JP2002296602A - Method for manufacturing liquid crystal display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing liquid crystal display panel with liquid crystal arranged between a pair of substrates capable of adhering so that these substrates are positioned in a specific relation to each other while controlling the substrates generating crinkles. SOLUTION: The manufacturing method consists of the following processes; a process in which the material for adhesion is fed onto at least one of the substrates S1 and S2; a process in which liquid crystal is fed onto one of the substrates; a process in which the substrates are temporarily adhered with the material for adhesion and liquid crystal being sandwiched in between; and a process in which the substrates are then properly and fully adhered. In the temporary adhesion process pressure is applied to the substrates at the normal temperature without heating them, and the substrates S1 and S2 are temporarily adhered under the normal temperature after positioning. The full adhesion process is conducted with application of heat and pressure to the substrates S1 and S2 after the temporary adhesion process is completely over.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a liquid crystal display panel in which liquid crystals are arranged between substrates.

[0002]

2. Description of the Related Art In a liquid crystal display panel, the first type is usually used.
A liquid crystal is disposed between the first pair of substrates and the second pair of substrates, and these substrates are adhered to each other by a seal wall made of an adhesive material.

[0003] As a substrate, a glass substrate is often used, but recently, a resin film substrate is sometimes used. When a resin film substrate is used as the substrate, the thickness and weight of the liquid crystal display panel can be reduced, and the substrate is less likely to be damaged than when a glass substrate is used as the substrate.

When a liquid crystal display panel is manufactured, the first substrate and the second substrate are bonded with a liquid crystal, a seal wall, etc. therebetween. For example, it has been proposed to bond the first and second substrates while applying pressure and heat to the first and second substrates.

[0005]

When a liquid crystal display panel is manufactured, these substrates are bonded together so that the first substrate and the second substrate have a predetermined positional relationship in order to display a good image. Is required.

Further, it is required to bond these substrates so that the substrates cannot be wrinkled. When a resin film substrate is used as a substrate, when the first and / or second substrates are bonded while applying heat thereto, the substrates may be wrinkled. When wrinkles occur in the substrates, problems such as air mixing between the substrates occur.

Therefore, the present invention relates to a method for manufacturing a liquid crystal display panel in which liquid crystal is arranged between a pair of substrates, and a liquid crystal display panel capable of adhering these substrates while suppressing wrinkling of the substrates. Provided is a method for manufacturing a display panel.

The present invention is also a method of manufacturing a liquid crystal display panel in which liquid crystal is disposed between a first and a second pair of substrates, wherein the first substrate and the second substrate have a predetermined positional relationship. An object of the present invention is to provide a method for manufacturing a liquid crystal display panel to which these substrates can be bonded.

[0009]

Means for Solving the Problems [1] In order to solve the above problems, the present invention is a method for manufacturing a liquid crystal display panel in which a liquid crystal is arranged between a first substrate and a second substrate. An adhesive material supplying step of supplying an adhesive material onto at least one of the first and second substrates, and a liquid crystal supplying step of supplying liquid crystal onto at least one of the first and second substrates A temporary bonding step of temporarily bonding the first substrate and the second substrate with the adhesive material and the liquid crystal interposed therebetween; and the first substrate and the first substrate with the adhesive material and the liquid crystal interposed therebetween. And a final bonding step of permanently bonding the second substrate. The final bonding step is performed after the temporary bonding step is completed. In the temporary bonding step and the final bonding step, the first and / or second bonding is performed. Liquid crystal display characterized by different heats applied to two substrates Provided is a method for manufacturing a panel. [1-1] The manufacturing method of the present invention is for manufacturing a liquid crystal display panel in which a liquid crystal is arranged between a first substrate and a second substrate.

[0010] The production method of the present invention comprises an adhesive material supply step,
It includes a liquid crystal supply step, a temporary bonding step, and a main bonding step. Hereinafter, each step will be described in order. (A) Adhesive material supply step In the adhesive material supply step, an adhesive material is supplied onto at least one of the first and second substrates.

In the temporary bonding step, the first substrate and the second substrate are temporarily bonded by the bonding material supplied onto the substrate, and in the final bonding step, the first substrate and the second substrate are fully bonded. Therefore, the bonding material supply step is performed before the temporary bonding step and the main bonding step.

The adhesive material may be, for example, a thermosetting resin, an ultraviolet curing resin, or the like.

For example, a sealing wall for sealing the liquid crystal from leaking from between the first and second substrates may be formed by the adhesive material supplied onto the substrate. The seal wall may be finally provided between the first substrate and the second substrate so as to surround the liquid crystal disposed between the first substrate and the second substrate. When the sealing wall is formed with the adhesive material as described above, for example, an adhesive sealing material may be used as the adhesive material.

One or more columnar structures may be formed by the adhesive material supplied on the substrate. The columnar structure may be provided between the first substrate and the second substrate and provided for bonding the first substrate and the second substrate. In addition to the bonding function, for example, the columnar structure may have a function of increasing the strength of the entire liquid crystal display panel or a function of controlling the gap between the first substrate and the second substrate. The cross-sectional shape of the columnar structure may be any shape, for example, a circular shape, an elliptical shape, a square shape, or the like. The columnar structure may be arranged in the display area. When the columnar structure is arranged in the display area, the material of the columnar structure (adhesive material) is preferably transparent so as not to lower the display quality. The columnar structure may be formed of, for example, an adhesive resin.

According to the adhesive material, only one of the seal wall and the columnar structure may be formed, or both may be formed. The adhesive material for forming the seal wall and the adhesive material for forming the columnar structure may be the same or different.

When a sealing wall, a columnar structure, or the like is formed by an adhesive material, the adhesive material may be disposed on the substrate in a predetermined shape, for example. For example, the adhesive material is arranged in a predetermined shape on the substrate by a printing method in which a paste-like adhesive material (for example, a material obtained by dissolving the adhesive material in a solvent) is extruded onto the substrate with a squeegee via a screen plate or a metal mask. Can be set up. The adhesive material can be disposed on the substrate in a predetermined shape by discharging the adhesive material onto the substrate from the tip of the nozzle by using a dispenser method, an inkjet method, or the like. Even in a transfer method in which the adhesive material is supplied onto a flat plate or a roller and then transferred onto a substrate, the adhesive material can be provided in a predetermined shape on the substrate. (B) Liquid crystal supply step In the liquid crystal supply step, a liquid crystal (liquid crystal composition) is supplied onto at least one of the first and second substrates. Typically, the liquid crystal may be supplied onto one of the first and second substrates.

The liquid crystal supply step is performed, for example, before the temporary bonding step and the main bonding step.

The liquid crystal to be supplied on the substrate is finally the first liquid crystal.
It is arranged in layers between the substrate and the second substrate.

In the liquid crystal supply step, the liquid crystal may be supplied to the entire substrate region where the liquid crystal is to be finally disposed, or the liquid crystal may be supplied to only a part of the substrate region. (C) Temporary bonding step In the temporary bonding step, the first substrate and the second substrate are temporarily bonded with the bonding material and liquid crystal supplied on the substrate interposed therebetween.

In the adhesive material supplying step, the first substrate and the second substrate are temporarily bonded with the adhesive material previously supplied onto the substrate.

In the temporary bonding step, the first substrate and the second substrate are temporarily bonded. Here, the temporary bonding is bonding performed prior to the main bonding. Typically, in the temporary bonding state, the bonding is incomplete, and the bonding state does not reach the bonding strength to be finally obtained. For example, when a thermosetting resin is used as an adhesive material, for example, the adhesive material is left uncured without applying heat, or even if heat is applied, the curing is incomplete and a bonded state is finally obtained. For example, the desired adhesive strength may not be reached.

The temporary bonding step may be performed, for example, while applying a predetermined pressure to the first and second substrates. The pressure may be applied to the first substrate and the second substrate so that they approach each other.

The temporary bonding step may be performed while sequentially applying a predetermined pressure from one end of the first and second substrates to the other end. Specifically, for example, by moving a pressure roller relatively to a flat table for holding at least one of the first and second substrates, the first and second substrates are moved. The temporary bonding step may be performed while applying a predetermined pressure sequentially from one end to the other end.
By temporarily bonding the first and second substrates while sequentially applying pressure from one end to the other end of the first and second substrates, the air between these substrates (for example, The first substrate and the second substrate can be temporarily bonded while extruding (air), so that air can be prevented from remaining between the substrates.

In the temporary bonding step, the first substrate and the second substrate may be temporarily bonded while spreading the liquid crystal supplied on the substrate by the applied pressure.

In the temporary bonding step, typically, the first
What is necessary is just to temporarily bond these substrates so that the substrate and the second substrate have a predetermined positional relationship. That is, typically, prior to the temporary bonding step, the first substrate and the second substrate may be aligned so that they have a predetermined positional relationship.
Typically, this alignment may be performed when the first and second substrates are at room temperature. (D) Final bonding step In the final bonding step, the first substrate and the second substrate are fully bonded with the bonding material and the liquid crystal interposed therebetween.

In the final bonding step, the first substrate and the second substrate are fully bonded. Here, the actual bonding is bonding performed after the temporary bonding. Typically, the bonding strength is higher than the temporary bonding state, and the bonding state reaches or is close to the bonding strength to be finally obtained. For example, when a thermosetting resin is used as the adhesive material, by applying heat, the degree of curing of the adhesive material is advanced from the temporarily cured state, and the adhesive state is finally increased to an adhesive strength to be obtained. It is cured to a degree of cure that has reached or is close to this.

The final bonding step may be performed, for example, while applying a predetermined pressure to the first and second substrates. The pressure may be applied to the first substrate and the second substrate so that they approach each other.

In the case where the main bonding step is performed while applying pressure to the first and second substrates as described above, the pressure may be applied in order from one end of the first and second substrates to the other end. Good. For example, with respect to a flat table for holding at least one of the first and second substrates,
By relatively moving the pressure roller, the first and second
A predetermined pressure can be applied in order from one end of the substrate to the other end. By passing the first and second substrates between the first and second pressure rollers facing each other,
A predetermined pressure can be sequentially applied from one end of the first and second substrates to the other end.

The main bonding step may be performed while applying not only pressure but also predetermined heat to the first and second substrates. When performing the main bonding step while applying heat and pressure to the first and second substrates, the heat and pressure may be applied in order from one end of the first and second substrates to the other end, for example. For example, by moving a heating and pressing roller relatively to a flat table for holding at least one of the first and second substrates, one end of the first and second substrates is moved. And predetermined heat and pressure can be applied in order from the other end. In this case, a heating device (for example, a heater) may be provided on the flat table, and heat may be applied to the first and second substrates also from the flat table. By passing the first and second substrates between the first and second heating and pressing rollers facing each other, predetermined heat and heat are sequentially applied from one end of the first and second substrates to the other end. Pressure can be applied.

In the case where the main bonding step is performed while applying pressure to the first and second substrates, the pressure may be applied to the entire surface of the portion of the first and second substrates to which pressure is to be applied at one time. Similarly, when performing the main bonding process while applying heat to the first and second substrates, the heat may be applied to the entire surface of the portion of the first and second substrates to which heat is to be applied at one time. [1-2] In the manufacturing method of the present invention, the main bonding step is performed after the temporary bonding step is completely completed. That is,
It does not mean that the final bonding step is performed while the temporary bonding step is performed. The temporary bonding step is performed by, for example, the first and second
In the case where pressure is applied sequentially from one end (first end) to the other end (second end) of the substrate, the pressure is applied to at least the second end before the final bonding step. To start.

Further, in the manufacturing method of the present invention, the heat applied to the first and / or second substrate differs between the temporary bonding step and the main bonding step.

Typically, the temporary bonding step is performed while the first and second substrates are at room temperature, and the main bonding step is performed while heating the first and / or second substrate. That is, typically, in the temporary bonding step, the first and second substrates are not subjected to heat, and the first and second substrates are kept at room temperature, and in the final bonding step, the first and ( Or) while heating the second substrate.

Manufacturing the liquid crystal display panel in this manner has the following advantages.

Since the temporary bonding step is performed without applying heat to both the first and second substrates, the first substrate and the second substrate can be temporarily bonded without thermal expansion of these substrates. Therefore, the first substrate and the second substrate are aligned so as to have a predetermined positional relationship, and then these substrates are temporarily bonded, so that the first substrate and the second substrate have a predetermined positional relationship. These substrates can be temporarily bonded. By performing the alignment in a state where the first and second substrates are at room temperature,
The displacement of the positional relationship between the first substrate and the second substrate due to thermal expansion or contraction of the substrate after the alignment can be suppressed.

Thereafter, even if the first and / or second substrates are fully bonded while applying heat, the temporary bonding process is completely completed, that is, the first substrate and the second substrate are bonded. Is temporarily bonded, the positional relationship between the first substrate and the second substrate that are temporarily bonded can be suppressed. Even if the first and / or the second substrate expands somewhat, the positional relationship between the temporarily bonded first substrate and the second substrate can be suppressed. Therefore, the first substrate and the second substrate are aligned so as to have a predetermined positional relationship, and then these substrates are temporarily bonded, so that the predetermined positional relationship between the first substrate and the second substrate is obtained. While these conditions are maintained, these substrates can be fully bonded.

Further, even if the first and / or second substrates are fully bonded while applying heat, the first and second substrates are already temporarily bonded, so that the first and / or second substrates are already bonded. Or) The generation of wrinkles on the second substrate can be suppressed.

When performing the main bonding step while applying heat to the first and / or second substrate, the heat suppresses the positional relationship between the first substrate and the second substrate and the occurrence of wrinkles in the substrate. For this reason, these substrates may be temporarily bonded with an adhesive material before the actual bonding so that the bonding area is as large as possible over the entire surface of the first substrate and the second substrate. For example, a plurality of columnar structures may be formed in a region including a display region with an adhesive material supplied on the substrate, and the first substrate and the second substrate may be temporarily bonded as described above. [1-3] Hereinafter, the production method of the present invention will be further described. (A) The pre-heating of the first and / or second substrate may be performed after the temporary bonding step and before the main bonding step. By performing the preheating, the actual bonding step can be efficiently performed. The preheating may be performed, for example, by radiant heat from an infrared lamp heater or the like. (B) In both the temporary bonding step and the final bonding step,
When the pressure is applied to the first and second substrates while applying the pressure, the pressure applied in the temporary bonding step and the pressure applied in the main bonding step may be the same or different. For example, the pressure applied to the first and second substrates in the temporary bonding step may be smaller than the pressure applied to the first and second substrates in the main bonding step. (C) The adhesive material and the liquid crystal are usually in contact with each other after the temporary bonding step and before the main bonding step is started. At this stage, the adhesive material has not been cured though it depends on the adhesive material. In order to suppress the deterioration of the liquid crystal due to the contact of the liquid crystal with the uncured adhesive material (for example, the seal material forming the seal wall), it is preferable to perform the final bonding step immediately after performing the temporary bonding step. (D) The manufacturing method of the present invention is particularly useful when, for example, a resin film substrate is used as at least one of the first and second substrates. In addition, by using a resin film substrate, the breakage of the substrate can be suppressed more than when a glass substrate is used, and the liquid crystal display panel can be made thinner,
The weight can be reduced. (E) In a liquid crystal display panel manufactured by the manufacturing method of the present invention, typically, electrodes are formed on the first and second substrates in order to drive the liquid crystal display panel to perform display. I just need.

The electrodes may be, for example, those for driving the liquid crystal display panel by simple matrix driving or active matrix driving.

If necessary, an insulating film, an alignment film, a gas barrier film and the like may be formed on the first and / or second substrate.

The electrodes and the like may be formed on the substrate before the adhesive material supply step and the liquid crystal material supply step. (F) In the liquid crystal display panel manufactured by the manufacturing method of the present invention, one or more spacers are provided between the first substrate and the second substrate in order to control the gap between the first substrate and the second substrate. May be arranged.

When such a spacer is arranged between the first substrate and the second substrate, the spacer may be, for example, the one of the first and second substrates before the first substrate and the second substrate are temporarily bonded. What is necessary is just to spray on at least one board | substrate.

Alternatively, spacers may be dispersed in the liquid crystal supplied onto the substrate in the liquid crystal material supply step. (G) The temporary bonding step may be performed after the liquid crystal supply step is performed, but the temporary bonding step and the liquid crystal supply step may be performed in parallel.

For example, when the first substrate and the second substrate are temporarily bonded while being sequentially pressed from one end to the other end, a liquid crystal is supplied between the first substrate and the second substrate. Alternatively, the first substrate and the second substrate may be temporarily bonded. (H) The liquid crystal (liquid crystal composition) supplied onto the substrate in the liquid crystal supply step may be, for example, a liquid crystal composition including a liquid crystal exhibiting a cholesteric phase (eg, a liquid crystal exhibiting a cholesteric phase at room temperature). Liquid crystals exhibiting a cholesteric phase selectively reflect light having a wavelength corresponding to the helical pitch of the liquid crystal. Therefore, a liquid crystal display panel in which liquid crystals exhibiting a cholesteric phase are arranged between substrates can be used as a reflective liquid crystal display panel.

As the liquid crystal exhibiting a cholesteric phase, for example, a cholesteric liquid crystal exhibiting a cholesteric phase itself, or a chiral nematic liquid crystal obtained by adding a chiral material to a nematic liquid crystal may be used. The chiral nematic liquid crystal has an advantage that the helical pitch can be adjusted by the amount of the chiral material added, and the selective reflection wavelength can be easily adjusted.

[0045]

[3] Embodiments of the present invention will be described below with reference to the drawings.

FIGS. 1 and 2 are a schematic sectional view and a schematic plan view, respectively, of an example of a liquid crystal display panel that can be manufactured by the manufacturing method according to the present invention.

The liquid crystal display panel DP1 shown in FIGS.
This is a reflective liquid crystal display panel. Liquid crystal display panel DP1
Is observed from above the display panel DP1 in FIG.

The liquid crystal display panel DP1 comprises transparent substrates S1 and S
2, and a liquid crystal LC is arranged between these substrates.

In this embodiment, the substrates S1 and S2 are both film substrates made of polycarbonate (PC).

On the surface of the substrate S1 on the side facing the substrate S2,
In this example, an electrode E1, an insulating film IS1, and an alignment film O1 are sequentially formed.

In this embodiment, on the surface of the substrate S2 facing the substrate S1, the electrode E2, the insulating film IS2, and the alignment film O2 are provided.
Are formed. A black light absorbing film AB is formed on a surface of the substrate S2 on a side far from the observation side.

The electrodes E1 and E2 are for driving the liquid crystal display panel DP1 in a simple matrix in this example. The electrode E1 includes a plurality of strip electrodes arranged in parallel at a predetermined pitch. The electrode E2 also includes a plurality of strip electrodes arranged in parallel at a predetermined pitch. The strip electrode of the electrode E1 and the strip electrode of the electrode E2 extend in directions orthogonal to each other. The electrodes E1 and E2 are both made of ITO in this example.

On the substrate S1, an alignment mark M
Two 1 are formed. Similarly, on the substrate S2,
Two alignment marks M2 are formed. These alignment marks are provided for adjusting the positional relationship between the substrates S1 and S2 to a predetermined positional relationship when the substrates are bonded. In this example, the alignment marks M1 and M2 are both made of the same ITO as the electrode material.

The liquid crystal (liquid crystal composition) LC disposed between the substrates S1 and S2 is, in this example, a chiral nematic liquid crystal composition exhibiting a cholesteric phase at room temperature. Liquid crystal L
C has a selective reflection wavelength in the visible light region.

A seal wall SW, a plurality of columnar structures CS, and a plurality of spacers SP are disposed between the substrates S1 and S2, in addition to the liquid crystal LC.

The spacer SP is used to keep the gap between the substrates S1 and S2 uniform at each part.
2 between the two.

The seal wall SW is provided annularly at a position surrounding the liquid crystal LC. The sealing wall SW is composed of the substrates S1 and S2.
Adhered to both. The seal wall SW prevents the liquid crystal LC from leaking from between the substrates S1 and S2.

The columnar structure CS is formed in a region including the display region. The columnar structure CS is bonded to both the substrates S1 and S2. The columnar structure CS is a substrate S1.
And S2 are adhered to maintain a gap between the substrates S1 and S2 and to increase the strength of the entire liquid crystal display panel DP1.

As described above, in the liquid crystal display panel DP1, the substrate S1 is formed by the seal wall SW and the columnar structure CS.
And S2 are adhered to each other. [4] Hereinafter, a method of manufacturing the liquid crystal display panel DP1 will be described with reference to the flowchart of FIG. (A) Preparation Step In the preparation step, the substrates S1 and S2 are prepared. In this example, a PC film is used as the substrates S1 and S2. (B) Function Film Forming Step In the function film forming step, a predetermined function film is formed on each of the substrates S1 and S2.

On the substrate S1, an electrode E1, an insulating film IS1
And an alignment film O1 are formed in this order. Further, an alignment mark M1 is also formed on the substrate S1.

Similarly, an electrode E2, an insulating film IS2, and an alignment film O2 are sequentially formed on the substrate S2. Also, the substrate S
2, an alignment mark M2 is also formed.

The electrode E1 and the alignment mark M1 on the substrate S1 are simultaneously formed by ITO in this example as follows. First, an ITO film is uniformly formed on the substrate S1, and the ITO film is patterned into a predetermined shape by using a photolithography method, so that an electrode E having a predetermined shape is formed.
1 and an alignment mark M1 having a predetermined shape are formed. Similarly, the electrode E2 and the alignment mark M2 on the substrate S2 are simultaneously formed of ITO. (C) Spacer dispersing step In the spacer dispersing step, the spacers SP are dispersed on at least one of the substrates S1 and S2. In this example, spacers SP are scattered on the substrate S1. (D) Adhesive material supply step In the adhesive material supply step, an adhesive material for bonding the substrates S1 and S2 is supplied onto at least one of the substrates S1 and S2. In this example, the substrates S1 and S2
Supply the adhesive material to any of the above.

According to the adhesive material supplied on the substrate S1,
A seal wall SW is formed. In this example, the adhesive material for forming the seal wall SW is a thermosetting resin. In this example, the seal wall SW having a predetermined shape is formed by a dispenser method.

According to the adhesive material supplied on the substrate S2,
A plurality of columnar structures CS are formed. The adhesive material for forming the columnar structure CS is a thermoplastic resin in this example. The columnar structure CS having a predetermined shape and a predetermined arrangement pattern includes:
In the present example, it is formed by a screen printing method.

As described above, the adhesive material supply step is both a seal wall forming step and a columnar structure forming step.

The order of the steps of forming the sealing wall SW by supplying the adhesive material onto the substrate, forming the columnar structure CS by supplying the adhesive material onto the substrate, and dispersing the spacers are as follows. May be performed. (E) Liquid crystal supply step In the liquid crystal supply step, the liquid crystal LC is supplied onto at least one of the substrates S1 and S2. In this example, the liquid crystal LC is supplied on the substrate S2. (F) Temporary bonding step In the temporary bonding step, the substrates S1 and S2 are temporarily bonded with the bonding material, the liquid crystal LC, and the spacer SP interposed therebetween. After the substrates S1 and S2 are aligned so as to have a predetermined positional relationship, these substrates are temporarily bonded. The temporary bonding step will be described later in detail. (G) Main Bonding Step In the main bonding step, the substrates S1 and S2, which are temporarily bonded with a bonding material or the like interposed therebetween, are permanently bonded. The substrates S1 and S2 are permanently bonded by curing the bonding material by a predetermined method. The main bonding step is started after the temporary bonding step is completed. The actual bonding step will be described later in detail. (H) Light Absorbing Film Forming Step In the light absorbing film forming step, a black light absorbing film AB is formed on the back side of the substrate S2. The light absorbing film AB can be formed by a coating method using, for example, a black paint. Note that the light absorbing film AB may be formed at a timing such as before the adhesive material supply step.

Thus, the liquid crystal display panel DP shown in FIG.
Get 1. [4] FIG. 4 shows a schematic configuration diagram of an example of a temporary bonding device for performing the temporary bonding step. FIG. 5 is a schematic block diagram of the temporary bonding apparatus. FIG. 5 mainly shows a portion related to driving of the temporary bonding apparatus and its control.

The temporary bonding apparatus A1 shown in FIG. 4 can perform a liquid crystal supply step and a temporary bonding step. After the completion of the adhesive material supply step, the liquid crystal supply step and the temporary adhesion step are performed by the temporary bonding apparatus A1.

The temporary bonding apparatus A1 has first and second two stages 31, 32 for holding a substrate and the like. In this example, the substrate S1 on which the seal wall SW is formed is held by the first stage 31, and the substrate S2 on which the columnar structure CS is formed is held by the second stage 32.

The first stage 31 can rotate around the rotation axis 31p between an initial position P11 for mounting the substrate S1 and a position P12 for performing the temporary bonding step. The turning of the first stage 31 is performed by a turning drive unit 31d.
Done by

The first stage 31 has a suction table 311. The suction table 311 has a plurality of exhaust holes 31.
1v is provided, and each exhaust hole 311v is connected to an exhaust pump 311p via a tube (not shown). By operating the exhaust pump 311p, the substrate S1 placed on the suction table 311 can be held with a predetermined suction force.

In the first stage 31, the suction table 3
11 is supported by a base member 313 via an XY-θ drive mechanism 312. By driving the XY-θ driving mechanism 312 by the driving unit 312d, the base member 3
The position of the suction table 311 with respect to 13 can be finely adjusted in the X-axis direction, the Y-axis direction, and the θ direction (hereinafter referred to as the XY-θ direction) in FIG.

The XY-θ drive mechanism 312 and its drive section 312d are used when positioning the substrate S1. For this positioning, two alignment marks M1 formed on the substrate S1 and CCD cameras 711 and 712 disposed above the first stage 31 are also used. By moving the CCD cameras 711 and 712 in the Y-axis direction, the CCD cameras can be retracted to a position where the rotation of the first stage 31 is allowed.

The second stage 32 moves along a guide rail 32g extending in the X-axis direction between an initial position P21 for mounting the substrate S2 and a position P22 for supplying the liquid crystal LC onto the substrate S2. be able to. Between the position P21 and the position P22, there is a position P23 at which the temporary bonding step is started. The second stage 32 is driven in the X-axis direction by an X-drive unit 32d, and based on a detection result of a position detection unit such as an encoder (not shown), the X-drive of the second stage 32
The position in the axial direction, the moving speed, and the like are controlled.

The second stage 32 also has a suction table 321 like the first stage 31. Suction table 3
21 is provided with a plurality of exhaust holes 321v, and each exhaust hole 321v is connected to an exhaust pump 321p via a tube (not shown). By operating the exhaust pump 321p, the substrate S2 placed on the suction table 321 can be held with a predetermined suction force.

In the second stage 32, the suction table 321 is supported by a base member 323 via an XY-θ driving mechanism 322. XY-θ drive mechanism 322
Of the suction table 321 with respect to the base member 323 by driving the
The direction can be fine-tuned.

The XY-θ drive mechanism 322 and its drive section 322d are used when positioning the substrate S2. For this positioning, two alignment marks M2 formed on the substrate S2 and CCD cameras 721 and 722 arranged above the second stage 32 are also used.

The temporary bonding apparatus A1 has, in addition to the first and second stages 31, 32, etc., a dispenser 4 used for performing the liquid crystal supply step and a pressure roller 5 used for performing the temporary bonding step. I have.

The dispenser 4 is connected to a liquid crystal supply control unit 4c, and the control unit 4c controls the liquid crystal supply amount and the like.

The pressure roller 5 used in the temporary bonding step is rotatably supported. The pressure roller 5 can move between a position where the temporary bonding process is performed and a retracted position above the position. The driving of the pressure roller 5 in the Y-axis direction is performed by a Y-drive unit 5d. [5] FIG. 6 shows a schematic configuration diagram of an example of the main bonding apparatus for performing the main bonding step.

The main bonding apparatus A2 shown in FIG. 6 is a stage 3 for mounting the substrates S1 and S2 to which the temporary bonding has been performed.
Three. In this example, the actual bonding apparatus A2 is disposed next to the temporary bonding apparatus A1, and the substrates S1 and S2 on the stage 32 of the temporary bonding apparatus A1 on which the temporary bonding has been completed are formed by rollers
It is transferred to the stage 33 of the main bonding apparatus A2 by 1 to R5.

The stage 33 of the bonding apparatus A2 can move in the X-axis direction along a guide rail 33g extending in the X-axis direction. The stage 33 includes an X-drive unit 33.
Driven in the X-axis direction by d.

The stage 33 has a suction table 331 like the stage 32. The suction table 331 is provided with a plurality of exhaust holes 331 (not shown), and each of the exhaust holes 331 is connected to an exhaust pump 331p via a tube (not shown). By operating the exhaust pump 331p, the substrate placed on the suction table 331 can be held with a predetermined suction force.

The suction table 331 incorporates a heater 331h. Based on the temperature detected by a temperature sensor (not shown), the heater 33
By controlling the driving of 1h, the suction table 331 can be heated to a predetermined temperature, and the substrates S1 and S2 on the suction table 331 can be heated.

The bonding apparatus A2 includes, in addition to the stage 33,
The heating and pressing roller 6 is provided.

The heating and pressing roller 6 is rotatably supported. The roller 6 is hollow, and has a heater 6h disposed therein. The heater 6 d drives and controls the heater 6 h based on the temperature detected by a temperature sensor (not shown), so that the temperature of the roller 6 can be controlled to a predetermined temperature. [6] Hereinafter, the liquid crystal supply step, the temporary bonding step, and the final bonding step performed using the temporary bonding apparatus A1 and the final bonding apparatus A2 will be described with reference to the process charts of FIGS.

The liquid crystal supply step, the temporary bonding step, and the main bonding step are all performed in a normal temperature atmosphere. (1) The first and second stages 31 of the temporary bonding device A1,
32 denotes initial positions P11 and P21 when the substrate is placed.
(# 101).

The substrates S1 and S2 are positioned and arranged at predetermined preset positions on the stages 31 and 32 at normal temperature (# 101).

The preset position where the substrate S1 should be placed is
The position is determined based on the position of the base member 313 of the first stage 31. Similarly, the preset position where the substrate S2 is to be arranged is determined based on the position of the base member 323 of the second stage 32.

When the first and second stages 31, 32 are located at the initial positions P11, P21, respectively,
The base member 313 of the first stage 31 and the base member 323 of the second stage have a predetermined positional relationship.

Therefore, after arranging the substrates S1 and S2 at the preset positions, the first stage 31 is turned to be arranged at the position P12 at which the temporary bonding step is started, and the second stage 32 is moved. If it is arranged at the position P23 at the start of the temporary bonding step (step #
103), the substrates S1 and S2 can be arranged in such a manner that they can be temporarily bonded without displacement. Move the stages 31 and 32 to the position P1
2, the preset positions of the substrates S1 and S2 are determined so that the substrates S1 and S2 have such a positional relationship when they are arranged at P23.

The substrate S1 is arranged at a preset position on the first stage 31 as follows. First, the substrate S1 is placed at a substantially preset position on the suction table 311 of the first stage 31. The substrate S1 is placed on the suction table 311 with the surface on which the seal wall SW is formed facing upward.

Next, the substrate S1 is sucked toward the suction table 311 by operating the exhaust pump 311p.

Next, the substrate S1 on the suction table 311
The position of the substrate S1 is finely adjusted by the XY-θ driving unit 312d so that the. For this alignment, two alignment marks M1 formed on the substrate S1 and CCD cameras 711 and 712 facing these marks are used. More specifically, based on the images read by the CCD cameras 711 and 712, the positions of the two alignment marks M1 are detected by the control unit 312c using an image processing technique. Based on the detected position information, a shift amount from the predetermined preset position of the substrate S1 is calculated. Based on the amount of the deviation, the control unit 312c performs XY
By controlling the driving of the −θ driving unit 312d, the substrate S1 is arranged at the preset position.

The substrate S2 is formed in the same manner as the substrate S1.
The stage 32 is arranged at a preset position. First, the substrate S2 is placed almost at a preset position on the suction table 321 of the second stage 32. With the surface on which the columnar structure CS is formed facing upward, the substrate S2 is attached to the suction table 32.
Place on top. Next, the substrate S2 is sucked toward the suction table 321 by operating the exhaust pump 321p. Next, similarly to the case of adjusting the position of the substrate S1, the XY-θ driving unit 322d finely adjusts the position of the substrate S2 so that the substrate S2 on the suction table 322 is at a predetermined preset position. (2) Next, the second stage 32 holding the substrate S2 is moved to a position for performing the liquid crystal supply step, that is, a position P22 facing the dispenser 4 (# 10).
2).

After lowering the dispenser 4, the substrate S2
A predetermined amount of liquid crystal LC is ejected from the dispenser 4 onto the end of (# 102). The liquid crystal LC is linearly arranged on the substrate S2.
Is arranged. (3) Next, after raising the dispenser 4, the second stage 32 holding the substrate S2 is moved to a position P23 where the temporary bonding step is started (# 103).

After the CCD cameras 711 and 712 are retracted to the retracted position, the first stage 31 holding the substrate S1 is turned to the position P12 where the temporary bonding step is started (# 103).

As a result, the edge of the substrate S1 is
(# 103). (4) Next, the pressure roller 5 is lowered, and the pressure roller 5 is arranged at a position where the temporary bonding step is started.

By moving the second stage 32 rightward in the drawing, the liquid crystal LC and the liquid crystal LC are applied while applying a predetermined pressure from one end of the substrates S1 and S2 to the other end thereof by the pressing roller 5 or the like. The substrates S1 and S2 are temporarily bonded with the bonding material interposed therebetween (# 104, # 105).

When the temporary bonding is being performed, the first stage 31 holding the substrate S1 by suction is at a fixed position. The first stage 31 sucks and holds the substrate S1 so as to allow the substrate S1 and the substrate S2 to move together.

During the temporary bonding, the pressure roller 5, the first stage 31 holding the substrate S1, and the second stage 32 holding the substrate S2 are all at room temperature. That is, when performing the temporary bonding step, no heat is applied to the substrate S1, the substrate S2, and the bonding material therebetween.

By sequentially applying pressure from one end of the substrates S1 and S2 to the other end, the liquid crystal LC is spread between the substrates, and the substrates S1 and S2 are spread.
The liquid crystal LC fills the entire space surrounded by 2 and the seal wall SW.

Further, by sequentially applying a pressure from one end of the substrates S1 and S2 to the other end, the substrates S1 and S2 are sequentially pressed.
The substrates S1 and S2 can be temporarily bonded while expelling the air between the two. Thereby, it is possible to suppress the air from remaining between the substrates S1 and S2.

Since the substrates S1 and S2 are positioned and set on the first and second stages 31 and 32, respectively, as described above, the substrates S1 and S2 are temporarily bonded in a predetermined positional relationship without displacement. can do. (5) Next, in order to fully bond the temporarily bonded substrates S1 and S2, these substrates are bonded to the stage 3 of the temporary bonding apparatus A1.
2 to the stage 33 of the actual bonding apparatus A2 (#
106). By operating the exhaust pump 331p, the temporarily bonded substrates S1 and S2 are sucked toward the suction table 331.

In this example, the substrates S1 and S2 are
Before the transfer to 3, the temperature of the stage 33 (suction table 331) has already been heated to a predetermined temperature (in this example, 50 ° C.). (6) Next, by moving the stage 33 rightward in the figure, the substrates S1 and S2 are heated by the heating / pressurizing roller 6 heated to a predetermined temperature (150 ° C. in this example).
Is fully bonded. The substrate S1 is heated by the heating / pressing roller
While applying heat and pressure sequentially from one end to the other end of S2 and S2, these substrates are fully bonded (# 107, # 1).
08).

By applying heat to the adhesive material (the thermosetting resin in this example) forming the seal wall SW, the adhesive material is cured, and the substrates S1 and S2 are permanently bonded. Further, an adhesive material (a thermoplastic resin in this example) for forming the columnar structure CS.
After applying heat to the substrate, the adhesive material is softened and then cured by cooling, whereby the substrates S1 and S2 are also permanently bonded.

If the uncured adhesive material and the liquid crystal LC are in contact with each other for a long time, problems such as contamination of the liquid crystal LC occur. Therefore, it is necessary to perform the final bonding step immediately after the temporary bonding step is completed. Is preferred. [7] As described above, in the manufacturing method of the present invention, the main bonding step is performed after the temporary bonding step of the substrates S1 and S2 is performed.

Since the temporary bonding step is performed without applying heat to the substrates S1 and S2, no thermal expansion of the substrates occurs and the substrates S1 and S2 can be temporarily bonded to each other without a positional shift in a predetermined positional relationship.

Although the final bonding step is performed while applying heat to the substrates S1 and S2, the final bonding step is performed after the temporary bonding step is completely completed.
The substrates S1 and S2 can be permanently bonded without destroying the positional relationship of No. 2. That is, the substrates S1 and S2 can be permanently bonded in a predetermined positional relationship without displacement. Also, wrinkles are generated on the substrates S1 and / or S2, and the substrates S1 and S2
The substrates S <b> 1 and S <b> 2 can be permanently bonded while suppressing air bubbles from entering between the substrates 2.

This is because even when the substrates S1 and / or S2 are slightly thermally expanded during the actual bonding and the expansion amounts are slightly different, the entire substrates S1 and S2 are already It is considered that the temporary bonding prevents the positional relationship between the substrates S1 and S2 from shifting. For the same reason, it is considered that the occurrence of wrinkles in the substrates S1 and S2 is also suppressed.

In the above example, the temporary bonding and the main bonding were performed by separate devices, respectively. However, the heating and pressing roller 6 and the heater for heating the suction stage of the stage 32 were provided to the temporary bonding device A1. After the temporary bonding is performed in the same manner as described above, the actual bonding may be performed using a bonding apparatus further provided with the above. [7-1] Example 1 When the temporary bonding step and the final bonding step were actually performed using the temporary bonding apparatus A1 and the final bonding apparatus A2 as described above, the substrates S1 and S2 were aligned without displacement. And the substrate S
Substrates S1 and S2 could be permanently bonded without wrinkles occurring in Nos. 1 and S2 and without air bubbles entering between substrates S1 and S2.

In order to produce a plurality of liquid crystal display panels DP1, the temporary bonding step and the final bonding step were performed a plurality of times.
2 is small enough to have no practical problem and the substrate S
Substrates S1 and S2 could be permanently bonded without wrinkles occurring in Nos. 1 and S2 and without air bubbles entering between substrates S1 and S2. [7-1] Comparative Example 1 On the other hand, the bonding apparatus A1 'shown in FIG.
When the temporary bonding step and the main bonding step were performed in parallel, the following problems occurred.

First, the bonding apparatus A1 'shown in FIG. 10 will be described. The bonding device A1 'is similar to the temporary bonding device A1 of FIG. 4 except for the following.

The bonding apparatus A1 'includes a heating and pressing roller 6 used for performing the main bonding step, in addition to the pressing roller 5 used for performing the temporary bonding step. Further, in the bonding apparatus A1 ', the suction tables 321 and 322 of the stages 31 and 32 for supporting the substrates S1 and S2 include:
The heaters, which are not shown, are incorporated respectively, and can heat the suction tables 321 and 322 to a predetermined temperature.

In Comparative Example 1, the temporary bonding step and the main bonding step were performed as follows using the bonding apparatus A1 '. First, the substrates S1 and S2 are placed on the stages 31, 3 respectively.
2 was set to the predetermined preset position. Substrates S1 and S2
Have been heated to 50 ° C. in advance. Next, the stage 32 was moved to supply the liquid crystal LC onto the substrate S2. Next, while rotating the stage 31, the stage 32 is moved,
These stages were arranged at positions where the temporary bonding step was started. Next, by moving the stage 32 rightward in the figure, the temporary adhesion is performed
The main bonding was performed by the heating and pressing roller 6 of #C. That is, before the entire substrates S1 and S2 were temporarily bonded, the actual bonding was performed in order from the portion where the temporary bonding was completed.

When the temporary bonding and the final bonding are performed as described above, when the stage 31 is turned and the substrate S1 on the stage 31 approaches the stage 32, the end of the substrate S1 expands due to the heat of the stage 32. did. Then, after the temporary bonding and the final bonding were completed, wrinkles were generated on the substrate S1 as shown in FIG. 11, and bubbles were mixed between the substrates S1 and S2. Further, the positional relationship between the substrates S1 and S2 also deviated from the predetermined positional relationship. [7-3] From these results, according to the manufacturing method of the present invention, the substrate S1 has no displacement and no wrinkles.
It can be seen that S2 and S2 can be permanently bonded.

Further, in the manufacturing method of the present invention, since the temporary bonding step and the final bonding step are performed in an atmosphere at room temperature, the temporary bonding apparatus and the final bonding apparatus do not need to be large. Also, in an environment where people can enter,
The temporary bonding step and the final bonding step can be performed. For example, in order to suppress the occurrence of wrinkles in the substrate, the ambient temperature during the temporary bonding and the final bonding is set to a temperature higher than room temperature (for example, the stage temperature (eg, 50
(C)) is also proposed, but if this is done, the size of the temporary bonding apparatus and the final bonding apparatus becomes large, and the environment when the temporary bonding step and the final bonding step are performed deteriorates. [8] In the manufacturing method of the present invention, the main bonding step may be performed using the main bonding apparatus A3 shown in FIGS. 12 (A) and 12 (B).

The bonding device A3 has two heating / pressing rollers 61 and 62 facing each other. Each of these rollers 61 and 62 has a built-in heater 61h and 62h, respectively. The rollers 61 and 62 can be heated to a predetermined temperature by the heaters 61h and 62h.

In the actual bonding apparatus A3, the temporarily bonded substrates S1 and S2 are passed through rollers 61 and 62 to apply heat and pressure sequentially from one end of the substrates S1 and S2 to the other. , And the actual bonding is performed. In the final bonding apparatus A3, similarly to the final bonding apparatus A2, the substrates S1 and S2 can be permanently bonded without any displacement and without wrinkles. [8-1] Example 2 When the substrates S1 and S2 temporarily bonded by the temporary bonding device A1 were actually bonded using the final bonding device A3,
The substrates S1 and S2 could be fully bonded without any displacement between the substrates S1 and S2, no wrinkling of the substrates S1 and S2, and no air bubbles between the substrates S1 and S2.
The temperature of the rollers 61 and 62 at the time of performing the actual bonding is as follows.
The temperature was set to 80 ° C.

In order to manufacture a plurality of liquid crystal display panels DP1, the temporary bonding step and the final bonding step were performed a plurality of times.
2 is small enough to have no practical problem and the substrate S
Substrates S1 and S2 could be permanently bonded without wrinkles occurring in Nos. 1 and S2 and without air bubbles entering between substrates S1 and S2. [9] In the manufacturing method of the present invention, the main bonding step may be performed using the main bonding apparatus A4 shown in FIG.

The main bonding apparatus A4 is the same as the main bonding apparatus A2 in FIG. 6 except for the following.

The bonding apparatus A4 includes a preliminary heating device H1 in addition to the heating and pressing roller 6. Preheating device H1
Is an infrared lamp heater in this example.

In the permanent bonding apparatus A4, the temporarily bonded substrates S1 and S2 are placed on the stage 33, and these substrates are sucked toward the suction table 331 of the stage 33. Bonding is performed.

The stage 33 is moved to a position facing the heater H1, and the substrates S1 and S2 are preheated from the substrate S1 side by the heater H1, and these substrates are heated from the substrate S2 side by the heater 331h of the suction table 331 of the stage 33. Preheat. In this example, the substrate S
When 1 and S2 are set on the stage 33, the temperature of the suction table 331 is normal temperature, and after the substrate is set on the stage 33, the heater 331h of the suction table 331 is driven, so that Substrate S1
And heating of S2 is started.

After the temperature of the suction table 331 reaches a predetermined temperature, the stage 33 is moved rightward in the figure, and the heating and pressing roller 6 at a predetermined temperature causes one end of the substrates S1 and S2 to move to the other end. The substrates S1 and S2 are permanently bonded while sequentially applying heat and pressure to the ends.

The thus temporarily bonded substrates S1 and S1
2 is preheated, and the substrate S1
Even when the substrates S1 and S2 are fully bonded, the substrates S1 and S2 can be completely bonded without any displacement and without wrinkles. [9-1] Example 3 When the substrates S1 and S2 temporarily bonded by the temporary bonding device A1 were actually bonded as described above using the actual bonding device A4, the substrates S1 and S2 were misaligned. And no wrinkles occurred on the substrates S1 and S2.
The substrates S1 and S2 could be permanently bonded without air bubbles entering between the two. The suction table 3 of the stage 33
The temperature of 31 was preliminarily heated to 50 ° C., and the temperature of the heating and pressing roller 6 was set at 150 ° C.

In order to manufacture a plurality of liquid crystal display panels DP1, the temporary bonding step and the final bonding step were performed a plurality of times.
2 is small enough to have no practical problem and the substrate S
Substrates S1 and S2 could be permanently bonded without wrinkles occurring in Nos. 1 and S2 and without air bubbles entering between substrates S1 and S2.

[0128]

According to the present invention, there is provided a method of manufacturing a liquid crystal display panel in which liquid crystal is disposed between a pair of substrates, and these substrates can be bonded while suppressing wrinkles from being generated in these substrates. A method for manufacturing a liquid crystal display panel can be provided.

Further, the present invention relates to a method for manufacturing a liquid crystal display panel in which liquid crystal is disposed between a first and a second pair of substrates, wherein the first substrate and the second substrate have a predetermined positional relationship. Thus, a method for manufacturing a liquid crystal display panel to which these substrates can be bonded can be provided.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view of an example of a liquid crystal display panel manufactured by a manufacturing method of the present invention.

FIGS. 2A and 2B are schematic plan views of the liquid crystal display panel of FIG. 1 as viewed from the front side and the back side, respectively.

FIG. 3 is a schematic flowchart of an example of a manufacturing method of the present invention when manufacturing the liquid crystal display panel of FIG.

FIG. 4 is a schematic configuration diagram of an example of a temporary bonding device for performing a temporary bonding step.

FIG. 5 is a schematic block diagram of the temporary bonding device of FIG. 4;

FIG. 6 is a schematic configuration diagram of an example of a main bonding apparatus for performing a main bonding step.

FIGS. 7 to 9 are process diagrams when a liquid crystal supply step, a temporary bonding step, and a full bonding step are performed using the temporary bonding apparatus of FIG. 4 and the full bonding apparatus of FIG. 6;

FIGS. 7 to 9 are process diagrams when a liquid crystal supply step, a temporary bonding step, and a full bonding step are performed using the temporary bonding apparatus of FIG. 4 and the full bonding apparatus of FIG.

FIGS. 7 to 9 are process diagrams when a liquid crystal supply step, a temporary bonding step, and a full bonding step are performed using the temporary bonding apparatus of FIG. 4 and the full bonding apparatus of FIG. 6;

FIG. 10 is a process chart when a temporary bonding step and a main bonding step are performed by the bonding apparatus used in Comparative Example 1.

FIG. 11 is a schematic plan view of a liquid crystal display panel manufactured in Comparative Example 1.

FIG. 12A is a schematic side view of another example of the main bonding apparatus for performing the main bonding step, and FIG. 12B is a schematic perspective view of the main bonding apparatus.

FIG. 13 is a schematic configuration diagram of still another example of the main bonding apparatus for performing the main bonding step.

[Explanation of symbols]

 DP1 Liquid crystal display panel S1, S2 Substrate E1, E2 Electrode IS1, IS2 Insulating film O1, O22 Alignment film LC Liquid crystal AB Light absorbing film SW Seal wall CS Columnar structure SP Spacer M1, M2 Alignment mark A1 Temporary bonding device A2, A3, A4 Bonding device 31, 32, 33 Stage 311, 321, 331 Suction table 312, 322 XY-θ drive mechanism 313, 323, 333 Base member 4 Dispenser 5 Pressure roller 6 Heating pressure roller 6h Heater 711, 712 , 721, 722 CCD camera

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2H089 LA09 NA22 NA38 NA45 NA48 NA56 QA12 QA14

Claims (12)

[Claims] 1. A method of manufacturing a liquid crystal display panel having a liquid crystal disposed between a first substrate and a second substrate, wherein an adhesive material is provided on at least one of the first and second substrates. An adhesive material supply step of supplying; a liquid crystal supply step of supplying liquid crystal onto at least one of the first and second substrates; and the first substrate with the adhesive material and the liquid crystal interposed therebetween. A temporary bonding step of temporarily bonding the first substrate and the second substrate with the bonding material and the liquid crystal interposed therebetween. The method of manufacturing a liquid crystal display panel, wherein the bonding step is performed after the temporary bonding step is completed, and the heat applied to the first and / or second substrate is different between the temporary bonding step and the main bonding step. . 2. The temporary bonding step is performed while the first and second substrates are at room temperature, and the main bonding step is performed while heating the first and / or second substrate. Of manufacturing a liquid crystal display panel. 3. The method for manufacturing a liquid crystal display panel according to claim 1, wherein said temporary bonding step is performed while applying a predetermined pressure to said first and second substrates. 4. The method for manufacturing a liquid crystal display panel according to claim 3, wherein said temporary bonding step is performed while sequentially applying a predetermined pressure from one end of said first and second substrates to the other end. 5. The temporary bonding step comprises: moving a pressure roller relative to a flat table for holding at least one of the first and second substrates; 5. The method for manufacturing a liquid crystal display panel according to claim 4, wherein the method is performed while applying a predetermined pressure to the first and second substrates. 6. The first bonding step is performed while applying predetermined heat and pressure to the first and second substrates.
The method for manufacturing a liquid crystal display panel according to any one of the above. 7. The method according to claim 1, wherein the main bonding step is performed while sequentially applying predetermined heat and pressure from one end of the first and second substrates to the other end. A method for manufacturing a liquid crystal display panel. 8. The main bonding step includes: moving a heating / pressing roller relative to a flat table for holding at least one of the first and second substrates; The method according to claim 7, wherein the method is performed while applying predetermined heat and pressure to the first and second substrates. 9. The method of claim 1, wherein the first and second substrates are passed through a space between the first and second heating / pressing rollers facing each other, so that the first and second substrates are fixed to each other. The method for manufacturing a liquid crystal display panel according to claim 7, wherein the method is performed while applying heat and pressure. 10. A method according to claim 1, further comprising a preheating step of preheating the first and / or second substrate after the temporary bonding step and before the main bonding step. A method for manufacturing a liquid crystal display panel according to the above item. 11. The manufacturing of the liquid crystal display panel according to claim 1, further comprising a positioning step of positioning the first substrate and the second substrate before the temporary bonding step. Method. 12. The method for manufacturing a liquid crystal display panel according to claim 1, wherein at least one of said first and second substrates is a resin film substrate.