JP2001009374A - Surface mounting-type piezoelectric oscillator and sealing method therefor - Google Patents

Surface mounting-type piezoelectric oscillator and sealing method therefor

Info

Publication number
JP2001009374A
JP2001009374A JP11184653A JP18465399A JP2001009374A JP 2001009374 A JP2001009374 A JP 2001009374A JP 11184653 A JP11184653 A JP 11184653A JP 18465399 A JP18465399 A JP 18465399A JP 2001009374 A JP2001009374 A JP 2001009374A
Authority
JP
Japan
Prior art keywords
sealing
sealing material
lid
groove
surface mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11184653A
Other languages
Japanese (ja)
Inventor
Takamasa Tanaka
隆昌 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Miyota KK
Original Assignee
Miyota KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Miyota KK filed Critical Miyota KK
Priority to JP11184653A priority Critical patent/JP2001009374A/en
Publication of JP2001009374A publication Critical patent/JP2001009374A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/1615Shape
    • H01L2924/16195Flat cap [not enclosing an internal cavity]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/163Connection portion, e.g. seal

Landscapes

  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
  • Gyroscopes (AREA)

Abstract

PROBLEM TO BE SOLVED: To enlarge the joint area between a sealing part and a sealing material and restrain the generated leakage by the enlarged area to miniaturize a surface mounting-type piezoelectric oscillator by forming grooves in a sealing part for a retainer base for surface mounting which stores and retains a piezoelectric element and a sealing part between the retainer base and a lid to be arranged on the upper surface of the retainer base. SOLUTION: Grooves 5a, 6a are formed in the sealing part of a retainer base 5 for surface mounting where a storage part for a piezoelectric element 1 is formed and a sealing part between the retainer base 5 and a lid 6 to be arranged on the upper face of the retainer base 5 respectively. At the same time, the grooves 5a, 6a and the sealing parts are filled with a sealing material 7. In this case, the retainer base 5 for surface mounting is formed of an insulating member such as glass or ceramics. However, when an eutectic alloy is used as the sealing material 7, the sealing part is treated by plating, metallizing or any other means so that the sealing material 7 can be welded. Thus it is possible to enlarge the joint area between the sealing parts of the retainer base 5 and the lid 6 and the sealing material 7 and thereby restrain the generated leakage by this enlarged area to achieve the miniaturization of a surface mounting-type piezoelectric element.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は表面実装型圧電振動
子に関する。本発明で表面実装型圧電振動子とは表面実
装型圧電共振子、表面実装型圧電発振器を含むものとす
る。
The present invention relates to a surface mount type piezoelectric vibrator. In the present invention, the surface-mounted piezoelectric vibrator includes a surface-mounted piezoelectric resonator and a surface-mounted piezoelectric oscillator.

【0002】[0002]

【従来の技術】図1は従来技術による表面実装型圧電振
動子の長手方向の断面図、図2は蓋を外した上面図であ
る。表面実装型圧電振動子は、圧電素子1と、圧電素子
1を収納保持するための表面実装用保持器ベース2と、
表面実装用保持器ベース2上に位置する蓋3と、表面実
装用保持器ベース2開口部と蓋3を封止するための封止
材4で構成されている。表面実装用保持器ベース2の開
口部と蓋3を封止するため、開口部には適度な巾Aの封
止部2aを有している。
2. Description of the Related Art FIG. 1 is a longitudinal sectional view of a conventional surface mount type piezoelectric vibrator, and FIG. 2 is a top view with a lid removed. The surface mount type piezoelectric vibrator includes a piezoelectric element 1, a surface mount holder base 2 for housing and holding the piezoelectric element 1,
The cover 3 includes a lid 3 located on the surface mounting retainer base 2, a sealing member 4 for sealing the opening of the surface mounting retainer base 2 and the lid 3. In order to seal the opening of the surface mounting retainer base 2 and the lid 3, the opening has a sealing portion 2a having an appropriate width A.

【0003】携帯端末やデジタルカメラ、デジタルビデ
オカメラといった家電製品の小型化と、情報伝達のスピ
ード・量が増すにつれ表面実装型圧電振動子の小型化、
高周波化、高精度化が求められている。小型化をするに
は圧電素子を小さくするか、封止部の巾Aを小さくする
ことになる。圧電素子1を小さくすると圧電振動子の電
気的性能が落ちるので、圧電素子1の大きさや収納部の
大きさは変えず、封止部の巾Aだけを狭くすることで表
面実装型圧電振動子の小型化をすることが考えられてい
る。
[0003] As home appliances such as portable terminals, digital cameras and digital video cameras have become smaller, and as the speed and amount of information transmission have increased, the size of surface mount type piezoelectric vibrators has been reduced.
Higher frequency and higher precision are required. To reduce the size, the size of the piezoelectric element is reduced, or the width A of the sealing portion is reduced. Since the electrical performance of the piezoelectric vibrator is reduced when the piezoelectric element 1 is reduced, the size of the piezoelectric element 1 and the size of the storage portion are not changed, and only the width A of the sealing portion is reduced, so that the surface mount type piezoelectric vibrator is reduced. It has been considered to reduce the size.

【0004】[0004]

【発明が解決しようとする課題】封止部の巾Aを狭くす
ると封止部でのリークが発生し易くなり、封止の作業条
件管理が難しくなる。
When the width A of the sealing portion is reduced, a leak easily occurs at the sealing portion, and it becomes difficult to control the working conditions of the sealing.

【0005】封止時に蓋を加熱しながら封止材を融かす
が、封止材4の量のバラツキによる内部または外部への
はみ出しを巾の狭い封止部では吸収できなくなり、内部
へのはみ出し不良が発生し易くなる。
[0005] The sealing material is melted while heating the lid at the time of sealing, but the protrusion to the inside or outside due to the variation in the amount of the sealing material 4 cannot be absorbed by the narrow sealing portion, and the protrusion to the inside is poor. Is more likely to occur.

【0006】[0006]

【課題を解決するための手段】圧電素子を収納保持する
ための表面実装用保持器ベースと、表面実装用保持器ベ
ース内に収納保持する圧電素子と、表面実装用保持器ベ
ース上に位置する蓋と、表面実装用保持器ベース開口部
と蓋を封止するための共晶合金または低融点ガラス等の
封止材を有する表面実装型圧電振動子において、表面実
装用保持器ベースと蓋の封止部に各々少なくとも1つの
溝を設けた構造とする。
SUMMARY OF THE INVENTION A surface mount holder base for housing and holding a piezoelectric element, a piezoelectric element housed and held in the surface mount holder base, and located on the surface mount holder base. In a surface-mount type piezoelectric vibrator having a lid and a sealing material such as a eutectic alloy or a low-melting glass for sealing the lid with the opening of the surface-mounting retainer base, the surface-mounting retainer base and the lid The structure is such that at least one groove is provided in each of the sealing portions.

【0007】封止部全周に溝を有する蓋の溝に封止材を
供給する工程と、前記封止部全周に対応した位置に溝を
有する表面実装用保持器ベースの溝を前記封止材に対応
させてセットする工程と、表面実装用保持器ベースを加
圧しながら封止材が融けるまで加熱する工程と、表面実
装用保持器ベースを加圧しながら冷却する工程を有する
表面実装型圧電振動子の封止方法とするか、封止部全周
に溝を有する表面実装用保持器ベースの溝に封止材を供
給する工程と、前記封止部全周に対応した位置に溝を有
する蓋の溝を前記封止材に対応させてセットする工程
と、蓋を加圧しながら封止材が融けるまで加熱する工程
と、蓋を加圧しながら冷却する工程を有する表面実装型
圧電振動子の封止方法とする。
A step of supplying a sealing material to a groove of a lid having a groove all around the sealing portion, and a step of sealing the groove of the surface mounting retainer base having a groove at a position corresponding to the entire periphery of the sealing portion. A surface mounting type having a step of setting the surface mounting retainer base in correspondence with the stopper, a step of heating the sealing material while pressing the surface mounting retainer base until the sealing material melts, and a step of cooling the surface mounting retainer base while pressing the base. A method of sealing the piezoelectric vibrator or a step of supplying a sealing material to a groove of a surface mounting retainer base having a groove on the entire periphery of the sealing portion, and a groove at a position corresponding to the entire periphery of the sealing portion. A surface mounting type piezoelectric vibration comprising a step of setting a groove of a lid having a shape corresponding to the sealing material, a step of heating the sealing material while pressing the lid until the sealing material melts, and a step of cooling while pressing the lid. This is a method of sealing a child.

【0008】[0008]

【発明の実施の形態】図3は本発明による表面実装型圧
電振動子の長手方向の断面図、図4は蓋と封止材を外し
た上面図である。
FIG. 3 is a longitudinal sectional view of a surface mount type piezoelectric vibrator according to the present invention, and FIG. 4 is a top view with a lid and a sealing material removed.

【0009】表面実装用保持器ベース5における圧電素
子1の収納部の大きさは従来技術と同じ構造であり、蓋
6との封止部が改良されている。表面実装用保持器ベー
ス5と蓋6の封止部にはそれぞれ溝5a、6aが形成さ
れ、封止材7は前記溝と封止部に充填されている。
The size of the housing portion of the piezoelectric element 1 in the surface mount holder base 5 is the same as that of the prior art, and the sealing portion with the lid 6 is improved. Grooves 5a and 6a are formed in the sealing portions of the surface mount holder base 5 and the lid 6, respectively, and the sealing material 7 is filled in the grooves and the sealing portions.

【0010】封止方法は、表面実装用保持器ベースを下
に配置するか、蓋を下に配置するかで変わるが以下の説
明では表面実装用保持器ベースを下に配置した例で説明
する。封止部全周に溝5aを有する表面実装用保持器ベ
ース5の溝5aに封止材7を供給する工程と、前記封止
部全周に対応した位置に溝6aを有する蓋6の溝6aを
前記封止材7に対応させてセットする工程と、蓋6を加
圧しながら封止材7が融けるまで加熱する工程と、蓋6
を加圧しながら冷却する工程で構成され、封止材7は溝
5a、6aで形成される体積より多少多い体積にする。
The sealing method varies depending on whether the surface-mounting cage base is arranged below or the lid is arranged below, but in the following description, an example in which the surface-mounting cage base is arranged below will be described. . A step of supplying the sealing material 7 to the groove 5a of the surface mounting retainer base 5 having the groove 5a on the entire periphery of the sealing portion, and a groove of the lid 6 having a groove 6a at a position corresponding to the entire periphery of the sealing portion. Setting the sealing material 6a in correspondence with the sealing material 7; heating the sealing material 7 while pressing the lid 6 until the sealing material 7 melts;
Is cooled while pressurizing, so that the sealing material 7 has a volume slightly larger than the volume formed by the grooves 5a and 6a.

【0011】表面実装用保持器ベース5は、ガラスまた
はセラミックス等の絶縁部材で形成されるが、封止材7
に共晶合金を使用する場合は、封止部はメッキまたはメ
タライズ等により封止材7が溶着できるように処理す
る。蓋6はガラス等の絶縁部材でもよいが、本実施形態
では薄型化のため、金属の板材を使用している。溝5
a、6aはエッチングまたはプレス等により加工する
が、材料により適宜決定できる。
The surface mounting retainer base 5 is formed of an insulating member such as glass or ceramics.
When a eutectic alloy is used, the sealing portion is treated by plating or metallizing so that the sealing material 7 can be welded. The lid 6 may be an insulating member such as glass, but in the present embodiment, a metal plate is used for thinning. Groove 5
Although a and 6a are processed by etching, pressing or the like, they can be appropriately determined depending on the material.

【0012】封止材7に金−錫等の共晶合金を使用する
場合、溝に合わせた線材を使用するか、プレス等の打ち
抜きで加工したものを使用するとよい。封止材に低融点
ガラスを使用する場合、粉末をプレス成形して仮焼きし
たものが好ましいが、ペースト状にしたものをスクリー
ン印刷等で溝5aに供給することも可能である。封止材
7は溝5a、6aで形成される体積より多少多い体積に
することは前述の通りであるが、封止部からはみ出さな
い量に設定する。
When a eutectic alloy such as gold-tin is used for the sealing material 7, it is preferable to use a wire material corresponding to the groove or a material processed by punching such as a press. When a low-melting glass is used as the sealing material, it is preferable that the powder is press-molded and calcined, but it is also possible to supply the paste-like material to the groove 5a by screen printing or the like. As described above, the sealing material 7 has a volume slightly larger than the volume formed by the grooves 5a and 6a, but is set to an amount that does not protrude from the sealing portion.

【0013】図5は封止材の内部へのはみ出し防止を考
慮した封止部の断面拡大図である。表面実装用保持器ベ
ース8と蓋9の封止部にはそれぞれ溝8a、9aが形成
され、さらに溝8bが形成されている。封止材10は前
記溝8a、9aと封止部に充填されるが、封止部の内側
には溝8bを設けてあるため、余分な封止材のたまりと
なり、内部へのはみ出しを防いでいる。
FIG. 5 is an enlarged cross-sectional view of the sealing portion in consideration of prevention of protrusion of the sealing material into the inside. Grooves 8a, 9a are formed in the sealing portion between the surface mounting retainer base 8 and the lid 9, and a groove 8b is further formed. The sealing material 10 is filled in the grooves 8a and 9a and the sealing portion, but since the groove 8b is provided inside the sealing portion, the sealing material 10 becomes a pool of extra sealing material and prevents the sealing material from protruding into the inside. In.

【0014】以上表面実装型圧電振動子の例で説明した
が、表面実装用保持器ベース内にIC等の電子部品を収
納して発振器とした表面実装型発振器にも同様に適用で
きることは言うまでもない。
Although the above description has been made with reference to the example of the surface mount type piezoelectric vibrator, it is needless to say that the present invention can be similarly applied to a surface mount type oscillator in which an electronic component such as an IC is housed in a surface mount holder base. .

【0015】[0015]

【発明の効果】表面実装用保持器ベースと蓋の封止部に
各々少なくとも1つの溝を設けて封止材を充填したの
で、表面実装用保持器ベースまたは蓋の封止部と封止材
の接合面積を広くすることができ、その分リークの発生
を抑えて表面実装型圧電振動子の小型化ができた。本実
施形態では実装面積が約70%に小型化できている。
According to the present invention, at least one groove is provided in each of the sealing portions of the surface mounting cage base and the lid, and the sealing material is filled. Therefore, the sealing portion of the surface mounting cage base or the lid and the sealing material are filled. The bonding area of the piezoelectric vibrator can be increased, and the occurrence of leakage can be suppressed by that much, and the size of the surface mount type piezoelectric vibrator can be reduced. In this embodiment, the mounting area can be reduced to about 70%.

【0016】封止部の内側に溝を形成して封止材のたま
り部とすることで、封止材の内側へのはみ出しを防止で
きたので、溝加工や、封止材の量のバラツキを吸収で
き、部品の製造、封止条件管理が容易になった。
By forming a groove inside the sealing portion to form a pool of the sealing material, it was possible to prevent the sealing material from protruding into the inside, so that groove processing and variations in the amount of the sealing material were possible. And the manufacturing of parts and the management of sealing conditions became easy.

【0017】表面実装用保持器ベースと蓋の封止部に溝
を設けたので、溝で封止材を容易に位置決めをすること
ができるようになった。
Since a groove is provided in the sealing portion between the surface mounting retainer base and the lid, the sealing material can be easily positioned by the groove.

【0018】蓋を下に配置すると、表面実装用保持器ベ
ースより蓋の外形が小さい場合の治具によるガイドが容
易になり、また、蓋が薄い場合でも治具によるガイドが
容易となる。
When the lid is placed below, the guide by the jig when the lid has a smaller outer shape than the surface mount retainer base becomes easy, and the guide by the jig becomes easy even when the lid is thin.

【図面の簡単な説明】[Brief description of the drawings]

【図1】従来技術による表面実装型圧電振動子の長手方
向の断面図
FIG. 1 is a longitudinal sectional view of a conventional surface mount type piezoelectric vibrator.

【図2】蓋を外した上面図FIG. 2 is a top view with a lid removed.

【図3】本発明による表面実装型圧電振動子の長手方向
の断面図
FIG. 3 is a longitudinal sectional view of a surface mount type piezoelectric vibrator according to the present invention.

【図4】蓋と封止材を外した上面図FIG. 4 is a top view with a lid and a sealing material removed.

【図5】封止材の内部へのはみ出し防止を考慮した封止
部の断面拡大図
FIG. 5 is an enlarged cross-sectional view of a sealing portion in consideration of prevention of protrusion of the sealing material into the inside;

【符号の説明】[Explanation of symbols]

1 圧電素子 2 表面実装用保持器ベース 2a 封止部 3 蓋 4 封止材 5 表面実装用保持器ベース 5a 溝 6 蓋 6a 溝 7 封止材 8 表面実装用保持器ベース 8a 溝 8b 溝 9 蓋 9a 溝 10 封止材 A 封止部の巾 DESCRIPTION OF SYMBOLS 1 Piezoelectric element 2 Cage base for surface mounting 2a Sealing part 3 Lid 4 Sealing material 5 Cage base for surface mounting 5a Groove 6 Cover 6a Groove 7 Sealing material 8 Cage base for surface mounting 8a Groove 8b Groove 9 Cover 9a groove 10 sealing material A width of sealing portion

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) // G01C 19/56 H01L 41/08 C ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) // G01C 19/56 H01L 41/08 C

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 圧電素子を収納保持するための表面実装
用保持器ベースと、表面実装用保持器ベース内に収納保
持する圧電素子と、表面実装用保持器ベース上に位置す
る蓋と、表面実装用保持器ベース開口部と蓋を封止する
ための共晶合金または低融点ガラス等の封止材を有する
表面実装型圧電振動子において、表面実装用保持器ベー
スと蓋の封止部に各々少なくとも1つの溝を設けたこと
を特徴とする表面実装型圧電振動子。
1. A surface mount retainer base for storing and holding a piezoelectric element, a piezoelectric element stored and held in the surface mount retainer base, a lid located on the surface mount retainer base, and a surface. In a surface mount type piezoelectric vibrator that has a sealing material such as a eutectic alloy or low-melting glass for sealing the mounting cage base opening and the lid, the surface mounting cage base and the lid sealing part A surface-mount type piezoelectric vibrator, wherein at least one groove is provided.
【請求項2】 封止部全周に溝を有する蓋の溝に封止材
を供給する工程と、前記封止部全周に対応した位置に溝
を有する表面実装用保持器ベースの溝を前記封止材に対
応させてセットする工程と、表面実装用保持器ベースを
加圧しながら封止材が融けるまで加熱する工程と、表面
実装用保持器ベースを加圧しながら冷却する工程を有す
ることを特徴とする表面実装型圧電振動子の封止方法。
2. A step of supplying a sealing material to a groove of a lid having a groove all around the sealing portion, and forming a groove of the surface mounting retainer base having a groove at a position corresponding to the entire periphery of the sealing portion. A step of setting the sealing material corresponding to the sealing material, a step of heating the sealing material base while pressing the surface mounting cage base until the sealing material is melted, and a step of cooling while pressing the surface mounting cage base. A method for sealing a surface-mount type piezoelectric vibrator, characterized by comprising:
【請求項3】 封止部全周に溝を有する表面実装用保持
器ベースの溝に封止材を供給する工程と、前記封止部全
周に対応した位置に溝を有する蓋の溝を前記封止材に対
応させてセットする工程と、蓋を加圧しながら封止材が
融けるまで加熱する工程と、蓋を加圧しながら冷却する
工程を有することを特徴とする表面実装型圧電振動子の
封止方法。
3. A step of supplying a sealing material to a groove of a surface mounting retainer base having a groove on the entire periphery of the sealing portion, and forming a lid groove having a groove at a position corresponding to the entire periphery of the sealing portion. A surface mounting type piezoelectric vibrator comprising: a step of setting corresponding to the sealing material; a step of heating the sealing material while pressing the lid until the sealing material melts; and a step of cooling while pressing the lid. Sealing method.
JP11184653A 1999-06-30 1999-06-30 Surface mounting-type piezoelectric oscillator and sealing method therefor Pending JP2001009374A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11184653A JP2001009374A (en) 1999-06-30 1999-06-30 Surface mounting-type piezoelectric oscillator and sealing method therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11184653A JP2001009374A (en) 1999-06-30 1999-06-30 Surface mounting-type piezoelectric oscillator and sealing method therefor

Publications (1)

Publication Number Publication Date
JP2001009374A true JP2001009374A (en) 2001-01-16

Family

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Cited By (5)

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JP2002255167A (en) * 2001-02-26 2002-09-11 Murata Mfg Co Ltd Electronic part package and its manufacturing method
WO2005050836A1 (en) * 2003-11-19 2005-06-02 Murata Manufacturing Co., Ltd. End surface reflection surface acoustic wave device and its manufacturing method
JP2013051512A (en) * 2011-08-30 2013-03-14 Nippon Dempa Kogyo Co Ltd Crystal resonator
CN103378011A (en) * 2012-04-12 2013-10-30 新科实业有限公司 Optoelectronic package and method for making same
JP2014165305A (en) * 2013-02-25 2014-09-08 Kyocera Crystal Device Corp Electronic device, glass sealing method of the same, and lid member for the same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002255167A (en) * 2001-02-26 2002-09-11 Murata Mfg Co Ltd Electronic part package and its manufacturing method
JP4710149B2 (en) * 2001-02-26 2011-06-29 株式会社村田製作所 Electronic component package and manufacturing method thereof
WO2005050836A1 (en) * 2003-11-19 2005-06-02 Murata Manufacturing Co., Ltd. End surface reflection surface acoustic wave device and its manufacturing method
JP2013051512A (en) * 2011-08-30 2013-03-14 Nippon Dempa Kogyo Co Ltd Crystal resonator
CN103378011A (en) * 2012-04-12 2013-10-30 新科实业有限公司 Optoelectronic package and method for making same
JP2014165305A (en) * 2013-02-25 2014-09-08 Kyocera Crystal Device Corp Electronic device, glass sealing method of the same, and lid member for the same

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