JP2002307198A - Powder forming die, powder forming method, and powder forming device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a powder forming die, a powder forming method and a powder forming device in which the powder can be fed without including air to ensure the uniform quality, miniaturization and low profile, and dimensional change of a formed body can be performed, and the formed body can be discharged without any abrasion of either the forming die or the formed body. SOLUTION: Facing side surfaces 12 of a pair of forming dies 10-1 and 10-2 have stepped shape, and four forming cavity 16 with two-dimensionally closed four sides are simultaneously formed between the side surfaces 12 by two surfaces 14H and 14V, etc., intersected with each other of a corresponding stepped part 14. Powder 18 is fed into the forming spaces, the forming spaces are sealed, the forming dies are, for example, allowed to simultaneously slide and the powder is compressed to simultaneously form four molded bodies. The molded bodies are discharged by moving a chute hole below the formed bodies.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a powder molding die, a powder molding method, and a powder molding apparatus for molding a molded product by compressing powder supplied to a molding space.

[0002]

2. Description of the Related Art A molding method (powder molding method) for molding a molded article by compressing a powder supplied to a molding space by pressure is widely adopted. For example, electronic components such as pharmaceutical tablets and capacitor elements have been molded by such molding methods. In an electronic component such as a capacitor element, post-processing such as sintering a molded product and immersing the molded product in an acid solution (electrolyte solution) is performed after the molding.

A general example of powder molding will be described with reference to FIG. 1. The punch 104 is inserted into the hollow die (female mold, upper mold) 102 from below, and the molding space 116 having an opening at the upper side is inserted into the die 102.
The powder 118 is supplied to the molding space 116 from the opening (see FIG. 5A). 2. After closing the opening of the molding space 116 with the cover plate 120, the punch 104 is raised and the powder 118 of the molding space 116 is
Is pressed and compressed to form a molded product 122 (see FIG. 5B). 3. The molded product 122 is discharged from the die 102. The discharge is performed, for example, by removing the cover plate 120, raising the punch 104, extruding the molded product 122 from the molding space 116, and sliding the molded product 122 to the side (see FIG. 5C).

In FIG. 5, the punch 104 is raised and compressed under pressure. However, the cover plate 120 is shaped so as to be inserted into the molding space 116, and the punch 104 is fixed.
The powder 118 in the molding space 116 may be pressed and compressed by lowering the port 120 as an upper punch. In this case as well, even when the punch 104 shown in FIG. 5 is raised and compressed under pressure, the punch 104 is lowered after molding to remove the molded product 122 from the molding space 11.
6 may be discharged from below.

In recent years, the size and thickness of molded products have been reduced, the openings of molding spaces have become smaller, and the supply of powder itself has become more difficult. If the opening is small, the powder easily entrains the air and is easily supplied to the molding space, and the air that has flowed into the molding space loses an escape space during pressurization and compression. High density (compressed density) cannot be obtained. If a uniform density (compression density) cannot be obtained, the quality will vary, and a uniform molded product cannot be obtained. In the molding of electronic components, for example, capacitor elements, if the density (compression density) of the molded product is not uniform, sintering and immersion in an electrolytic solution will be uneven, and uniform quality (electrical characteristics) will be obtained overall. Absent.

In the molding die (powder molding die) comprising the combination of the punch and the die, the opening of the molding space is equal to the size (width) of the molded product, and it cannot cope with the miniaturization of the molded product.
In order to solve this problem, Japanese Patent No. 2565849 discloses a method in which a molding die is composed of one female mold and a pair of male dies, and a pair of male dies are arranged in a molding groove provided in the female mold from left and right in a central direction. It is configured to slide and compress the powder under pressure.
In this configuration, the opening of the molding space can be set to an arbitrary size by the space between the pair of male dies.

In other words, according to Japanese Patent No. 2565849, as shown in FIGS. 6A and 7A, one forming groove 203 is provided inside the female mold 202, and A pair of male molds 204L and 204R are slidably opposed to each other. Then, the pair of male molds 204L and 204R are simultaneously slid (slid) from left and right in the center direction to form a pair of male molds 20L and 204R.
A molding space 216 is formed in the center of the female mold 202 between the 4L, 204R and the female mold 202.

FIGS. 6A, 6B and 7C show an exploded perspective view and a longitudinal sectional view of the molding die 200 at the time of powder supply, compression and discharge, respectively.

[0009] A pair of male molds 20 are formed inside the molding groove 203 of the female mold 202.
In this mold 200 in which the 4L and 204R slide, the molding space 216 has a pair of side surfaces 203a1, 20a of a fixed female mold groove.
A closed molding space 216 having four faces in two dimensions is formed two-dimensionally by 3a2 and the opposing end faces 204La and 204Ra of the movable male mold (see an enlarged drawing of FIG. 6A).

Since two surfaces (side surfaces 203a1, 203a2) of the female mold 202 and two surfaces (end surfaces 204La, 204Ra) of the male dies 204L, 204R form a molding space 216, a pair of male dies 204 are formed.
L, 204R are slid and the distance between them (end surfaces 204La, 204R
By changing (Ra position), the molding space 216 can be formed to any size. Therefore, when powder is supplied, the molding space
The pair of male molds 204L, 204R is first slid so that 216 is set to be larger than the size of the molded article, and after the powder is supplied, the pair of male molds 204L, 204R can be further slid and compressed. .

That is, the opening of the molding space 216 is formed with a width X ′ larger than the width X of the molded product 222, and the powder 218 is supplied (see FIGS. 6A and 7A). -Plate 22
After closing the molding space 216 with 0, a pair of male molds 204L, 204R
At the same time, slide the powder to the specified width X
Is press-compressed to form a molded product 222 (FIG. 6).
(B) and FIG. 7 (B)). In addition, an eave portion 202a that covers the upper surfaces of the male molds 204L and 204R extends from the upper part of the female mold 202,
Male type 204L, 204R when sliding with female type eaves 202a
(FIGS. 7A and 7B)
(C)).

As described above, the opening of the molding space 216 can be formed to have an arbitrary size, and the opening of the molding space 216 has a width X ′ larger than the width X of the molded product 222, so that the powder 218 can be smoothly formed. It can be supplied and can be used for miniaturization of molded products.

Of course, since the powder 218 is supplied smoothly,
There is no air involved. For this reason, the powder can be uniformly pressed and compressed without leaving voids therein, and a molded article having a uniform density (compressed density) (a molded article of uniform quality) can be molded.
Therefore, a molded article having uniform quality (electrical characteristics) can be easily obtained as a whole even in electronic parts.

The fact that the opening of the molding space 216 can be formed in an arbitrary size means that moldings having different widths X can be molded. Therefore, the female mold 202, male mold 204L, A versatile (powder) molding die 200 can be obtained without replacing 204R.

In Japanese Patent No. 2565849, a chip type tantalum solid electrolytic capacitor element (tantalum capacitor element) is formed by compressing powder (tantalum powder) under pressure.

Since the tantalum capacitor element is formed by inserting the lead wire into the tantalum powder from above and compressing the tantalum powder under pressure, the same direction (vertical direction) as the lead wire insertion direction is used. When the tantalum capacitor element is molded by the conventional molding method shown in FIG. 5, the lead wire cannot be sufficiently tightened and held, and the lead wire may fall off. Cheap.

However, in Japanese Patent No. 2565849, since the powder is pressed and compressed in a direction (horizontal direction) perpendicular to the insertion direction (vertical direction) of the lead wire, the lead wire is firmly held. It can be clamped and held, preventing the lead wire from falling off. Accordingly, the lead wire can be firmly held even in a thin molded product 222 having a small height H (see FIG. 7B), and the molded product can be made thin. When the powder is lightly pressed and compressed, a lead wire is inserted and then further pressed and molded.
The lead wire can be installed accurately and easily.

[0018]

[Patent Document 2]
No. is an excellent powder molding method that not only exhibits excellent effects in the ease of powder supply, prevention of air entrapment, and uniform quality as well as the ability to reduce the size and thickness of molded products and change dimensions. There is no doubt that.

However, in a molding die in which a pair of male dies are slid inside the female molding groove, it is inevitable to form the molding space 216 (the female molding groove 203) and the male dies 204L, 2L.
The slide path (slide path) of 04R coincides, which causes a fundamental inconvenience. In other words, four closed molding spaces 216 are formed two-dimensionally by the female mold surface and the male mold surface (the pair of side surfaces 203a1 and 203a2 of the female mold groove and the opposite end surfaces 204La and 204Ra of the male mold). In the forming die, the female forming groove 203 which is a part of the forming space 216 becomes a slide path (sliding path) of the male dies 204L and 204R, and forms the forming space 216 (the female forming groove 203). ) And the slide paths (slide paths) of the male molds 204L and 204R coincide with each other.

The part that forms part of the molding space 216 (the female molding groove 203 (more precisely, the side surfaces 203a1, 203a2)) and the male mold 2
A configuration in which the slide paths (slide paths) of 04L and 204R coincide with each other is not preferable in terms of durability and uniform quality of the mold 200.

That is, a pair of male molds 204 are formed inside the female mold 202.
In the configuration in which the pressure is compressed by sliding the L and 204R, the molded product is inserted into the shot hole 226 using a male slide.
When the molded product is moved upward, the molded product naturally falls through the shot hole 226, and the molded product can be easily discharged. In this embodiment, one of the male molds 204R is further slid after the molding to form the molded product. Discharge is being performed (see FIG. 7C).

However, when the molded product 222 is moved along the slide path (female molded groove 203) by sliding the male mold 204R for discharge, the molded product 222 such as a tantalum capacitor element has The groove 203, that is, the side surfaces 203a1 and 203a2 thereof are polished and damaged by the polishing action of the molded product 222, which adversely affects the durability of the female mold 202. In the configuration of the embodiment in which the eave portion 202a is provided above the female mold 202 and the molded product 222 is moved in the vertical direction while restraining the molded product 222, not only the side surfaces 203a1 and 203a2 of the molded groove 203 but also the molded groove 203 (the female mold) The bottom and top surfaces of 202) are also damaged by the polishing action.

Further, the female mold 202 is polished by the slide of the molded article 222, and the molded article 222 itself is also molded into the molding groove.
The contact surface with 203 (female mold 202) is polished and smoothed.
The molded article 222 is immersed in an acid solution (electrolyte solution) between the four smoothed surfaces (upper and lower surfaces, the front surface, and the rear surface) and the two non-contact surfaces (left and right surfaces) that are still rough. The permeation state of the liquid in the chemical conversion treatment or the like is different, and the quality is locally different, so that uniform quality (electrical characteristics) cannot be obtained as a whole.

In this molding method, the punch,
Similar to the conventional molding method using a die composed of a die, only one molded product can be obtained in one cycle, which is not suitable for mass production.

According to the present invention, powder can be supplied without entraining air to ensure uniform quality, and can be made smaller, thinner, and have a change in dimensions. It is another object of the present invention to provide a powder molding die, a powder molding method, and a powder molding apparatus capable of discharging a molded product without causing a polishing action.

[0026]

Therefore, in the present invention, apart from the concepts of die and punch, and male and female,
It is configured such that a molding space is directly formed from a pair of molding dies themselves.

According to one embodiment of the pair of powder molding dies according to the present invention, the side surfaces are stepped, and a series of molding spaces two-dimensionally closed between the side surfaces by the corresponding step portions are formed simultaneously. Has become. The step portion has, for example, an arc shape or a shape having two intersecting surfaces.

According to one example of the powder molding method of the present invention, a pair of molding dies, at least one of which is slidable and the side surfaces of which are stepped, are arranged side by side in a direction intersecting the sliding direction. Thus, a series of two-dimensionally closed molding spaces are simultaneously formed between the side surfaces of the molding die by the step-shaped steps; the powder supplied to the molding space is pressed and compressed by the slide of the molding die. It is configured to simultaneously mold a plurality of molded products. The discharge of the molded article is performed by opening the molded article in a three-dimensionally unconstrained state, and then moving a series of shot holes immediately below the molded article. Here, as for a pair of molds, both may be slid simultaneously, or one mold may be fixed and only the other mold may be slid.

Further, according to an example of the powder compacting apparatus of the present invention, the powder molding apparatus has a stepped side surface, and is arranged side by side with the side surfaces facing each other. A pair of molding dies, at least one of which is slidable, simultaneously forming a series of two-dimensionally closed molding spaces therebetween; and controlling the sliding of the movable molding dies to add powder in the molding spaces. Control means for performing pressure compression.

A series of shot holes are provided in the backup plate, and a pair of molds are juxtaposed on the backup plate.
A series of molding spaces formed by a pair of molds are formed so as to be aligned with a series of shot holes of the backup plate, and the control means slides the backup plate after molding to form the shot holes. In this case, the molded product can be discharged through the shot hole.

According to the present invention, the opposing side surfaces of the pair of molding dies are stepped, so that a series of two-dimensionally closed molding spaces can be formed between the side surfaces by the corresponding step portions. Individual molded articles can be molded simultaneously.

Since at least one of the pair of molds is slidable, the space for molding can be set to any size depending on the distance between the pair of molds in the sliding direction.
Therefore, by forming the opening of the molding space large, the powder can be supplied smoothly, the generation of voids due to the entrainment of air can be prevented, the powder can be uniformly pressed and compressed, and the uniform density (compression density) can be obtained. The molded article of (1) can be molded. In addition, since the molding space can be set to an arbitrary size, molded products of different sizes can be molded without exchanging molding dies, and it is possible to cope with dimensional changes of molded products.

Of course, the opening of the molding space can be made larger than the molded product, and it is possible to cope with the miniaturization of the molded product.

Even in an electronic component such as a tantalum capacitor element, since the powder is pressed and compressed in a direction perpendicular to the lead wire insertion direction, the lead wire is firmly held and the molded product is made thinner. Can also respond.

[0035]

Embodiments of the present invention will be described below in detail with reference to the drawings.

As shown in FIG. 1A, in the embodiment of the powder molding die according to the present invention, a pair of molding dies 10 (10-1, 10-2) having opposing side surfaces 12 having a stepped shape are used. That is, a series of molding spaces 16 are formed between the corresponding side surfaces 12. That is, the depth T and the length L of the step portion 14 of the side surface 12 are the same in both the molds 10-1 and 10-2.
In the embodiment, both side surfaces 12 have a step shape having four step portions 14 of the same size.

By forming the opposite side surfaces 12 in the same step shape, as shown in FIG. 1 (B), if the side surfaces are abutted and arranged side by side, the corresponding two step surfaces 14H and 14V intersect with each other. A two-dimensionally closed molding space 16 is simultaneously formed between the side surfaces. That is, as can be seen from the enlarged drawing portion, the two intersecting surfaces 14H-1, 14H of the step portion 14 of the molding die 10-1.
A molding space 16 that is two-dimensionally closed can be set from four surfaces VH and two surfaces 14H-2 and 14V-2 intersecting the corresponding step portion 14 of the molding die 10-2 facing the molding die 10-2.

In the embodiment, the step portion 14 has a shape having two intersecting surfaces, but a molding space having a shape corresponding to a molded product.
It suffices if 16 can be formed between the side surfaces 12, and it is not limited to this shape. For example, as shown in FIG. 1 (C), the step portion 14 may be formed in an arc shape, and if a semi-circular arc shape is pressed and compressed until a semi-circle is connected, a circular molded product can be formed and before the connection, When the compression is stopped, an almost elliptical molded product is obtained.

In the molding die 10 in which the molding space 16 is formed by using the opposing side surfaces of the step shape, a number of molding spaces 16 corresponding to the number of the step portions of the step shape can be simultaneously formed. Then, powder 18 is supplied from a hopper (not shown) to the molding space 16 through the opening, and the molding die 10-1 is slid to the left and the molding die 10-2 is slid to the right at the same time. Extrude excess powder while applying light pressure.

The powder 18 extruded from the molding space 16 is
After properly discharging from the top of 10-1 and 10-2, the cover plate 20 is placed on the molds 10-1 and 10-2, and covers the opening of the space 16 for molding to form the space 16 for molding. Three-dimensional sealing (see FIG. 2).

In forming the tantalum capacitor element, a lead wire is extended from the cover plate 20 and the cover plate 20 is stretched.
Is placed on the molds 10-1 and 10-2, and a lead wire is preferably inserted into the powder. As will be described later, since the powder is pressed and compressed in a direction perpendicular to the lead wire insertion direction, the lead wire can be held firmly and the molded product can be made thinner.

After the molding space 16 is three-dimensionally sealed with the cover plate 20, the molding die 10-1 is moved to the left, and the molding die 10-2.
Are simultaneously slid to the right, and the powder is pressure-formed to form a molded product 22 having a predetermined shape (see FIG. 3A).

In the embodiment, as shown in FIGS. 3A and 3A, a pair of molding dies 10-1 and 10-2 are connected to a back plate 24.
The molds 10-1 and 10-2 have an L-shaped cross section and a rectangular back plate 24 is wrapped therein. A series of shot holes 26 for discharging the molded product 22 are formed in the back plate 24 at the same pitch and the same number as the steps 14 on the side surfaces of the molding dies 10-1 and 10-2. (Figure 3
(B)). Since the molded product 22 is also formed at the same pitch as the step portion 14, if the shot holes 26 are aligned with the molded product 22, the molded products 22 can be simultaneously discharged through the shot holes 26.

As shown in FIGS. 3A and 3B, after molding,
First, the cover plate 20 is removed from above the molds 10-1 and 10-2, and the molded product 22 is released from restraint in the vertical direction (Z direction). Then, the molding die 10-2 is slid in a direction (-Y direction) away from the molding die 10-1 in a direction orthogonal to the sliding direction (X direction), and the direction (Y direction) orthogonal to the sliding direction (X direction). Direction) to release the molded article 22.
Further, the mold 10-2 is slid to the left (−X direction) to release the molded product 22 in the X direction.

After the molded article 22 is released in the three-dimensional XYZ directions, the back plate 24 is slid to the left so that the shot holes 26 of the back plate 24 are directly below the molded article 22. Then, the molded product 22 falls naturally through the shot hole 26 and is discharged (see FIGS. 4A and 4B).

Since the molded product 22 is discharged by moving the shot holes 26 without moving the molded product 22, the molded product
The damage of the molded article 22 is avoided, and a molded article 22 of uniform quality is obtained. Particularly, as in the embodiment, if the molded product 22 is opened three-dimensionally and then the shot hole 26 of the back plate 24 is moved, the molded product 22 is formed by contact between the back plate 24 and the molded product 22. The product 22 (contact surface = lower surface) is not polished, the contact surface of the molded product 22 with the back plate 24 is not smoothed, and the contact surface and the non-contact surface of the molded product 22 are the same. Is maintained. Therefore, when the molded product 22 is a tantalum capacitor element, even in a chemical conversion treatment in which the molded product is immersed in an acid solution (electrolyte solution), the permeation state of the liquid is the same, and uniform quality (electrical characteristics) can be obtained as a whole. .

Of course, even if the back plate 24 is slid, the molding dies 10-1 and 1-1 involved in the formation of the molding space 16 are formed.
The side plate 12 of 0-2 is not polished and the back plate 24
Does not adversely affect the durability of the molds 10-1 and 10-2.

The molding space 16 is formed by juxtaposing a pair of molding dies 10-1 and 10-2. The size of the molding space 16 does not need to match the size of the molded product 22, and After supplying the powder 18 to the molding space 16 set to be larger than the width, the powder 18 may be pressed and compressed to a predetermined size.
22 miniaturization is possible. Of course, molded products 22 having different widths can be molded, and the molding die 10-
Can be handled without replacing 1, 10-2.

In the molding using the pair of molding dies 10-1 and 10-2, it is only necessary to change the interval between the pair of molding dies, so that one of the pair of molding dies is fixed and the other is fixed. Movable
(Slidable) or both may be movable (slidable). Here, if only one of the pair of molding dies is movable, the molding device into which the molding dies are incorporated can be reduced in size and weight. If both are movable and slid simultaneously as in the embodiment, the powder can be left and right in the same state. Since the body 18 can be compressed under pressure, variations in density (compression density) hardly occur, and a molded product 22 of uniform quality can be easily obtained.

In the embodiment, (1) Cover plate
The molded product 22 is released in the Z direction except for the molding die (2).
-2 is slid in the -Y direction to release in the Y direction. (3) The mold 10-2 is slid in the -X direction to release in the X direction, and the molded product 22 is released in the XYZ three-dimensional direction. But
The order of release is not limited to this, and the mold 10-1 may be slid instead of the mold 10-2. FIG.
(A), the molding die 10-2 may be moved obliquely as indicated by the arrow a to release the molded product 22 simultaneously in both the X direction and the Y direction.

Molds 10-1, 10-2, cover plate 20,
The movement of the back plate 24, hopper, etc.
It is controlled by control means (not shown) having a PU or the like. For example, supply of powder from a hopper, pressurization and compression of powder by molding dies 10-1 and 10-2, discharge of excess powder, three-dimensional sealing and restraint by cover plate 20 Release, release of the molded product 22 by movement of the back plate 24, etc., automatically and continuously under the control of the control means. Done.

The embodiments described above are for explaining the present invention, and do not limit the present invention in any way, and all modifications and alterations within the technical scope of the present invention are also included in this embodiment. It goes without saying that it is included in the invention.

[0053]

As described above, according to the present invention, the opposing side surfaces of the pair of molding dies have a stepped shape. Therefore, the two-dimensional space between the side surfaces is utilized by using, for example, two intersecting surfaces of the corresponding step portions. Thus, a series of four closed molding spaces can be formed, and a plurality of molded products can be molded simultaneously in one cycle.

Since at least one of the pair of molds is slidable, the space for molding can be set to any size depending on the distance between the pair of molds in the sliding direction.
Therefore, by forming the opening of the molding space large, the powder can be supplied smoothly, the generation of voids due to the entrainment of air can be prevented, the powder can be uniformly pressed and compressed, and the uniform density (compression density) can be obtained. The molded article of (1) can be molded. In addition, since the molding space can be set to an arbitrary size, molded products of different sizes can be molded without exchanging molding dies, and it is possible to cope with dimensional changes of molded products.

Of course, the opening of the molding space can be formed larger than the molded product, and it is possible to cope with the miniaturization of the molded product.

Even in electronic parts such as tantalum capacitor elements, since the powder is pressed and compressed in a direction perpendicular to the lead wire insertion direction, the lead wire is firmly held and the molded product is made thinner. Can also respond.

Since the molded product is discharged by moving the shot holes without moving the molded product, damage to the molded product can be avoided, and a molded product of uniform quality can be obtained. In particular, if the shot hole is moved after the molded product is three-dimensionally opened, the smoothness of the molded product due to contact is prevented, and the surface of the molded product is maintained in the same state. Therefore, even when the molded article is a tantalum capacitor element, even in a chemical conversion treatment in which the molded article is immersed in an acid solution (electrolyte solution), the permeation state of the liquid becomes the same, and uniform quality (electrical characteristics) can be obtained as a whole.

[Brief description of the drawings]

1A is a plan view showing the shape of a molding die of the present invention, FIG. 1B is a plan view of the molding die in a state where a molding space is set side by side, and FIG. 14 is a modified example of the step portion corresponding to the enlarged drawing of FIG.

FIG. 2 is a plan view of a mold in which powder is pressed and compressed by simultaneously sliding in a central direction.

FIG. 3 (A) is a plan view of a molding die formed by molding a molded product by simultaneously compressing and compressing powder by sliding in the center direction;
(A ') is a right side view thereof, and (B) is a front view thereof.

FIG. 4A is a plan view of a molding die when a molded product is discharged,
(B) is a front view thereof.

5 (A), 5 (B), and 5 (C) are process diagram explanatory views showing a method of molding powder using a conventionally known punch and die in a longitudinal sectional view.

6 (A), 6 (B) and 6 (C) are process diagrams showing exploded perspective views of a conventionally known method of molding powder using a female mold and a male mold.

FIGS. 7A, 7B, and 7C are process diagrams showing the molding method shown in FIG. 6 in a longitudinal sectional view.

[Explanation of symbols]

10 (10-1, 10-2) (a pair of powders) Mold 12 Stair-shaped side surface 14 Mold step 14H, 14V (14H-1, 14H-2; 14V-1, 14V-2) )
Intersecting surfaces of steps 16 Forming space 18 Powder 20 Cover plate 22 Molded product 24 Back plate 26 Shot hole 100 (Powder) Mold 102, 104 Punch and die 116 Forming space 118 Powder 120 Cover plate 122 Molded product 200 (Powder) Mold 202 Female mold 203 Female molded groove 203a1, 203a2 Side of molded groove 204L, 204R A pair of male mold 204La 204Ra Male end face 216 For molding Space 218 Powder 222 Molded product 226 Shut hole

[Procedure amendment]

[Submission date] April 27, 2001 (2001.4.2
7)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Change

[Correction contents]

[Claims]

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0033

[Correction method] Change

[Correction contents]

Of course, the opening of the molding space can be formed larger than that of the molded product, and the molded product can be reduced in size.

[Procedure amendment 3]

[Document name to be amended] Statement

[Correction target item name] 0038

[Correction method] Change

[Correction contents]

In the embodiment, the step portion 14 has a shape having two surfaces which intersect with each other.
It suffices if 16 can be formed between the side surfaces 12, and it is not limited to this shape. For example, as shown in FIG. 1 (C), the step portion 14 may be formed in an arc shape, and if a semi-circular arc shape is pressed and compressed until a semi-circle is connected, a circular molded product can be formed and before the connection, When the compression is stopped, an almost elliptical molded product is obtained.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0043

[Correction method] Change

[Correction contents]

In the embodiment, as shown in FIGS. 3A and 3A, a pair of molding dies 10-1 and 10-2 are connected to a back plate 24.
The molds 10-1 and 10-2 have an L-shaped cross section and a rectangular back plate 24 is wrapped therein. On the back plate 24, a series of shot holes 26 for discharging the molded product 22 are provided with side surfaces 12 of the molding dies 10-1 and 10-2.
And the same number and the same pitch L as the step portions 14 (see FIG. 3B). Since the molded product 22 is also formed at the same pitch as the step portion 14, if the shot holes 26 are aligned with the molded product 22, the molded products 22 can be simultaneously discharged through the shot holes 26.

[Procedure amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0055

[Correction method] Change

[Correction contents]

Of course, the opening of the molding space can be formed larger than that of the molded product, and the molded product can be downsized.

[Procedure amendment 6]

[Document name to be amended] Drawing

[Correction target item name] Fig. 6

[Correction method] Change

[Correction contents]

FIG. 6

Claims (18)

[Claims] 1. A pair of powder molding dies in which opposing side surfaces are stepped, and a series of molding spaces closed two-dimensionally between the side surfaces by corresponding step portions are simultaneously formed. 2. A pair of powder molding dies in which a series of two-dimensionally closed molding spaces are simultaneously formed between the side surfaces, with the opposing side surfaces having stepped shapes and the corresponding step portions being arc-shaped. 3. A pair of opposed side faces having a stepped shape, and a series of four closed closed molding spaces are simultaneously formed two-dimensionally between the side faces by using two intersecting faces of corresponding step portions. Powder mold. 4. A pair of molding dies, at least one of which is slidable and the side surfaces of which are stepped, are arranged side by side in a direction intersecting the sliding direction so that the two molding dies are formed by stepped step portions. Powder molding that simultaneously forms a series of two-dimensionally closed molding spaces between the side surfaces, and presses and compresses the powder supplied to the molding space with a molding die slide to simultaneously mold multiple molded products Method. 5. A pair of molding dies, at least one of which is slidable, and the side surfaces of which are stepped, are arranged side by side in a direction intersecting the sliding direction so that the molding die is formed by the arc shape of the stepped step portion. A series of two-dimensionally closed molding spaces are simultaneously formed between the two side surfaces of the above, and the powder supplied to the molding spaces is pressed and compressed by a molding die slide to simultaneously form a plurality of molded products. Powder molding method. 6. A pair of molding dies, at least one of which is slidable and the side surfaces of which are stepped, are arranged side by side in a direction intersecting with the sliding direction so that the two step surfaces of the stepped step portion intersect. Simultaneously form a series of four closed two-dimensional molding spaces between the two side surfaces of the mold, and press and compress the powder supplied to the molding space with the slide of the mold to form a plurality of moldings. Powder molding method for molding products at the same time. 7. The powder according to claim 4, wherein both of the pair of molds are slidable, and the pair of molds are simultaneously slid in the approaching direction to compress the powder under pressure. Body molding method. 8. A powder is pressed and compressed by fixing one of a pair of molds and sliding the other.
The powder molding method according to claim 3. 9. A pair of molding dies, at least one of which is slidable and whose side surfaces are stair-shaped, are arranged side by side in a direction intersecting the sliding direction so that the two side surfaces are formed by a step-shaped step portion. Simultaneously forming a series of two-dimensionally closed molding spaces; supplying powder to the series of molding spaces; three-dimensionally sealing the molding spaces; A step of pressurizing and compressing powder in a molding space with a slide of a molding die to simultaneously mold a plurality of molded products. 10. A pair of molding dies, at least one of which is slidable and the side surfaces of which are stepped, are arranged side by side in a direction intersecting the sliding direction, so that the two side surfaces are formed by the stepped step portion. Simultaneously forming a series of two-dimensionally closed molding spaces, supplying powder to the series of molding spaces, and moving excess molding powder from the molding spaces by sliding a movable mold. A step of extruding and discharging, a step of three-dimensionally sealing the molding space, a step of pressing and compressing the powder in the molding space with a slide of a movable molding die, and simultaneously molding a plurality of molded products, Powder molding method comprising: 11. A step of releasing a molded article in a three-dimensionally unconstrained state, and a step of moving a series of shot holes immediately below the molded article to drop and discharge the molded article from the shot hole. The powder molding method according to claim 9 or 10, further comprising: 12. A series of molding spaces closed two-dimensionally between two side surfaces by step-shaped step portions by having step-shaped side surfaces and juxtaposing the side surfaces so as to face each other. A powder molding apparatus, comprising: a pair of molding dies to be formed, at least one of which is slidable; and control means for controlling sliding of a movable molding die to pressurize and compress powder in a molding space. 13. A series of two-dimensionally closed two-sided surfaces having stepped side surfaces having arc-shaped steps and having the side surfaces facing each other and juxtaposed by the stepped steps. A pair of molding dies at least one of which is slidable, and control means for controlling the slide of the movable molding die to pressurize and compress the powder in the molding space. Powder molding equipment. 14. A stair-shaped side surface is provided side by side so as to face each other, so that two surfaces intersecting the stair-shaped step portion are two-dimensionally four-sided between the two side surfaces. A pair of molding dies, at least one of which is slidable, which simultaneously forms a series of closed molding spaces, and control means for controlling the slide of the movable molding die to pressurize and compress the powder in the molding space. And a powder molding apparatus comprising: 15. A slidable backup plate having a series of shot holes, a stepped side surface, and a stepped side plate arranged side by side on the backup plate with the side surfaces facing each other. 2 by part
Two-dimensionally closed between two sides, backup
A pair of molding dies, at least one of which is slidable, which simultaneously forms a series of molding spaces that can be aligned with a series of shot holes of the mold, and a three-dimensional molding space after powder is supplied to the molding space. A powder molding apparatus, comprising: a cover plate that seals electrically and releases the seal after molding; and a control unit that controls sliding of a movable mold and a backup plate. 16. The control means presses and compresses the powder in the molding space by sliding the movable molding die after three-dimensional sealing of the molding space, and forms the backup press after the molding.
The powder molding apparatus according to any one of claims 12 to 15, wherein the slide is moved to move the shot hole below the molded product, and the molded product is discharged through the shot hole. 17. The control means slides the movable molding die after supplying the powder to push out and discharge excess powder from the molding space, and removes the movable molding die after three-dimensionally closing the molding space. The powder in the molding space is slid to form a compact by pressurizing and compressing, and after molding, the backup plate is slid to move the shot hole below the molded product, and the molded product is passed through the shot hole. The powder molding apparatus according to any one of claims 12 to 15, wherein the powder is discharged. 18. A device according to claim 12, further comprising release means for releasing at least one of the pair of molding dies to release restraint of the molded product in a direction orthogonal to the sliding direction.
Powder molding apparatus according to any one of the above.