JP2002270616A5 - - Google Patents

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Publication number
JP2002270616A5
JP2002270616A5 JP2002050005A JP2002050005A JP2002270616A5 JP 2002270616 A5 JP2002270616 A5 JP 2002270616A5 JP 2002050005 A JP2002050005 A JP 2002050005A JP 2002050005 A JP2002050005 A JP 2002050005A JP 2002270616 A5 JP2002270616 A5 JP 2002270616A5
Authority
JP
Japan
Prior art keywords
bipolar transistor
heterojunction bipolar
gaassb
layer
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002050005A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002270616A (ja
Filing date
Publication date
Priority claimed from US09/796,299 external-priority patent/US6762480B2/en
Application filed filed Critical
Publication of JP2002270616A publication Critical patent/JP2002270616A/ja
Publication of JP2002270616A5 publication Critical patent/JP2002270616A5/ja
Pending legal-status Critical Current

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JP2002050005A 2001-02-27 2002-02-26 薄いガリウム砒素アンチモン層をベースに用いた利得向上型ヘテロ接合バイポーラトランジスタ及びその製造方法 Pending JP2002270616A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US796299 1997-02-07
US09/796,299 US6762480B2 (en) 2001-02-27 2001-02-27 Thin gallium-arsenide-antimonide base heterojunction bipolar transistor (HBT) having improved gain

Publications (2)

Publication Number Publication Date
JP2002270616A JP2002270616A (ja) 2002-09-20
JP2002270616A5 true JP2002270616A5 (cg-RX-API-DMAC7.html) 2005-08-25

Family

ID=25167855

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002050005A Pending JP2002270616A (ja) 2001-02-27 2002-02-26 薄いガリウム砒素アンチモン層をベースに用いた利得向上型ヘテロ接合バイポーラトランジスタ及びその製造方法

Country Status (3)

Country Link
US (2) US6762480B2 (cg-RX-API-DMAC7.html)
EP (1) EP1237199A3 (cg-RX-API-DMAC7.html)
JP (1) JP2002270616A (cg-RX-API-DMAC7.html)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003009339A2 (en) * 2001-07-20 2003-01-30 Microlink Devices, Inc. Graded base gaassb for high speed gaas hbt
US7295586B2 (en) * 2002-02-21 2007-11-13 Finisar Corporation Carbon doped GaAsSb suitable for use in tunnel junctions of long-wavelength VCSELs
JP2004207583A (ja) 2002-12-26 2004-07-22 Sony Corp 半導体装置
US7242038B2 (en) 2004-07-01 2007-07-10 Nippon Telegraph And Telephone Corporation Heterojunction bipolar transistor
FR2878078B1 (fr) * 2004-11-18 2007-01-19 Cit Alcatel Transistor bipolaire et procede de fabrication de ce transistor
US7038256B1 (en) * 2004-12-03 2006-05-02 Northrop Grumman Corp. Low turn-on voltage, non-electron blocking double HBT structure
US8575659B1 (en) * 2011-08-13 2013-11-05 Hrl Laboratories, Llc Carbon-beryllium combinationally doped semiconductor
JP6240061B2 (ja) * 2014-12-25 2017-11-29 日本電信電話株式会社 ヘテロ接合バイポーラトランジスタおよびその製造方法
JP7597124B2 (ja) * 2020-12-17 2024-12-10 日本電信電話株式会社 ヘテロ接合バイポーラトランジスタ

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US27232A (en) * 1860-02-21 Spring-skate
US4821082A (en) * 1987-10-30 1989-04-11 International Business Machines Corporation Heterojunction bipolar transistor with substantially aligned energy levels
JP2830167B2 (ja) * 1989-09-22 1998-12-02 日本電気株式会社 半導体結晶
JP3210383B2 (ja) * 1992-01-22 2001-09-17 株式会社東芝 ヘテロ接合バイポーラトランジスタ
US5349201A (en) * 1992-05-28 1994-09-20 Hughes Aircraft Company NPN heterojunction bipolar transistor including antimonide base formed on semi-insulating indium phosphide substrate
JPH0783032B2 (ja) * 1993-01-28 1995-09-06 日本電気株式会社 2−6族化合物半導体p形電極構造
EP0715357A1 (en) * 1994-11-30 1996-06-05 Rockwell International Corporation Carbon-doped GaAsSb semiconductor
US5770868A (en) * 1995-11-08 1998-06-23 Martin Marietta Corporation GaAs substrate with compositionally graded AlGaAsSb buffer for fabrication of high-indium fets
DE19640003B4 (de) * 1996-09-27 2005-07-07 Siemens Ag Halbleitervorrichtung und Verfahren zu dessen Herstellung
JP3628873B2 (ja) * 1998-04-28 2005-03-16 富士通株式会社 半導体装置及びその製造方法
JPH11354451A (ja) * 1998-06-05 1999-12-24 Hitachi Ltd 半導体装置
JP3658745B2 (ja) * 1998-08-19 2005-06-08 株式会社ルネサステクノロジ バイポーラトランジスタ
JP2000306920A (ja) * 1999-04-20 2000-11-02 Furukawa Electric Co Ltd:The ヘテロ接合バイポーラトランジスタ及びその作製方法
US6670653B1 (en) 1999-07-30 2003-12-30 Hrl Laboratories, Llc InP collector InGaAsSb base DHBT device and method of forming same
US6251738B1 (en) * 2000-01-10 2001-06-26 International Business Machines Corporation Process for forming a silicon-germanium base of heterojunction bipolar transistor
US6316795B1 (en) * 2000-04-03 2001-11-13 Hrl Laboratories, Llc Silicon-carbon emitter for silicon-germanium heterojunction bipolar transistors

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