JP2002299978A - Structure of piezoelectric wafer, piezoelectric vibrating element and method of manufacturing piezoelectric device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem that the smaller piezoelectric vibrating elements are when the piezoelectric vibrating elements are subjected to batch processing production by cutting out the piezoelectric vibrating elements from a piezoelectric wafer of a large area, the more complicated the cutting out work from a wafer and picking up work after cutting out are. SOLUTION: In the structure of the piezoelectric wafer 11 provided with a configuration in which a plurality of piezoelectric vibrating elements 12 are connected, the piezoelectric wafer is provided with contour slits 20 subjected to penetration formation along the outer circumferential contour of each piece of the piezoelectric vibrating element, non-slit parts 21 respectively formed on two facing sides of the contour slits, and branch slits 22 respectively extending outward from a right place of one of two contour slit end parts facing each other across each no-slit part, and the two branch slits have positional relation of point symmetry to each other.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a piezoelectric wafer used for manufacturing a piezoelectric vibrating element by batch processing, a piezoelectric vibrating element, and a method of manufacturing a piezoelectric device.

[0002]

2. Description of the Related Art Piezoelectric vibrating elements having a structure in which excitation electrodes and the like are formed on a piezoelectric substrate represented by quartz have been applied to various piezoelectric devices such as a piezoelectric vibrator and a piezoelectric oscillator. It is used as an indispensable main part in electronic equipment, especially communication equipment. With the miniaturization of various electronic devices, miniaturization of piezoelectric devices is also required. Ultra-small size, for example, about 1.2 mm ^square, has also been put to practical use as an individual piece size of the piezoelectric vibration element. As a method of manufacturing such an ultra-small size piezoelectric vibrating element, for example, as shown in FIG. 13, after forming a plurality of crystal vibrating elements 2 on a large-area quartz crystal wafer 1 using a photolithography technique or the like, In general, a method of using a dicing saw or the like to cut the individual pieces 2a of the crystal resonator element is used. Thereafter, the individual pieces 2a are sucked one by one by a vacuum nozzle (not shown), transferred to a package (not shown), and wired with the package, and then subjected to characteristics as a piezoelectric device (resonance frequency, temperature characteristics). Etc.). As a result of measuring the characteristics of each piece, if the predetermined characteristics are not satisfied, a procedure has been taken in which the package is sealed after fine adjustment is performed so as to obtain the predetermined characteristics. However, the process of picking up the individual pieces 2a of the micro-sized quartz-crystal vibrating elements one by one with a vacuum nozzle and mounting the pieces in a package is extremely complicated. And cost increases.

[0003]

SUMMARY OF THE INVENTION The present invention has been made in view of the above, and it is desirable to reduce the size of the piezoelectric vibrating element in batch processing by cutting the piezoelectric vibrating element from a large-area piezoelectric wafer. Accordingly, it is an object of the present invention to provide a method of manufacturing a piezoelectric wafer, a piezoelectric vibration element, and a piezoelectric device, which can solve a problem that a cutting operation from a wafer and a pickup operation after the cutting are complicated. I do.

[0004]

According to a first aspect of the present invention, there is provided a piezoelectric wafer having a structure in which a plurality of piezoelectric vibrating elements are connected to each other. A peripheral slit formed along the outer peripheral contour of the element piece;
A non-slit portion formed on each of the two sides, a branch slit extending outward from a suitable place in one of two peripheral slit ends facing one non-slit portion, and the other non-slit portion. And a branch slit extending outward from one of the two ends of the two circumferential slits opposed to each other, and the two branch slits have a point-symmetric positional relationship with each other. I do. Claim 2
Faces a peripheral slit formed along the outer peripheral contour of the individual piece of the piezoelectric vibrating element, a non-slit portion formed on two opposing sides of the peripheral slit, and one non-slit portion therebetween. A branch slit extending outward from one appropriate location of one of the two circular slit ends, and a branch slit extending outward from one appropriate location of the two peripheral slit ends facing each other across the other non-slit portion. And a branch slit, wherein the two branch slits are piezoelectric wafers having a point-symmetric positional relationship with each other, and when separating each piezoelectric vibration element from the piezoelectric wafer, the two slits are opposed to the non-slit portions. It is characterized in that a torsional shearing force in the direction is generated to cause a tear. According to a third aspect of the present invention, the peripheral slits of two adjacent piezoelectric vibrating elements on the piezoelectric wafer are partially shared. A fourth aspect of the present invention is characterized in that a thick portion is interposed between a plurality of adjacent piezoelectric vibration elements on the piezoelectric wafer. Claim 5
Forming a connecting piece connected to the non-slit portion between each one of the branch slits and a part of the orbital slit,
When the piezoelectric vibration element is separated from the piezoelectric wafer, the non-slit portion is configured to generate a torsional shearing force in an opposite direction. The invention according to claim 6 is characterized in that a connecting piece connected to the non-slit portion is formed by forming the branch slits two by two.
The invention according to claim 7 is characterized in that two orbiting slit ends, which are opposed to each other with the non-slit portion interposed therebetween, are bent inward of the piezoelectric vibration element. The invention according to claim 8 is a method for manufacturing a piezoelectric vibration element for separating each piezoelectric vibration element from a piezoelectric wafer having a configuration in which a plurality of piezoelectric vibration elements are connected, wherein the piezoelectric wafer includes a plurality of piezoelectric vibration elements. A circular slit formed along the outer peripheral contour of the piece,
A non-slit portion formed on each of two opposing sides of the orbiting slit in a symmetrical positional relationship, and one of two opposing orbiting slit ends opposed to each other with one non-slit portion extending outward from an appropriate position. Provided, and a branch slit extending outward from one appropriate position of one of two circumferential slit ends opposed to each other with the other non-slit portion interposed therebetween, and the two branch slits are point-to-point with each other. Forming a conductive film on the flat plate portion of the piezoelectric wafer and forming the orbital slit, the non-slit portion and the branch slit surrounding the conductive film, and a state in which the piezoelectric wafer is fixed. Separating the piezoelectric vibrating element pieces along the orbital slit by adsorbing the individual piezoelectric vibrating element pieces and lifting them in a direction perpendicular to the piezoelectric wafer surface. The features. The invention according to claim 9 is a method of manufacturing a piezoelectric device in which a piezoelectric vibration element separated from a piezoelectric wafer having a configuration in which a plurality of piezoelectric vibration elements are connected is housed in a package, wherein the piezoelectric wafer includes A circumferential slit formed along the outer peripheral contour of each of the vibrating elements, and a non-slit portion formed in a symmetrical positional relationship on two opposing sides of the circumferential slit,
One of two branch slit ends extending outward from one appropriate place of two orbiting slit ends opposed to each other with one non-slit portion interposed therebetween, and one of two orbital slit ends opposed to each other with the other non-slit portion interposed therebetween And a branch slit extending outward from an appropriate position of the two, the two branch slits,
Forming a conductor film on the flat plate portion of the piezoelectric wafer and forming the orbiting slits, non-slit portions and branch slits surrounding each conductor film, and fixing the piezoelectric wafer. Separating the piezoelectric vibrating element pieces along the orbital slits by adsorbing the individual piezoelectric vibrating element pieces and lifting the piezoelectric vibrating element pieces in a direction orthogonal to the surface of the piezoelectric wafer in a state where the piezoelectric vibrating element pieces are separated. Mounting the piece in a package. A tenth aspect of the present invention is a piezoelectric vibrating element including a piezoelectric substrate and an excitation electrode formed on the surface of the piezoelectric substrate, wherein the piezoelectric vibrating element includes tearing portions at two opposing positions on the periphery of the piezoelectric substrate. The outer peripheral edge of the piezoelectric substrate excluding the fractured portions is an etched edge.

[0005]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to embodiments shown in the drawings. 1 (a), 1 (b) and 1 (c) are a plan view of a main part of a piezoelectric wafer according to an embodiment of the present invention and a configuration diagram of a manufactured piezoelectric vibration element, and a thin plate made of a piezoelectric material such as quartz. The piezoelectric wafer 11 is
After a plurality of piezoelectric vibration elements 12 are formed within the area by batch processing, the piezoelectric vibration elements 12 can be mass-produced by dividing into individual pieces. The characteristic configuration of the piezoelectric wafer 11 of the present invention is such that when forming conductive films such as the excitation electrode 15 and the lead electrode 16 which constitute the individual piezoelectric vibrating elements 12, each piezoelectric film is surrounded so as to surround these conductive films. The point is that the orbiting slit 20 and the non-slit portion 21 are formed along the outer peripheral contour line of the vibration element 12, and the branch slit 22 is formed on the piezoelectric wafer 11 from an appropriate position of the orbiting slit 20. That is, as shown in FIG. 2, when the vacuum nozzle 50 sucks the central portion of the piezoelectric vibrating element 12 constituting a part of the piezoelectric wafer and lifts it upward, the non-slit portion 21 has the branch slit 22 opposed thereto. It is easily cut into a straight line by the action,
The two ends 20 a of the orbiting slit 20 opposed to each other are communicated with each other, and as a result, the piezoelectric vibration element 12 is separated from the piezoelectric wafer 11 along the shape of the orbiting slit 20.

That is, the piezoelectric wafer 11 of this embodiment is processed as shown in FIG. 1A in order to enable mass production by batch processing. In other words, the piezoelectric wafer 11 has a circumferential slit 20 formed partially discontinuously along the outer peripheral contour line of the individual piece of the piezoelectric vibrating element 12 and symmetrical positions on two opposing sides of the circumferential slit 20. A non-slit portion 21 formed in a relationship and two non-slit portions 2
Two circumferential slit ends 20a that face each other across 1
And branch slits 22 each extending outward from a suitable place 20a ′ near one end 20a of the two.
In this example, each branch slit 22 is connected to the piezoelectric vibrating element 12.
Has a point-symmetric positional relationship with respect to the center point of. A narrow connecting piece 23 is formed between each branch slit 22 and the adjacent circumferential slit 20. The connecting piece 23 connected to the non-slit portion 22 prevents the piezoelectric vibrating element 12 surrounded by the orbiting slit 20 from dropping off the piezoelectric wafer 11. On the other hand, the connecting piece 23 is placed on two opposing sides of the orbiting slit 20 in a point-symmetrical positional relationship.
When the piezoelectric vibration element 12 is lifted from the piezoelectric wafer as described later, the non-slit portion 2 is formed.
In 2, it is easy to form a linear cut (a tear line) connecting the opposing ends 20 a. In other words, in other words, the configuration of the piezoelectric wafer 11 of the present embodiment is different from the configuration of the orbiting slit 20 formed along the outer peripheral contour of the piezoelectric vibrating element 12.
Is divided into two orbiting slit portions 20A and 20B
, And each of the orbiting slit portions 20A and 20B has an end portion 20a bent inward by a required angle. Each end portion 20a provided in each of the orbiting slit portions 20A and 20B faces each other via the non-slit portion 22. Out of the four ends 20a of the orbiting slit portions 20A and 20B, the two ends 20a in a positional relationship opposite to each other are substantially outwardly directed from appropriate places (front side positions = bent parts) 20a '. A U-shaped branch slit 22 is drawn out at a required angle. Each of the branch slits 22 forms a narrow connecting piece 23 with the adjacent orbiting slit 20, and the connecting piece 23 has a minimum width at a connecting portion with the non-slit portion 21. That is, since each end 20a of each orbital slit portion 20A, 20B is bent inward at a required angle, two adjacent ends 20a are closest to each other at the inner end. In a positional relationship. In addition,
It is preferable that the two branch slits 22 arranged opposite to each other have a point-symmetrical shape and a positional relationship. However, it is not necessary that the two branch slits 22 have the same shape with no difference even if they are slightly different. Absent. In short, branch slit 2
When the piezoelectric element 2 does not exist, the non-slit portion 21 is not cut as desired when the piezoelectric vibrating element is sucked and lifted, and the two opposite ends 20a of the orbiting slit 20 cross the excitation electrode 15 and the like. Alternatively, there is a problem that a cutting line is formed in a state of being longitudinally extended and a defective product is formed. On the other hand, when the branch slit 22 is provided, when the piezoelectric vibrating element 12 is sucked and lifted, an ideal cutting line is provided between the two end portions 20a opposed to each other with the non-slit portion 23 interposed therebetween. Is easily formed.

As shown in FIG. 1B, the separated piezoelectric vibrating element 12 has a structure in which an excitation electrode 15 and a lead electrode 16 are formed on a piezoelectric substrate 12A. The characteristic configuration of the piezoelectric vibrating element 12 is as follows:
In this example, the tearing portions 12B respectively provided at the center positions of the respective sides
Only (corresponding to the non-slit portion 21) is formed by cutting (breaking), and the other outer peripheral edge is formed by etching. Further, the shape of the piezoelectric vibrating element 12 formed on the piezoelectric wafer 11 of the present invention (the outer contour of the piezoelectric substrate 12A) does not need to be substantially rectangular, and the piezoelectric vibrating element provided with the piezoelectric substrate 12A of various shapes may be used. Can be formed. For example, as shown in FIG. 1C, a piezoelectric vibration element 12 composed of a piezoelectric substrate 12A having a circular (including an ellipse, an ellipse, etc.) outer profile can be formed. In addition, in each claim, "two opposing sides" refer to FIG.
In the case of a rectangular piezoelectric substrate as shown in FIG. 1B, it is exactly the opposite side, and in the case of a circular piezoelectric substrate as shown in FIG. Means position. That is, each claim includes not only a rectangular piezoelectric substrate (circular slit) but also a piezoelectric substrate (circular slit) having various external contours.

Next, FIG. 2 shows a processed piezoelectric wafer 1.
In a state in which the piezoelectric vibrating element 12 included in 1 is fixed on the wafer mounting table 51, the central part of each piezoelectric vibrating element 12 is sucked and lifted by the vacuum nozzle 50 and mounted in the recess of the package 52. Is shown. FIG.
(A) (b) and (c) are the perspective view which shows the suction state by a vacuum nozzle, the lift state after adsorption | suction, and the principal part enlarged view of a circumference slit. First, as shown in FIGS. 2 and 3A, the vacuum nozzle 50 is lowered toward the center of the specific piezoelectric vibration element 12 on the piezoelectric wafer 11 to suck the center. Subsequently, the vacuum nozzle 50 is raised in a direction orthogonal to the surface of the piezoelectric vibrating element while the suction by the vacuum nozzle 50 is continued as shown in FIG. Then, the two non-slit portions 21 opposed to each other are arranged.
The connecting pieces 23 extending outward from the respective elements are connected to the crystal vibrating element 12 and are simultaneously pulled up. At this time, of the entire length of the connecting piece 23, the portion connected to the non-slit portion 21 interposed between the two ends 20a of the orbiting slit 20 has the narrowest width, and therefore, the portion shown in FIG. When the piezoelectric vibrating element 12 is lifted further than the state, this portion is cut along the line indicated by the dotted line L. Specifically, since the two connecting pieces 23 are point-symmetrical to each other, when the piezoelectric vibrating element 12 is lifted upward, torques in the torsional directions toward different directions are generated by the two non-slit portions 21. At the same time, and the cutting along the dotted line L is accurately performed by the shearing force in the torsional direction toward each different direction (see FIG. 4). As shown in FIG. 5, when only the orbiting slit 20 is provided and the branch slit 22 is not formed, when the piezoelectric vibration element 12 is lifted by the vacuum nozzle, the torque in the torsion direction is applied to the non-slit portion 21. Does not occur, a sufficient shearing force is not generated, and if it is forcibly lifted and cut, the cutting is not performed along the ideal cutting line L shown in FIG. The notch is formed and there is a possibility that it becomes a defective product.

In this embodiment, since the extending direction of the connecting piece 23 is point-symmetric, the piezoelectric vibrating element 12
Is lifted in a direction perpendicular to the surface of the piezoelectric wafer 11, a shearing force is generated in the non-slit portion 21 in the torsional direction. However, as shown in FIG. In this case, the non-slit portions 21 are twisted in the same direction as shown by the arrows, so that the piezoelectric vibrating element 12 is moved in one direction as a whole as shown in FIG. (To the left in the drawing), and it becomes difficult to generate a shearing force sufficient to cut the non-slit portion 21. In addition, as disclosed in FIGS. 1, 2, 3 and 4, in the present invention, a step of forming conductor films (excitation electrodes and leads) 15 and 16 on a flat plate portion of the piezoelectric wafer 11 and a step of forming each conductor Forming the orbiting slit 20, the non-slit portion 21, and the branch slit 22 surrounding the film; and adsorbing individual piezoelectric vibrating element pieces while the piezoelectric wafer is fixed, and lifting the piezoelectric vibrating element in a direction orthogonal to the surface of the piezoelectric wafer. 1 (including FIG. 7, FIG. 8, FIG. 9, FIG. 10, FIG. 12, which will be described later) by performing the step of separating the piezoelectric vibrating element pieces along the orbiting slit 20. The piezoelectric vibration element 12 having such a configuration can be manufactured. In forming the slits, mechanical cutting or laser processing may be used, but etching is most suitable for performing batch processing. Further, the piezoelectric vibrating element 12 separated by the above-described steps is mounted in a package 52 as shown in FIG. Oscillator, SAW, etc.).

Next, FIG. 7 shows a modified embodiment of the present invention.
When the non-slit portions 21 are formed on the two opposing sides of 0, the two end portions 20a facing each other with the non-slit portion 21 interposed therebetween are not bent inward. On the other hand, the connecting pieces 23 formed by extending the two branch slits 22 in parallel (not necessarily parallel) to the outside are configured to be point-symmetric. For this reason, the piezoelectric vibrating element 1
When the non-slit portion 21 is sucked and lifted, a torsional shearing force is generated in each of the non-slit portions 21 in the opposite direction. The vibration element 12 can be separated from the piezoelectric wafer 11 with high accuracy. Next, FIG. 8 shows a modification of the present invention. That is, the position of the two non-slit portions 21 formed on the orbiting slit 20 is not limited to the center of the two opposing sides shown in FIG. There may be. For example, as shown in FIG. 8, non-slit portions may be arranged at two corners opposed to each other along a diagonal line. A non-slit portion 21 is cut along an ideal cutting line (a straight line connecting the end portions 20a) due to the generation of torsional shearing force in the direction.

Next, FIG. 9 is a configuration diagram of a piezoelectric wafer according to a modified embodiment of the present invention. This embodiment is different from the above-described embodiment in that the piezoelectric vibrating elements 12 adjacent to each other in the horizontal direction are shared. It is configured to be connected via the circumferential slit portion 20b. With this configuration, it is possible to arrange more piezoelectric vibrating elements on one wafer, and it is possible to increase productivity. In each of the above embodiments, when the width of the non-slit portion 21 (the interval between the end portions 20a) is too small, the cutting when the piezoelectric vibration element 12 is lifted becomes easy, while the piezoelectric vibration element is separated. When the piezoelectric wafer 11 before handling is handled, there is a possibility that the piezoelectric vibrating element may drop or separate. For this reason, the width of the non-slit portion 21, that is, the width between the opposing ends 20a is not
The thickness is set to 10 times or less, preferably 8 times to 10 times the plate thickness of 1. Next, FIG. 10A is a perspective view of a piezoelectric wafer according to another embodiment of the present invention, and FIG. 10B is an enlarged plan view of a main part. In contrast to the piezoelectric wafer according to each of the above embodiments having a flat plate shape, the piezoelectric wafer 11 of the present embodiment has a recess 30 formed at a position corresponding to the quartz crystal vibrating element 12,
The inner bottom surface 30 a of the recess 30 is used as the quartz vibrating element 12. That is, the entire surface electrode 3 is provided on the inner bottom surface 30 a of the recess 30.
1 and an excitation electrode 15 and a lead electrode 16 are formed on the back surface. Also, the inner bottom surface 30a of the recess 30
A circumferential slit 20 is discontinuously formed in the outer peripheral edge of the thick portion 33, that is, in the region along the inner wall skirt of the thick portion 33. Non-slit portions 21 are formed on two opposing sides of the orbiting slit 20, and branching slits 22 are drawn outward from appropriate places at both ends 20 a of the orbiting slit 20 to form connecting pieces 23. I have. Each connecting piece 23
Is set such that each connecting piece is point-symmetric. As described above, in the present embodiment, since the thick portion 33 is located outside the orbiting slit 20 formed on the inner bottom surface of the flat recess, the center of the piezoelectric vibrating element 12 corresponding to the inner bottom surface of the recess is connected to the vacuum nozzle. When the material is sucked and lifted, the surrounding thick portion 33 is strong, so that it is easily divided.

FIG. 11 is a process chart showing a procedure for manufacturing a piezoelectric wafer having such a structure. First, FIG.
In the step (b), a conductor film 35 (silver, aluminum, or the like) serving as an entire surface electrode is formed in all the recesses 30 arranged on the surface of the piezoelectric wafer 11, and subsequently, in the step (b), the recesses 30 are formed. The excitation electrode 15 and the like are formed on the back side of the substrate by using photolithography technology. Subsequently, in the step (c), a photoresist film 36 is formed on the back surface of the recess, and in the step (d), only the positions corresponding to the circumferential slits 20 and the branch slits 22 are masked using a mask (not shown). Exposure removes the exposed portions. Next, as in the step (e), the orbiting slit 20 and the branch slit 22 are formed in the periphery of the inner bottom surface 30a by removing the wafer back surface exposed from the portion 36a from which the photoresist film has been removed by etching. Thereafter, by removing the photoresist film 36, a piezoelectric wafer having a configuration as shown in FIG. 10 is completed. According to this manufacturing method, not only the piezoelectric wafers shown in FIGS. 1, 7, 8 and the like, but also various types of piezoelectric wafers can be formed in the recesses. In this case, the cutability of the non-slit portion 21 is also improved. In addition,
The configuration such as the number and shape of the excitation electrodes is not limited to the illustrated one, but can be variously changed.

Next, FIG. 12 shows a modification applicable to all the above-described embodiments, and shows a blank of each piezoelectric vibrating element 12 arranged on the piezoelectric wafer 11, specifically, a circular slit 2.
The information recording unit 40 composed of a two-dimensional bar code or the like is printed on the wafer surface located outside the zero. That is, the information recording unit 40 records characteristics (resonance frequency, temperature frequency characteristic, etc.) unique to each piezoelectric vibration element. That is, each piezoelectric vibration element 12 on the piezoelectric wafer 11
After the characteristics are individually measured, the information recording unit 40 that records the measurement results is printed at the illustrated position. By recording the characteristics of each of the plurality of piezoelectric vibrating elements arranged on one piezoelectric wafer 11 in the information recording unit 40 located immediately adjacent to the piezoelectric wafer 11, the piezoelectric vibrating elements 12
When the components are separated and automatically mounted in a package, the recorded contents are read by a reader (not shown), and the respective piezoelectric vibrating elements 12 can be classified and ranked based on the difference in read characteristics, pass / fail, and level. . Specifically, for example, according to the degree of deviation from the specification value for the resonance frequency and temperature frequency characteristics, by separating and ranking the piezoelectric vibration elements after separation from the wafer, and by sorting, The efficiency of the fine adjustment of the characteristics in the post-process can be improved.

[0014]

As described above, according to the present invention, when the piezoelectric vibrating element is cut from a large-sized piezoelectric wafer in batch processing and produced, the smaller the piezoelectric vibrating element is, the more the piezoelectric vibrating element is cut out from the wafer. It is possible to solve the problem that the work and the pick-up work after cutting out become complicated.

[Brief description of the drawings]

FIG. 1A is a plan view of a main part of a piezoelectric wafer according to an embodiment of the present invention, and FIGS. 1B and 1C are configuration diagrams of an example of a completed piezoelectric vibration element.

FIG. 2 is a view showing an apparatus and a procedure for separating a piezoelectric vibration element from a piezoelectric wafer.

FIGS. 3A, 3B, and 3C are diagrams showing a procedure for separating a piezoelectric vibration element from a piezoelectric wafer of the present invention, and an enlarged view of a main part.

FIGS. 4A and 4B are a plan view and a front view illustrating the principle of the present invention.

FIG. 5 is a plan view showing a comparative example.

6A and 6B are a plan view and a front view showing a comparative example.

FIG. 7 is a main part configuration diagram of a piezoelectric wafer according to another embodiment of the present invention.

FIG. 8 is a main part configuration diagram of a piezoelectric wafer according to another embodiment of the present invention.

FIG. 9 is a main part configuration diagram of a piezoelectric wafer according to another embodiment of the present invention.

FIG. 10 is a main part configuration diagram of a piezoelectric wafer according to another embodiment of the present invention.

FIGS. 11A to 11E are views showing a procedure for manufacturing the piezoelectric wafer shown in FIG. 10;

FIG. 12 is a main part configuration diagram of a piezoelectric wafer according to another embodiment of the present invention.

FIG. 13 is a configuration explanatory view of a conventional example.

[Explanation of symbols]

Reference Signs List 11 piezoelectric wafer, 12 piezoelectric vibration element, 15 excitation electrode, 16 lead electrode, 20 orbital slit, 20a
End part, 21 non-slit part, 22 branch slit, 23
Connecting piece, 30 concave portion, 31 whole surface electrode, 40 information recording section, 50 vacuum nozzle, 52 package.

Claims (10)

[Claims] 1. A structure of a piezoelectric wafer having a configuration in which a plurality of piezoelectric vibrating elements are connected, wherein the piezoelectric wafer comprises: a circumferential slit formed through an outer peripheral contour of an individual piece of the piezoelectric vibrating element; A non-slit portion formed on each of the two opposing sides of the slit, and a branch slit extending outward from one appropriate place of one of two orbiting slit ends facing each other with one non-slit portion interposed therebetween, A branch slit extending outward from one of the two peripheral slit ends facing each other across the other non-slit part,
Wherein the two branch slits have a point-symmetric positional relationship with each other. 2. A circulating slit formed along an outer peripheral contour of an individual piece of a piezoelectric vibrating element, a non-slit portion formed on two opposing sides of the circulating slit, and one non-slit portion sandwiched therebetween. And a branch slit extending outward from one appropriate location of one of the two peripheral slit ends facing each other, and a branch slit extending from one appropriate location of the two peripheral slit ends facing each other across the other non-slit part. An extended branch slit, wherein the two branch slits are piezoelectric wafers having a point-symmetric positional relationship with each other, and when separating each piezoelectric vibration element from the piezoelectric wafer, the non-slits A structure of a piezoelectric wafer, wherein a torsional shearing force in an opposite direction is generated in the portion and the portion is torn. 3. The two adjacent piezoelectric wafers on the piezoelectric wafer.
The structure of the piezoelectric wafer according to claim 1, wherein a part of the orbiting slit of the two piezoelectric vibration elements is shared. 4. The structure of a piezoelectric wafer according to claim 1, wherein a thick portion is interposed between a plurality of adjacent piezoelectric vibrating elements on the piezoelectric wafer. 5. A connecting piece connected to the non-slit portion is formed between each one of the branch slits and a part of the orbiting slit, and the non-slit portion is separated when the piezoelectric vibration element is separated from a piezoelectric wafer. Wherein a torsional shearing force is generated in the opposite direction to
5. The structure of the piezoelectric wafer according to any one of 2, 3, and 4. 6. The connecting piece according to claim 1, wherein a connecting piece connected to the non-slit portion is formed by forming the branch slits two by two. Structure of the piezoelectric wafer. 7. The piezoelectric device according to claim 1, wherein two orbiting slit ends opposed to each other with the non-slit portion interposed therebetween are bent inward of the piezoelectric vibration element.
7. The structure of the piezoelectric wafer according to any one of 4, 5, and 6. 8. A method of manufacturing a piezoelectric vibrating element for separating each piezoelectric vibrating element from a piezoelectric wafer having a configuration in which a plurality of piezoelectric vibrating elements are connected, wherein the piezoelectric wafer is an individual piece of each of the piezoelectric vibrating elements. And a non-slit portion formed in a symmetrical positional relationship on two opposing sides of the revolving slit, and a non-slit portion facing each other with one non-slit portion interposed therebetween.
A branch slit extending outward from one appropriate location of one of the circular slit ends and a branch extending outward from one appropriate location of one of the two circular slit ends facing the other non-slit portion. A slit, and the two branch slits have a point-symmetric positional relationship with each other, a conductor film on the flat plate portion of the piezoelectric wafer, the orbiting slit surrounding each conductor film, a non-slit portion, A step of forming a branch slit, and a step of adsorbing individual piezoelectric vibrating element pieces in a state where the piezoelectric wafer is fixed and lifting the piezoelectric vibrating element pieces in a direction orthogonal to the surface of the piezoelectric wafer, thereby forming a piezoelectric vibrating element piece Separating the piezoelectric vibrating element. 9. A method of manufacturing a piezoelectric device in which a piezoelectric vibration element separated from a piezoelectric wafer having a configuration in which a plurality of piezoelectric vibration elements are connected is housed in a package, wherein the piezoelectric wafer includes each of the piezoelectric vibration elements A circumferential slit formed along the outer peripheral contour of the individual piece, a non-slit portion formed in two symmetrical positions on two opposing sides of the circumferential slit, and a non-slit portion facing each other with one non-slit portion therebetween.
A branch slit extending outward from one appropriate location of one of the circular slit ends and a branch extending outward from one appropriate location of one of the two circular slit ends facing the other non-slit portion. A slit, and the two branch slits have a point-symmetric positional relationship with each other, a conductor film on the flat plate portion of the piezoelectric wafer, the orbiting slit surrounding each conductor film, a non-slit portion, A step of forming a branch slit, and a step of adsorbing individual piezoelectric vibrating element pieces in a state where the piezoelectric wafer is fixed and lifting the piezoelectric vibrating element pieces in a direction orthogonal to the surface of the piezoelectric wafer, thereby forming piezoelectric vibrating element pieces along the orbital slit. And a step of mounting the separated piezoelectric vibrating element pieces in a package. 10. A piezoelectric vibrating element comprising: a piezoelectric substrate; and an excitation electrode formed on the surface of the piezoelectric substrate, wherein the piezoelectric vibrating element includes tearing portions at two opposing positions on a peripheral edge of the piezoelectric substrate. A piezoelectric vibrating element, wherein the outer peripheral edge of the piezoelectric substrate excluding each rupture portion is an etched edge.