JP2002255167A - Electronic part package and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase the adhesion of both packaging materials even if a polishing treatment on the bonding surfaces of both packaging materials is eliminated. SOLUTION: This electronic part package is equipped with the first and second packaging materials 12 and 14, and a bonding material 16. In this case, the first and second packaging materials 12 and 14 are bonded to each other, and constitute an electronic part housing space 26 inside. The bonding material 16 bonds the bonding surfaces of both packaging materials 12 and 14 to each other, and seals the electronic part housing space 26. The second packaging material 14 includes a shape retaining section 14a to retain the shape, and a flexible layer 14b which is laminated on the shape retaining section 14a and has flexibility to deform by pressurization. Then, in the flexible layer 14b, the surface on the opposite side from the side facing to the shape retaining section 14a is made the bonding surface to the first packaging material 12.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component package suitable for accommodating electronic components therein and a method of manufacturing the same.

[0002]

2. Description of the Related Art As an electronic component package, first and second package materials which are joined to each other to form an electronic component accommodation space therein, and a joint surface of both package materials are joined to form an electronic component accommodation space. The one provided with a bonding material to be sealed is well known.

In such an electronic component package, the thickness of the joining material is made as thin as possible to enhance the adhesion between the two package materials, thereby suppressing the invasion of moisture under high temperature and high pressure into the inside, and sealing the package. It is designed to improve stopping performance.

[0004] More specifically, a required hermetic sealing property is obtained by suppressing the thickness of the joining material between the joining surfaces of both package materials to 20 µm or less. In this case, an adhesive such as an epoxy resin as a bonding material contains a fine powder of SiO ₂ as an inorganic filler at a ratio of 50 to 60%.

[0005]

By the way, in the production of the above electronic component package, if the package material is made of alumina or resin and the joint surface thereof has low smoothness and has unevenness, Since the thickness of the bonding material cannot be reduced below the size of the concavities and convexities, bonding both package materials as they are has a limit in achieving hermetic sealing against moisture intrusion into the electronic component housing space. .

[0006] Therefore, conventionally, the joining surfaces are subjected to a treatment such as polishing so as to eliminate irregularities, so as to improve the smoothness of the joining surfaces and then join them together, thereby reducing the thickness of the joining material. That was being done.

However, such a polishing process takes a long time, which causes a reduction in mass productivity of electronic component packages and an increase in manufacturing cost.

[0008] Therefore, the present invention provides a method for polishing a bonding surface of a package material without polishing or the like.
In addition, even if the joining surface has low smoothness and unevenness is present, the thickness of the joining material is reduced so that the adhesion between the two package materials can be increased, so that the above-described processing can be omitted to improve mass productivity and manufacture of the electronic component package. Making cost reduction possible is a common issue to be solved.

[0009]

A first electronic component package according to the present invention includes first and second package members which are joined together to form an electronic component accommodating space therein, and a joining surface between the two package members. And a joining material for sealing the electronic component accommodating space by joining the first and second package materials, wherein a joining surface of at least one of the package materials is deformed by joining to a joining surface of the other package material. It is characterized by having.

A second electronic component package according to the present invention is characterized in that the first and second package materials which are joined to each other to form an electronic component accommodation space therein, and the joining surfaces of the two package materials are joined to each other to form the electronic component. An electronic component package comprising a joining material for sealing a component accommodating space, wherein the second package material has a shape holding portion for holding its shape, and at least a bonding surface for the shape holding portion. And a flexible layer which is provided on the side and is deformed by a pressure applied at the time of joining to the joining surface of the first package material.

According to the first or second aspect of the present invention, since the flexible layer of at least one package material serves as a bonding surface and is bonded to the bonding surface of the other package material, the bonding of one or the other package material is performed. Even if unevenness is present on the surface and the smoothness is low, the flexible layer of one package material is deformed and joined according to the unevenness on the joint surface of the other package material with the joining material therebetween, and as a result, In addition, the joining material joins both joining surfaces along the irregularities, and the thickness becomes extremely thin. Even if the bonding surfaces of both package materials are both soft, the unevenness of the surface is crushed by pressing, and the bonding surfaces of each other become flat, so that both bonding surfaces are bonded. Becomes extremely thin.

Therefore, in the case of the first or second aspect of the present invention, the adhesion between the two package materials can be increased only by applying pressure when the two package materials are joined while leaving the unevenness of the joint surface of the package material as it is. Unlike the conventional case, the above-described polishing process can be omitted, and the mass productivity of the electronic component package can be improved and the manufacturing cost can be reduced.

[0013] In the third case of the present invention, when the shape holding portion is flat, if the flexible layer is provided on both sides of the shape holding portion, both surfaces of the second package material are bonded to each other. Therefore, it is not necessary to identify the joining surface of the second package material, and the assembly of the two package materials is facilitated, which is preferable.

In the above case, if the joining material is made of a resin-based adhesive, it can overcome the drawback of the resin-based adhesive, that is, the ease of infiltration of moisture, while taking advantage of its advantage, that is, the ease of processing. It is possible to further improve the mass productivity and reduce the manufacturing cost of the electronic component package.

As a result of the above, the thickness of the joining material can be set to the extent that it conforms to the unevenness of the joining surface of the other package material. Small gaps are likely to occur.

Therefore, as a further preferred embodiment of the present invention, the shape retaining portion of the second package material is provided with the same thermal expansion coefficient as that of the first package material or the first thermal expansion coefficient of the flexible layer. If the package material has a coefficient of thermal expansion close to that of the package material, the two package materials will also undergo thermal expansion even at high temperatures, so that a small gap will not easily occur between the joint surface and the joint material. This is preferable because the adhesion between the two package materials can be maintained even below.

In this case, while the shape holding portion of the second package material is made of a metal or an alloy, while the flexible layer is made of metal and provided on the shape holding portion by cladding, laminating, vapor deposition, or sputtering, the flexible layer is made of a metal. Hardness is low, that is, flexibility can be preferably maintained. This can reduce the Vickers hardness (Hv) as compared with the case where the flexible layer is provided on the shape holding portion by electrolytic or electroless plating.

[0018] The shape holding portion is made of nickel having a nickel content of 40 to 40%.
When the soft layer is made of nickel and the metal of the soft layer is made of nickel, the soft layer can be satisfactorily blended and adhered to the shape holding portion, and is generally made of alumina or the like. Since the shape holding portion is almost similar in the coefficient of thermal expansion to the other package material to be formed, the two package materials joined to each other may have a gap in the joint surface due to a temperature change or a decrease in joint strength. Problems can be avoided.

In the method of manufacturing an electronic component package according to the present invention, the first and second package materials which are joined to each other to form an electronic component housing space therein, and the joining surfaces of the two package materials are joined to each other. A method of manufacturing an electronic component package comprising: a bonding material that seals an electronic component storage space, wherein a bonding surface of at least one package material is deformed by bonding to a bonding surface of the other package material; A first step of interposing a bonding material between the bonding surfaces of the two package materials,
A second step of deforming the flexible bonding surface by applying a required pressing force to bond the bonding surface of one package material to the bonding surface of the other package material.

According to the method for manufacturing an electronic component package of the present invention, since the flexible layer of one package material can be used as a bonding surface and bonded to the bonding surface of the other package material, the bonding surface of the other package material has irregularities. An electronic component package in which the flexible layer of one package material can be deformed and bonded in accordance with the unevenness of the bonding material with the bonding material in between, and the thickness of the bonding material can be extremely thin even if it is present and has low smoothness. Is obtained.

Thus, it is possible to manufacture an electronic component package in which the adhesion between the two package materials is enhanced while leaving the unevenness of the bonding surface of the package material as it is. By eliminating the polishing process, it is possible to improve the mass productivity of electronic component packages and reduce the manufacturing cost.

In this manufacturing method, in a package material manufacturing step prior to the first step, at least one of the two package materials is provided with a shape holding portion for holding the shape, and a flexible joint surface. You may make it obtain by laminating | stacking the surface layer made.

In the package material manufacturing process, at least one of the package materials is replaced with
A surface layer serving as a flexible bonding surface may be laminated on the shape holding portion by cladding or laminating, vapor deposition, or sputtering.

[0024]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The details of the present invention will be described below based on embodiments shown in the drawings.

1 and 2 relate to an embodiment of the present invention. FIG. 1 is an exploded cross-sectional view showing an electronic component package according to the present embodiment. FIG. It is sectional drawing seen from the front.

Referring to FIGS. 1 and 2, an electronic component package 10 according to the present embodiment includes a first package material 12 and
A second package member 14 and a bonding member 16 are provided.

It should be noted that, in FIG.
Are exaggerated for ease of understanding.

The first package material 12 has a box shape having an opening 20 and has, for example, S
An electronic component 24 requiring high airtightness, such as an AW filter or a crystal oscillator, is mounted.

The first package material 12 is preferably made of metal or ceramics in terms of moisture resistance, and among them, alumina (aluminum oxide) is more preferable in terms of cost and thermal conductivity. In this case, the first package member 12 may be made of resin. Examples of the resin include orthocresol novolak, phenol novolak, and naphthalene epoxy.

Alumina is better than resin if importance is placed on moisture resistance, but resin may be used if priority is given to cost and productivity. Even in such a case, it is necessary to reduce the thickness of the bonding material in order to prevent moisture from entering as much as possible.

The second package member 14 has a plate-like lid, and is joined to the joint surface 18 of the first package member 12 so as to close the opening 20 of the first package member 12, so that the electronic components are interposed between each other. The component housing space 26 is configured.

Next, in the case of the present embodiment, the second package member 14 includes a shape holding portion 14a for holding a shape,
It is characterized by comprising a flexible layer 14b laminated on both sides of the shape holding portion 14a and having flexibility deformable by pressure.

The shape holding portion 14a is provided with the first package material 1
In the case where 2 is made of alumina, it is preferable to be made of a nickel alloy having a thermal expansion coefficient close to that of this alumina. 40% by weight of nickel as this nickel alloy
To 55% by weight of a nickel-iron alloy is preferred.

The thermal expansion coefficient of alumina is 7 ppm, while the thermal expansion coefficient of the main nickel-iron alloy is as shown in the table of FIG.

The flexible layer 14b is made of a metal, preferably pure nickel, having the flexibility of being plastically deformed by the pressure applied to the bonding surface of the second package material 12 at the time of bonding. Alternatively, it is provided by lamination, vapor deposition, or sputtering.

By providing the flexible layers 14 b on both sides of the shape holding portion 14 a, the bonding surface 28 (the surface of one flexible layer 14 b) of the second package 14 is bonded to the bonding surface 18 of the first package 12. There is no need to identify the joining direction, and the workability at the time of joining can be improved. Of course, the flexible layer 14b may be provided only on one side of the shape holding portion 14a.

In this case, the hardness of the flexible layer 14b is 60 in Vickers hardness (Hv). On the other hand, as shown in Japanese Patent Application Laid-Open No. H11-176969, there is a conventional technique in which nickel is electroplated or electrolessly plated on a nickel alloy, but nickel hardness in electrolytic plating is Vickers hardness ( Hv) is 200 to 250, and the hardness of nickel in electroless plating is 450 to 550 in Vickers hardness (Hv).

Therefore, as in the present embodiment, the flexible layer 1
In the case where 4b is provided on the shape holding portion 14a by cladding, lamination, vapor deposition, or sputtering, the Vickers hardness (Hv) is sufficiently small and the flexibility is high as compared with the case where the 4b is provided by electrolytic plating or electroless plating. Has become.

The clad is a method in which two or more metal materials are brought into close contact with each other and the entire contact surface is metallurgically bonded. Methods of metallurgical bonding include rolling, extrusion, and explosive welding. is there.

The joining material 16 is preferably made of a resin-based adhesive, more preferably an epoxy resin-based adhesive. When the bonding material 16 is made of a resin-based adhesive, there is a drawback that moisture easily penetrates, but the thickness is reduced to cover the drawback, and the advantage of its workability is utilized.

When a resin is used as the bonding material, the ease with which moisture invades is inversely proportional to the length of the invasion path and proportional to the cross-sectional area. Therefore, a resin whose moisture resistance is improved by reducing the thickness of the bonding material is most effective, and an example thereof is an epoxy resin. However, it is not limited to the epoxy resin, and another resin material may be used as the bonding material.

The electronic component package 10 of the present embodiment and the conventional electronic component package 30 will be specifically described with reference to FIGS. 2 and 3. FIG. In the conventional electronic component package 30 shown in FIG.
The first package material, 34 is the second package material, 35
Is an electronic component to be stored, and 36 is a bonding material. Unlike the second embodiment, the second package material 14 has no flexible layer and has a single-layer structure.

Conventionally, at least the bonding surface of the second package material 34 is made a smooth surface which has been polished in advance so that the surface thereof has no irregularities, and the second package material 32 is 34 were joined via a joining material 36. The presence of this polishing process has conventionally taken a lot of trouble in manufacturing and has caused a cost increase. In addition, since the vertical height of the unevenness of the bonding surface of the first package material 32 is about 10 μm, and the thickness of the bonding material is about 4 μm, the substantial thickness of the bonding layer becomes 14 μm and sufficient moisture permeability is obtained. The joining layer could not be made thin enough to be suppressed.

On the other hand, in the present invention, the polishing step can be omitted. In the present invention, the bonding surface of the second package 14 is also deformed according to the unevenness of the bonding surface of the first package material 12 due to the pressure when the second package 14 is bonded to the first package material 12. Then, the joining layer becomes labyrinth-like in accordance with the shape of the unevenness of the joining surface, so that the length of the moisture-permeable path through the joining layer between the electronic component housing and the outside becomes longer, and the joining layer The thickness is also as thin as the thickness of the bonding material, specifically, 4 μm corresponding to the above-described conventional example, which is advantageous in terms of moisture resistance.

The electronic component package 1 according to the present invention
0 of the second package material 14 is a flat shape holding portion 14.
Since the flexible layers 14b and 14b are stacked on the substrate a, the shape holding portion 14a is a base material that supports the flexible layers 14b and 14b. Since the coefficient of thermal expansion of the shape holding portion 14a is close to the coefficient of thermal expansion of the first package material 12, the first package material 12 and the second package material 14 expand or contract to the same degree with respect to a temperature change. Therefore, it is possible to suppress the occurrence of cracks at the joints, so that the airtightness is not unduly reduced. In addition, when the coefficient of thermal expansion of the shape retention layer of the second package material is close to that of the first package material, the second package material may be a single layer.

Next, a method for manufacturing an electronic component package according to the present invention will be described.

The second package material 14 is previously coated with pure nickel (flexible layer) having a thickness of 10 μm on both surfaces of a single plate (thickness 0.1 mm) (shape holding portion) of a nickel-iron alloy containing 50% by weight of nickel. ) Are laminated by cladding or bonding to form a lid having a three-layer structure (package material manufacturing process).

Then, an epoxy resin-based bonding material is applied to the bonding surface of the first package material 12 made of alumina (the opening of the cavity is 3.0 mm × 3.0 mm, the width of the bonding portion is 0.4 mm), and dried. After processing, an electronic component element such as a surface acoustic wave element is mounted and installed in the cavity, and the second package member 14 is positioned and mounted in an open sealing state (first step).

Next, in a high-temperature environment suitable for thermosetting of the bonding material adhesive, a required pressure (10 P) is applied to the first package material 12 and the second package material 14 in the direction in which they are overlapped.
In addition to (a), the joint surface of the pure nickel in the second package member 14 is plastically deformed according to the unevenness of the joint surface of the first package member 14, and the joint is performed with the joint member (second step).

In the case of the package material of the above embodiment, the pressure for joining is preferably 5 Pa or more.

The present invention is not limited to the above embodiment, and various applications and modifications are possible.

(1) In the above-described embodiment, the first package material 12 has a box shape and the second package material 14 has a lid shape. However, the present invention is not limited to this. As shown in FIG. 4, the second package member 14 may be an electronic component package having a shape similar to that of the first package member 12, or, as shown in FIG. The present invention can be similarly applied to an electronic component package in which the material 12 has a flat plate shape, the second package material 14 has a box shape, and electronic components are mounted on the first package material 12.

In FIGS. 4 and 5, parts similar or corresponding to those in FIGS. 1 to 3 are denoted by the same reference numerals.

(2) In the case of the above embodiment, the flexible layer 14
Although b is provided only on the second package material 14 side, a flexible layer 14b may be provided also on the first package material 12 side. Flexible layers 14b for both package materials 12 and 14 respectively
Is provided, the unevenness of the bonding surface of each of the package materials 12 and 14 is crushed so as to be reduced by pressing, so that the height of the unevenness of the bonding surface in the bonded state can be reduced, and the bonding layer The thickness can be made thin so that the airtightness is high.

(3) The shape holding portion 14a of the second package material 14 of the above-described embodiment is a nickel-iron alloy, but is not limited to this, and may be made of only metal. . As this metal, for example, NiF
eCr (Kovar), stainless steel, nickel silver, phosphor bronze, and the like.

As the metal, a nickel-iron alloy (particularly a nickel content of 40 to 5) is used in order to match the thermal expansion coefficient with the first package material 12 made of alumina.
5%) is preferred.

The material constituting the flexible layer 14b includes, for example, pure nickel, gold, silver, aluminum, copper, iron and the like.

Further, the shape holding portion 14a, the flexible layer 14b,
The first package member 12 may be made of plastic.

Examples of the joining material include metal brazing material such as solder, glass, and resin.

As for the combination of the materials of the first package material and the second package material with respect to the coefficient of thermal expansion, as described above, in addition to the combination of alumina and a nickel-iron alloy, for example, glass epoxy resin and nickel silver And the like.

When the first package material and the second package material are made of a resin material, respectively, the first package material and the shape holding portion of the second package material are formed in order to make their thermal expansion coefficients close to each other. Are preferably made of the same resin.

[0062]

As described above, according to the present invention,
Since the bonding surface of at least one of the package materials has flexibility to be deformed by pressure, even if unevenness is present on the bonding surface of the other package material and the smoothness is low,
As a result of the flexible layer of one package material being deformed and joined corresponding to the irregularities with the joining material interposed therebetween, the joining material joins both joining surfaces along the irregularities, and the thickness becomes extremely thin.

Therefore, in the case of the present invention, the adhesion between the two package materials can be enhanced while the unevenness of the bonding surface of the package material is left as it is, so that the above-mentioned polishing treatment can be omitted unlike the conventional case. Thus, it is possible to improve the mass productivity of electronic component packages and reduce the manufacturing cost.

[Brief description of the drawings]

FIG. 1 is an exploded front view showing an electronic component package according to an embodiment of the present invention.

FIG. 2 is a sectional view of the electronic component package of FIG.

FIG. 3 is a cross-sectional view of a conventional electronic component package as viewed from the front.

FIG. 4 is a cross-sectional view of an electronic component package according to another embodiment of the present invention as viewed from the front.

FIG. 5 is a cross-sectional view of an electronic component package according to still another embodiment of the present invention as viewed from the front.

FIG. 6 is a table showing approximate thermal expansion coefficients corresponding to nickel contents in a nickel-iron alloy.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Electronic component package 12 1st package material 14 2nd package material 14a Shape holding | maintenance part 14b Flexible layer 16 Joining material 26 Electronic component accommodation space

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification FI FI Theme Court ゛ (Reference) H01L 23/10 B65D 85/38 D (72) Inventor Kei Hachinohe 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto, Kyoto Prefecture F-term in Murata Manufacturing Co., Ltd. (reference) 3E061 AA01 AB13 AC07 AD05 DB01 3E096 AA01 BA08 CA02 DA14 DA17 DB07 DC01 EA11X EA11Y FA30 FA31 GA07 GA11

Claims (9)

[Claims] 1. A first and a second package material which are joined to each other to form an electronic component housing space therein, and a joint which seals the electronic component housing space by joining the joining surfaces of the two package materials to each other. An electronic component package comprising: an electronic component package having at least one package material having flexibility to be deformed by joining to a joint surface of the other package material. . 2. A first and a second package material which are joined to each other to form an electronic component housing space therein, and a joint for joining the joining surfaces of the two package materials to seal the electronic component housing space. An electronic component package comprising: a second package material, wherein the second package material is provided on a bonding surface side with respect to at least a shape holding portion for holding the shape thereof, and the first package material is provided with the first package material; An electronic component package, comprising: a flexible layer that is deformed by a pressure applied during bonding to a bonding surface of a package material. 3. The electronic component package according to claim 2, wherein the shape holding portion has a flat plate shape, and the flexible layers are provided on both sides of the shape holding portion. package. 4. The electronic component package according to claim 1, wherein the bonding material is a resin-based adhesive. 5. The electronic component package according to claim 2, wherein the shape holding portion of the second package material has a thermal expansion coefficient equal to a thermal expansion coefficient of the first package material, or a thermal expansion of the flexible layer. An electronic component package having a coefficient of thermal expansion closer to the coefficient of thermal expansion of the first package material than the coefficient of thermal expansion. 6. The electronic component package according to claim 2, wherein the shape holding portion of the second package material is made of a metal or an alloy, and the flexible layer is made of a metal, and An electronic component package provided on the shape holding portion by cladding or laminating, vapor deposition, or sputtering. 7. A first and a second package material which are joined to each other to form an electronic component accommodating space therein, and a joint for joining the mutual joining surfaces of the both package materials to seal the electronic component accommodating space. A method for manufacturing an electronic component package comprising: a package member having at least one package material having a flexible bonding surface deformed by bonding to the bonding surface of the other package material; A first step of interposing a bonding material between the bonding surfaces of the two, and applying a required pressing force to deform the flexible bonding surface so that the bonding surface of one package material is bonded to the bonding surface of the other package material. A method for manufacturing an electronic component package, comprising: a second step of joining. 8. The method for manufacturing an electronic component package according to claim 7, wherein in a package material manufacturing step prior to the first step, at least one of the two package materials is changed in shape. A method for manufacturing an electronic component package, comprising: laminating a surface layer forming the flexible bonding surface on a shape holding portion for holding. 9. The method of manufacturing an electronic component package according to claim 8, wherein in the package material manufacturing step, at least one package material of the two package materials is flexible-bonded to the shape holding unit. A method for manufacturing an electronic component package, comprising laminating a surface layer forming a surface by cladding or laminating, vapor deposition, and sputtering.