JP2002314021A - Structure of lead frame for electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lead frame that can manufacture a plurality of lead terminals 3, 4, and 5 to a semiconductor device, and a number of electronic components 2 that project from one side of a package body 8 to the semiconductor device using a simply process. SOLUTION: At a site between left and right side frames 11a and at a region between section bars 11b for mutually interlocking both the side frames, a plurality of pairs 6 of first lead terminals for composing one electronic component and a plurality of pairs 6' of second lead terminals for composing one electronic component are aligned so that the pairs face in the opposite direction; at the same time, each of the lead terminals 3', 4', and 5' in each of the pairs 6' of the second lead terminals is positioned among the lead terminals 3, 4, and 5 in the pairs 6 of the first lead terminals; and semiconductor device mounting sections 3a and 3a' in each of the pairs 6 of the first lead terminals and each of the pairs 6' of the second ones are interlocked to the section bars 11b via a narrow piece 11d.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to an electronic component such as a transistor or a diode, as shown in FIG.
A plurality of lead terminals 3, 4, 5 for the semiconductor element,
The present invention relates to a structure of a lead frame used in the manufacture of an electronic component configured to protrude from one side surface of a synthetic resin package 8 for sealing the semiconductor element.

[0002]

2. Description of the Related Art Conventionally, the method shown in FIG. 1 to FIG.

That is, as shown in FIG. 1, one electronic component 2 is composed of a base lead terminal 3 having a semiconductor element mounting portion 3a at the tip and two lead terminals 4 and 5 located on both sides thereof. A lead frame 1 in which a plurality of lead terminal pairs 6 are formed at appropriate intervals in the longitudinal direction at a pitch P is punched out from a thin metal plate. At this time,
The tie bar 1a for integrally connecting the lead terminals 3, 4, and 5 is punched and formed at the same time.

Next, after mounting the semiconductor element 7 on the semiconductor element mounting portion 3a at the tip of the base lead terminal 3 in each lead terminal pair 6 of the lead frame 1, the semiconductor element 7 and the two lead terminals 4 and 5 are mounted. Are electrically connected by wire bonding or the like.

[0005] Next, as shown in FIG. 2, a package 8 made of a synthetic resin for sealing the semiconductor element 6 is formed at the tip of each of the lead terminal pairs 6. The tie bars 1a between them are punched by punches A and B indicated by oblique lines, and the connecting portions of the lead terminals 4 and 5 of each lead terminal pair 6 to the lead frame 1 are punched by punches C indicated by oblique lines. As shown in FIG. 3, both lead terminals 4 and 5 of each lead terminal pair 6 are separated from the lead frame 1.

In this state, that is, in a state where each electronic component 2 is connected to the lead frame 1 via the base lead terminal 3, a mark is imprinted on the package 7 of each electronic component 2, and After performing a performance test by energizing the electronic component 2, finally, the connecting portion of the base lead terminal 3 to the lead frame 1 in each electronic component 2 is punched out by a punch, so that the electronic component 2 is separated from the lead frame 1. Like that.

[0007]

According to this conventional lead frame, the marking of each electronic component 2 and the performance inspection by energization are performed on the lead frame 1 without separating the lead frame 1 from the base. Has the advantage that it can be easily performed in the form of being integrally connected via the lead terminals 3 for use, but on the other hand, the electronic components 2 are arranged in a line at an appropriate pitch P in the longitudinal direction. Accordingly, there is a problem that the number of electronic components that can be manufactured per unit length along the longitudinal direction is small.

According to the present invention, a unit length is measured along a longitudinal direction of a lead frame in a state in which a mark can be imprinted on an electronic component and a performance test by energization can be performed in a form connected to the lead frame. An object of the present invention is to provide a lead frame structure that can increase the number of hits.

[0009]

In order to achieve this technical object, the present invention provides a method of disposing a pair of left and right side frames extending in the longitudinal direction at appropriate intervals along the longitudinal direction of the both side frames. At least one base lead terminal having a semiconductor element mounting portion at the tip is provided between the side frames and between the section bars. A plurality of first lead terminal pairs each including a lead terminal, each lead terminal of each first lead terminal pair being parallel to the longitudinal direction of the side frames, and a direction perpendicular to the longitudinal direction of the both side frames. And a plurality of second lead terminal pairs each including a base lead terminal having a semiconductor element mounting portion at the tip and at least one lead terminal. Re And the lead terminals in the respective second lead terminal pairs are arranged side by side so as to be located between the respective lead terminals in the respective first lead terminal pairs. The first
The lead terminals and the respective second lead terminals of the respective second lead terminals are integrally connected to each other and both side frames by a dam bar extending in a direction perpendicular to the longitudinal direction of the both side frames. Each of the semiconductor element mounting portion of the first lead terminal pair and the semiconductor element mounting portion of each of the second lead terminal pairs is integrally connected to each of the section bars via a narrow strip. ].

[0010]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 5 is a plan view of a lead frame according to an embodiment of the present invention, and FIG. 6 is a partially enlarged view thereof.

In this figure, reference numeral 11 denotes a lead frame formed in a long strip shape by a thin metal plate, and the lead frame 11 is formed by a pair of left and right side frames 11a extending in the longitudinal direction. They are integrally connected by section bars 11b arranged at appropriate intervals along the longitudinal direction of the frame.

A base lead having a semiconductor element mounting portion 3a such as an island at its tip at a position between the side frames 11a and between the section bars 11b of the lead frame 11. Lead terminal pair 6 comprising terminal 3 and lead terminals 4 and 5 on both sides thereof
(This lead terminal pair 6 constitutes one electronic component 2)
(The four in the present embodiment) with the respective lead terminals 3, 4, and 5 in the respective first lead terminal pairs 6 being parallel to the longitudinal direction of the both side frames 11a. Are arranged at appropriate pitch intervals in a direction perpendicular to the longitudinal direction.

Further, a portion of the lead frame 11 between the side frames 11a and between the section bars 11b is similarly provided with a semiconductor element mounting portion 3a 'such as an island at the tip. A second lead terminal pair 6 ′ (the lead terminal pair 6 constitutes one electronic component 2 ′) comprising a base lead terminal 3 ′ and lead terminals 4 ′ and 5 ′ on both sides thereof. In the present embodiment, the four lead terminals 6 ′ are turned in the opposite direction to the first lead terminal pairs 6 and the respective lead terminals 3 ′, 3 ′ in the second lead terminal pairs 6 ′. 4 ', 5' are arranged side by side so as to be located between the respective lead terminals 3, 4, 5 in the respective first lead terminal pairs 6.

Each of the lead terminals 3, 4, 5, and 5 in each of the first lead terminals 6 and each of the second lead terminals 6 '.
Between the 3 ', 4', 5 'and the two side frames 11a are integrally connected by two dam bars 11c extending in a direction perpendicular to the longitudinal direction of the two side frames.

Further, the semiconductor element mounting portion 3a of each of the first lead terminal pairs 6 is connected to the section bar 11b.
Of the second lead terminal pairs 6 are connected integrally to the section bar 11b adjacent to the semiconductor element mounting portion 3a via one or a plurality of (two in the drawing) narrow pieces 11d. ′, One or a plurality (two in the drawing) of narrow strips 11 d ′ are connected to the section bar 11 b of each section bar 11 b adjacent to the semiconductor element mounting section 3 a ′. And connected together.

When manufacturing the electronic component 2 using the lead frame 11 configured as described above, first, as shown in FIG. 7, the semiconductor element mounting portion 3a and the first After the semiconductor element 7 is mounted on each of the semiconductor element mounting portions 3a 'of the two lead terminal pairs 6', the semiconductor element 7 and the two lead terminals 4, 5,.
4 'and 5' are electrically connected by wire bonding or the like.

Next, as shown in FIG. 8, the tip of each of the first lead terminal pairs 6 and the tip of each of the second lead terminal pairs 6 'are made of synthetic resin to seal the semiconductor element 7, as shown in FIG. By forming the package body 8 described above, the electronic component 2 by each of the first lead terminal pairs 6 and the electronic component 2 by each of the second lead terminal pairs 6 'are formed.

Next, as shown in FIG. 9, the two dam bars 11c are punched out by punches A, B, and C shown by oblique lines, thereby forming the first lead terminal pairs 6 as shown in FIG. Each lead terminal 3, 4, in the electronic component 2
5 and the respective lead terminals 3 ′ 4 ′ 5 ′ in the electronic component 2 by the respective second lead terminal pairs 6 ′ are connected to the lead frame 1.
Disconnect from 1.

At this time, each of the electronic components 2 is not completely separated from the lead frame and the narrow pieces 11
In this state, that is, in a state of being integrally connected to the lead frame 11, a performance test is performed by imprinting a mark on each of the electronic components 2 and energizing the electronic components 2, because the electronic components 2 are integrally connected to the lead frame 11 through the lead frame 11 And so on.

When the performance of the marking and the performance inspection by energization are completed, finally, each of the narrow strips 11d
Is punched out with a punch, so that all of the electronic components 2 are separated from the lead frame 11.

[0022]

As described above, according to the structure of the lead frame of the present invention, in addition to manufacturing the electronic components in two rows in the width direction of the lead frame, the lead terminals in each of the two rows of electronic components are manufactured. By overlapping each other with respect to the longitudinal direction of the lead frame,
While the number of electronic components that can be manufactured per unit length of the lead frame can be greatly increased, while each electronic component is integrally connected to the lead frame, the marking and energization of each electronic component are performed. Since a performance test or the like can be performed, there is an effect that the process can be significantly simplified as compared with a case where the performance test for each electronic component is performed after the electronic component is separated from the lead frame.

In particular, as described in claim 2, the plurality of narrow pieces are provided for one semiconductor element mounting portion, so that each electronic component has its lead terminals separated from the lead frame. Since it is possible to reduce the displacement of the lead frame in the lateral direction and the displacement such that the lead frame rises or sinks from the surface, there is an advantage that the performance inspection of each electronic component can be further facilitated.

[Brief description of the drawings]

FIG. 1 is a plan view showing a conventional lead frame.

FIG. 2 is a plan view showing a state where a package body is molded in the conventional lead frame.

FIG. 3 is a plan view showing a state where lead terminals are separated in the conventional lead frame.

FIG. 4 is a perspective view of an electronic component.

FIG. 5 is a plan view showing a lead frame according to the embodiment of the present invention.

FIG. 6 is an enlarged view of a main part of FIG. 5;

FIG. 7 is a plan view showing a state where a semiconductor element is mounted on the lead frame of the present invention.

FIG. 8 is a plan view showing a state in which a package is molded in the lead frame of the present invention.

FIG. 9 is a plan view showing a state in which a dam bar is punched in the lead frame of the present invention.

FIG. 10 is a plan view showing a state after punching a dam bar in the lead frame of the present invention.

[Explanation of symbols]

 2 Electronic component 3, 3 'Base lead terminal 3a, 3a' Semiconductor element mounting part 4, 5, 4 ', 5' Lead terminal 6, 6 'Lead terminal pair 7 Semiconductor element 8 Package body 11 Lead frame 11a Side frame 11b Section bar 11c Dam bar 11d Narrow strip

Claims (2)

[Claims] A pair of left and right side frames extending in the longitudinal direction are integrally connected to each other by section bars disposed at appropriate intervals along the longitudinal direction of the both side frames. A plurality of first lead terminal pairs each including a base lead terminal having a semiconductor element mounting portion at the tip and at least one lead terminal are provided between the section bars. Each lead terminal in the first lead terminal pair is made parallel to the longitudinal direction of both side frames,
A second lead terminal which is disposed at appropriate pitch intervals in a direction perpendicular to the longitudinal direction of the both side frames, and also includes a base lead terminal having a semiconductor element mounting portion at the tip and at least one lead terminal. A plurality of the pairs are arranged such that each of the second lead terminal pairs is opposite to each of the first lead terminal pairs, and each of the lead terminals of each of the second lead terminal pairs is replaced with each of the leads of each of the first lead terminal pairs. The first lead terminal and the second lead terminal are arranged side by side so as to be located between the terminals, and a space between each of the lead terminals and both side frames is perpendicular to the longitudinal direction of the both side frames. And a semiconductor chip mounting portion in each of the first lead terminal pairs and a semiconductor element mounting portion in each of the second lead terminal pairs are respectively connected to the respective memory cells. Relative Deployment bar structure of an electronic component lead frame, characterized in that integrally connected to via a narrow strip. 2. The method according to claim 1, wherein the narrow strip is
A lead frame structure for an electronic component, wherein a plurality of semiconductor element mounting portions are provided.