JP2002314299A - Device and method for mounting surface-mounted component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To significantly improve manufacturing efficiency in manufacturing different type of electronic circuit boards with a device and method for mounting surface-mounted components. SOLUTION: The device for mounting the surface-mounted component comprises a mark recognition means for recognizing an existing mark arranged on the surface of a transferred substrate, an automatic search means for manufacturing program for automatically searching a manufacturing program corresponding to the existing mark, and an output means of mounting data for outputting the mounting data of a part of the manufacturing program automatically searched. The method for mounting the surface-mounted component comprises the steps of a mark recognition process, automatic search process of manufacturing program, and outputting process of the mounting data. Automatic searching for the appropriate manufacturing program corresponding to the existing mark and outputting only the mounting data of a part of the manufacturing program improves manufacturing efficiency.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mounting component mounting machine and a surface mounting component mounting method, and more particularly, to a surface mounting method for a continuously transported substrate by effectively utilizing existing marks on the substrate surface. The present invention relates to a surface mounting component mounting machine and a surface mounting component mounting method that can significantly improve work efficiency when mounting different types of electronic circuit boards by mounting mounted components in various modes.

[0002]

2. Description of the Related Art Conventionally, mounters have been used when producing surface-mounted components on the surface of a predetermined substrate to produce the same or different types of electronic circuit boards. This mounter
A camera that recognizes surface-mounted components and BOC marks, a feeder that supplies surface-mounted components, a substrate transport device that transports substrates, a head unit that attracts surface-mounted components and moves them to the surface of the board, etc. The mechanism is controlled by a mounter control unit.

[0003] The mounter control section is connected to a storage device such as a hard disk. The storage device stores a production program for producing a desired electronic circuit board. When a desired electronic circuit board is produced by mounting surface mount components at a predetermined position on the board, the production program is output from the storage device to a mounter control unit, and control of the mounter is performed according to the output production program. Is going.

When producing the same kind of electronic circuit board,
For example, a procedure as shown in FIG. 5 is employed. That is, a predetermined production program is output from the storage device to the mounter control unit, and after the board is transported to a predetermined position and positioned, the BOC mark provided on the surface of the board is recognized to correct the displacement of the board position. . Next, according to the production program, the surface-mounted components are mounted on the substrate surface to produce a desired electronic circuit substrate. This process was repeated a plurality of times to continuously produce a predetermined number of electronic circuit boards.

As shown in FIG. 7, the production program includes (1) “board data” storing the size and shape of each board, and (2) coordinates on the board on which the surface mount components are mounted. (3) “Component data” storing the size and shape of each surface-mounted component, and (4) Suction position when each surface-mounted component is sucked. It consists of five components: "suction data" and (5) "vision data" for correcting the position data of the surface mount component recognized by the camera.

[0006]

The production program output to the mounter control section can be continuously used without any inconvenience when the same kind of electronic circuit board is continuously produced as described above. Although it is possible, there are the following inconveniences when continuously producing different types of electronic circuit boards.

That is, as shown in FIG. 6, when a board that cannot be handled by the production program output first is conveyed, the conventional mounter does not have a function of automatically switching to the production program corresponding to this board. Therefore, once the production is stopped by the operator, another production program stored in the storage device is searched, and if there is no appropriate production program, the operator creates a new production program on the spot and performs this search ( It was necessary to go through a complicated procedure of newly outputting the created production program to the mounter control unit, restarting production after performing a setup change operation such as rearrangement of a feeder as necessary.

An object of the present invention is to use an existing mark such as a BOC mark provided in advance on a board for discriminating the board without adding a new device in the surface mount component mounting machine and the surface mount component mounting method. This eliminates the need to exchange production programs for each board,
An object of the present invention is to significantly improve the production efficiency when continuously mounting different types of electronic circuit boards by mounting surface mount components on the boards.

[0009]

In order to solve the above-mentioned problems, a surface mount component mounting machine according to the present invention is, for example, as shown in FIG. Means 11, mark recognition means 12 for recognizing an existing mark provided on the surface of the transferred and positioned substrate, and storage for storing a production program corresponding to each aspect of the recognized existing mark on a one-to-one basis. Means, a production program automatic search means for automatically searching for a production program corresponding to the recognized existing mark, a mounting data output means for outputting mounting data which is a part of the automatically searched production program, Surface mounting component mounting means for mounting a surface mounting component on the surface of the substrate by a production program including the mounting data.

According to the surface mount component mounting machine according to the present invention, the production program is automatically searched according to the form of the existing mark, and only the mounting data which is a part of the production program is output to perform the production. Since the program is updated and the surface mount components are mounted according to the updated production program, even if the type or number of surface mount components to be mounted on the surface of the board changes, the production program can be searched each time, The trouble of newly creating can be saved. In addition, since it is not necessary to output the entire production program, the time required for output can be reduced. As a result, production efficiency can be significantly improved.

As shown in FIG. 3, for example, the surface mounting component mounting method according to the present invention includes a board transfer positioning step S4 for transferring the board to a predetermined position and positioning the board. A mark recognition step S5 for recognizing the provided existing mark, a production program automatic search step S6 for automatically retrieving a production program corresponding to the recognized form of the existing mark, and a part of the automatically retrieved production program. The method is characterized by passing through a mounting data output step S7 for outputting mounting data and a surface mounting component mounting step S8 for mounting surface mounting components on the surface of the substrate in accordance with a production program including the output mounting data.

According to the surface mounting component mounting method according to the present invention, the production program is automatically searched according to the mode of the existing mark, and only the mounting data which is a part of the production program is output to output the production program. Updates are made and surface mount components are mounted according to the updated production program, so even if the type or number of surface mount components to be mounted on the surface of the board changes, search the production program or create a new one each time. This saves time and effort. Also,
Since it is not necessary to output the entire production program, the time required for output can be reduced. As a result, production efficiency can be significantly improved.

[0013]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows a main part of a mounter 10 which is an embodiment of a surface mount component mounting machine according to the present invention. The mounter 10 includes a board transfer positioning unit 11 for transferring and positioning a board, an OCC camera 12 capable of recognizing a BOC mark, a suction nozzle 13 capable of vacuum-sucking a surface mount component, and a vertically moving suction nozzle 13. (Z
Direction) and a rotation direction (θ direction), a head unit 14 for moving the head unit 14 in a horizontal direction (XY direction), a feeder 16 for supplying surface mount components, and a feeder. Feeder setting part 17 for setting the component 16 and a board 19 with a BOC mark for mounting components
And a drive unit (not shown) such as a motor for driving the head unit 14 and the XY movement mechanism 15.

The driving unit is controlled by a mounter control unit 18 to move the head unit 14 to a predetermined position on the feeder 16 and cause the suction nozzle 13 to vacuum-suction the surface-mounted component. Thereafter, the head unit 14 is moved to a predetermined position on the substrate, the vacuum suction state of the suction nozzle 13 is released, and the surface mount component is mounted on the substrate. The method of controlling the driving means by the mounter control unit 18 is a well-known technique, and a description thereof will be omitted.

The mounter control section 18 is equipped with a CPU, an input interface, and an output interface, and is connected to storage means, an input section, and an output section. The CPU of the mounter control unit 18 controls the respective driving means included in the mounter 10 as described above, and also automatically searches for a corresponding production program based on the mode of the BOC mark recognized by the OCC camera 12. It is also used for

The storage means (not shown) connected to the mounter control unit 18 includes, for example, a magnetic recording medium,
It can be constituted by an optical recording medium or the like. The storage means stores various production programs necessary for producing an electronic circuit board by mounting surface mount components on the board. This production program is composed of board data, mounting data, component data, suction data, and vision data, and can be output for each of these components.

FIG. 2 shows the appearance of the entire mounter 10. As shown in FIG. A casing 20 is provided above a main part of the mounter 10 shown in FIG. 1. The casing 20 has a keyboard 21 as an input unit connected to the mounter control unit 18 and a liquid crystal as an output unit. A display 22 is provided.

Next, with reference to FIG. 3, a procedure for producing an electronic circuit board by mounting surface mount components on the board will be described below.

First, the power supply of the mounter 10 is turned on, and the number of substrates to be produced is set on the substrate transfer / positioning unit 11 and the predetermined surface mount components are set on the feeder 16, respectively. ). At this time, all the substrates are of the same type (the same area and the same shape).

Next, in step S2, it is checked whether the production program stored in the storage means is appropriate (it is suitable for production of a desired electronic circuit board). At this time, if the production program is appropriate, the process proceeds to the next step S3.

Next, in step S3, the main production program (master production program) is stored in the storage means.
Output to the mounter controller 18 by the CPU. afterwards,
In step S4, the substrate is transported to a predetermined position by the substrate transport positioning unit 11, and is positioned.

Next, in step S5, the transport
The mode of the BOC mark provided on the surface of the positioned substrate is recognized by the OCC camera 12, and the displacement of the position of the substrate is corrected. Next, in step S6, the CPU automatically searches the storage means for a production program corresponding to the mode of the BOC mark recognized in step S5. That is, the CPU is a production program automatic search means.

Next, in step S7, the mounting data, which is a part of the production program automatically searched, is output from the storage means to the mounter control unit 18 by the CPU. That is, the CPU is an on-board data output unit. Next, in step S8, the CPU 1 controls the head unit 1 of the mounter 10 according to the production program in which only the mounting data is changed.
4. The XY moving mechanism 15 and the like are controlled to mount the surface-mounted components on the board to produce a predetermined electronic circuit board.

Hereinafter, in the same procedure, the production of the electronic circuit board is performed until the number of sheets to be produced is reached (steps S4 to S4).
9). When the production of the electronic circuit boards has been completed up to the production number, the latest production program is stored in the storage means, and the production is completed (steps S10 and S11).

FIG. 4 shows the form of the BOC mark used in the present embodiment. The form of the BOC mark is ○,
The three types of unit marks of □ and △ are provided in at least two of the four corners of the substrate to form a combination of five. Five kinds of production programs are prepared corresponding to the five combinations of the BOC marks described above,
These were stored in the storage means.

More specifically, as shown in FIG. 4, when a circle-shaped unit mark is recognized at the corner 1 and the corner 2 on the board, the production program 1 is automatically searched and the corner 2 on the board is searched. When the unit mark of the circle type is recognized at the corner 3 and the corner 3, the production program 2 is automatically searched and the circle 3 and the corner 4
If the unit mark of the mold is recognized, the production program 3
Is automatically searched, and when the unit mark of the □ type is recognized at the corner 1, the corner 2 and the corner 3 on the board, the production program 4 is automatically searched, and When the unit mark of the mold is recognized, the production program 5 is automatically searched.

According to the mounter 10 shown in the present embodiment, an appropriate production program can be automatically searched from the storage means by the CPU according to the mode of the BOC mark, and the storage means can be read from the storage means by the CPU. Since it is only necessary to output only the mounting data which is a part of the production program automatically searched, the production efficiency can be remarkably improved.

Further, since the BOC mark, which has been conventionally used only for correcting the displacement of the board, is used for the board discrimination, a special board discriminating means such as a bar code detector is not required.

In this embodiment, the BOC mark is used as an existing mark. However, a "bad mark" for identifying a defective board, and a "Bad mark" for correcting a displacement of a mounting position of an electronic circuit component. IC mark "etc.
Like the C mark, it can be used as a substrate discrimination mark.

More specifically, the bad marks and the IC marks are provided in advance in different forms for each substrate, and a production program corresponding to each form is stored in a storage means, and recognized by a camera. The production program is automatically searched by the CPU according to the bad mark or the IC mark, and only the mounting data which is a part of the automatically searched production program is output by the CPU. Make production.

In the present embodiment, the description “BO on the substrate”
Based on the recognition result of the form of the C mark, a function of automatically searching for a corresponding production program and outputting only mounting data that is a part of the production program (hereinafter, referred to as an "automatic board discrimination function") is performed. Although the mounter 10 having the structure is shown, the automatic board discrimination function can be arbitrarily turned ON / OFF.
It is also possible to adopt a structure in which it can be turned off and the production program can be searched and created manually as in the conventional case as occasion demands.

Further, the shape of the unit mark constituting the BOC mark is not limited to the above-described circles, triangles, and squares. Further, the positions at which these unit marks are provided (the coordinates at the four corners on the substrate surface) can also be changed as appropriate.

[0034]

According to the surface mount component mounting machine of the present invention, (1) when producing different kinds of electronic circuit boards, it is not necessary to search for a production program or create a new one as in the prior art. In addition, since it is not necessary to output the entire production program, the production efficiency in producing different types of electronic circuit boards by mounting surface mount components on the same type of board in various modes can be significantly improved.

(2) It is necessary to use a special board discriminating means such as a conventional bar code detector by effectively utilizing an existing mark conventionally used for another purpose as a mark for discriminating a board. Therefore, continuous production of different types of electronic circuit boards can be efficiently performed using a simple device.

According to the surface mounting component mounting method of the present invention, it is not necessary to search for a production program or create a new production program when producing a different type of electronic circuit board as in the prior art. Since it is not necessary to output the entire program, it is possible to remarkably improve the production efficiency when surface mount components are mounted on the same type of board in various modes to produce different types of electronic circuit boards.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a main part of an example of a surface mount component mounting machine according to the present invention, where (a) is an overall perspective view, and (b).
FIG. 2 is an enlarged perspective view of a substrate with a BOC mark.

FIG. 2 is a perspective view showing an exterior of the entire surface mount component mounting machine of FIG. 1;

FIG. 3 is an example of a flowchart showing a surface mounting component mounting method according to the present invention.

FIG. 4 is an explanatory diagram showing examples of existing marks used in the surface mounting component mounting method according to the present invention and examples of respective production programs corresponding thereto.

FIG. 5 is a flowchart showing a conventional continuous production process of the same type of electronic circuit board employed.

FIG. 6 is a flowchart showing a conventional process for continuously producing different types of electronic circuit boards.

FIG. 7 is an explanatory diagram showing components of a production program.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Mounter 11 Substrate conveyance positioning part 12 OCC camera 13 Suction nozzle 14 Head part 15 XY movement mechanism 16 Feeder 17 Feeder installation part 18 Mounter control part 19 Substrate with a BOC mark 20 Casing 21 Keyboard 22 Liquid crystal display S1 Production start S2 Production program check process S3 Master production program output process S4 Board transfer positioning process S5 BOC mark recognition process S6 Production program automatic search process S7 Mounting data output process S8 Surface mounting component mounting process S9 Production discrimination process S10 Production program input process S11 Production end

Claims (3)

[Claims] 1. A surface mount component mounting machine capable of mounting surface mount components on a surface of a substrate conveyed continuously in various manners, comprising: a substrate transfer positioning means for transferring and positioning the substrate to a predetermined position. Mark recognition means for recognizing an existing mark provided on the surface of the substrate which has been conveyed and positioned; storage means for storing a production program in one-to-one correspondence with each aspect of the recognized existing mark; Production program automatic search means for automatically searching for a production program corresponding to the detected existing mark, mounting data output means for outputting mounting data that is a part of the automatically searched production program, and the output mounting data. According to the production program,
And a surface mounting component mounting means for mounting a surface mounting component on the surface of the substrate. 2. The surface mount component mounting machine according to claim 1, wherein said existing mark is a BOC mark. 3. A surface mounting component mounting method for mounting a surface mounting component on a surface of a substrate that is continuously transported in various modes, a substrate transport positioning step of transporting and positioning the substrate to a predetermined position, A mark recognition step of recognizing an existing mark provided on the surface of the transferred and positioned substrate, a production program automatic search step of automatically searching for a production program corresponding to the recognized form of the existing mark, A mounting data output step of outputting mounting data as a part of the production program, and a surface mounting component mounting step of mounting a surface mounting component on the surface of the substrate according to the production program updated by the output mounting data. Surface mounting component mounting method characterized by passing through.