JP2002286755A - プローブユニットの製造方法 - Google Patents

プローブユニットの製造方法

Info

Publication number
JP2002286755A
JP2002286755A JP2001086267A JP2001086267A JP2002286755A JP 2002286755 A JP2002286755 A JP 2002286755A JP 2001086267 A JP2001086267 A JP 2001086267A JP 2001086267 A JP2001086267 A JP 2001086267A JP 2002286755 A JP2002286755 A JP 2002286755A
Authority
JP
Japan
Prior art keywords
substrate
lead
layer
probe unit
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001086267A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002286755A5 (OSRAM
Inventor
Atsuo Hattori
敦夫 服部
俊▲隆▼ ▲吉▼野
Toshitaka Yoshino
哲丞 ▲浜▼野
Tetsujo Hamano
Masahiro Sugiura
正浩 杉浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Corp
Original Assignee
Yamaha Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Corp filed Critical Yamaha Corp
Priority to JP2001086267A priority Critical patent/JP2002286755A/ja
Priority to US10/099,988 priority patent/US6946375B2/en
Publication of JP2002286755A publication Critical patent/JP2002286755A/ja
Publication of JP2002286755A5 publication Critical patent/JP2002286755A5/ja
Priority to US11/179,659 priority patent/US7087501B2/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2001086267A 2001-03-23 2001-03-23 プローブユニットの製造方法 Pending JP2002286755A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2001086267A JP2002286755A (ja) 2001-03-23 2001-03-23 プローブユニットの製造方法
US10/099,988 US6946375B2 (en) 2001-03-23 2002-03-19 Manufacture of probe unit having lead probes extending beyond edge of substrate
US11/179,659 US7087501B2 (en) 2001-03-23 2005-07-13 Manufacture of probe unit having lead probes extending beyond edge of substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001086267A JP2002286755A (ja) 2001-03-23 2001-03-23 プローブユニットの製造方法

Publications (2)

Publication Number Publication Date
JP2002286755A true JP2002286755A (ja) 2002-10-03
JP2002286755A5 JP2002286755A5 (OSRAM) 2005-06-16

Family

ID=18941674

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001086267A Pending JP2002286755A (ja) 2001-03-23 2001-03-23 プローブユニットの製造方法

Country Status (2)

Country Link
US (2) US6946375B2 (OSRAM)
JP (1) JP2002286755A (OSRAM)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005257677A (ja) * 2004-02-13 2005-09-22 Yamaha Corp プローブユニット及びプローブユニットの製造方法
US7145171B2 (en) 2003-05-01 2006-12-05 Yamaichi Electronics Co., Ltd. Probe unit and its manufacturing method
JP2007003263A (ja) * 2005-06-22 2007-01-11 Yamaha Corp プローブユニットの製造方法及びそれを用いたプローブユニット
JP2007085877A (ja) * 2005-09-22 2007-04-05 Yamaha Corp プローブユニット
US7218131B2 (en) 2004-03-19 2007-05-15 Renesas Technology Corp. Inspection probe, method for preparing the same, and method for inspecting elements
US7559139B2 (en) 2004-06-29 2009-07-14 Yamaha Corporation Method for manufacturing a probe unit
US8312626B2 (en) 2007-09-10 2012-11-20 Yamaichi Electronics Co., Ltd. Manufacturing method for probe contact

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5914613A (en) 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US6256882B1 (en) 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
US6578264B1 (en) 1999-06-04 2003-06-17 Cascade Microtech, Inc. Method for constructing a membrane probe using a depression
US6838890B2 (en) 2000-02-25 2005-01-04 Cascade Microtech, Inc. Membrane probing system
DE20114544U1 (de) 2000-12-04 2002-02-21 Cascade Microtech, Inc., Beaverton, Oreg. Wafersonde
AU2002327490A1 (en) 2001-08-21 2003-06-30 Cascade Microtech, Inc. Membrane probing system
KR100864916B1 (ko) 2002-05-23 2008-10-22 캐스케이드 마이크로테크 인코포레이티드 피시험 디바이스를 테스트하기 위한 프로브
US6724205B1 (en) 2002-11-13 2004-04-20 Cascade Microtech, Inc. Probe for combined signals
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
JP2007517231A (ja) 2003-12-24 2007-06-28 カスケード マイクロテック インコーポレイテッド アクティブ・ウェハプローブ
KR101157449B1 (ko) 2004-07-07 2012-06-22 캐스케이드 마이크로테크 인코포레이티드 멤브레인 서스펜디드 프로브를 구비한 프로브 헤드
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
DE202007018733U1 (de) 2006-06-09 2009-03-26 Cascade Microtech, Inc., Beaverton Messfühler für differentielle Signale mit integrierter Symmetrieschaltung
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
US8410806B2 (en) 2008-11-21 2013-04-02 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3825807A (en) * 1972-02-29 1974-07-23 Eastman Kodak Co High gain barrier layer solid state devices
JPH07199219A (ja) 1993-12-28 1995-08-04 Mitsui Eng & Shipbuild Co Ltd 液晶表示装置検査用プローブカード
JP2599895B2 (ja) * 1994-06-23 1997-04-16 山一電機株式会社 プローブユニットとその製法
JP3554233B2 (ja) * 1998-10-28 2004-08-18 キヤノン株式会社 光プローブの製造方法
US6255126B1 (en) * 1998-12-02 2001-07-03 Formfactor, Inc. Lithographic contact elements
US6511793B1 (en) * 1999-03-24 2003-01-28 Lg Electronics Inc. Method of manufacturing microstructure using photosensitive glass substrate
US6232669B1 (en) * 1999-10-12 2001-05-15 Advantest Corp. Contact structure having silicon finger contactors and total stack-up structure using same
JP2001116678A (ja) * 1999-10-14 2001-04-27 Canon Inc 光照射用または光検出用プローブの製造方法、および光照射用または光検出用プローブ
US6225219B1 (en) * 1999-12-20 2001-05-01 United Microelectronics Corp. Method of stabilizing anti-reflection coating layer
US6362087B1 (en) * 2000-05-05 2002-03-26 Aptos Corporation Method for fabricating a microelectronic fabrication having formed therein a redistribution structure
KR100392956B1 (ko) * 2000-12-30 2003-07-28 엘지전자 주식회사 플라즈마 디스플레이 패널의 격벽 제조방법
US6886395B2 (en) * 2003-01-16 2005-05-03 Veeco Instruments Inc. Method of fabricating a surface probing device and probing device produced thereby

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7145171B2 (en) 2003-05-01 2006-12-05 Yamaichi Electronics Co., Ltd. Probe unit and its manufacturing method
JP2005257677A (ja) * 2004-02-13 2005-09-22 Yamaha Corp プローブユニット及びプローブユニットの製造方法
US7218131B2 (en) 2004-03-19 2007-05-15 Renesas Technology Corp. Inspection probe, method for preparing the same, and method for inspecting elements
US7559139B2 (en) 2004-06-29 2009-07-14 Yamaha Corporation Method for manufacturing a probe unit
JP2007003263A (ja) * 2005-06-22 2007-01-11 Yamaha Corp プローブユニットの製造方法及びそれを用いたプローブユニット
JP2007085877A (ja) * 2005-09-22 2007-04-05 Yamaha Corp プローブユニット
US8312626B2 (en) 2007-09-10 2012-11-20 Yamaichi Electronics Co., Ltd. Manufacturing method for probe contact

Also Published As

Publication number Publication date
US20020137316A1 (en) 2002-09-26
US20050266690A1 (en) 2005-12-01
US7087501B2 (en) 2006-08-08
US6946375B2 (en) 2005-09-20

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