JP2002270411A - Laser trimming unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laser trimming unit which never deteriorates the precision of measurement due to dust generated when trimming and has high production efficiency. SOLUTION: A main transfer table 21 which holds electronic parts W and transfers them along a main transfer route while rotating, an auxiliary transfer table 31 which holds electronic parts W and transfers them along an auxiliary transfer route while rotating, a linear feeder 23 which feeds the electronic parts W, a taping unit 28 which takes out the electronic parts W, a first characteristic measuring unit 24 which measures the characteristics of the electronic parts W, a second characteristic measuring unit 26 which measures the characteristics of the electronic parts W, a laser trimming mechanism 40 which cut off the prescribed part of the electronic part W on the basis of a measurement result by the first characteristic measuring unit 24, and a dust collector 41 which removes dust that is generated when the composition material of the parts W is vaporized by the laser trimming mechanism 40 and solidified.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser trimming apparatus for trimming a predetermined portion with a laser beam while transporting an electronic component, and more particularly to minimizing the influence of dust generated by the trimming process. Regarding what can be suppressed.

[0002]

2. Description of the Related Art A laser trimming apparatus performs processing such as partial cutting or partial removal of an electronic component by utilizing the power of a laser beam (hereinafter, referred to as "trimming") to adjust the characteristics of the component. It is. For example, adjustment of a chip-shaped electronic component, that is, adjustment of inductance and resistance of a high-frequency coil is performed by trimming using laser light while measuring characteristics. However, since the trimming process using laser light is performed by evaporating the composition material of the parts, the amount of diffusion of the vaporized material becomes several thousand times or more the original volume, which is cooled and condensed in the air. And the dust adheres to the surroundings. For this reason, if there is a measuring device nearby, the optical system becomes dirty and it is difficult to detect it, and the electrical contacts become dirty and contact failures often occur. Was.

[0003]

The conventional laser trimming apparatus described above has the following problems. In other words, since the measurement of the characteristics of the electronic components and the trimming process are performed by separate devices, dust due to evaporation of the material adheres to peripheral devices, lowering production efficiency, and a large space for installing the devices. There was a problem that needed.

Accordingly, an object of the present invention is to provide a laser trimming apparatus which does not lower the measurement accuracy due to dust generated by the trimming process and has high production efficiency.

[0005]

In order to solve the above-mentioned problems and achieve the object, a laser trimming apparatus according to the present invention is configured as follows.

(1) In a laser trimming apparatus for cutting a predetermined portion of an electronic component, a main transport means for holding the electronic component and transporting the same electronically along a main transport route, and provided adjacent to the main transport route. A sub-transporting unit that holds the electronic component and conveys the electronic component around the sub-transport route; an electronic component supply unit that is provided in the main transport route and supplies the electronic component to the main transport unit; An electronic component unloading means provided to unload the electronic component from the main transport means, and an electronic component unloading means provided between the electronic component supply means and the electronic component unloading means on the main transport path; An electronic component transfer unit that transfers the electronic component to and from a transfer unit; and an electronic component transfer unit that is provided between the electronic component supply unit and the electronic component transfer unit in the main transfer path. First characteristic measuring means for measuring the property, second characteristic measuring means provided between the electronic component transferring means and the electronic component unloading means on the main transport path, and measuring characteristics of the electronic component; A laser trimming means provided on the sub-transport path for cutting off a predetermined portion of the electronic component based on a measurement result by the first characteristic measuring means.

(2) In the laser trimming apparatus described in the above (1), the main transport means includes a rotary table having an electronic component holding means for holding the electronic component on an outer periphery thereof. Features.

(3) In the laser trimming apparatus described in (1), the sub-transporting means includes a rotary table having an electronic component holding means for holding the electronic component on an outer periphery thereof. Features.

(4) In the laser trimming device described in (2), the electronic component holding means of the main transport means is a suction mechanism for suctioning a predetermined suction surface of the electronic component. Features.

(5) In the laser trimming apparatus described in (4), the electronic component holding means of the sub-transporting means may include a surface other than a surface to be sucked of the electronic component by the suction mechanism. , Two opposite surfaces are held.

(6) The laser trimming device according to the above (1), wherein the second portion on the main transport path is provided.
An electronic component discharging unit that discharges the electronic component from the main transport unit based on a measurement result by the second specific measuring unit is provided between the characteristic measuring unit and the electronic component unloading unit. I do.

(7) The laser trimming apparatus according to the above (1), further comprising a removing means provided on the sub-transport path for removing dust of the electronic component cut by the laser trimming means. It is characterized by the following.

[0013]

FIG. 1 is a plan view showing a laser trimming device 10 according to an embodiment of the present invention, FIG. 2 is an explanatory diagram showing a suction method of a suction portion 22 incorporated in the laser trimming device 10, FIG. 3 is a cross-sectional view showing a main part of the sub-carrying table 31 incorporated in the laser trimming device 10. In the drawings, W indicates an electronic component, Wa indicates a lower surface, and Wb indicates an upper surface. An electrode Wc is formed on the lower surface Wa. The upper surface Wb is a surface to be attracted, and is trimmed by a laser trimming mechanism 40 described later. Further, Wd indicates a side surface of the electronic component W.

The laser trimming device 10 includes an electronic component W
A main transport unit 20 that supplies, measures, and discharges the data, and a sub transport unit 30 that performs trimming.

The main transport section 20 has a main transport table 21 which rotates intermittently in the direction of arrow R in FIG. At the outer edge of the main transfer table 21, a suction unit 22 that suction-holds the upper surface Wb of the electronic component W along the circumferential direction is provided.
The suction unit 22 includes a suction nozzle 22a as shown in FIG. 2, and the suction nozzle 22a is connected to a suction device (not shown). A linear feeder (electronic component supply means) 23 for supplying the electronic component W clockwise from the left end in FIG. Device 24, sub-transport unit 30
A transfer unit 25 for transferring an electronic component W between the electronic component W
Characteristic measuring device 26 for measuring the electrical characteristics of the device, a discharge tray (component discharging means) 2 for discharging a defective electronic component W
7. A taping device (electronic component unloading means) 28 for storing the electronic component W in the storage recess of the carrier tape C.

The sub-transport section 30 has a sub-transport table 31 which rotates in the direction of arrow r in FIG. A gripping mechanism 32 that grips the side surface Wd of the electronic component W along the circumferential direction is provided at the outer edge of the sub-transport table 31. As shown in FIG. 3, the gripping mechanism 32 is fixedly attached to the sub-transport table 31 and is attached to the sub-transport table 31 via a fixing portion 34 so as to be rotatable around the rotation axis S. And the movable gripping piece 35
3 and a push-up mechanism 37 that pushes up the drive end 35b of the movable gripping piece 35.

A laser trimming mechanism 4 for cutting off the upper surface Wb of the electronic component W is provided on the outer periphery of the sub-transport table 31.
0 and a dust suction device 41 are arranged.

In the laser trimming device 10 configured as described above, the electronic component W is trimmed as follows. That is, the upper surface Wb of the electronic component W sequentially conveyed by the linear feeder 23 is
Adsorbed by 2a. Next, the electronic component W is transported to the first characteristic measuring device 24 by the main transport table 31. In the first characteristic measuring device 24, a measurement terminal (not shown) is brought into contact with the electrode Wc of the electronic component W to measure the characteristic. After the measurement is completed, the electronic component W is transported to the transfer unit 25.

In the transfer section 25, the push-up mechanism 37 of the sub-transport section 30 operates, and the working end 35a of the movable gripping piece 35 points to the arrow α.
In the opposite direction, and a gap is generated between the fixed gripping piece 33. On the other hand, when the electronic component W reaches the transfer unit 25 and the electronic component W is positioned in the gap, the suction of the electronic component W by the suction unit 22 is stopped. Subsequently, the operation of the lifting mechanism 37 is completed, and the operating end 35a of the movable gripping piece 35 sandwiches and holds the electronic component W between the movable gripping piece 35 and the fixed gripping piece 33 by the bias of the spring 36.

Next, the sub-transport table 31 transports the electronic component W to the laser trimming mechanism 40. The laser trimming mechanism 40 performs a predetermined amount of trimming based on the characteristics of the electronic component W measured by the first characteristic measuring device 24. After the trimming process, the composition material that has been partially cut or partially removed from the electronic component W evaporates and then cools and becomes fine dust. As a result, the dust does not affect the main transport unit 20 side.

After the completion of the trimming, the sub-transport table 3
1 transports the electronic component W to the transfer unit 25. Push-up mechanism 3
7, the working end 35a of the movable gripping piece 35 moves in the direction opposite to the direction of the arrow α, and the gripping of the electronic component W between the movable gripping piece 35 and the fixed gripping piece 33 is released. Then, the electronic component W is sucked again by the suction unit 22. Next, the electronic component W is transported to the second characteristic measuring device 26 by the main transport table 31. In the second characteristic measuring device 26, the electrode Wc of the electronic component W
To a measurement terminal (not shown) to measure the characteristics. At this time, if the characteristic is within the allowable range, the product is determined to be good, and if the characteristic is out of the allowable range, it is determined to be defective. After the completion of the measurement, the electronic component W determined to be defective is transported to a position above the discharge tray (component discharge means) 27, and the suction of the suction unit 22 is released. Then, the sheet is stored in the discharge tray 27.

On the other hand, after the measurement is completed, the electronic component W determined to be non-defective is transported to the taping device 28 and stored in the storage recess of the carrier tape C.

As described above, according to the laser trimming apparatus 10 according to the present embodiment, the sub-conveying section 30 processes the finely divided dust generated during trimming.
The influence of dust on the main transport unit 20 side can be minimized, and the measurement by the first characteristic measuring device 24 and the second characteristic measuring device 26 is not affected. In addition, since the inspection / measurement and the laser processing are performed by the same device, the production efficiency can be improved, and the space for installing the device can be reduced.

The present invention is not limited to the above embodiment. That is, in the above-described embodiment,
Although a rotary table is used as the main transport unit and the sub-transport unit, it may be a unit that transports components linearly, such as a conveyor. In addition, methods such as suction and gripping are used as the holding means, but are not limited to these holding methods. In addition, it goes without saying that various modifications can be made without departing from the spirit of the present invention.

[0025]

According to the present invention, measurement accuracy is not reduced by dust generated by trimming.
In addition, it is possible to provide a laser trimming device that has high production efficiency and can reduce the installation space of the device.

[Brief description of the drawings]

FIG. 1 is a plan view showing a laser trimming device according to one embodiment of the present invention.

FIG. 2 is a sectional view showing a suction unit incorporated in the laser trimming apparatus.

FIG. 3 is a sectional view showing a main part of a sub-transport table incorporated in the laser trimming apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Laser trimming apparatus 20 ... Main conveyance part 21 ... Main conveyance table 22 ... Suction part 23 ... Linear feeder (electronic component supply means) 24 ... 1st characteristic measuring device 25 ... Transfer part 26 ... 2nd characteristic measuring device 27 ... Discharge tray (component discharge means) 28 taping device (electronic component unloading means) 30 sub-transport section 31 sub-transport table 32 gripping mechanism 40 laser trimming mechanism

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (reference) // B23K 101: 36 H01C 17/24 L

Claims (7)

[Claims] 1. A laser trimming apparatus for cutting a predetermined portion of an electronic component, comprising: main transport means for holding the electronic component and transporting the same electronically along a main transport route; provided adjacent to the main transport route; A sub-transporting unit that holds the electronic component and conveys it around the sub-transport route; an electronic component supply unit that is provided in the main transport route and supplies the electronic component to the main transport unit; An electronic component unloading unit provided for unloading the electronic component from the main transport unit; and an electronic component unloading unit provided between the electronic component supply unit and the electronic component unloading unit on the main transport path, wherein the main transport unit and the sub-transport are provided. Electronic component transfer means for transferring the electronic component between the electronic component supply means and the electronic component transfer means on the main transport path; A first characteristic measuring means for measuring a characteristic of the electronic component, the second characteristic measuring means being provided between the electronic component transferring means and the electronic component unloading means on the main transport path, and measuring characteristics of the electronic component; A laser trimming device provided on a sub-transport path for cutting off a predetermined portion of the electronic component based on a measurement result by the first characteristic measuring device. 2. A laser trimming apparatus according to claim 1, wherein said main transport means includes a rotary table having an electronic component holding means for holding said electronic component on an outer periphery thereof. 3. The laser trimming apparatus according to claim 1, wherein said sub-transporting means includes a rotary table having an electronic component holding means for holding said electronic component on an outer periphery thereof. 4. The laser trimming device according to claim 2, wherein said electronic component holding means of said main transport means is a suction mechanism for sucking a predetermined suction surface of said electronic component. 5. The electronic component holding means of the sub-transporting means holds two opposing surfaces out of surfaces other than a surface to be sucked of the electronic component by the suction mechanism. 3. The laser trimming device according to claim 1. 6. The electronic component is discharged from the main transport unit between the second characteristic measuring unit and the electronic component unloading unit on the main transport path based on a measurement result by the second specific measuring unit. 2. The laser trimming device according to claim 1, further comprising an electronic component discharging unit. 7. The laser trimming device according to claim 1, further comprising: a removing unit provided on the sub-conveying path to remove dust of the electronic component cut by the laser trimming unit.