JP2002270502A - 光学ビーム案内システムと該システム内に内蔵される光学成分の汚染を防止する方法 - Google Patents

光学ビーム案内システムと該システム内に内蔵される光学成分の汚染を防止する方法

Info

Publication number
JP2002270502A
JP2002270502A JP2002028953A JP2002028953A JP2002270502A JP 2002270502 A JP2002270502 A JP 2002270502A JP 2002028953 A JP2002028953 A JP 2002028953A JP 2002028953 A JP2002028953 A JP 2002028953A JP 2002270502 A JP2002270502 A JP 2002270502A
Authority
JP
Japan
Prior art keywords
beam guiding
layer
barrier layer
optical
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002028953A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002270502A5 (enExample
Inventor
Ansgar Freitag
フライターク アンスガル
Ulrich Bingel
ビンゲル ウルリッヒ
Josef Distl
ディストル ヨセフ
Uwe W Hamm
ヴェー ハム ウーヴェ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Carl Zeiss SMT GmbH
Original Assignee
Carl Zeiss SMT GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Carl Zeiss SMT GmbH filed Critical Carl Zeiss SMT GmbH
Publication of JP2002270502A publication Critical patent/JP2002270502A/ja
Publication of JP2002270502A5 publication Critical patent/JP2002270502A5/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/0006—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 with means to keep optical surfaces clean, e.g. by preventing or removing dirt, stains, contamination, condensation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70983—Optical system protection, e.g. pellicles or removable covers for protection of mask
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S359/00—Optical: systems and elements
    • Y10S359/90—Methods
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Optics & Photonics (AREA)
  • Toxicology (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Lenses (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2002028953A 2001-02-24 2002-02-06 光学ビーム案内システムと該システム内に内蔵される光学成分の汚染を防止する方法 Pending JP2002270502A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10109031.5 2001-02-24
DE2001109031 DE10109031A1 (de) 2001-02-24 2001-02-24 Optisches Strahlführungssystem und Verfahren zur Kontaminationsverhinderung optischer Komponenten hiervon

Publications (2)

Publication Number Publication Date
JP2002270502A true JP2002270502A (ja) 2002-09-20
JP2002270502A5 JP2002270502A5 (enExample) 2005-07-21

Family

ID=7675413

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002028953A Pending JP2002270502A (ja) 2001-02-24 2002-02-06 光学ビーム案内システムと該システム内に内蔵される光学成分の汚染を防止する方法

Country Status (4)

Country Link
US (1) US6824277B2 (enExample)
EP (1) EP1235110A3 (enExample)
JP (1) JP2002270502A (enExample)
DE (1) DE10109031A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7034998B2 (en) 2000-06-21 2006-04-25 Carl Zeiss Smt Ag Method of connecting a multiplicity of optical elements to a basic body
CN109116682A (zh) * 2017-06-23 2019-01-01 中国科学院长春光学精密机械与物理研究所 一种用于调整光学元件位姿的装置及调整方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4689058B2 (ja) * 2001-02-16 2011-05-25 キヤノン株式会社 リニアモータ、ステージ装置および露光装置ならびにデバイス製造方法
EP1452851A1 (en) * 2003-02-24 2004-09-01 ASML Netherlands B.V. Method and device for measuring contamination of a surface of a component of a lithographic apparatus
SG115621A1 (en) * 2003-02-24 2005-10-28 Asml Netherlands Bv Method and device for measuring contamination of a surface of a component of a lithographic apparatus
EP1475668A1 (en) * 2003-05-09 2004-11-10 ASML Netherlands B.V. Method of preparing components for a lithographic apparatus
JP4386807B2 (ja) * 2004-07-29 2009-12-16 富士通コンポーネント株式会社 触覚パネル
WO2010111552A1 (en) * 2009-03-27 2010-09-30 Dh Technologies Development Pte. Ltd. Heated time of flight source

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JPH01221750A (ja) * 1988-02-29 1989-09-05 Hoya Corp パターン形成又は修正方法
JPH10340748A (ja) * 1997-06-06 1998-12-22 Hitachi Chem Co Ltd 回路電極の接続方法
JPH1114876A (ja) * 1997-06-19 1999-01-22 Nikon Corp 光学構造体、その光学構造体を組み込んだ投影露光用光学系及び投影露光装置
WO2000042639A1 (en) * 1999-01-13 2000-07-20 Nikon Corporation Method and apparatus for projection exposure
JP2000277413A (ja) * 1999-03-24 2000-10-06 Canon Inc 露光量制御方法、露光装置およびデバイス製造方法
JP2000315645A (ja) * 1999-04-30 2000-11-14 Nikon Corp 光学部材およびその製造方法、光学装置およびこれを用いた露光装置

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US4111762A (en) * 1975-01-31 1978-09-05 Martin Marietta Corporation Optically black coating and process for forming it
DE3534366A1 (de) * 1985-09-26 1987-04-02 Siemens Ag Verfahren zur unloesbaren befestigung von optischen elementen in einem metallischen traeger sowie haltevorrichtung fuer kugellinsen oder lichtwellenleiter
JPH01114876A (ja) 1987-10-28 1989-05-08 Canon Inc 画像形成装置
US5906688A (en) * 1989-01-11 1999-05-25 Ohmi; Tadahiro Method of forming a passivation film
JPH0222612A (ja) 1988-07-11 1990-01-25 Fujitsu Ltd レンズアセンブリ
US5137767A (en) * 1990-08-29 1992-08-11 Kyocera America, Inc. Partially coated assembly structure and method for making a ceramic lid for hermetic sealing of an eprom circuit
JP3218802B2 (ja) * 1993-05-07 2001-10-15 株式会社神戸製鋼所 半導体製造装置用ステンレス鋼材の表面処理法
US5696623A (en) * 1993-08-05 1997-12-09 Fujitsu Limited UV exposure with elongated service lifetime
BE1007851A3 (nl) * 1993-12-03 1995-11-07 Asml Lithography B V Belichtingseenheid met een voorziening tegen vervuiling van optische componenten en een fotolithografisch apparaat voorzien van een dergelijke belichtingseenheid.
BE1007907A3 (nl) * 1993-12-24 1995-11-14 Asm Lithography Bv Lenzenstelsel met in gasgevulde houder aangebrachte lenselementen en fotolithografisch apparaat voorzien van een dergelijk stelsel.
US5685895A (en) * 1994-08-10 1997-11-11 Nikon Corporation Air cleaning apparatus used for an exposure apparatus
US6014263A (en) * 1998-05-04 2000-01-11 General Electric Company Optical lens and method of preventing clouding thereof at high temperatures
DE19830438A1 (de) * 1998-07-08 2000-01-13 Zeiss Carl Fa Verfahren zur Dekontamination von Mikrolithographie-Projektionsbelichtungsanlagen
US6520650B2 (en) * 1999-02-08 2003-02-18 Valeo Sylvania L.C.C. Lamp reflector with a barrier coating of a plasma polymer
JP2001110710A (ja) * 1999-10-08 2001-04-20 Nikon Corp 露光装置、露光方法、および半導体デバイスの製造方法
KR100345320B1 (ko) * 1999-12-23 2002-07-24 학교법인 포항공과대학교 스테인레스 스틸 표면상에 크롬산화막을 형성하는 방법
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US6555234B1 (en) * 2001-02-01 2003-04-29 Advanced Micro Devices, Inc. Barrier for and a method of reducing outgassing from a photoresist material

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JPH01221750A (ja) * 1988-02-29 1989-09-05 Hoya Corp パターン形成又は修正方法
JPH10340748A (ja) * 1997-06-06 1998-12-22 Hitachi Chem Co Ltd 回路電極の接続方法
JPH1114876A (ja) * 1997-06-19 1999-01-22 Nikon Corp 光学構造体、その光学構造体を組み込んだ投影露光用光学系及び投影露光装置
WO2000042639A1 (en) * 1999-01-13 2000-07-20 Nikon Corporation Method and apparatus for projection exposure
JP2000277413A (ja) * 1999-03-24 2000-10-06 Canon Inc 露光量制御方法、露光装置およびデバイス製造方法
JP2000315645A (ja) * 1999-04-30 2000-11-14 Nikon Corp 光学部材およびその製造方法、光学装置およびこれを用いた露光装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7034998B2 (en) 2000-06-21 2006-04-25 Carl Zeiss Smt Ag Method of connecting a multiplicity of optical elements to a basic body
CN109116682A (zh) * 2017-06-23 2019-01-01 中国科学院长春光学精密机械与物理研究所 一种用于调整光学元件位姿的装置及调整方法

Also Published As

Publication number Publication date
US6824277B2 (en) 2004-11-30
EP1235110A3 (de) 2004-02-18
US20020145808A1 (en) 2002-10-10
EP1235110A2 (de) 2002-08-28
DE10109031A1 (de) 2002-09-05

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