JPS62256492A - Circuit board and manufacture of the same - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a circuit board, and relates to a structure of a circuit board that allows a wiring circuit to be easily formed on an insulating substrate, and a manufacturing method thereof.

Considering the structure and manufacturing method of conventional circuit boards,
There were three main types.

The first conventional technique uses, for example, a copper-clad laminate as a starting material, in which metal foil such as copper foil is adhered to the entire surface of an insulating substrate in advance, and the metal foil is selected according to the desired wiring pattern. The circuit board was then removed by etching.

In this method, a metal foil forming a wiring pattern is bonded onto an insulating substrate.

The second conventional technique is the so-called additive method, in which an electroless plating catalyst is deposited on the entire surface of an insulating substrate in advance, and then the surface of the insulating substrate except for the desired wiring pattern is covered with a metal resist, and then electroless plating is applied. Circuit boards were manufactured by forming wiring patterns made of metal layers such as copper by plating. This method has a structure in which a metal plating layer forming a wiring pattern is adhered onto an insulating substrate.

The third conventional technology is called a multi-wire wiring board, in which a semi-cured adhesive is applied to the entire surface of an insulating substrate in advance, metal wires are laid at desired positions on the adhesive layer, and then the adhesive is applied. The material is melted and bonded. This method has a structure in which metal wires are bonded onto an insulating substrate.

(Problems to be Solved by the Invention) However, the above-mentioned prior art had the following problems.

That is, in the first and second prior art described above,
A large number of processes are required to complete the circuit board, and chemical treatments such as etching or plating are required, so large-scale manufacturing equipment is required, and printed masks etc. are required depending on the desired circuit. Since it has to be prepared for each model, it has the disadvantage that it is not suitable for high-mix, low-volume production, and the overall cost is high. On the other hand, in the above-mentioned third conventional technology, since adhesive is used to fix the metal wire, the management of the material is troublesome, and if the management is insufficient, the metal wire will be incompletely fixed and the metal wire will not be properly fixed. There is a risk that the wires may peel off or fall off from the insulating board, and there is a risk that the wires may peel off or fall off from the insulating board.
There were problems such as the high cost of product inspection because the metal surface of the wire could be contaminated with adhesive and damage the connection.

Therefore, in view of the problems of the prior art described above, it is an object of the present invention to provide a circuit board that has a simple manufacturing process, is suitable for high-mix, low-volume production, and is capable of reducing costs with few quality problems. purpose.

[Means for Solving the Problems] In order to solve the problems of the prior art described above, the present invention has a structure in which a conductive wire is held and fixed to an insulated substrate by an insulated wire,
A step of placing a conductive wire on an insulating substrate, a step of drilling a plurality of holes in the conductor mounting surface of the insulating substrate, and a step of fixing the conductive wire to the insulating substrate with the insulated wire through the holes. The manufacturing method consists of a holding and fixing process.

More specifically, on a hard or flexible insulating substrate, a conductive wire consisting of a single wire or a plurality of metal wires or a conductive wire such as carbon fiber, which can be substituted for the metal wire, is placed on the hard or flexible insulating substrate,
The structure is such that the conductive wire is attached to the insulated substrate on the surface of the insulated substrate along the conductive wire.

[Function] With the above structure, the conductive wire is mechanically held and fixed to the insulating substrate by the insulated wire.

[Embodiment] The figures are all related to the present invention, and FIG. 1 is a perspective view showing a first embodiment of the present invention, and FIG. 2 is a front sectional view and a plan view showing the portion of FIG. 1. FIG. 3 is a perspective view showing a second embodiment of the invention, and FIGS. 4 to 6 are perspective views showing a method of manufacturing a circuit board of the invention.

The present invention relates to a structure in which a conductive wire is held and fixed to an insulated substrate by an insulated wire, and a method for manufacturing the same, and several embodiments are possible for its implementation. That is, the insulating substrate in the present invention may be hard or flexible, the conductive wire may be anything as long as it is conductive and can be formed into a linear shape, and the insulating coating and conductive protective coating may be selected as appropriate. It can be applied by In addition, the manufacturing method of holding and fixing the insulated wire to the insulated substrate using the insulated wire can change the order of the steps as appropriate. It is also possible to perform a plurality of steps at the same time, and furthermore, known methods other than those described below can be used.

In the first embodiment described below, the conductive wire is a single copper wire,
The conductive wire is exposed, and the second embodiment is different from the first embodiment.
The conductive wire of the embodiment is coated with an insulating coating.

A first embodiment of the present invention will be described with reference to FIGS. 1 and 2. In the figure, 1 is a circuit board, and the circuit board 1 is placed on a flexible film 2 made of polyethylene or the like with a thickness of 0.14 mm.
A diameter copper wire 3 is sewn and fixed with a polyester thread 4. 2a where the ends of the copper wires 3 are gathered;
2b and 2e are connection parts for connecting to other circuit boards. The twine 4 is exposed in a loop shape on the surface of the film 2 through a hole 2d provided from the back side of the film 2 along the copper wire laying part of the film 2, and the loop-shaped part connects the copper [3] to the surface of the film 2. It is pressed and fixed.

FIG. 3 is a diagram showing a second embodiment of the circuit board of the present invention. The difference between this embodiment and the first embodiment is that the copper wire 3' is covered with an insulating coating 3'a. However, the copper wires are laid in a criss-cross manner. According to this embodiment, the degree of freedom in wiring increases, such as by allowing wiring tolerances at arbitrary points and making multilayer wiring possible.

In addition, in each of the above embodiments, the conductive wire is not limited to copper wire, and may be any other metal, as long as it is conductive and can be formed into a wire test. good.

In addition, as another embodiment of the present invention, although not shown in the drawings, there is one in which the conductive wire is a stranded wire of gold 1@cotton.

In this embodiment, since the conductive wire is a stranded wire, it has the advantage of being highly flexible and easy to wire.

It is a matter of course that the type of metal does not matter, and it may have an insulating or conductive coating.

Further, as yet another embodiment of the present invention, although not shown, there is one in which the conductive wire is made of carbon fiber.

According to this embodiment, since the conductive wire is made of carbon fiber, it is not subject to oxidation corrosion unlike metal, and has the advantage that the flexibility is even better than those of the above-mentioned embodiments.

Further, as another embodiment of the present invention, although not shown, a conductive N
There are wires made of metal, such as copper, whose surface becomes nonconductive when oxidized, and whose surface is coated with a conductive film containing carbon.

In each of the above embodiments, the insulating substrate was made of a polyethylene film, but the material of the film is not limited to polyethylene; for example, it may be made of heat-resistant polyimide, or the insulating substrate may be made of a hard material such as phenol. It may be a resin laminate or an epoxy resin laminate, as long as it can support the circuit. When the insulating substrate is a flexible film, the conductive wires are not fixed to the insulating substrate with adhesive, but are tied together with insulated wires, so the conductive wires are wires with a circular cross section. Even if there is a wire, it can freely follow the deformation of the insulating substrate, and there is no risk of wire breakage. In addition, the insulated wire was made of polyester strands,
It is not limited to this, and can be selected as appropriate. Moreover, the number can also be selected as appropriate.

A method for manufacturing the circuit board of the present invention will be explained.

FIG. 4 is a diagram showing the first embodiment of the circuit board manufacturing method of the present invention. First, the copper wire 3 is laid on the film 2, and then the copper wire 3 is secured to the tip of the strand from the back side of the film 2. Move the needle to the surface of the film 2 while piercing the film 2 with the needle and forming the hole 2d, and then straddle the copper wire 31 to form the hole 2d.
Move the needle to the back side of film 2 and tighten the thread to fix the copper wire.

FIG. 5 is a diagram showing a second embodiment of the circuit board manufacturing method of the present invention, in which a needle through which a copper wire 3 is inserted is pierced into the film 2 to expose the needle tip and the copper wire on the back surface of the film, and then The gap between the needle tip and the copper wire is expanded and the thread is inserted between them.
The needle is then returned to the film surface and the copper wire is taut, and the strands are taut to secure the copper wire.

FIG. 6 is a diagram showing a third embodiment of the circuit board manufacturing method of the present invention, in which a copper wire is fixed with two strands 4a and 4b.

A method of manufacturing a circuit board with crossed conductive lines as shown in the second embodiment of the circuit board of the present invention described above can also be manufactured by the same method as shown in the above embodiment.

In the above embodiment, since the insulating substrate is a film, the hole 2d
The step of opening the hole and the step of securing and fixing the conductive wire to the insulating substrate using the insulated wire through the hole are performed almost simultaneously, and the entire process including the laying of the conductive wire is performed continuously. If the insulating substrate is hard and thick, the holes 2d described above must be formed in advance.

In the circuit board manufacturing method of the present invention described above, the position of laying the conductive wire can be programmed in advance into a computer, and the laying machine, which is the laying means, can be controlled to automatically lay the conductive wire.

[Effects] As described above, according to the present invention, a circuit board is formed in which conductive wires are fixed to an insulated substrate using insulated wires, so complicated manufacturing processes such as etching and plating, etc., which are difficult to control, can be avoided. It is possible to provide a circuit board that does not require any process, has a simple manufacturing process, is suitable for high-mix, low-volume production, and has fewer quality problems caused by difficult process conditions, and therefore can reduce costs. In addition, the conductive wire can be made of a single conductive metal wire, a stranded wire consisting of multiple thin conductive metal wires, conductive carbon fiber, or an insulating substrate made of a flexible film, so the entire structure can be flexible. A flexible circuit board can be provided. Furthermore, since an insulating coating can be applied as appropriate, multilayer wiring is possible.

[Brief explanation of drawings]

The figures are all related to the present invention; FIG. 1 is a perspective view showing the first embodiment of the invention, FIG. 2 is a view showing the part of FIG. 1, and (a) is a front view. Cross-sectional view (b) is a plan view, (c) is a back view, FIG. 3 is a perspective view showing a second embodiment of the present invention, and FIG. 4 is a first embodiment of the method for manufacturing a circuit board of the present invention. FIG. 5 is a perspective view showing the procedure of the second embodiment of the method of manufacturing a circuit board of the present invention, and FIG. 6 is a perspective view of the procedure of the eighth embodiment of the method of manufacturing a circuit board of the present invention. FIG. 1.11: Circuit board 2: Insulating board 2d: Hole 3: Conductive wire 4: No-ta line Figure 3

Claims (10)

[Claims] (1) A circuit board characterized in that a conductive wire is held and fixed to an insulated substrate by an insulated wire. (2) The circuit board according to claim (1), wherein the conductive wire is a single conductive metal wire. (3) The circuit board according to claim (1), wherein the conductive wire is comprised of a plurality of thin conductive metal wires. (4) The circuit board according to claim (1), wherein the conductive wire is a stranded wire made of a plurality of thin conductive metal wires. (5) The circuit board according to claims (1), (2), (3), and (4), wherein the conductive wire is made of bare metal. (6) Claims (1), (2), and (3) characterized in that the conductive wire is coated with an insulating coating.
, the circuit board according to item (4). (7) Claims (1), (2), and (3) characterized in that the conductive wire is coated with a conductive coating.
, the circuit board according to item (4). (8) The circuit board according to claim (1), wherein the conductive wire is made of conductive carbon fiber. (9) The circuit board according to claim (1), wherein the insulating substrate is made of a flexible film. (10) a step of placing a conductive wire on the insulating substrate; a step of drilling a plurality of holes in the conductor placement surface of the insulating substrate;
A method for manufacturing a circuit board, comprising the step of holding and fixing the conductive wire to an insulating substrate with the insulated wire through the hole.