JPH0496410A - Manufacture of crystal resonator - Google Patents

Abstract

PURPOSE:To easily disconnect the crystal resonator from a wafer by deviating the position of a linking part, which links the frame of the wafer and the crystal resonator, from the center line of the crystal resonator. CONSTITUTION:In the wafer, the position of a linking part 3 linking a crystal resonator 1 and a frame 2 of the wafer is deviated from the center line of the crystal resonator 1. Namely, a symmetric line B of the linking part 3 and a symmetric center line A of the resonator 1 are not coincident but deviated only for a distance D. At such a time, when force Fz is impressed in the perpendicular direction of the symmetric center line A, a moment M is generated as the symmetric center line B of the linking part 3 as a rotational center. Stress is concentrated at a part (c) by this moment M, and the oscillator is disconnected from the wafer. Thus, cycle time for disconnection, that is, time required for disconnection can be shortened.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a photo-etched crystal resonator used in information equipment such as microcomputers, cordless telephones, and wristwatches, and wireless communication devices. .

[Summary of the invention]

The present invention is formed from a thin crystal wafer by photoetching. To make it easier to separate the crystal oscillator from the wafer by shifting the position of the connecting part connecting the wafer frame and the crystal oscillator from the center line of the crystal oscillator, taking into consideration the crystal oscillation order. The purpose is to provide a manufacturing method featuring the following.

[Conventional technology]

FIG. 2 is a conventional plan view of a thin quartz wafer that has been photoetched. The figure shows an example in which a large number of tuning fork type crystal resonators are formed at the same time, where l is a crystal piece and 2 is a frame portion. Further, the vibrator piece I and the frame portion 2 are connected by a connecting portion 3. This one
FIG. 3 is a plan view showing an enlarged portion.

In the figure, the positional relationship between the connecting portion 3 and the vibrator piece l is as follows:
The center line B of the connecting portion 3 and the symmetry center line A of the vibrator pieces completely match.

[Problem to be solved by the invention]

A major feature of photo-etching processing is that several hundred crystal resonators can be manufactured from one crystal wafer, as shown in Figure 2. Furthermore, mount the vibrator to the plug I
・It is effective to automatically cut out the vibrators from within the wafer even in the process of wafer mounting, and therefore this processing method is suitable for automation in the mounting process.

Due to the above characteristics, the number of resonators that can be manufactured by photo-etching, such as tuning fork type crystal resonators and long piece vertical resonators, is increasing every year, with tuning fork type crystal resonators being the mainstream.
Nine pieces have been produced.

Under such conditions of mass production, it is important to stabilize the characteristic values of the vibrator and to reduce the number of processing steps, especially the cycle time of the mounting assembly machine.

FIG. 4 is a perspective view showing a mechanism for separating the vibrator from the wafer. 1 is a vibrator piece, and 2 is a frame portion. Further, 3 is a connecting portion.

When disconnecting, with respect to the symmetry center line of the resonator,
Immediately after applying pressure Fz from the vertical direction, force F in the plane
x is applied. At this time, the two forces Fz and Fx cause stress concentration at part C, and as a result, the vibrator is separated from the wafer as shown in the plan view 5. In the same figure, 4 is the separation part; This cut-off portion 4 exists between the two stress concentration portions C.

The characteristics of the above-mentioned separation mechanism are that two applied forces Fz
, Fx. However, in this mechanism,
There is a drawback that it takes time to apply the force Fx within a plane. That is, the disadvantage is that the cycle time for disconnection cannot be reduced. Applied force in the vertical direction Fz
With only a chisel, stress concentration does not occur in the C portion, so it is impossible to separate it properly.

Therefore, the problem to be solved by the present invention is to shorten the cycle time of the above-mentioned separation, in other words, the manufacturing time required for separation.

[Means to solve the problem]

In order to solve the above problems, the present invention aims to solve the above problems by using a quartz crystal.

In a crystal resonator formed by bar-to-flat etching processing and its manufacturing method, the position of the connection part connecting the crystal resonator and the frame of the wafer within the wafer is shifted from the center line of the crystal resonator. This provides a method for manufacturing a crystal resonator, characterized in that the resonator pieces can be easily separated from the wafer.

[Effect]

Regarding the basic operation that forms the background of the present invention, it is desirable to disconnect only by applying force Fz in the vertical direction, also from the viewpoint of simplification of the mechanism. For this purpose, it is necessary to cause stress concentration within the plane using only the applied force Fz in the vertical direction.

In the mechanism shown in FIG. 4, the reason why stress concentration does not occur due to only the applied force F2 in the vertical direction is that the center line of symmetry of the connecting portion 2 and the center line of symmetry of the vibrator piece 1 coincide.

If the center line of symmetry of the connecting portion 3 and the center of symmetry W of the vibrator piece 1 are
If AA is different, a force moment I. will occur when Fz is applied, and stress concentration will occur in the C portion, which is the focus of the present invention.

[Example] FIG. 1 is a perspective view showing a separation structure using the present invention. In the figure, the symmetrical cotton of the connecting part 3) 3 and the vibrator piece I
The symmetry centers A of the two do not coincide, but are shifted by a distance. At this time, when a force F2 is applied in the vertical direction to the symmetry center line, a moment M is generated with the symmetry center vAB of the connecting portion 3 as the center of rotation. At this time, moment) M is given by the following equation.

M-Fzxl) This moment) M causes stress concentration in the C portion, and the vibrator is separated from the wafer as shown in the plan view of FIG.

In the same figure, ζ, 4 is a separated part, and since the center line of symmetry B of the connecting part 3 and the center line of symmetry of the vibrator 1 do not match, this separated part 4 is also connected to the center line of symmetry A of the vibrator 1. There is no symmetrical relationship with respect to

FIG. 7 is a plan view of an embodiment to which the present invention is applied.

1 is a crystal resonator piece, and 2 is a frame portion of the wafer. It is also a 3-bar connecting part. Symmetry center line B of linked part 3
and the symmetry center line A of the vibrator piece 1 do not coincide.

Although FIG. 7 shows an example of a tuning fork type crystal resonator, it goes without saying that similar effects can be obtained with other resonators to which photoetching can be applied. Furthermore, in this embodiment, the connecting portion 3
Although the shape is a simple rectangle, it goes without saying that any shape may be used as long as it reduces stress concentration.

〔Effect of the invention〕

By applying the present invention, the time required to separate the one-piece vibrator piece from the wafer can be reduced compared to the conventional Fz and Fx
This is reduced to about half compared to the manufacturing method that applies two types of force.

As described above, the present invention has many effects, such as reducing the working time required to separate the crystal from the wafer, and thereby making it possible to supply inexpensive crystal resonators.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a single crystal resonator to which the present invention is applied. Figure 2 is a plan view showing a crystal wafer after conventional photo-etching processing, Figure 3 is an enlarged plan view of the vibrator inside the wafer in Figure 2, and Figure 4 is a perspective view of Figure 3. FIG. 5 is a plan view showing a vibrator piece and a frame separated by a conventional method, FIG. 6 is a plan view showing a state in which the vibrator is separated to which the present invention is applied;
FIG. 7 is a plan view showing an embodiment of the present invention. 1 ・ ・ 2 ・ ・ 3 ・ ・ 4 ・ ・ A ・ ・ B ・ ・ Fz ・ Fx ・ ・Frame connection part separation part in the crystal resonator piece wafer Symmetry center line stress of the symmetry center line connection part of the resonator piece The applied force in the applied force plane perpendicular to the center line of symmetry of the concentrated part A - to Q - 4

Claims (1)

[Claims] In a method for manufacturing a crystal resonator, in which a large number of crystal resonators are simultaneously formed from a crystal wafer by photo-etching, the position of a connecting portion connecting the crystal resonator and the frame of the wafer within the wafer, A method for manufacturing a crystal resonator, characterized in that a piece of the resonator is easily separated from the wafer by being shifted from the center line of the crystal resonator.