JP2002299380A - Semiconductor chip mounting structure and method for mounting the semiconductor chip - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor chip mounting structure, capable of sufficiently assuring reliability of electrically connecting a substrate conductive pattern to a conductive adhesive, and to provide a method for mounting the semiconductor chip. SOLUTION: (a) In a flip-chip mounting for disposing a circuit board 1, having a conductive pattern oppositely to an electrode 3 on the surface of the semiconductor chip 2 and electrically connecting the electrode 3 to the board 1; the conductive adhesive 5 is transferred to and coated on the salient electrodes 5; (b) the chip 2 is aligned so that the electrode 4 is contacted with gold stud bumps 6; the adhesive 5 is cured by heating and mounting on the board 2 and is electrically connected; and (c) since a semiconductor chip mounting structure, formed by sealing with a sealing resin 7, can be formed uniformly and stably in a shape of the electrode 4, reliability of the electrical connection can be improved as compared with that by the conventional methods.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip mounting structure and a semiconductor chip mounting method for fixing a semiconductor chip on a substrate provided with a predetermined conductor pattern and electrically connecting the semiconductor chips to each other.

[0002]

2. Description of the Related Art Conventionally, as a method of connecting a semiconductor chip on which a stud bump is formed to a substrate, a conductive adhesive 5 is transferred to a stud bump 6 formed on an electrode 3 of the semiconductor chip 2 as shown in FIG. A common practice is to start by doing. Then, the transferred conductive adhesive 5
The substrate 1 and the stud bump 6 described later by utilizing the adhesive force of
After bonding, the connection structure is sealed by injection of a sealing resin 7 described later and heat curing, and the semiconductor chip 2 is bonded to the semiconductor chip 2 via the stud bumps 6 and the conductive adhesive 5. This is to obtain electrical connection between the provided electrode 3 and the conductor pattern on the substrate 1 side. However, problems to be solved have been pointed out in such a connection method. The greatest challenge is to secure the connection reliability between the substrate conductive pattern and the conductive adhesive.

That is, since the gold stud bump 6 is usually formed by a method such as melting the tip of a gold wire, it is difficult to form the shape uniformly and stably. As a result, it becomes difficult to control the transfer amount of the conductive adhesive and the like, and sufficient connection reliability between the substrate conductive pattern and the conductive adhesive cannot be secured.

[0004]

DISCLOSURE OF THE INVENTION The present invention has been made in view of the above problems, and has as its object the following:
An object of the present invention is to provide a semiconductor chip mounting structure and a semiconductor chip mounting method capable of sufficiently securing the reliability of electrical connection between a substrate conductive pattern and a conductive adhesive.

[0005]

According to a first aspect of the present invention, there is provided a semiconductor chip mounting structure, comprising: a protruding electrode on a substrate provided with a conductive pattern; and an electrode on a surface of the semiconductor chip. In the flip-chip mounting structure in which the parts are opposed to each other and electrically connected to each other, the flip-chip mounting structure is formed on the electrode part on the surface of the semiconductor chip via a conductive adhesive applied to the protruding electrode on the substrate. It is characterized by being connected to a stud bump.

According to a second aspect of the present invention, in the semiconductor chip mounting structure according to the first aspect, the protruding electrode has a protrusion corresponding to a top of the stud bump. Is what you do.

According to a third aspect of the present invention, in the semiconductor chip mounting structure according to the first aspect, the projecting electrode has a concave portion corresponding to a top of the stud bump. It is characterized by the following.

In the semiconductor chip mounting structure according to a fourth aspect of the present invention, in the semiconductor chip mounting structure according to the third aspect, a portion to which the conductive adhesive is applied is limited only inside the concave portion. It is characterized by the following.

According to a fifth aspect of the present invention, in the semiconductor chip mounting structure according to the fourth aspect, the inner diameter of the opening of the concave portion is larger than the maximum diameter of the stud bump. Is what you do.

According to a sixth aspect of the present invention, in the semiconductor chip mounting structure according to any one of the first to fifth aspects, the conductive adhesive flows out between the adjacent protruding electrodes. A barrier for prevention is provided.

According to a seventh aspect of the present invention, in the semiconductor chip mounting structure according to the sixth aspect, the partition wall is formed simultaneously with at least the substrate and the protruding electrodes on the substrate at the same time. It is characterized by being formed.

According to the invention of a semiconductor chip mounting structure according to claim 8, in the semiconductor chip mounting structure according to claim 6, the partition is made of a curable resin before being completely cured,
The semiconductor chip and the substrate are fixed by advancing a curing reaction when connecting the semiconductor chip.

According to a ninth aspect of the present invention, in the semiconductor chip mounting structure according to any one of the first to eighth aspects, one or a plurality of sealing resin injection holes are provided on the substrate. It is characterized by being provided.

According to a tenth aspect of the present invention, there is provided a flip chip in which a protruding electrode on a substrate on which a conductive pattern is provided and an electrode portion on a surface of a semiconductor chip are opposed to each other, and are electrically connected to each other. In the chip mounting, a conductive adhesive is applied to the protruding electrodes on the substrate, and connection is made with stud bumps formed on the electrode portions on the surface of the semiconductor chip.

According to the eleventh aspect of the invention, there is provided a flip chip in which a protruding electrode on a substrate on which a conductive pattern is provided and an electrode portion on a surface of a semiconductor chip are opposed to each other, and a mutual electrical connection is made. In the chip mounting, before the connection, corresponding to the shape of the protruding electrode on the substrate,
The method is characterized in that the stud bump is shaped.

According to a twelfth aspect of the present invention, in the semiconductor chip mounting method according to the eleventh aspect, a conductive adhesive is applied to the protruding electrodes on the substrate, and the semiconductor chip surface is provided. And a stud bump formed on the electrode portion.

[0017]

Embodiments of the present invention will be described below with reference to the drawings. It should be noted that the semiconductor chip connection structure of the present invention is not limited to the embodiment described below, and it goes without saying that various changes can be made without departing from the spirit of the present invention. Further, in the following embodiment, the MID is used as the circuit board 1 for connecting the semiconductor chip 2.
Although the MID circuit board formed by (injection-formed circuit parts) is used, the board of the present invention is not limited to these, and it goes without saying that there is no limitation as long as it contributes to solving the above-mentioned problem. Nor. Further, in the following embodiment, the gold stud bump 6 is used as the stud bump, but the stud bump of the present invention is not limited to this, and there is no limitation as long as it contributes to solving the above-mentioned problem. Needless to say.

[First Embodiment] FIG. 1 shows a first embodiment of the present invention.
FIGS. 3A and 3B schematically show a concept of a manufacturing process of a semiconductor chip mounting structure according to the embodiment, in which FIG. 3A is a schematic cross-sectional view showing a state before a mounting structure is formed, FIG.
(c) is a schematic sectional view showing the state after the sealing resin is injected and cured. That is, in the flip-chip mounting in which the MID circuit board 1 provided with the conductive pattern (not shown) and the Al electrode 3 which is the electrode portion on the surface of the semiconductor chip 2 are electrically connected to each other, first, the MID circuit board is used. A conductive adhesive 5 is transferred and applied to the protruding electrodes 4 provided on the circuit board 1 (a), and Al
After aligning the semiconductor chip 2 having the gold stud bumps 6 formed on the electrodes 3 so that the bump electrodes 4 and the gold stud bumps 6 are in contact with each other, the semiconductor chip 2 is mounted on the circuit board 1 and the conductive adhesive 5 is cured by heating. And make an electrical connection (b). After that, the sealing resin 7 is injected and cured by heating to fix the semiconductor chip connection structure (c).

According to such a semiconductor chip connection structure, the projecting electrodes 4 on the circuit board 1 are formed by die-molding, as compared with a conventional connection structure in which the conductive adhesive 5 is transferred and applied to the gold stud bumps 6. Since it is formed, it is possible to form the shape uniformly and stably. As a result, it is possible to secure a stable transfer and application amount of the conductive adhesive 5, and to improve the reliability of the electrical connection. It becomes possible.

[Second Embodiment] FIG. 2 shows a second embodiment of the present invention.
FIG. 4 is a schematic cross-sectional view showing a main part of a semiconductor chip mounting structure according to the embodiment. That is, in the semiconductor chip mounting structure according to the present embodiment, the projecting electrodes 4 provided on the MID circuit board 1 have the protrusions 4 a corresponding to the tops 8 of the gold stud bumps 6 formed on the Al electrodes 3 of the semiconductor chip 2. Have

In this embodiment, as in the first embodiment, since the protruding electrodes 4 on the circuit board 1 are formed by molding, it is possible to form the shape uniformly and stably. As a result, Transfer of stable conductive adhesive,
The application amount can be secured, and the reliability of the electrical connection can be improved. In addition, in the present embodiment, in the present embodiment, the protruding electrode 4 corresponds to the convex portion 4 corresponding to the top 8 of the gold stud bump 6.
Due to having a, the bonding surface area that can contribute to the connection is increased, and the reliability of the electrical connection can be further improved.

[Third Embodiment] FIG. 3 shows a third embodiment of the present invention.
FIG. 4 is a schematic cross-sectional view showing a main part of a semiconductor chip mounting structure according to the embodiment. That is, in the semiconductor chip mounting structure according to the present embodiment, the protruding electrode 4 provided on the MID circuit board 1 has the concave portion 4 b corresponding to the top 8 of the gold stud bump 6 formed on the Al electrode 3 of the semiconductor chip 2. Things.

In this case, the effective inner diameter of the recess 4b may be larger than the diameter of the gold wire forming the top 8 of the gold stud bump 6, and the effective depth of the recess 4b is 10 times the outer diameter of the gold stud bump 6. % To 95%.

Also in this embodiment, similarly to the above embodiment, the projecting electrodes 4 on the circuit board 1 are formed by molding.
Is formed, it is possible to form the shape uniformly and stably, as a result, it is possible to secure a stable transfer and application amount of the conductive adhesive, and to improve the reliability of the electrical connection. it can.

Further, similarly to the above-described second embodiment, the projecting electrode 4 has the concave portion 4 corresponding to the top 8 of the gold stud bump 6.
Due to having b, the bonding surface area that can contribute to the connection increases, and the reliability of the electrical connection can be further improved.

In addition, in the present embodiment, the structure is such that the top 8 of the gold stud bump 6 is completely or partially buried in the recess 4b of the protruding electrode 4, so that the connection strength against the force in the shearing direction. Can be achieved, and the reliability of the electrical connection can be further improved.

[Fourth Embodiment] FIG. 4 shows a fourth embodiment of the present invention.
FIG. 4 is a schematic cross-sectional view showing a main part of a semiconductor chip mounting structure according to the embodiment. That is, similarly to the third embodiment, the semiconductor chip mounting structure according to the present embodiment also has the MID circuit board 1.
At the tip of the protruding electrode 4 provided above, a recess 4c is provided in which at least the top portion 8 of the gold stud bump 6 is accommodated, and the gold stud bump 6 is filled with the conductive adhesive 5 filled only in the recess 4c.
Is inserted and connected.

Also in this case, the effective inner diameter of the recess 4c may be larger than the diameter of the gold wire forming the top 8 of the gold stud bump 6, and the effective depth of the recess 4c is smaller than the outer diameter of the gold stud bump 6. 10% to 95% can be exemplified.

Also in this embodiment, similarly to the third embodiment, the protruding electrode 4 is connected to the top 8 of the gold stud bump 6.
, The reliability of the electrical connection can be similarly improved. In addition to this,
In the present embodiment, the portion where the conductive adhesive 5 is applied is
Only in the recess 4c, the portion where the conductive adhesive 5 is applied is not exposed to the side surface of the connection portion, so that a short circuit between adjacent electrode connection portions can be effectively avoided, and furthermore, Stable electrical connectivity can be obtained.
As a result, it is possible to design the pitch of the interval between the adjacent electrodes to be small, which can contribute to the reduction in size and weight of the entire mounting structure.

[Fifth Embodiment] FIG. 5 shows a fifth embodiment of the present invention.
FIG. 4 is a schematic cross-sectional view showing a main part of a semiconductor chip mounting structure according to the embodiment. That is, the semiconductor chip mounting structure according to the present embodiment is configured such that the tip recess 4 d of the protruding electrode 4 provided on the MID circuit board 1 is large enough to accommodate the entire gold stud bump 6, and only the recess 4 d of the protruding electrode 4 is provided. Conductive adhesive 5
Is filled, and the gold stud bump 6 is buried and connected to the recess 4d. In this case, the inner diameter of the effective recess 4d may be larger than the outer diameter of the gold stud bump 6 itself, and the effective depth of the recess 4d may be, for example, 10% to 120% of the outer diameter of the gold stud bump 6.

In this embodiment, similarly to the third and fourth embodiments, since the projecting electrode 4 has the concave portion 4 d corresponding to the top 8 of the gold stud bump 6, the electrical connection is similarly made. Improved connection reliability can be achieved. Further, similarly to the fourth embodiment, the portion where the conductive adhesive 5 is applied is limited to the inside of the concave portion 4c,
Since the portion to which the conductive adhesive 5 is applied is not exposed on the side surface of the connection portion, a short circuit between adjacent electrode connection portions can be effectively avoided, and furthermore, stable electrical connectivity can be obtained. it can. Further, as a result, similarly to the fourth embodiment, it is possible to design the pitch of the interval between the adjacent electrodes to be small, which can contribute to the reduction in size and weight of the entire mounting structure. In addition to this, in the present embodiment, a wider bonding area can be secured as compared with the above-described fourth embodiment, so that the bonding strength is improved and the connection reliability can be further improved. .

[Sixth Embodiment] FIG. 6 shows a sixth embodiment of the present invention.
(A) is a schematic cross-sectional view cut along a plane including a center line of a protruding electrode 4 on a substrate 1 and an electrode section 3 on a semiconductor chip 2, showing a main part of the semiconductor chip mounting structure according to the embodiment;
FIG. 2B is a schematic cross-sectional view taken along a cross section of the protruding electrode 4 parallel to the substrate 1. That is, the semiconductor chip mounting structure according to the present embodiment includes a projection electrode 4 on the MID substrate 1 provided with a conductive pattern (not shown) and an Al electrode 3 on the surface of the semiconductor chip.
And a semiconductor chip mounting structure formed by applying a conductive adhesive 5 to the protruding electrodes 4 on the MID substrate 1 and connecting to the gold stud bumps 6 formed on the Al electrodes 3. , The adjacent protruding electrodes 4
A partition wall 9 between them. That is, even when the conductive adhesive 5 transferred to the protruding electrode 4 flows out of the electrode connecting portion, the conductive adhesive 5 is blocked by the partition wall 9 and the conductive adhesive 5 can be prevented from flowing out to the adjacent electrode connecting portion. Even when the interval between the electrodes is small, it is possible to effectively avoid short-circuiting of the conductive adhesive application portion between adjacent electrode connection portions, and the wall is formed of a spacer in the connection structure between the MID circuit board 1 and the semiconductor chip 2. Since it plays a role, the stabilization of the connection gap in the connection structure can be achieved.

In the present embodiment, the partition 9 is made of M
In the process of forming the ID substrate 1, it is possible to simultaneously form the substrate and the substrate by a normal MID molding method using a mold or the like integrated with the substrate 1, the protruding electrodes 4, and the like, thereby contributing to the rationalization of the manufacturing process. .

Further, a step of fixing the semiconductor chip 2 and the substrate 1 by forming the partition wall 9 for preventing the conductive adhesive from flowing out of a curable resin before complete curing, and allowing the curing reaction to proceed when the semiconductor chip 2 is connected. If adopted, the semiconductor chip 2 and the substrate 1 can be securely fixed at the time of connection,
Further, it is possible to achieve a sufficient improvement in initial connectivity.

In this case, the partition 9 for preventing the conductive adhesive from flowing out.
Examples of the material constituting the film include, for example, a film-like material containing a commercially available thermosetting resin [PFM- manufactured by Nitto Denko Corporation]
21 etc.] can be suitably used, but there is no particular limitation. In addition, curable resins before complete curing, that is, thermosetting resins, photocurable resins, and electron beam curable resins And the like can be exemplified, but it goes without saying that there is no restriction as long as it contributes to solving the above-mentioned problem. Also, regarding the shape of the partition wall 9, the conductive adhesive can be prevented from flowing out, a short circuit of the conductive adhesive applied portion between adjacent electrode connection sites can be effectively avoided, and the sealing resin 7 is injected and filled. The shape is not particularly limited to the shape illustrated in FIG. 6 as long as it does not hinder the curing, and it goes without saying that there is no restriction as long as it contributes to solving the above-mentioned problem.

[Seventh Embodiment] FIG. 7 shows a seventh embodiment of the present invention.
(A) is a schematic cross-sectional view cut along a plane including a center line of a protruding electrode 4 on a substrate 1 and an electrode section 3 on a semiconductor chip 2, showing a main part of the semiconductor chip mounting structure according to the embodiment;
FIG. 2B is a schematic cross-sectional view taken along a cross section of the protruding electrode 4 parallel to the substrate 1. That is, the semiconductor chip mounting structure according to the present embodiment is, like the sixth embodiment, provided on the MID circuit board 1 having the partition 9 for preventing the conductive adhesive from flowing out.
Further, a hole 10 for injecting a sealing resin is provided on the substrate in the vicinity of the partition wall 9, and after the sealing resin 7 is injected and filled from this hole, it is cured to perform resin sealing. .
At this time, for example, the sealing resin is placed on the corners of the protrusions on the circuit board 1 (for example, the corners of the partition walls 9 of the present embodiment) and the like, which have conventionally tended to be insufficiently filled with the sealing resin 7. By providing the injection hole 10, the sealing resin 7 can be reliably filled. Thereby, unlike the conventional method of injecting the sealing resin 7 from the side, resin sealing in which voids or the like are hardly generated can be performed, and the connection reliability of the semiconductor chip connection structure can be further improved.

The location, size, shape, number, etc., of the holes 10 for injecting the sealing resin are also advantageously reduced by eliminating, filling, and curing the sealing resin 7 by eliminating voids and the like. As long as it can be implemented, it is not particularly limited to the embodiment illustrated in FIG. 7, and it goes without saying that there is no restriction as long as it contributes to solving the above-mentioned problem.

[Eighth Embodiment] FIG. 8 shows an eighth embodiment of the present invention.
FIGS. 3A and 3B schematically show a semiconductor chip mounting method according to the embodiment, in which FIG. 3A is a schematic sectional view showing a state before shaping, FIG. 3B is a schematic sectional view showing a shaping step, and FIG. FIG. That is, the semiconductor chip mounting method according to the present embodiment includes:
The gold stud bumps 6 formed on the Al electrodes 3 on the semiconductor chip 2 are shaped by a mold 11 according to the shapes of the protruding electrodes 4 on the substrate 1 to correct the non-uniformity of the shape of the gold stud bumps 6. It is to do.

Thus, after forming the gold stud bumps 6, which are originally difficult to form the shape uniformly and stably, the shape is made uniform by ex-post shaping, and the transfer amount of the conductive adhesive is obtained. In this case, the connection reliability of the semiconductor chip connection structure can be further improved by facilitating the management of the semiconductor chip and ensuring the stable bonding. The specific pressure required for shaping the stud bump is, for example, 1 × 10 ^-3 to 1 × 10 ^-1 Kgf / piece for a gold stud bump 6 having an outer diameter of 100 μ formed from a gold wire having an outer diameter of 25 μ. Can be achieved.

Further, it goes without saying that the semiconductor chip connection method according to the present embodiment can be advantageously applied to the formation of the semiconductor chip connection structures according to the above-described first to eighth embodiments. The method can be sufficiently applied to the above-described conventional semiconductor chip connection method which is started by first transferring the conductive adhesive 5 to the stud bumps, and can contribute to improvement of connection reliability.

[0041]

As described above, in the invention of the semiconductor chip mounting structure according to the first aspect, the protruding electrode on the substrate provided with the conductive pattern and the electrode portion on the surface of the semiconductor chip are arranged so as to face each other. In the flip-chip mounting structure electrically connected to each other, it is connected to a stud bump formed on the electrode portion on the surface of the semiconductor chip via a conductive adhesive applied to the projecting electrode on the substrate. As compared to the conventional connection structure in which conductive adhesive is transferred and applied to stud bumps, the protruding electrodes on the circuit board can be formed by molding, so the shape of the protruding electrodes Can be formed uniformly and stably, the transfer and application amount of the conductive adhesive can be stably secured, and the excellent effect of improving the reliability of the electrical connection can be achieved. That.

According to a second aspect of the present invention, in the semiconductor chip mounting structure according to the first aspect, the protruding electrode has a convex portion corresponding to the top of the stud bump. Therefore, in addition to the effect of the invention of the semiconductor chip mounting structure according to the first aspect, since the bonding surface area that can contribute to the connection is increased, the reliability of the electrical connection can be further improved. It works.

According to a third aspect of the present invention, in the semiconductor chip mounting structure according to the first aspect, the projecting electrode has a concave portion corresponding to the top of the stud bump. Therefore, in addition to the effect of the invention of the semiconductor chip mounting structure according to the first aspect, since the bonding surface area that can contribute to the connection is increased, the excellent effect that the reliability of the electrical connection can be further improved can be achieved. To play. In addition, according to the present invention, the stud bump has a structure in which the stud bump is partially buried in the concave portion of the protruding electrode at the top, so that the connection strength can be improved with respect to the force in the shear direction, and the electrical connection can be further improved. This has an excellent effect that the reliability can be improved.

In the semiconductor chip mounting structure according to a fourth aspect of the present invention, in the semiconductor chip mounting structure according to the third aspect, a portion to which the conductive adhesive is applied is limited only to the inside of the concave portion. Therefore, in addition to the effects of the invention of the semiconductor chip mounting structure according to claim 3,
Since the portion to which the conductive adhesive is applied is not exposed on the side surface of the connection portion, a short circuit between adjacent electrode connection portions can be effectively avoided, and furthermore, stable electrical connectivity can be obtained. . Further, as a result, it is possible to design the pitch of the interval between the adjacent electrodes to be small, and there is an excellent effect that it is possible to contribute to reduction in size and weight of the entire mounting structure.

According to a fifth aspect of the present invention, in the semiconductor chip mounting structure according to the fourth aspect, the inner diameter of the opening of the concave portion is larger than the maximum diameter of the stud bump. Therefore, in addition to the effect of the invention of the semiconductor chip mounting structure according to the fourth aspect, an excellent bonding area can be secured, so that the adhesive strength is improved, and it is possible to contribute to further improvement of connection reliability. It works.

According to a sixth aspect of the present invention, in the semiconductor chip mounting structure according to any one of the first to fifth aspects, a partition for preventing a conductive adhesive from flowing out between the adjacent protruding electrodes. Therefore, in addition to the effect of the invention of the semiconductor chip mounting structure according to any one of claims 1 to 5, the conductive adhesive transferred to the protruding electrode flows out of the electrode connection portion. Even in this case, the conductive adhesive is blocked by the partition walls and can be prevented from flowing out to the adjacent electrode connection site. For this reason, even if the interval between adjacent electrodes is a narrow pitch, a short circuit of the conductive adhesive application portion between adjacent electrode connection portions can be effectively avoided, and
Since the partition functions as a spacer in the connection structure between the circuit board and the semiconductor chip, there is an excellent effect that the connection gap in this connection structure can be stabilized.

In the semiconductor chip mounting structure according to a seventh aspect of the present invention, in the semiconductor chip mounting structure according to the sixth aspect, the partition for preventing the conductive adhesive from flowing out is at least a substrate and a projecting electrode on the substrate. Since it is characterized by being formed simultaneously and integrally with the semiconductor chip, in addition to the effect of the invention of the semiconductor chip mounting structure according to claim 6, there is an excellent effect that it can contribute to rationalization of the manufacturing process.

In the semiconductor chip mounting structure according to the eighth aspect, in the semiconductor chip mounting structure according to the sixth aspect, the partition for preventing the conductive adhesive from flowing out is made of a curable resin before being completely cured, The semiconductor chip and the substrate are fixed by advancing a curing reaction at the time of connection of the semiconductor chip, so that in addition to the effect of the invention of the semiconductor chip mounting structure according to claim 6, the semiconductor chip is connected at the time of connection. An excellent effect that the substrate and the substrate can be securely fixed and sufficient initial connectivity can be achieved can be achieved.

According to a ninth aspect of the present invention, in the semiconductor chip mounting structure according to any one of the first to eighth aspects, one or a plurality of sealing resin injection holes are provided on the substrate. Therefore, in addition to the effect of the invention of the semiconductor chip mounting structure according to claim 1 to claim 8, unlike a conventional method of injecting a sealing resin from a side surface, a resin in which voids and the like hardly occur. Sealing is possible, and an excellent effect that the connection reliability of the semiconductor chip connection structure can be further improved can be achieved.

According to a tenth aspect of the present invention, there is provided a flip chip in which a protruding electrode on a substrate on which a conductive pattern is provided and an electrode portion on a surface of a semiconductor chip are opposed to each other, and are electrically connected to each other. In chip mounting, a conductive adhesive is applied to the protruding electrodes on the substrate, and connection is made with stud bumps formed on the electrode portions on the semiconductor chip surface. Compared with the conventional mounting method of transferring and applying the adhesive, the projecting electrodes on the circuit board can be formed by molding, so that the shape of the projecting electrodes can be formed uniformly and stably. Thus, an excellent effect of stably securing the transfer and application amount of the conductive adhesive and improving the reliability of the electrical connection can be achieved.

According to the eleventh aspect of the present invention, a flip-chip is provided in which a protruding electrode on a substrate on which a conductive pattern is provided and an electrode portion on the surface of a semiconductor chip are arranged to face each other, and a mutual electrical connection is made. In the chip mounting, before the connection, corresponding to the shape of the protruding electrode on the substrate,
Since the stud bump is shaped, the gold stud bump 6 whose shape is originally difficult to form uniformly and stably is formed, and then the shape is formed by ex post shaping. It is possible to further improve the connection reliability of the semiconductor chip connection structure by making the transfer of the conductive adhesive easier, and ensuring stable bonding by making the transfer of the conductive adhesive uniform. It has the effect.

According to a twelfth aspect of the present invention, in the method of mounting a semiconductor chip according to the eleventh aspect, a conductive adhesive is applied to the protruding electrodes on the substrate, and the surface of the semiconductor chip is mounted. Since the connection is made with the stud bump formed on the electrode portion, the conductive adhesive is transferred to the stud bump in addition to the effect of the invention of the semiconductor chip mounting method according to claim 11. As compared with the conventional mounting method of coating, the protruding electrodes on the circuit board can be formed by molding, so that the shape of the protruding electrodes can be formed uniformly and stably, and the conductivity can be improved. An excellent effect is obtained in that the transfer and application amount of the adhesive can be secured stably, and the reliability of the electrical connection can be improved.

[Brief description of the drawings]

FIGS. 1A and 1B schematically show a manufacturing process of a semiconductor chip mounting structure according to a first embodiment of the present invention. FIG. 1A is a schematic cross-sectional view showing a state before a mounting structure is formed, and FIG. FIG. 3C is a schematic cross-sectional view showing a state after the structure is formed, and FIG.

FIG. 2 is a schematic sectional view showing a main part of a semiconductor chip mounting structure according to a second embodiment of the present invention.

FIG. 3 is a schematic sectional view showing a main part of a semiconductor chip mounting structure according to a third embodiment of the present invention.

FIG. 4 is a schematic sectional view showing a main part of a semiconductor chip mounting structure according to a fourth embodiment of the present invention.

FIG. 5 is a schematic sectional view showing a main part of a semiconductor chip mounting structure according to a fifth embodiment of the present invention.

FIGS. 6A and 6B show a main part of a semiconductor chip mounting structure according to a sixth embodiment of the present invention. FIG. 6A shows a center line between a protruding electrode 4 on a substrate 1 and an electrode section 3 on a semiconductor chip 2. FIG. 2B is a schematic cross-sectional view taken along a cross section of the protruding electrode 4 parallel to the substrate 1.

FIGS. 7A and 7B show a main part of a semiconductor chip mounting structure according to a seventh embodiment of the present invention. FIG. 7A shows a center line between a protruding electrode 4 on a substrate 1 and an electrode part 3 on a semiconductor chip 2. FIG. 2B is a schematic cross-sectional view taken along a cross section of the protruding electrode 4 parallel to the substrate 1.

8A and 8B schematically show a semiconductor chip mounting method according to an eighth embodiment of the present invention, wherein FIG. 8A is a schematic sectional view showing a state before shaping, FIG. 8B is a schematic sectional view showing a shaping step, (c) is a schematic sectional view showing the state after shaping.

FIG. 9 shows a schematic concept of a transfer step of a conductive adhesive 5 in a semiconductor chip mounting method according to a conventional example.
(a) is a schematic sectional view showing a state before transfer, and (b) is a schematic sectional view showing a state after transfer.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Semiconductor chip 3 Electrode part 4 Protruding electrode 5 Conductive adhesive 6 Stud bump 7 Sealing resin 8 Top part 9 Partition 10 Sealing resin injection hole 11 Mold

Continued on the front page (72) Inventor Shinobu Kida 1048 Kadoma, Kadoma, Osaka Pref. Matsushita Electric Works Co., Ltd. F term (reference) 5F044 KK17 KK27 LL07 LL11 QQ02 QQ04

Claims (12)

[Claims] In a flip-chip mounting structure in which a protruding electrode on a substrate provided with a conductive pattern and an electrode portion on a surface of a semiconductor chip are opposed to each other and electrically connected to each other, the protruding electrode on the substrate is coated on the protruding electrode. A semiconductor chip mounting structure, wherein the semiconductor chip mounting structure is connected to a stud bump formed on the electrode portion on the surface of the semiconductor chip through the provided conductive adhesive. 2. The semiconductor chip mounting structure according to claim 1, wherein said projection electrode has a projection corresponding to a top of said stud bump. 3. The semiconductor chip mounting structure according to claim 1, wherein said protruding electrode has a concave portion corresponding to a top of said stud bump. 4. A site to which the conductive adhesive is applied,
4. The semiconductor chip mounting structure according to claim 3, wherein the semiconductor chip mounting structure is limited only inside the concave portion. 5. The semiconductor chip mounting structure according to claim 4, wherein the inner diameter of the opening of the concave portion is larger than the maximum diameter of the stud bump. 6. The semiconductor chip mounting structure according to claim 1, wherein a partition for preventing the conductive adhesive from flowing out is provided between the adjacent protruding electrodes. 7. The semiconductor chip mounting structure according to claim 6, wherein said partition is formed at least simultaneously with said substrate and said projecting electrode on said substrate. 8. The semiconductor device according to claim 6, wherein the partition wall is made of a curable resin before complete curing, and the semiconductor chip and the substrate are fixed by advancing a curing reaction when connecting the semiconductor chip. Semiconductor chip mounting structure. 9. The method according to claim 1, wherein one or a plurality of sealing resin injection holes are provided on the substrate.
The semiconductor chip mounting structure described in the above. 10. In flip-chip mounting in which a protruding electrode on a substrate provided with a conductive pattern and an electrode portion on the surface of a semiconductor chip are opposed to each other and electrically connected to each other, the protruding electrode on the substrate is electrically conductive. A method of mounting a semiconductor chip, comprising applying an adhesive and connecting to a stud bump formed on the electrode portion on the surface of the semiconductor chip. 11. In flip-chip mounting in which a protruding electrode on a substrate provided with a conductive pattern and an electrode portion on a surface of a semiconductor chip are opposed to each other and are electrically connected to each other, before the connection, According to the shape of the protruding electrode,
A method of mounting a semiconductor chip, wherein the stud bump is shaped. 12. The semiconductor according to claim 11, wherein a conductive adhesive is applied to the protruding electrode on the substrate, and a connection is made with a stud bump formed on the electrode portion on the surface of the semiconductor chip. Chip mounting method.