JP2002252432A - Flexible wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a flexible wiring board by which the pitch of wiring can be reduced and a current capacity can be increased at low cost. SOLUTION: Since the flexible wiring board is wired by stitching a film substrate 1 by a wire 4 and a thread 6 of copper, the pitch of wiring of the wire 4 can be reduced in comparison with the conventional wiring pattern with a conductive paste, and a downsized flexible wiring board can be provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible wiring board used for electronic equipment such as a video camera.

[0002]

2. Description of the Related Art A conventional flexible wiring board is obtained by screen-printing a conductive paste such as silver on a synthetic resin film to form a contact portion of a switch, an electrode portion on which electric components are mounted, and a contact portion and an electrode portion. A desired wiring pattern made of a lead line drawn from the wire is formed.

[0003]

However, in the conventional flexible wiring board, since all the wiring patterns are formed by printing a conductive paste, the printed pattern is thin, so that the current capacity is small. It is small and has a high electric resistance. Therefore, the width of the pattern must be increased in order to increase the current capacity, and there is a problem that the pitch between adjacent patterns is increased.

Therefore, the present invention has a small wiring pitch,
It is another object of the present invention to provide an inexpensive flexible wiring board having a large current capacity.

[0005]

As a first means for solving the above-mentioned problems, a flexible insulating film-like substrate and a film-like substrate formed by printing on the film-like substrate are provided. A configuration in which a conductive pattern, a wire, and a thread-shaped material are provided, and the wire is formed of a conductive wire, and the wire and the thread-shaped material are sewn to the film-shaped base material to form a wiring by the wire; did.

As a second solution, the wire is formed of a metal wire, and the thread is formed of an insulating material which is more flexible than the wire. As a third solution, the wire material is arranged on one surface side of the film-shaped base material, and the thread material is arranged on the other surface side of the film-shaped substrate, Is penetrated from the other surface side to the one surface side, and is entangled with the wire material to hold the wire material.

As a fourth solution, the wire is used as a lower thread of a sewing machine, and the thread is used as an upper thread passed through a needle hole of the sewing machine. The film-shaped substrate was sewn to the film-shaped substrate by sewing. Further, as a fifth solution, the wire and the conductive pattern are provided with a connection portion for electrically connecting each other.

According to a sixth aspect of the present invention, the conductive pattern comprises a land portion forming the connection portion provided on a fixed contact for a switch, and / or the connection portion for connecting an electric component. And a land portion. As a seventh solution, the connection part of the wire is located on the connection part of the conductive pattern.

As an eighth solution, the connecting portions of the conductive pattern and the wire are electrically connected by a conductive adhesive. As a ninth solving means, on the connection portion of the conductive pattern,
A stitched portion between the wire and the thread-like material is located, and the connection portion of the wire including the stitched portion is connected to the connection portion of the conductive pattern with the adhesive.

[0010] As a tenth solution, a holding member is mounted on the adhesive material. As an eleventh solution, the adhesive is made of low melting point solder, and the holding member is made of a solderable material.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to the drawings of a flexible wiring board of the present invention, FIG. 1 is a developed view showing a first embodiment of the flexible wiring board of the present invention, FIG. 2 is an enlarged view of a portion A in FIG. FIG. 3 is an enlarged sectional view of a main part of the flexible wiring board according to the first embodiment of the present invention, and FIG. 4 is an enlarged sectional view of a main part of the flexible wiring board according to the second embodiment of the present invention.
FIG. 5 is an enlarged sectional view of a main part according to a third embodiment of the flexible wiring board of the present invention.

Next, the structure of the first embodiment of the flexible wiring board of the present invention will be described with reference to FIGS. 1 to 3. The flexible insulating film-like substrate 1 is made of polyester, polyimide or the like. A first base portion 1a, a drawer portion 1b connected to the first base portion 1a and extending in a band shape, and connected to the first base portion 1a by a thin connecting portion 1c. And a second base 1d.

A conductive pattern P formed by printing a conductive paste such as silver has a plurality of fixed contacts 2 provided on a first base 1 and a plurality of movable contacts 3 provided on a second base 1d. The fixed contact 2 includes a pair of contact portions 2
a, 2b, provided at the ends of the contact portions 2a, 2b,
A relatively wide land portion for forming the connection portions 2c and 2d is formed. Although not shown here, the conductive pattern P may be used to form a land portion forming a connection portion for connecting an electric component, or a part of the lead wiring having the connection portion.

The second base 1d is arranged so that the connecting portion 1c is bent to face the first base 1a, and the movable contacts 3 face the fixed contacts 2 respectively. become. A spacer (not shown) made of an adhesive (not shown) is attached between the first base 1a and the second base 1d, and the fixed contact 2 and the movable contact are provided. 3, a push-type switch is formed.

In such a push-type switch, when the second base 1d on the movable contact 3 is pressed with a finger or an operation member (not shown), the second base 1d is bent, and the movable contact 3 is moved. When the switch is turned on by contacting the pair of contact portions 2a and 2b, and when the pressing on the second base 1d is released, the portion of the second base 1d that has been pressed and bent is self-returning. As a result, the contact of the movable contact 3 to the pair of contact portions 2a, 2b is released, and the contact returns to the original state of OFF.

The plurality of wires 4 made of a conductive wire are other than a copper wire, an alloy wire made of an alloy of silver and copper, a metal wire that is a conductive wire made of a gold wire, or a metal wire made of a conductive resin or the like. And a square wire such as a round wire, an elliptical wire, or a square wire having a wire diameter of about 50 μm.
These wires 4 are arranged on one surface side of the film-shaped base material 1 to form wiring.

A connecting portion 4b is provided at one end of a part of the plurality of wires 4a.
b is located on the connection portions 2c and 2d of the fixed contact 2 and is connected between the connection portion 4b of the wire 4 and the conductive pattern P (fixed contact 2) by soldering or an adhesive 5 made of a conductive material such as a conductive adhesive. The connection parts 2c and 2d are electrically and mechanically connected and fixed. In addition, the connection portion 4 of some of the wires 4a
Except for b, it is a wiring for a lead wire for drawing out, and other wires 4c not connected to the fixed contact 2 are:
It is a wiring for a lead wire for connecting between other electric circuits (not shown). The connecting portion (not shown) of the wire 4c is connected to a land portion (not shown) which is a connecting portion of a conductive pattern P made of a conductive paste such as silver formed on the film-like base material 1 by an adhesive 5. Connected by the wire 4
c may be a wiring for a lead wire for connecting between an LED (not shown) and a chip component (not shown).

The flexible thread material 6 is made of polyester,
It is made of an insulating material such as nylon, cotton, or silk, and made of a fiber such as polyester, cotton, or silk. As the thread material 6, a material having greater flexibility than the wire 4 is used. Then, as shown in FIG. 3, the thread material 6 is arranged on the other surface side of the film-shaped base material 1 and is sewn to the wire material 4 located on one surface side to hold the wire material 4. Also,
The sewing of the wire 4 and the thread 6 is performed by a sewing machine (not shown).
The wire 4 is used for the lower thread and the thread 6 is used for the upper thread to be passed through the hole of the needle of the sewing machine, and the sewing machine is sewn to the film-like substrate 1.

When the wire 4 and the thread 6 are sewn together, as shown in FIG. 3, the wire 4 is arranged so as to extend on one side of the film-like substrate 1. A thread material 6 penetrates from the other surface side of the film-shaped base material 1 to one surface side, and is entangled with the wire material 4 to hold the wire material 4. That is, in the first embodiment, the flexibility of the wire 4 is small, so that the wire 4 does not bend in the direction of the other surface of the film-like substrate 1 but extends on one surface. I have.

FIG. 4 shows a second embodiment of the present invention.
In the second embodiment, the flexibility of the wire 4 is greater than that of the first embodiment, and the flexibility of the thread 6 is greater than that of the wire 4. Substrate 1
Are sewn together by sewing. And
When such a wire 4 and a thread-like material 6 are sewn together, FIG.
As shown in FIG. 2, the thread material 6 penetrating from the other surface side of the film-shaped base material 1 to the one surface side is in a state of being entangled with the wire 4 bent toward the other surface side of the film-shaped base material 1. I have.

That is, in the second embodiment, the wire 4 is formed of a material having such flexibility that the wire 4 can be slightly bent in the direction of the other surface of the film-like base material 1. Since the configuration is the same as that of the first embodiment, the same components are denoted by the same reference numerals, and description thereof is omitted here.

FIG. 5 shows a third embodiment of the present invention.
In the third embodiment, the connection portion 4b of the wire 4 and the stitched portion of the wire 4 and the thread 6 are positioned on the connection portions 2c and 2d provided on the conductive pattern P, and the connection is performed by the adhesive 5. The portions 2c and 2d and the wire 4 of the sewn portion are bonded to the connecting portions 2c and 2d to electrically and mechanically connect the two, and the upper portion of the adhesive 5 can be soldered with copper foil or the like. The holding member 7 made of metal is placed thereon.

Then, by pressing the adhesive 5 with the pressing member 7, the adhesive 5 spreads around the wire 4 so that the connection can be reliably performed. When the adhesive 5 made of low-melting-point solder (having a melting point of 120 to 130 ° C.) is used and the holding member 7 made of copper foil or the like and having good solder wettability is used, the low-melting-point solder is held down during heating. Since the low-melting-point solder adheres well to the member 7, the wire 4
It can be connected around and fixed securely.

Although the filament 6 in the above embodiment has been described as being formed of insulating fibers, the wire 4
A conductive material having greater flexibility may be used. Also, the wire 4 has been described as being used for the wiring for the lead wire, but may be used for the fixed contact of the switch. In the above-described embodiment, the holding member 7 is made of metal. However, a conductive adhesive is used for the adhesive 5 and the conductive adhesive is pressed by the insulating holding member 7. Is also good.

[0025]

According to the flexible wiring board of the present invention, the wire 4 formed of a conductive wire and the thread-shaped material 6 are sewn to the film-shaped substrate 1 to form the wiring by the wire 4.
The wire 4 can have a smaller wiring pitch than a conventional wiring pattern using a conductive paste, and can provide a small-sized flexible wiring board. Further, since the conductive pattern P is used together, a pattern having a large area such as a fixed contact or a land portion of an electric component can be obtained, which is preferable.

The wire 4 is formed of a metal wire, and the thread 6 is formed of an insulating material which is more flexible than the wire 4. Therefore, the thread 6 having a greater flexibility than the wire 4 is used. By using it, the film-like substrate 1
The wire 4 is hard to be broken and the reliability can be improved. In addition, by forming the thread material 6 from an insulating material, the flexibility is enhanced, the thread material 6 is hard to be cut, and the productivity is improved. Is good and a cheap one is obtained.

A wire 4 is arranged on one side of the film-like base 1, and a thread 6 is arranged on the other side of the film-like base 1, and the thread 6 is placed on the other side. To one surface side, and is entangled with the wire 4 to hold the wire. Therefore, the highly flexible thread-like material 6 is sewn so as to penetrate the film-like base material 1.
The deformation of the wire 4 in the direction toward the other surface is small, so that the wire 4 is harder to break and the reliability can be further improved.

Further, the wire 4 is used as a lower thread of the sewing machine, and the thread 6 is used as an upper thread passed through a hole of a needle of the sewing machine. 1, the wire 4 can be easily wired, and various shapes can be easily handled, and the highly flexible thread-like material 6 is used as the upper thread.
Even if the needle moves up and down, there is no fear that the thread-like material 6 is cut, and the yield can be improved and a flexible wiring board can be manufactured.

Further, since the wire 4 and the conductive pattern P are provided with connecting portions for electrical connection with each other, the advantages of the conductive pattern (printed pattern) by printing such that a large area can be formed and the conduction resistance are reduced. It is possible to obtain a wire having the advantage of a conductive wire that can be made smaller.

The conductive pattern P has lands that form the connecting portions 2c and 2d provided on the fixed contact 2 for the switch, and / or lands that form the connecting portions for connecting the electric components. Therefore, the connection part 2 having a large area
c and 2d are obtained, and a good connection with the wire 4 can be provided.

The connection portions 2c, 2d of the conductive pattern P
Since the connecting portion 4b of the wire 4 is located on the upper side, the position where the conductive pattern P is applied with high accuracy by printing,
The wires 4 can be arranged, and the positions of both can be accurately determined.

Further, since the connecting portions of the conductive pattern P and the wire 4 are electrically connected by the conductive adhesive 5, the electrical and mechanical connection between them can be ensured.

The seam of the wire 4 and the thread-like material 6 is located on the connection of the conductive pattern P, and the connection 4b of the wire 4 including the seam is connected by the adhesive 5 to the connection of the conductive pattern P. Adhesive 5 to the wire 4
And a strong connection structure can be provided.

A pressing member 7 is provided on the adhesive 5.
Is placed, pressing the adhesive 5 with the pressing member 7 spreads the adhesive 5 around the wire 4 so that the connection can be ensured.

Further, since the adhesive 5 is made of low melting point solder and the holding member 7 is made of a solderable material, the low melting point solder adheres well to the holding member 7, and the low melting point solder surrounds the wire 4. The connection can be made surely.

[Brief description of the drawings]

FIG. 1 is a development view showing a first embodiment of a flexible wiring board of the present invention.

FIG. 2 is an enlarged view of a portion A in FIG.

FIG. 3 is an enlarged sectional view of a main part according to the first embodiment of the flexible wiring board of the present invention.

FIG. 4 is an enlarged sectional view of a main part according to a second embodiment of the flexible wiring board of the present invention.

FIG. 5 is an enlarged sectional view of a main part according to a third embodiment of the flexible wiring board of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Film-shaped base material 1a 1st base 1b Lead-out part 1c Connecting part 1d 2nd base P Conductive pattern 2 Fixed contact 2a Contact part 2b Contact part 2c Connection part (land part) 2d Connection part (land part) 3 Movable contact 4 Wire 4a Partial Wire 4b Connection 4c Other Wire 5 Adhesive 6 Thread 7 Pressing Member

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E317 AA01 AA11 BB01 BB03 BB11 CC01 CC13 CC15 GG11 GG14 5E338 AA01 AA12 AA16 BB54 BB63 BB75 CC01 CD01 CD33 CD40 EE11 EE23 5E343 AA02 AA12 AA18 BB12 BB09 BB09 BB09 BB09 BB09 DD65 GG08 GG13

Claims (11)

[Claims] An insulating film-like base material having flexibility, a conductive pattern formed by printing on the film-like base material, a wire, and a thread-like material, wherein the wire is a conductive wire. A flexible wiring board formed, wherein the wire and the thread-like material are sewn to the film-like base material to form a wiring by the wire. 2. The wire rod is formed of a metal wire,
2. The flexible wiring board according to claim 1, wherein the thread-like material is formed of an insulating material that is more flexible than the wire material. 3. The film material is disposed on one surface side of the film-shaped substrate, and the thread material is disposed on the other surface of the film-shaped substrate, and the thread material is disposed on the other surface. The flexible wiring board according to claim 2, wherein the flexible wiring board is configured to penetrate from one side to the one surface side and be entangled with the wire to hold the wire. 4. The film-like base material is machined by using the wire material as a lower thread of a sewing machine and the thread material as an upper thread passed through a needle hole of the sewing machine. 4. The flexible wiring board according to claim 1, wherein the flexible wiring board is sewn to a material. 5. The flexible wiring board according to claim 1, wherein a connection portion for electrically connecting the wire and the conductive pattern is provided. 6. The method according to claim 6, wherein the conductive pattern has a land portion forming the connection portion provided on a fixed contact for a switch, and / or a land portion forming the connection portion for connecting an electric component. The flexible wiring board according to claim 5, wherein 7. On the connection part of the conductive pattern,
The flexible wiring board according to claim 5, wherein the connection portion of the wire is located. 8. The flexible wiring board according to claim 5, wherein the connection portions of the conductive pattern and the wire are electrically connected by a conductive adhesive. 9. On the connection portion of the conductive pattern,
9. The seam of the wire and the thread-like material is located, and the connection part of the wire including the seam is connected to the connection part of the conductive pattern with the adhesive. Flexible wiring board. 10. The flexible wiring board according to claim 8, wherein a holding member is mounted on the adhesive. 11. The flexible wiring board according to claim 10, wherein the adhesive is made of a low melting point solder, and the holding member is made of a solderable material.