JP2002293991A - 室温硬化性混成シリコーン - Google Patents
室温硬化性混成シリコーンInfo
- Publication number
- JP2002293991A JP2002293991A JP2001095695A JP2001095695A JP2002293991A JP 2002293991 A JP2002293991 A JP 2002293991A JP 2001095695 A JP2001095695 A JP 2001095695A JP 2001095695 A JP2001095695 A JP 2001095695A JP 2002293991 A JP2002293991 A JP 2002293991A
- Authority
- JP
- Japan
- Prior art keywords
- polymer
- group
- composition
- loop
- olefinic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920001296 polysiloxane Polymers 0.000 title claims description 13
- 229920000642 polymer Polymers 0.000 claims abstract description 60
- 239000000203 mixture Substances 0.000 claims abstract description 35
- -1 hydride substituent Chemical group 0.000 claims abstract description 23
- 238000004132 cross linking Methods 0.000 claims abstract description 19
- 150000001875 compounds Chemical class 0.000 claims abstract description 13
- 238000006243 chemical reaction Methods 0.000 claims abstract description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 9
- 239000010703 silicon Substances 0.000 claims abstract description 9
- 150000002894 organic compounds Chemical class 0.000 claims abstract description 6
- 239000000126 substance Substances 0.000 claims abstract description 5
- 238000000576 coating method Methods 0.000 claims description 18
- 229920002857 polybutadiene Polymers 0.000 claims description 18
- 239000011248 coating agent Substances 0.000 claims description 16
- 239000005062 Polybutadiene Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 125000001424 substituent group Chemical group 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 9
- 125000004423 acyloxy group Chemical group 0.000 claims description 8
- 125000003545 alkoxy group Chemical group 0.000 claims description 8
- 125000000217 alkyl group Chemical group 0.000 claims description 8
- 125000003118 aryl group Chemical group 0.000 claims description 7
- 239000003431 cross linking reagent Substances 0.000 claims description 7
- 125000001309 chloro group Chemical group Cl* 0.000 claims description 6
- 150000004678 hydrides Chemical group 0.000 claims description 4
- 230000001588 bifunctional effect Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 238000006467 substitution reaction Methods 0.000 claims 1
- 229920005573 silicon-containing polymer Polymers 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 21
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 18
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 13
- DTQVDTLACAAQTR-UHFFFAOYSA-N Trifluoroacetic acid Chemical compound OC(=O)C(F)(F)F DTQVDTLACAAQTR-UHFFFAOYSA-N 0.000 description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 239000004971 Cross linker Substances 0.000 description 7
- 239000003054 catalyst Substances 0.000 description 7
- DRUOQOFQRYFQGB-UHFFFAOYSA-N ethoxy(dimethyl)silicon Chemical compound CCO[Si](C)C DRUOQOFQRYFQGB-UHFFFAOYSA-N 0.000 description 6
- 238000006459 hydrosilylation reaction Methods 0.000 description 6
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- QBERHIJABFXGRZ-UHFFFAOYSA-M rhodium;triphenylphosphane;chloride Chemical compound [Cl-].[Rh].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 QBERHIJABFXGRZ-UHFFFAOYSA-M 0.000 description 4
- 239000004205 dimethyl polysiloxane Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 3
- 229910052736 halogen Inorganic materials 0.000 description 3
- 150000002367 halogens Chemical class 0.000 description 3
- 150000002430 hydrocarbons Chemical group 0.000 description 3
- 229920000098 polyolefin Polymers 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 150000003377 silicon compounds Chemical class 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000011995 wilkinson's catalyst Substances 0.000 description 2
- AOSATGCSEIIZPL-FMQUCBEESA-N 1-methyl-4-[(e)-4-(4-methylphenyl)hex-3-en-3-yl]benzene Chemical compound C=1C=C(C)C=CC=1C(/CC)=C(\CC)C1=CC=C(C)C=C1 AOSATGCSEIIZPL-FMQUCBEESA-N 0.000 description 1
- WZFUQSJFWNHZHM-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)CC(=O)N1CC2=C(CC1)NN=N2 WZFUQSJFWNHZHM-UHFFFAOYSA-N 0.000 description 1
- 101500000959 Bacillus anthracis Protective antigen PA-20 Proteins 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- 238000006151 Voronkov reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- QABCGOSYZHCPGN-UHFFFAOYSA-N chloro(dimethyl)silicon Chemical compound C[Si](C)Cl QABCGOSYZHCPGN-UHFFFAOYSA-N 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- CWAFVXWRGIEBPL-UHFFFAOYSA-N ethoxysilane Chemical class CCO[SiH3] CWAFVXWRGIEBPL-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 125000004356 hydroxy functional group Chemical group O* 0.000 description 1
- 239000012442 inert solvent Substances 0.000 description 1
- 238000002329 infrared spectrum Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002808 molecular sieve Substances 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920000015 polydiacetylene Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- QQZMDXUEROTLLD-UHFFFAOYSA-N rhodium;triphenylphosphane Chemical compound [Rh].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 QQZMDXUEROTLLD-UHFFFAOYSA-N 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 229910052990 silicon hydride Inorganic materials 0.000 description 1
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000012974 tin catalyst Substances 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001095695A JP2002293991A (ja) | 2001-03-29 | 2001-03-29 | 室温硬化性混成シリコーン |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001095695A JP2002293991A (ja) | 2001-03-29 | 2001-03-29 | 室温硬化性混成シリコーン |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002293991A true JP2002293991A (ja) | 2002-10-09 |
| JP2002293991A5 JP2002293991A5 (https=) | 2006-09-14 |
Family
ID=18949709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001095695A Pending JP2002293991A (ja) | 2001-03-29 | 2001-03-29 | 室温硬化性混成シリコーン |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002293991A (https=) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017160357A (ja) * | 2016-03-10 | 2017-09-14 | 信越化学工業株式会社 | プライマー組成物およびそれを用いた接着結合方法 |
| WO2018139134A1 (ja) * | 2017-01-30 | 2018-08-02 | 信越化学工業株式会社 | 室温硬化性シラン含有樹脂組成物及び実装回路基板 |
| WO2019163330A1 (ja) * | 2018-02-20 | 2019-08-29 | 信越化学工業株式会社 | 有機ケイ素化合物、並びにそれを用いたゴム用配合剤およびゴム組成物 |
-
2001
- 2001-03-29 JP JP2001095695A patent/JP2002293991A/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017160357A (ja) * | 2016-03-10 | 2017-09-14 | 信越化学工業株式会社 | プライマー組成物およびそれを用いた接着結合方法 |
| WO2018139134A1 (ja) * | 2017-01-30 | 2018-08-02 | 信越化学工業株式会社 | 室温硬化性シラン含有樹脂組成物及び実装回路基板 |
| JPWO2018139134A1 (ja) * | 2017-01-30 | 2019-11-07 | 信越化学工業株式会社 | 室温硬化性シラン含有樹脂組成物及び実装回路基板 |
| US11274225B2 (en) | 2017-01-30 | 2022-03-15 | Shin-Etsu Chemical Co., Ltd. | Room temperature-vulcanizing silane-containing resin composition and mounting circuit substrate |
| WO2019163330A1 (ja) * | 2018-02-20 | 2019-08-29 | 信越化学工業株式会社 | 有機ケイ素化合物、並びにそれを用いたゴム用配合剤およびゴム組成物 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4236937B2 (ja) | 熱的に安定で、湿気硬化性のポリシラザン類およびポリシロキサザン類 | |
| US5378734A (en) | UV and moisture-curable organopolysiloxane compositions, cured products therof, and method for making | |
| JPS5826376B2 (ja) | ゴム状に硬化しうるオルガノポリシロキサン組成物 | |
| JP4618451B2 (ja) | トリアジンチオール基及びアルケニル基を有するオルガノポリシロキサン及びその製造方法、並びに当該オルガノポリシロキサンを含有する接着用プライマー組成物 | |
| JPS642626B2 (https=) | ||
| WO2019069706A1 (ja) | 室温硬化性オルガノポリシロキサン組成物の製造方法、室温硬化性オルガノポリシロキサン組成物及び物品 | |
| FR2560203A1 (fr) | Compositions de resines epoxy thermodurcissables comportant comme agent de durcissement un polyorganosiloxane a fonction aminoimidonorbornyle | |
| JP3277749B2 (ja) | シリコーンゲル組成物及びポッティング材 | |
| JPH05179159A (ja) | プライマー組成物及びシリコーン支持体の上塗方法 | |
| JP2002531621A (ja) | 水分の存在下に周囲温度から半透明エラストマーに硬化するオルガノポリシロキサン組成物 | |
| JP4187941B2 (ja) | ホウ素含有ポリオルガノシルセスキオキサン及び接着剤組成物 | |
| US5567752A (en) | Silicon- and nitrogen- containing adhesion promotors and compositions containing them | |
| JP2008512546A (ja) | 無水物官能性シルセスキオキサン樹脂 | |
| JPS6335656A (ja) | 硬化性組成物 | |
| JPS6084375A (ja) | プライマ−組成物 | |
| JPH0711228A (ja) | シリコーン粘着剤組成物、粘着テープ及び粘着方法 | |
| JPH02219885A (ja) | プライマー組成物 | |
| JPS6365228B2 (https=) | ||
| WO2023068094A1 (ja) | 室温硬化性オルガノポリシロキサン組成物、接着剤、シール剤及びコーティング剤 | |
| JP2002293991A (ja) | 室温硬化性混成シリコーン | |
| JP2000086765A (ja) | 有機ケイ素組成物 | |
| JPH0258296B2 (https=) | ||
| WO2022009759A1 (ja) | 二成分型室温速硬化性オルガノポリシロキサン組成物、該組成物の硬化物及び物品 | |
| US6251993B1 (en) | Room temperature curable hybrid silicones | |
| CN120225601A (zh) | 无排放硅橡胶化合物 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060728 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060728 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20081224 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090623 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20091124 |