
を適切に実現しうるボンディング装置を提供することが
できる。According to this, it is possible to provide a bonding apparatus that can appropriately realize the connection method described in claim 2.

【００２４】また、請求項７に記載の発明は、第１の部
材（１）と第２の部材（２）とがワイヤボンディングに
より形成された線材（３）により接続されてなる接続構
造において、第１の部材のうち線材と接続された部位お
よび第２の部材のうち線材と接続された部位の少なくと
も一方の部位の近傍に、振動吸収部材（２０）が設けら
れていることを特徴とするワイヤボンディングを用いた
接続構造を提供するものであり、本接続構造は、請求項
３記載の接続方法を用いて適切に形成され、その効果
は、請求項３の発明と同様である。According to a seventh aspect of the present invention, there is provided a connection structure in which the first member (1) and the second member (2) are connected by a wire (3) formed by wire bonding. A vibration absorbing member (20) is provided near at least one of a portion of the first member connected to the wire and a portion of the second member connected to the wire. The present invention provides a connection structure using wire bonding. This connection structure is appropriately formed by using the connection method according to the third aspect, and the effect is the same as that of the third aspect.

【００２５】また、請求項８に記載の発明は、第１の部
材（１）を１次ボンディング側、第２の部材（２）を２
次ボンディング側として、第１の部材と第２の部材とが
ワイヤボンディングにより形成された線材（３）により
接続されてなる接続構造において、線材と第２の部材と
の接続部（５ａ、５ｂ）が２箇所あることを特徴とする
ワイヤボンディングを用いた接続構造を提供するもので
あり、本接続構造は、請求項４記載の接続方法を用いて
適切に形成され、その効果は、請求項４の発明と同様で
ある。According to the invention described in claim 8, the first member (1) is connected to the primary bonding side, and the second member (2) is connected to two.
As the next bonding side, in a connection structure in which the first member and the second member are connected by a wire (3) formed by wire bonding, a connection portion (5a, 5b) between the wire and the second member The present invention provides a connection structure using wire bonding, characterized in that there are two locations, and this connection structure is appropriately formed using the connection method described in claim 4, and the effect is as described in claim 4. It is the same as the invention of the above.

【００２６】なお、上記各手段の括弧内の符号は、後述
する実施形態に記載の具体的手段との対応関係を示す一
例である。The reference numerals in the parentheses of the respective means are examples showing the correspondence with specific means described in the embodiments described later.

【００２７】[0027]

【発明の実施の形態】（第１実施形態）図１および図２
は、本発明の第１実施形態に係るワイヤボンディングを
用いた接続方法を示す説明図である。本接続方法は、最
終的には、図２（ｃ）に示す様な、第１の部材１と第２
の部材２とがワイヤ３により結線された接続構造を形成
するためのものである。(First Embodiment) FIGS. 1 and 2
FIG. 3 is an explanatory diagram showing a connection method using wire bonding according to the first embodiment of the present invention. This connection method finally ends up with the first member 1 and the second member as shown in FIG.
To form a connection structure in which the members 2 are connected by wires 3.

【００２８】図２（ｃ）に示す接続構造において、各部
材１、２は、特に限定しないが、半導体素子、リードフ
レーム、セラミック基板、プリント基板等を採用するこ
とができる。また、ワイヤ３は、Ａｌ（アルミ）、Ａｕ
（金）、Ｃｕ（銅）等の材質よりなるものを採用するこ
とができる。In the connection structure shown in FIG. 2C, each of the members 1 and 2 is not particularly limited, but may be a semiconductor element, a lead frame, a ceramic substrate, a printed board, or the like. The wire 3 is made of Al (aluminum), Au
Those made of materials such as (gold) and Cu (copper) can be adopted.

【００２９】次に、本実施形態の接続方法について、工
程順に説明していく。図１（ａ）に示す様に、ボンディ
ング装置には、ワイヤ３を保持するとともにワイヤ３に
超音波振動を印加可能なツール１０、ワイヤ３の振動を
抑制すべくワイヤ３を押さえるための押さえ治具１１、
最終的に余分なワイヤ３を切断するためのクランパ１２
が備えられている。これら各部１０〜１２は、図示しな
いが、例えば装置のヘッドに保持され、各部が互いに独
立に作動可能となっている。Next, the connection method of this embodiment will be described in the order of steps. As shown in FIG. 1A, the bonding apparatus includes a tool 10 for holding the wire 3 and applying ultrasonic vibration to the wire 3, and a pressing jig for holding the wire 3 to suppress the vibration of the wire 3. Utensil 11,
A clamper 12 for finally cutting the extra wire 3
Is provided. Although not shown, these units 10 to 12 are held by, for example, a head of the apparatus, and the units can operate independently of each other.

【００３０】まず、図１（ａ）に示す１次ボンディング
工程を行う。ワイヤボンディング用のツール１０にワイ
ヤ（線材）３を保持し、第１の部材１にワイヤ３の先端
部を、図中の矢印Ｆに示す様に超音波振動を加えながら
接続する。この第１の部材１とワイヤ３との接続部を１
次ボンディング部４とする。First, a primary bonding step shown in FIG. A wire (wire) 3 is held by a wire bonding tool 10, and the distal end of the wire 3 is connected to the first member 1 while applying ultrasonic vibration as shown by an arrow F in the figure. The connection between the first member 1 and the wire 3 is 1
The next bonding section 4 is used.

【００３１】続いて、図１（ｂ）に示す様に、第１の部
材１に接続されたワイヤ３を、ツール１０によって保持
しながら、ツール１０を第２の部材２まで移動して着地
させることにより、ワイヤ３を第２の部材２まで引き回
す（引き回し工程）。このとき、押さえ治具１１および
クランパ１２もツール１０と同様に移動する。Subsequently, as shown in FIG. 1B, the tool 10 is moved to and landed on the second member 2 while holding the wire 3 connected to the first member 1 by the tool 10. Thereby, the wire 3 is routed to the second member 2 (routing step). At this time, the holding jig 11 and the clamper 12 also move similarly to the tool 10.

【００３２】次に、図１（ｃ）に示す様に、第２の部材
２まで引き回されたワイヤ３のうち、第１の部材１への
接続部位と第２の部材２へ接続されるべき部位との間の
部位を、押さえ治具１１により支持する。つまり、引き
回し後のワイヤ３のうち１次ボンディング部４とツール
１０との間に位置する部位を、押さえ治具１１にて支持
する。ここで、ワイヤ３において押さえ治具１１により
支持された部位が、支持部３ｂとなる。Next, as shown in FIG. 1C, of the wires 3 routed to the second member 2, the wire 3 is connected to the connecting portion to the first member 1 and to the second member 2. A part between the parts to be laid is supported by the holding jig 11. In other words, a part of the wire 3 after the wiring located between the primary bonding part 4 and the tool 10 is supported by the holding jig 11. Here, the portion of the wire 3 that is supported by the holding jig 11 becomes the support portion 3b.

【００３３】この押さえ治具１１によるワイヤ３の支持
は、図１（ｄ）、（ｅ）に示す様な形にて、行うことが
可能である。図１（ｄ）は、押さえ治具１１として、ワ
イヤ３を挟んで支持する構造を採用したもの、図１
（ｅ）は、治具１１に形成した溝１１ａにワイヤ３を入
れて上方から押さえて支持する構造を採用したものであ
る。The holding of the wire 3 by the holding jig 11 can be performed in a form as shown in FIGS. 1 (d) and 1 (e). FIG. 1D shows a structure in which the holding jig 11 employs a structure in which the wire 3 is supported therebetween.
(E) adopts a structure in which the wire 3 is inserted into the groove 11a formed in the jig 11 and held down from above to support it.

【００３４】こうして、押さえ治具１１によってワイヤ
３を支持した状態で、図２（ａ）に示す２次ボンディン
グ工程を行う。すなわち、第２の部材２に押し当てられ
たワイヤ３に、ツール１０によって、ワイヤ３の長軸方
向に沿った方向）図中の矢印Ｆ方向）へ超音波振動を加
えることにより、ワイヤ３を第２の部材２に接続する。
この第２の部材２とワイヤ３との接続部を２次ボンディ
ング部５とする。In this manner, the secondary bonding step shown in FIG. 2A is performed while the wire 3 is supported by the holding jig 11. That is, the tool 3 applies ultrasonic vibration to the wire 3 pressed against the second member 2 in a direction along the long axis direction of the wire 3 (in a direction indicated by an arrow F in the figure) to thereby apply the wire 3 to the wire 3. Connect to the second member 2.
The connection portion between the second member 2 and the wire 3 is referred to as a secondary bonding portion 5.

【００３５】ここまでの工程によって、第１の部材１と
第２の部材２とがワイヤ３を介して結線される。次に、
図２（ｂ）に示す様に、押さえ治具１１をワイヤ３から
解除し、ツール１０およびクランパ１２を適量後退させ
る。By the steps described above, the first member 1 and the second member 2 are connected via the wire 3. next,
As shown in FIG. 2B, the holding jig 11 is released from the wire 3, and the tool 10 and the clamper 12 are retracted by an appropriate amount.

【００３６】そして、図２（ｃ）に示す様に、ツール１
０およびクランパ１２を更に後退させ、ワイヤ３を切断
して余分な部分を除去することにより、本実施形態の接
続方法が完了し、上記した接続構造が出来上がる。Then, as shown in FIG.
The connection method of the present embodiment is completed by further retracting the clamp 0 and the clamper 12 and cutting the wire 3 to remove an excess portion, thereby completing the connection structure described above.

【００３７】ところで、本実施形態の接続方法によれ
ば、１次ボンディングを行った後、１次ボンディング部
４と２次ボンディング部５になるべき部位との間にて、
押さえ治具１１によってワイヤ３を支持した状態で（支
持部３ｂを形成した状態で）、２次ボンディングを行う
ことになる。By the way, according to the connection method of the present embodiment, after the primary bonding is performed, between the primary bonding portion 4 and the portion to be the secondary bonding portion 5,
Secondary bonding is performed while the wire 3 is supported by the holding jig 11 (while the support portion 3b is formed).

【００３８】そのため、２次ボンディングによるワイヤ
３の共振振動は、治具１１によって支持されたワイヤ３
の支持部３ｂにて抑制され、当該振動の１次ボンディン
グ部４への伝達が抑制される。よって、２次ボンディン
グ時にワイヤ３に加わる振動による１次ボンディング部
４の強度低下を防止することができる。ちなみに、本接
続方法によれば、１次ボンディング部４におけるワイヤ
３のネック部３ａにて、クラックは発生しなかった。Therefore, the resonance vibration of the wire 3 due to the secondary bonding is reduced by the wire 3 supported by the jig 11.
And the transmission of the vibration to the primary bonding section 4 is suppressed. Therefore, it is possible to prevent a decrease in the strength of the primary bonding portion 4 due to the vibration applied to the wire 3 during the secondary bonding. By the way, according to this connection method, no crack occurred at the neck 3a of the wire 3 in the primary bonding portion 4.

【００３９】また、本実施形態において、押さえ治具１
１は、金属製、樹脂製等のものにできるが、ワイヤ３を
支持する面には、ワイヤ３を傷つけないように、ゴムや
樹脂のシートを付けた構成としても良い。In this embodiment, the holding jig 1
1 may be made of metal, resin, or the like, but may have a configuration in which a rubber or resin sheet is attached to the surface supporting the wires 3 so as not to damage the wires 3.

【００４０】また、本発明者等の検討では、線径が１０
０μｍ以下と細いＡｌのワイヤ３において、上記したネ
ック部３ａの破断が発生しやすいため、本実施形態の接
続方法は、線径１００μｍ以下のＡｌのワイヤ３を用い
た場合に、特に有効である。According to the study by the present inventors, the wire diameter was 10 mm.
In the Al wire 3 having a thickness as small as 0 μm or less, the above-described breakage of the neck portion 3a is likely to occur. Therefore, the connection method of this embodiment is particularly effective when the Al wire 3 having a wire diameter of 100 μm or less is used. .

【００４１】また、本実施形態によれば、ワイヤ３をツ
ール１０に保持しつつワイヤ３の先端部を第１の部材１
に接続し、ワイヤ３をツール１０によって第２の部材２
まで引き回した後、超音波振動を印加しながら第２の部
材２に接続するボンディング装置において、ワイヤ３の
うち、第１の部材１への接続部位と第２の部材２へ接続
されるべき部位との間の部位を支持する押さえ治具１１
を備えたボンディング装置を提供することができる。そ
して、このボンディング装置を用いて本実施形態の接続
方法を適切に実現している。According to the present embodiment, while holding the wire 3 on the tool 10, the tip of the wire 3 is connected to the first member 1.
And the wire 3 is connected to the second member 2 by the tool 10.
In the bonding apparatus connected to the second member 2 while applying the ultrasonic vibration after being drawn up to the second member 2, a portion of the wire 3 to be connected to the first member 1 and a portion to be connected to the second member 2 Jig 11 for supporting the part between
Can be provided. Then, the connection method of the present embodiment is appropriately realized using this bonding apparatus.

【００４２】（第２実施形態）本第２実施形態も、上記
第１実施形態と同様、ワイヤ３を１次ボンディングした
後、ワイヤ３のうち第１の部材１への接続部位と第２の
部材２へ接続されるべき部位との間に、ワイヤ３が支持
された支持部３ｂを形成した状態で２次ボンディングを
行うが、上記第１実施形態では、押さえ治具１１により
ワイヤ３の支持を行っていたのに対し、本実施形態で
は、振動吸収部材２０を用いてワイヤ３を支持すること
が主たる相違点である。(Second Embodiment) In the second embodiment, similarly to the first embodiment, after the wire 3 is primarily bonded, the connection portion of the wire 3 to the first member 1 and the second The secondary bonding is performed in a state where the supporting portion 3b supporting the wire 3 is formed between the portion to be connected to the member 2 and the supporting portion 3b. In the first embodiment, the supporting jig 11 supports the wire 3. However, in the present embodiment, the main difference is that the wire 3 is supported by using the vibration absorbing member 20.

【００４３】図３は、本実施形態の接続方法の要部を示
す図である。本実施形態では、第１の部材１のうちワイ
ヤ３と接続される部位の近傍に、ワイヤ３に加わる振動
を吸収可能な樹脂やゴム等よりなる振動吸収部材２０を
設けた後に、上記図１及び図２に示した接続方法（ただ
し、押さえ部材１１は用いても用いなくても良い）を行
う。FIG. 3 is a diagram showing a main part of the connection method of this embodiment. In the present embodiment, after a vibration absorbing member 20 made of a resin, rubber, or the like capable of absorbing vibration applied to the wire 3 is provided in the vicinity of a portion of the first member 1 connected to the wire 3, FIG. And the connection method shown in FIG. 2 (however, the holding member 11 may or may not be used) is performed.

【００４４】そして、この接続方法における２次ボンデ
ィング（上記図２（ａ）参照）は、振動吸収部材２０に
ワイヤ３を接触させた状態で行う。それによって、ワイ
ヤ３のうち１次ボンディング部４の近傍部分が振動吸収
部材２０に接した状態で、２次ボンディングが行われる
ことになる。ここで、ワイヤ３において振動吸収部材２
０に接して支持された部位が、支持部３ｂとなる。The secondary bonding (see FIG. 2A) in this connection method is performed in a state where the wire 3 is in contact with the vibration absorbing member 20. Thereby, the secondary bonding is performed in a state where the portion of the wire 3 near the primary bonding portion 4 is in contact with the vibration absorbing member 20. Here, the vibration absorbing member 2
The portion supported in contact with 0 is the support portion 3b.

【００４５】そのため、２次ボンディングによるワイヤ
３の共振振動は、支持部３ｂにおいて振動吸収部材２０
に吸収されて抑制され、当該振動の１次ボンディング部
４への伝達が抑制される。よって、本実施形態において
も、２次ボンディング時にワイヤ３に加わる振動による
１次ボンディング部４の強度低下を防止することができ
る。Therefore, the resonance vibration of the wire 3 due to the secondary bonding is reduced by the vibration absorbing member 20 at the support portion 3b.
And the vibration is suppressed, and the transmission of the vibration to the primary bonding portion 4 is suppressed. Therefore, also in the present embodiment, it is possible to prevent a decrease in the strength of the primary bonding portion 4 due to the vibration applied to the wire 3 during the secondary bonding.

【００４６】なお、本実施形態においては、振動吸収部
材２０は、第１の部材１のうちワイヤ３と接続される部
位の近傍でなくとも、第２の部材２のうちワイヤ３と接
続される部位の近傍に形成しても良い。さらには、両部
材１、２におけるワイヤ３と接続される部位の近傍に形
成しても良い。In this embodiment, the vibration absorbing member 20 is connected to the wire 3 of the second member 2 even if it is not near the portion of the first member 1 to which the wire 3 is connected. It may be formed near the site. Further, it may be formed in the vicinity of a portion of both members 1 and 2 connected to wire 3.

【００４７】そして、本実施形態においては、第１の部
材１と第２の部材２とがワイヤボンディングにより形成
されたワイヤ３により接続されてなる接続構造におい
て、第１の部材１のうちワイヤ３と接続された部位およ
び第２の部材２のうちワイヤ３と接続された部位の少な
くとも一方の部位の近傍に、振動吸収部材２０が設けら
れているワイヤボンディングを用いた接続構造が提供さ
れる。In this embodiment, in the connection structure in which the first member 1 and the second member 2 are connected by the wire 3 formed by wire bonding, the wire 3 of the first member 1 A connection structure using wire bonding is provided in which a vibration absorbing member 20 is provided near at least one of a portion connected to the wire 3 and a portion connected to the wire 3 of the second member 2.

【００４８】この振動吸収部材２０の、より具体的な構
成例を図４に示す。図４（ａ）は、第１及び第２の部材
１、２として、ＩＣチップ１００を用いた場合を示す概
略断面図である。ＩＣチップ１００は、基板１０１に接
着剤１０２を介して搭載されている。このＩＣチップ１
００の表面には、下側から順に、シリコン窒化膜等より
なる保護膜１０３、表面保護膜としてのポリイミド膜１
０４が形成されている。FIG. 4 shows a more specific configuration example of the vibration absorbing member 20. FIG. 4A is a schematic cross-sectional view illustrating a case where an IC chip 100 is used as the first and second members 1 and 2. The IC chip 100 is mounted on a substrate 101 via an adhesive 102. This IC chip 1
00, a protective film 103 made of a silicon nitride film or the like and a polyimide film 1 as a surface protective film are arranged in this order from the bottom.
04 is formed.

【００４９】ここで、ＩＣチップ１００のうちワイヤ３
と接続されるべき部位であるパッド（例えばＡｌ等より
なる）１０５は、両膜１０３、１０４に設けられた開口
部から露出している。そして、このパッド１０５にワイ
ヤ３が接続されている。Here, the wire 3 of the IC chip 100
A pad (made of, for example, Al) 105 which is a portion to be connected to the substrate is exposed from openings provided in both films 103 and 104. The wire 3 is connected to the pad 105.

【００５０】このとき、ワイヤボンディングにて形成さ
れるワイヤ３の形状を考慮して、パッド１０５の近傍の
ポリイミド膜１０４を、局部的に厚くする等により、ワ
イヤ３の引き回しによってポリイミド膜１０４とワイヤ
３とが接触するようにし、ワイヤ３に支持部３ｂを形成
する。At this time, in consideration of the shape of the wire 3 formed by wire bonding, the polyimide film 104 in the vicinity of the pad 105 is locally thickened or the like. 3 so as to be in contact with each other, and a supporting portion 3b is formed on the wire 3.

【００５１】ポリイミド膜１０４を局部的に厚くするこ
とは、ポリイミドを一部余分に塗布したり、厚くする部
分の周囲をエッチングして薄くする等の手法により、実
現可能である。そして、このワイヤ３と接するポリイミ
ド膜１０５の部分が、振動吸収部材２０として構成され
る。It is possible to locally increase the thickness of the polyimide film 104 by a method such as partially applying extra polyimide or etching the periphery of the thickened portion to reduce the thickness. The portion of the polyimide film 105 that is in contact with the wire 3 is configured as the vibration absorbing member 20.

【００５２】また、図４（ｂ）は第１及び第２の部材
１、２として、プリント基板やセラミック基板等の配線
基板１１０を用いた例を示す概略斜視図である。この配
線基板１１０のうちワイヤ３と接続されるべき部位であ
るパッド（導体部）１１１に、ワイヤ３が接続されてい
る。FIG. 4B is a schematic perspective view showing an example in which a wiring board 110 such as a printed board or a ceramic board is used as the first and second members 1 and 2. The wire 3 is connected to a pad (conductor portion) 111 which is a portion of the wiring board 110 to be connected to the wire 3.

【００５３】このとき、ワイヤボンディングにて形成さ
れるワイヤ３の形状を考慮して、パッド１１１の近傍
に、振動吸収部材としての突起部１１２を設け、ワイヤ
３の引き回しによって突起部１１２とワイヤ３とが接触
するようし、ワイヤ３に支持部３ｂを形成する。このよ
うな突起部１１２は、例えば、次のようにして形成する
ことができる。At this time, in consideration of the shape of the wire 3 formed by wire bonding, a protrusion 112 as a vibration absorbing member is provided near the pad 111, and the protrusion 112 and the wire 3 And the supporting portion 3b is formed on the wire 3. Such a protrusion 112 can be formed, for example, as follows.

【００５４】配線基板１１０がプリント基板である場合
には、シルク印刷によって部品配置用の記号を基板上に
形成するときに、これら記号と同時に突起部１１２も形
成できる。また、エポキシ樹脂等を印刷、塗布する等に
より形成しても良い。また、セラミック基板の場合に
は、シリコンゴム等を印刷、塗布する等により形成する
ことができる。When the wiring board 110 is a printed board, when the symbols for arranging the components are formed on the board by silk printing, the projections 112 can be formed simultaneously with these symbols. Further, it may be formed by printing or coating an epoxy resin or the like. In the case of a ceramic substrate, it can be formed by printing or coating silicon rubber or the like.

【００５５】（第３実施形態）本第３実施形態も、上記
第１実施形態と同様、ワイヤ３を１次ボンディングした
後、ワイヤ３のうち第１の部材１への接続部位と第２の
部材２へ接続されるべき部位との間に、ワイヤ３が支持
された支持部３ｂを形成した状態で２次ボンディングを
行うが、本実施形態では、ワイヤ３の支持方法が上記各
実施形態とは異なり、２次ボンディングを２回行うこと
で、１回目の２次ボンディング部５ａを、ワイヤ３の支
持部３ｂとしたものである。(Third Embodiment) In the third embodiment, similarly to the above-described first embodiment, after the wire 3 is primarily bonded, the connection portion of the wire 3 to the first member 1 and the second The secondary bonding is performed in a state where the support portion 3b supporting the wire 3 is formed between the portion to be connected to the member 2 and the second embodiment. In contrast, by performing the secondary bonding twice, the first secondary bonding portion 5a is used as the supporting portion 3b of the wire 3.

【００５６】図５は、本実施形態に係るワイヤボンディ
ングを用いた接続方法を示す説明図である。本実施形態
の接続方法について、工程順に説明していく。なお、本
実施形態のボンディング装置は、上記した押さえ治具１
１は備えておらず、ツール１０、クランパ１２を備えて
いるが、押さえ治具１１を備えて併用しても良い。FIG. 5 is an explanatory diagram showing a connection method using wire bonding according to the present embodiment. The connection method of the present embodiment will be described in the order of steps. The bonding apparatus according to the present embodiment includes the holding jig 1 described above.
1 is not provided, but is provided with a tool 10 and a clamper 12, but a holding jig 11 may be provided and used together.

【００５７】まず、図５（ａ）、（ｂ）に示す様に、上
記第１実施形態と同様に、ワイヤボンディング用のツー
ル１０に保持されたワイヤ３の先端部を第１の部材１に
接続し（１次ボンディング工程）、第１の部材１に接続
されたワイヤ３をツール１０によって第２の部材２まで
引き回す（引き回し工程）。First, as shown in FIGS. 5A and 5B, the tip of the wire 3 held by the wire bonding tool 10 is attached to the first member 1 as in the first embodiment. The wire 3 connected to the first member 1 is connected to the first member 1 and routed to the second member 2 by the tool 10 (route process).

【００５８】次に、本実施形態における２次ボンディン
グ工程では、ワイヤ３と第２の部材２との接続（２次ボ
ンディング）を２回行うようにし、印加する超音波振動
を１回目の方を２回目よりも弱くしている。Next, in the secondary bonding step in the present embodiment, the connection (secondary bonding) between the wire 3 and the second member 2 is performed twice, and the ultrasonic vibration to be applied is changed to the first one. Weaker than the second time.

【００５９】すなわち、図５（ｃ）に示す様に、１回目
の２次ボンディングは、ワイヤ３が第２の部材２から剥
離しない程度の弱い超音波出力として行う。続いて、図
５（ｄ）に示す様に、ツール１０及びクランパ１２を後
方へ移動し、１回目の２次ボンディング部（１回目の接
続部）５ａとは異なる部位にて、十分な接合強度および
信頼性が得られるように、１回目よりも強い超音波出力
として２回目の２次ボンディングを行う。That is, as shown in FIG. 5C, the first secondary bonding is performed with a weak ultrasonic output that does not peel the wire 3 from the second member 2. Subsequently, as shown in FIG. 5D, the tool 10 and the clamper 12 are moved backward, and a sufficient bonding strength is obtained at a portion different from the first secondary bonding portion (first connection portion) 5a. In order to obtain high reliability and the second time, the second bonding is performed with an ultrasonic output stronger than the first time.

【００６０】そして、図５（ｅ）に示す様に、更に、ツ
ール１０およびクランパ１２を後退させ、ワイヤ３を切
断して余分な部分を除去することにより、本実施形態の
接続方法が完了する。本実施形態では、２次ボンディン
グを２回行うため、２次ボンディング部は、１回目の２
次ボンディング部５ａ、２回目の２次ボンディング部５
ｂの２箇所形成される。そして、１回目の２次ボンディ
ング部５ａにて支持されたワイヤ３の部分が、支持部３
ｂを構成する。Then, as shown in FIG. 5 (e), the tool 10 and the clamper 12 are further retracted, and the wire 3 is cut to remove an extra portion, thereby completing the connection method of the present embodiment. . In this embodiment, since the secondary bonding is performed twice, the secondary bonding unit
Next bonding section 5a, second secondary bonding section 5
b are formed at two places. The portion of the wire 3 supported by the first secondary bonding portion 5a is
b.

【００６１】このように、本実施形態の接続方法では、
２次ボンディング工程において、ワイヤ３と第２の部材
２との接続を２回行うものとし、且つ、１回目は、２回
目よりも弱い超音波振動を印加しながらワイヤ３を第２
の部材２に接続するようにし、２回目は、１回目の２次
ボンディング部（１回目の接続部）５ａとは異なる部位
にて、１回目よりも強い超音波振動を印加しながらワイ
ヤ３を第２の部材２に接続するようにしている。As described above, according to the connection method of this embodiment,
In the secondary bonding step, the connection between the wire 3 and the second member 2 is performed twice, and the first time, the wire 3 is connected to the second member 2 while applying a weaker ultrasonic vibration than the second time.
In the second time, the wire 3 is connected to a portion different from the first secondary bonding portion (first connection portion) 5a while applying a stronger ultrasonic vibration than the first time. It is connected to the second member 2.

【００６２】それによれば、１回目の２次ボンディング
では、比較的弱い超音波振動を印加するため、１次ボン
ディング部へ伝達される線材の共振振動は、１次ボンデ
ィング部４にクラックが発生しない程度に小さいものに
できる。そして、２回目の２次ボンディングでは、比較
的強い超音波振動を印加して確実に接続を行うことがで
きる。つまり、１回目の２次ボンディング部５ａは仮接
合部であり、２回目の２次ボンディング部５ｂにて、確
実に接合した形となる。According to this, in the first secondary bonding, a relatively weak ultrasonic vibration is applied, so that the resonance vibration of the wire transmitted to the primary bonding portion does not cause a crack in the primary bonding portion 4. Can be as small as possible. Then, in the second secondary bonding, a relatively strong ultrasonic vibration can be applied to make a reliable connection. That is, the first secondary bonding portion 5a is a temporary bonding portion, and the second secondary bonding portion 5b is securely bonded at the second secondary bonding portion 5b.

【００６３】ここで、ワイヤ３は、１次ボンディング部
４と２回目の２次ボンディングされるべき部位の間に
て、１回目の２次ボンディング部５ａ（ワイヤの支持部
３ｂ）によって固定、支持されているため、２回目の２
次ボンディングの強い振動は、１次ボンディング部４側
へは伝達されない。Here, the wire 3 is fixed and supported between the primary bonding portion 4 and the portion to be subjected to the second secondary bonding by the first secondary bonding portion 5a (the wire supporting portion 3b). Because it is the second 2
The strong vibration of the next bonding is not transmitted to the primary bonding section 4 side.

【００６４】そのため、本実施形態によっても、２次ボ
ンディングによるワイヤ３の共振振動を抑制でき、２次
ボンディング時にワイヤ３に加わる振動による１次ボン
ディング部４の強度低下を防止することができる。そし
て、１次ボンディング部４におけるワイヤ３のネック部
３ａにて、クラックが発生しない。Therefore, also in the present embodiment, the resonance vibration of the wire 3 due to the secondary bonding can be suppressed, and the strength of the primary bonding portion 4 due to the vibration applied to the wire 3 at the time of the secondary bonding can be prevented. Then, no crack occurs at the neck 3a of the wire 3 in the primary bonding portion 4.

【００６５】また、本実施形態によれば、図５（ｅ）に
示す様に、第１の部材１を１次ボンディング側、第２の
部材２を２次ボンディング側として、第１の部材１と第
２の部材２とがワイヤボンディングにより形成されたワ
イヤ３により接続されてなる接続構造において、ワイヤ
３と第２の部材２との接続部５ａ、５ｂが２箇所あるこ
とを特徴とするワイヤボンディングを用いた接続構造が
提供される。According to the present embodiment, as shown in FIG. 5E, the first member 1 is used as the primary bonding side, and the second member 2 is used as the secondary bonding side. And a second member 2 are connected by a wire 3 formed by wire bonding, in which there are two connection portions 5a and 5b between the wire 3 and the second member 2. A connection structure using bonding is provided.

【００６６】また、本実施形態の好ましい形態を図６を
参照して説明する。上記接続方法によって出来上がった
接続構造を、図５（ｅ）の上方からみた場合、図６
（ａ）に示す様に、１次ボンディング部４、１回目の２
次ボンディング部５ａおよび２回目の２次ボンディング
部５ｂが、ワイヤ３により形成されるループの軸線Ｌ１
上に並んでいる。A preferred embodiment of the present embodiment will be described with reference to FIG. When the connection structure formed by the above connection method is viewed from above in FIG.
As shown in (a), the primary bonding section 4 and the first 2
The second bonding portion 5a and the second secondary bonding portion 5b are connected to the axis L1 of the loop formed by the wire 3.
Lined up.

【００６７】ここにおいて、図６（ｂ）に示す様に、２
回目の２次ボンディングは、１回目の２次ボンディング
部（線材における１回目の接続部）５ａと１次ボンディ
ング部（線材における第１の部材への接続部）４との両
接続部を結ぶ線、すなわち、上記軸線Ｌ１に対して、ワ
イヤ３を交差する方向（図中の一点鎖線Ｌ２の方向）に
引き回した状態で行うことが好ましい。Here, as shown in FIG.
The second secondary bonding is a wire connecting both the connecting portions of the first secondary bonding portion (the first connecting portion of the wire) 5a and the primary bonding portion (the connecting portion of the wire to the first member) 4. That is, it is preferable to perform the operation in a state where the wire 3 is routed in a direction intersecting the axis L1 in the direction intersecting with the axis L1 (the direction of the dashed line L2 in the drawing).

【００６８】それによれば、２回目の２次ボンディング
の際にワイヤ３に加わる振動の方向が、ワイヤ３の長手
軸方向（上記軸線Ｌ１の方向）からずれるため、２回目
の振動が、１次ボンディング部４へ伝達しにくくでき
る。そのため、ワイヤ３の共振によるダメージを、より
効果的に低減することができる。このときのずれ角度θ
は、１０°〜９０°（望ましくは３０°〜９０°）にて
良好な結果が得られる。According to this, the direction of the vibration applied to the wire 3 at the time of the second secondary bonding is shifted from the longitudinal axis direction of the wire 3 (the direction of the axis L1), so that the second vibration Transmission to the bonding portion 4 can be made difficult. Therefore, damage due to resonance of the wire 3 can be reduced more effectively. Deviation angle θ at this time
Gives good results at 10 ° to 90 ° (preferably 30 ° to 90 °).

【００６９】（他の実施形態）なお、上記各実施形態に
おいて、ワイヤ３による第１及び第２の部材１、２の結
線が終了した時点で、治具等を用いてワイヤ３をループ
の頂点方向へ引っ張り、ワイヤ３及び各ボンディング部
４、５の引っ張り強度をチェックするようにしても良
い。(Other Embodiments) In each of the above embodiments, when the connection of the first and second members 1 and 2 by the wire 3 is completed, the wire 3 is connected to the top of the loop using a jig or the like. It is also possible to check the tensile strength of the wire 3 and the bonding portions 4 and 5 by pulling in the direction.

【００７０】また、上記した各実施形態を適宜併用して
も良い。それにより、２次ボンディング時に線材に加わ
る振動による１次ボンディング部の強度低下を防止する
という効果を、いっそう高めることができる。Further, each of the above-described embodiments may be appropriately used in combination. Thereby, the effect of preventing the strength of the primary bonding portion from being reduced due to the vibration applied to the wire during the secondary bonding can be further enhanced.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の第１実施形態に係るワイヤボンディン
グを用いた接続方法を示す説明図である。FIG. 1 is an explanatory diagram showing a connection method using wire bonding according to a first embodiment of the present invention.

【図２】図１に続く接続方法を示す説明図である。FIG. 2 is an explanatory diagram showing a connection method following FIG. 1;

【図３】本発明の第２実施形態に係るワイヤボンディン
グを用いた接続方法の要部を示す説明図である。FIG. 3 is an explanatory diagram showing a main part of a connection method using wire bonding according to a second embodiment of the present invention.

【図４】振動吸収部材のより具体的な構成例を示す図で
ある。FIG. 4 is a diagram showing a more specific configuration example of a vibration absorbing member.

【図５】本発明の第３実施形態に係るワイヤボンディン
グを用いた接続方法を示す説明図である。FIG. 5 is an explanatory diagram showing a connection method using wire bonding according to a third embodiment of the present invention.

【図６】上記第３実施形態の好ましい例を示す説明図で
ある。FIG. 6 is an explanatory diagram showing a preferred example of the third embodiment.

【図７】従来の一般的なワイヤボンディングを用いた接
続方法を示す説明図である。FIG. 7 is an explanatory diagram showing a connection method using conventional general wire bonding.

【符号の説明】[Explanation of symbols]

１…第１の部材、２…第２の部材、３…ワイヤ、３ｂ…
ワイヤの支持部、５ａ…１回目の２次ボンディング部、
１０…ツール、１１…押さえ治具、２０…振動吸収部
材。DESCRIPTION OF SYMBOLS 1 ... 1st member, 2 ... 2nd member, 3 ... wire, 3b ...
Wire support, 5a ... first secondary bonding part,
Reference numeral 10: tool, 11: holding jig, 20: vibration absorbing member.

フロントページの続き (72)発明者 大谷 祐司 愛知県刈谷市昭和町１丁目１番地 株式会 社デンソー内 Ｆターム(参考） 5F044 AA01 AA02 BB01 CC00 CC05Continuation of the front page (72) Inventor Yuji Otani 1-1-1, Showa-cho, Kariya-shi, Aichi F-term in DENSO Corporation (reference) 5F044 AA01 AA02 BB01 CC00 CC05

Claims (8)

【特許請求の範囲】[Claims] 【請求項１】 ワイヤボンディング用のツール（１０）
に保持された線材（３）の先端部を第１の部材（１）に
接続し、前記第１の部材に接続された前記線材を、前記
ツールによって第２の部材（２）まで引き回した後、超
音波振動を印加しながら前記第２の部材に接続する接続
方法において、 前記第１の部材に接続された前記線材のうち、前記第１
の部材への接続部位と前記第２の部材へ接続されるべき
部位との間に、前記線材が支持された支持部（３ｂ）を
形成した後、前記線材を第２の部材に接続することを特
徴とするワイヤボンディングを用いた接続方法。A tool for wire bonding (10)
Is connected to the first member (1), and the wire connected to the first member is routed to the second member (2) by the tool. A connection method for connecting to the second member while applying ultrasonic vibration, wherein the first wire member is connected to the first member.
Forming a supporting portion (3b) that supports the wire between a portion connected to the member and a portion to be connected to the second member, and then connecting the wire to the second member. A connection method using wire bonding. 【請求項２】 ワイヤボンディング用のツール（１０）
に保持された線材（３）の先端部を第１の部材（１）に
接続し、前記第１の部材に接続された前記線材を、前記
ツールによって第２の部材（２）まで引き回した後、超
音波振動を印加しながら前記第２の部材に接続する接続
方法において、 前記第１の部材に接続された前記線材のうち、前記第１
の部材への接続部位と前記第２の部材へ接続されるべき
部位との間の部位を、治具（１１）を用いて支持した状
態で、前記線材を第２の部材に接続することを特徴とす
るワイヤボンディングを用いた接続方法。2. A tool for wire bonding (10).
Is connected to the first member (1), and the wire connected to the first member is routed to the second member (2) by the tool. A connection method for connecting to the second member while applying ultrasonic vibration, wherein the first wire member is connected to the first member.
Connecting the wire to the second member in a state where a portion between the portion to be connected to the member and the portion to be connected to the second member is supported using a jig (11). Characteristic connection method using wire bonding. 【請求項３】 ワイヤボンディング用のツール（１０）
に保持された線材（３）の先端部を第１の部材（１）に
接続し、前記第１の部材に接続された前記線材を、前記
ツールによって第２の部材（２）まで引き回した後、超
音波振動を印加しながら前記第２の部材に接続する接続
方法において、 前記第１の部材のうち前記線材と接続される部位および
前記第２の部材のうち前記線材と接続される部位の少な
くとも一方の部位の近傍に、前記線材に加わる振動を吸
収可能な振動吸収部材（２０）を設け、 前記振動吸収部材に前記線材を接触させた状態で、前記
線材に超音波振動を印加しながら前記第２の部材に接続
することを特徴とするワイヤボンディングを用いた接続
方法。3. A tool for wire bonding (10).
Is connected to the first member (1), and the wire connected to the first member is routed to the second member (2) by the tool. A connection method for connecting to the second member while applying ultrasonic vibration, wherein a portion of the first member connected to the wire and a portion of the second member connected to the wire are A vibration absorbing member (20) capable of absorbing vibration applied to the wire is provided in the vicinity of at least one of the portions, and while applying the ultrasonic vibration to the wire while the wire is in contact with the vibration absorbing member. A connection method using wire bonding, characterized by connecting to the second member. 【請求項４】 ワイヤボンディング用のツール（１０）
に保持された線材（３）の先端部を第１の部材（１）に
接続し、前記第１の部材に接続された前記線材を、前記
ツールによって第２の部材（２）まで引き回した後、超
音波振動を印加しながら前記第２の部材に接続する接続
方法において、 前記線材と前記第２の部材との接続を２回行うように
し、１回目は、２回目よりも弱い超音波振動を印加しな
がら前記線材を前記第２の部材に接続するものであり、
２回目は、１回目の接続部（５ａ）とは異なる部位に
て、１回目よりも強い超音波振動を印加しながら前記線
材を前記第２の部材に接続するものであることを特徴と
するワイヤボンディングを用いた接続方法。4. A tool for wire bonding (10).
Is connected to the first member (1), and the wire connected to the first member is routed to the second member (2) by the tool. In the connection method of connecting to the second member while applying ultrasonic vibration, the connection between the wire and the second member is performed twice, and the first time the ultrasonic vibration is weaker than the second time. While connecting the wire to the second member,
The second time is to connect the wire to the second member while applying a stronger ultrasonic vibration than the first time at a site different from the first connection portion (5a). A connection method using wire bonding. 【請求項５】 前記線材（３）と前記第２の部材（２）
との２回目の接続は、前記線材における前記１回目の接
続部（５ａ）と前記第１の部材（１）への接続部（４）
とを結ぶ線に対して、前記線材を交差する方向に引き回
した状態で行うことを特徴とする請求項４に記載のワイ
ヤボンディングを用いた接続方法。5. The wire (3) and the second member (2)
A second connection with the first connection portion (5a) of the wire and a connection portion (4) to the first member (1).
5. The connection method using wire bonding according to claim 4, wherein the connection is performed in a state where the wire is routed in a direction crossing the wire connecting the wires. 【請求項６】 ワイヤボンディング用の線材（３）をツ
ール（１０）に保持しつつ前記線材の先端部を第１の部
材（１）に接続し、前記第１の部材に接続された前記線
材を、前記ツールによって第２の部材（２）まで引き回
した後、超音波振動を印加しながら前記第２の部材に接
続するボンディング装置において、 前記第１の部材に接続された前記線材のうち、前記第１
の部材への接続部位と前記第２の部材へ接続されるべき
部位との間の部位を、治具（１１）を用いて支持した状
態で、前記線材を第２の部材に接続するようになってい
ることを特徴とするボンディング装置。6. A wire (3) for wire bonding is held by a tool (10), and a distal end of the wire is connected to a first member (1), and the wire connected to the first member is provided. Is drawn to the second member (2) by the tool, and then connected to the second member while applying ultrasonic vibration. Among the wire rods connected to the first member, The first
The wire is connected to the second member in a state where the portion between the connection portion to the member and the portion to be connected to the second member is supported using a jig (11). A bonding apparatus, comprising: 【請求項７】 第１の部材（１）と第２の部材（２）と
がワイヤボンディングにより形成された線材（３）によ
り接続されてなるワイヤボンディングを用いた接続構造
において、 前記第１の部材のうち前記線材と接続された部位および
前記第２の部材のうち前記線材と接続された部位の少な
くとも一方の部位の近傍に、振動吸収部材（２０）が設
けられていることを特徴とするワイヤボンディングを用
いた接続構造。7. A connection structure using wire bonding in which a first member (1) and a second member (2) are connected by a wire (3) formed by wire bonding, wherein: A vibration absorbing member (20) is provided near at least one of a portion of the member connected to the wire and a portion of the second member connected to the wire. Connection structure using wire bonding. 【請求項８】 第１の部材（１）を１次ボンディング
側、第２の部材（２）を２次ボンディング側として、前
記第１の部材と前記第２の部材とがワイヤボンディング
により形成された線材（３）により接続されてなるワイ
ヤボンディングを用いた接続構造において、 前記線材と前記第２の部材との接続部（５ａ、５ｂ）が
２箇所あることを特徴とするワイヤボンディングを用い
た接続構造。8. The first member and the second member are formed by wire bonding with the first member (1) serving as a primary bonding side and the second member (2) serving as a secondary bonding side. In a connection structure using wire bonding connected by a wire (3), there is provided a connection portion (5a, 5b) between the wire and the second member, wherein wire bonding is used. Connection structure.
JP2001123007A 2001-04-20 2001-04-20 Connecting method and connecting structure employing wire bonding Pending JP2002319596A (en)

Priority Applications (1)

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Application Number Priority Date Filing Date Title
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Publications (1)

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Country Link
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006013751A1 (en) * 2004-08-05 2006-02-09 Seiko Epson Corporation Bonding structure, wire bonding method, actuator device and liquid injecting head
JP2007134715A (en) * 2005-11-09 2007-05-31 Semikron Elektronik Gmbh & Co Kg Power semiconductor module
WO2008066190A1 (en) * 2006-11-28 2008-06-05 Kaijo Corporation Wire bonding method and wire bonding apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006013751A1 (en) * 2004-08-05 2006-02-09 Seiko Epson Corporation Bonding structure, wire bonding method, actuator device and liquid injecting head
JP2007134715A (en) * 2005-11-09 2007-05-31 Semikron Elektronik Gmbh & Co Kg Power semiconductor module
KR101271283B1 (en) 2005-11-09 2013-06-04 세미크론 엘렉트로니크 지엠비에치 앤드 코. 케이지 Power Semiconductor Module
WO2008066190A1 (en) * 2006-11-28 2008-06-05 Kaijo Corporation Wire bonding method and wire bonding apparatus

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