JP2000114418A - Pin erecting plate and resin wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a low-cost resin wiring board and a pin erecting plate wherein the bonding strength of an erected pin is high with less electrical failure. SOLUTION: Related to a pin erecting plate 25, many pins 16 comprising a tip end 16A protruding from a second main surface 21B side, an intermediate part 16B penetrating a through hole, and a base and 16C which is larger in diameter than them are erected on a pin holding plate 21 comprising many through holes 24 and a conductor layer 22 formed at least at the periphery of the through hole. The base end 16C comprises an engagement part 17A engaged with the through hole 24 for soldering and a contact part 17B which, comprising brazing filler metal, etc., is tightly fitted to the base end side surface of the engagement pat 17A and swells in the base end direction. A resin wiring board comprises a wiring plate where a pin pad is formed on a second wiring board main surface, and the pin pad is abutted by an abutting part of a pin holding plate 21 for soldering, so that the pin erecting plate is connected to the wiring plate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pin erection plate having a plurality of pins erected on a pin holding plate, and a resin wiring board including the pin erection plate and a wiring board. The present invention relates to a resin wiring board and a pin standing plate which have high strength at a joint portion between the pin and the pin standing plate and in which electrical failure hardly occurs.

[0002]

2. Description of the Related Art Conventionally, as a resin wiring board, a pin erecting plate in which a number of pins as input / output terminals are stood on a pin holding plate is made of a resin such as an epoxy resin or a resin such as an epoxy resin or a glass fiber. It has been known that a semiconductor device is fixed to a resin wiring board using an insulating material made of a composite material of the above. For example, a resin wiring board 70 shown in FIG. 7 includes a pin P1 having a nail head (nail head) head P1A in advance and a first solder material ST formed on a conductor layer CL formed on a pin holding plate 72 in advance.
Then, a pin standing plate 73 having a large number of pins P1 standing on the pin holding plate 72 is manufactured. Then, the head P1A of each pin P1 of the pin standing plate 73 is soldered to the pin pad PD formed on the back main surface 71A (the lower side in the figure) of the wiring board 71 with the second solder material SR, The pin standing board 73 and the wiring board 71 are connected. By the way, this resin wiring board 70 is used to solder the pin standing plate 73 and the wiring board 71 with the second solder material SR when the head P1A of the pin P1 and the pin pad P provided on the wiring board 71 are used.
D, the layer of the second solder material SR may be crushed and spread, and a short circuit may occur between adjacent input / output terminals. In particular, this danger becomes extremely high as the pitch of the input / output terminals is reduced.

Therefore, Japanese Patent Application Laid-Open No. 4-129260 discloses a shape in which a head P1A of the pin P1 has a projection.
That is, as shown in FIG. 8, using a pin P2 having a protrusion P2B protruding from a nail-shaped head P2A, the protrusion P
A resin wiring board 80 is shown in which 2B is brought into contact with the pin pad PD and soldered. In this way, when the pin P2 and the wiring board 71 are joined with the second solder material SR, the protrusion P2B of the pin P2 is located between the head P2A of the pin P2 and the pin pad PD provided on the wiring board 71. Intervening, the second solder material SR sandwiched between the head P2A and the pin pad PD does not spread laterally and does not short-circuit with each other.

[0004]

However, since the pin P2 having the protruding portion P2B is not widely used, a mold or the like must be separately manufactured in order to manufacture the pin P2. Furthermore, since the mold and the like are more complicated than the commonly used nail-shaped pin P1, the manufacturing cost of the pin is high. In general, the number of pins used for a wiring board is as large as several tens to about 1000, so an increase in the unit cost of the pins results in a large increase in cost of the resin wiring board. Further, in the resin wiring board 80, when stress is generated in the pin P2, a crack is generated on the contact surface between the pin protruding portion P2B and the pin pad PD of the wiring board 71, and as a result, the bonded portion is broken. In some cases, the strength is not practically sufficient.

The present invention has been made in view of the above situation, and is a resin wiring board having a pin standing board, but has a high bonding strength between pins and the wiring board, is less likely to cause electrical failure, and is inexpensive. It is an object of the present invention to provide a flexible resin wiring board and a pin standing plate on which such pins are erected.

[0006]

Means for Solving the Problems, Actions and Effects The means for solving the problem has a substantially plate shape having a first main surface and a second main surface, and a space between the first main surface and the second main surface. A pin holding plate having a large number of through holes penetrating therethrough, and a conductor layer formed at least on the periphery of the through hole on the first main surface; a tip protruding from the second main surface side; An intermediate portion penetrating through the base portion, a proximal end portion having a diameter larger than that of the distal end portion and the intermediate portion, the engaging portion engaging with the through hole, and being soldered to the conductor layer; and the engaging portion. A base having a melting point higher than that of the first solder material for soldering the conductive layer and the conductor layer, the contact portion having a solder material or a brazing material which is fixed to the base side surface of the engagement portion and swells in the base direction. And a plurality of pins having end portions.

According to the present invention, the base end of the pin has the contact portion and the engagement portion. Therefore, when a pin standing board having such pins is joined to a wiring board, the distance between the pin holding plate and the wiring board among the pin standing boards is equal to the height of the base end of the pin. That is, a gap is left by the height of the contact portion in addition to the engagement portion. For this reason, the second solder material for soldering the pins and the pin pads spreads, and there is no short circuit between adjacent input / output terminals.

Further, when the pin standing board of the present invention is joined to a wiring board, between the engaging portion of the pin and the pin pad, in addition to the second solder material used for soldering, the tip of the pin, the middle of the pin, and the like. Part and engaging part (these are collectively referred to as a pin body)
A contact portion having a softer solder material or brazing material is interposed. For this reason, even when stress is generated between the pin and the pin pad, the solder material or brazing material in the contact portion is also deformed and absorbs and relieves the stress, so that it is difficult to break, and the pin pad is made of Kovar or the like. An extremely high connection strength can be obtained as compared with a case where the pins are directly soldered.

Further, the surface of the contact portion has finer irregularities than the relatively smooth surface of the pin body made of Kovar or the like. This is because when the solder material or the brazing material is cooled and solidified, fine irregularities and voids are formed. Therefore, at the time of soldering, the contact area between the second solder material and the contact portion increases. From this point, there is also an advantage that the contact portion can be firmly connected by soldering as compared with a case where the base end portion of the pin main body having a relatively smooth surface has the same shape as the contact portion. Moreover, since each pin is fixed to the pin holding plate, even if stress is applied only to a specific pin, the stress is dispersed to the pin holding plate or to other pins via the pin holding plate, Pins can be connected more firmly than when individual pins are simply connected without the pin holding plate.

Here, the pin holding plate is only required to have predetermined electrical insulation, strength, heat resistance and the like. For example, a resin such as an epoxy resin or a polyimide resin, a glass
Three-dimensional networks such as epoxy resin composite materials, glass-BT resin composite materials, composite materials of these resins with glass fibers, polyamide fibers, etc., composite materials of these resins with ceramic powders such as alumina, and continuous porous PTFE A composite material obtained by impregnating and curing an epoxy resin or the like into a fluorine-based resin having a structure may be used. In addition, the through-hole formed in the pin holding plate can insert or press-fit the distal end portion and the intermediate portion of the pin into the through-hole, and engage the base end portion (of which the engaging portion) of the pin. Any material having an inner diameter that can be made to work can be used.

[0011] The conductor layer formed on the pin holding plate may be
It may be formed at least on the periphery of the through hole of the first main surface. For example, a pin holding plate having a metal layer on the first main surface may be
A through hole may be formed and formed around the through hole by etching or the like. In addition, a conductor layer (through-hole conductor) is formed not only on the peripheral edge of the through hole on the first main surface but also on the inner wall of the through hole.
In addition to soldering the engaging portion of the pin on the periphery of the through hole on the main surface, it is preferable to solder the conductor layer (through hole conductor) on the inner wall of the through hole and the intermediate portion of the pin. This is because the bonding strength between the pin and the pin holding plate can be further increased.

The material of the pin body (the engaging portion among the distal end portion, the intermediate portion, and the proximal end portion) may be appropriately selected in consideration of strength, workability, and the like, but may be Kovar or 42Ni-Fe.
Alloys and copper alloys. The soldering material and the brazing material in the contact portion of the pin have a higher melting point than the first soldering material used in this case so that the pin does not melt when soldering to the conductor layer of the pin holding plate. The material may be appropriately selected from among them, taking into account the material of the pin body and the ease of plating. For example, a silver brazing material such as Ag-Cu or Au-
Gold brazing material such as Si, Au-Sn, Au-Ge, 95P
High temperature solder materials such as b-5Sn and 90Pb-10Sn are exemplified. This contact portion is made of only solder material and brazing material.
Plating or Au plating may be applied. Even in this case, the joint strength between the pin and the wiring board can be extremely increased, as described above, as in the case where only the solder material and the brazing material are used. Further, as the first solder material for soldering the pins to the pin holding plate, as described above, a wire having a lower melting point than that of the first solder material to prevent the contact portion from being melted at the time of soldering and to be connected thereafter. It may be selected in consideration of the soldering temperature of the plate, etc., for example,
95Sn-5Sb solder material, Pb-Sn-based solder material (for example, 37Pb-63Sn eutectic solder material, 50Pb-50Sn, 90Pb-10Sn
Etc.), Sn-Ag based solder material (for example, 96.5Sn-3.5Ag)
And the like.

[0013] Here, in the pin standing plate, the engaging portion is shaped like a nail head, and the abutting portion has a substantially spherical surface from substantially the entire proximal side surface of the engaging portion in the proximal direction. It is good to be a pin standing board characterized by being a spherical contact part which has the above-mentioned solder material or brazing material which protrudes in a shape.

When the contact portion having a spherical shape or other shape is formed of the same metal as the pin body, the contact portion is usually formed integrally by pressing or the like at the time of forming the pin. However, it is difficult to form such a spherical contact portion, and the unit price increases. In general, the number of pins used for a wiring board is as large as several tens to about 1000, so that a slight increase in the unit price results in a large increase in cost. On the other hand, the pin used in the present invention is provided with a spherical contact portion having a brazing material or the like swelling over substantially the entire proximal side surface of the nail-shaped engaging portion.
Therefore, a nail-shaped pin that can be easily formed can be used, and a brazing material piece is placed on the base side surface of the engaging portion and is heated and melted, thereby easily forming a hemispherical spherical shape. A brazing material (solder material) can be welded. Moreover, such a nail-shaped pin with brazing material welded is used in large quantities in ceramic wiring boards,
After all, it can be obtained at low cost. Therefore, the pins are inexpensive and easily available, and the cost can be further reduced.

Further, according to the present invention, since the contact portion of the pin is spherical, the contact portion and the pin pad contact at substantially one point. Therefore, when the contact portion and the pin pad are soldered, the contact portion and the pin pad are easily shifted laterally, so that when a force due to the self-alignment effect is generated, the pin holding plate can be easily placed on the surface. , It is easy to automatically arrange the positional relationship between the contact portion and the pin pad at the correct position. Therefore, the contact portion and the pin pad can be securely joined at a predetermined position.

Here, in the pin standing plate, the conductor layer is formed only on the periphery of the through hole on the first main surface, and the base end of the pin and the conductor layer on the periphery of the through hole are provided. It is preferable to use a pin standing plate characterized by being soldered.

According to the present invention, the conductor layer is formed only on the periphery of the through hole of the first main surface of the pin holding plate, and is not formed on the periphery of the through hole or the inner wall of the through hole on the second main surface. The pin is fixed to the pin holding plate by soldering only the engagement portion of the base end of the pin and this conductor layer. For this reason, in this pin standing plate, for example, as described above,
Just forming a conductor layer on the periphery of the first main surface, such as forming a through hole in a pin holding plate with a metal foil stretched on the first main surface and forming a conductor layer on the periphery of the through hole by etching or the like. In this case, a step of plating the inner wall of the through-hole with through-holes is not required, so that a more inexpensive pin standing plate can be obtained.

Preferably, the pin standing plate is characterized in that an intermediate portion of the pin is press-fitted into the through hole. When the base end portion (engaging portion) of the pin and the conductor layer are soldered and the intermediate portion is pressed into the through hole of the pin holding plate, the pin is more firmly held by the pin holding plate. Because. On the other hand, the pin standing plate may be characterized in that an intermediate portion of the pin is loosely inserted into the through hole. Since the middle part of the pin is loosely inserted into the through-hole, the pin is inserted even when stress is applied, such as when inserting the pin into a pin insertion port or socket to mount the pin on another wiring board. This is because not only the tip portion but also the intermediate portion can be deformed to absorb and relieve stress.

Another solution is that the first wiring board has a substantially plate shape having a first wiring board main surface and a second wiring board main surface and is made of resin or a composite material containing resin. A wiring board having wiring formed on at least one of the surface, the second wiring board main surface, and the inside thereof, and a pin pad formed on the second wiring board main surface, and the pin erecting plate being attached to the pin pad. A resin wiring board formed by bringing the contact portions of the pins into contact with each other and soldering with a second solder material having a lower melting point than the solder material or the brazing material of the contact portions.

According to the present invention, this resin wiring board
A contact portion of each pin of the pin standing plate is brought into contact with a pin pad of a wiring board having a pin pad on the second main surface, and connected by soldering. Therefore,
As described above, between the pin holding plate and the wiring board, not only the pin engagement portion but also the contact portion are interposed. For this reason, in this resin wiring board, when the pin standing board and the wiring board are joined, the second solder material for soldering the pin abutting portion and the pin pad spreads laterally so that the adjacent input / output terminals As a result, a highly reliable resin wiring board can be obtained.

Further, as described above, since the contact portion having a solder material or a brazing material softer than the pin body is interposed between the pin engagement portion and the pin pad, a stress is applied between the pin and the pin pad. However, since the solder or brazing material in the contact portion is deformed to absorb and relax the stress, the connection strength is extremely high. Furthermore, since the surface of the contact portion has fine irregularities, the contact area between the second solder material and the contact portion increases when soldering the contact portion and the pin pad. Rather than using a pin with a smooth surface, the connection is tighter.

In particular, when the contact portion of the pin is a spherical contact portion, the spherical contact portion and the pin pad come into contact at substantially one point. For this reason, when soldering the wiring board and the pin holding plate, the pin standing plate is easily moved by the self-alignment effect, so that the positional relationship between the spherical contact portion and the pin pad is automatically set to the correct position. The resin wiring board is easily arranged, and the spherical contact portion and the pin pad are securely joined at a predetermined position.

Here, the second solder material for connecting the pin holding plate to the wiring board, that is, the second solder material for connecting the pin pad and the contact portion of the pin is a solder material or a brazing material of the contact portion of the pin. It may be selected in consideration of the soldering temperature of an electronic component to be mounted before or after it, and may be selected, for example, from a Pb-Sn-based solder material (for example, 37Pb).
-63Sn eutectic solder material, 50Pb-50Sn, 90Pb-10Sn, etc.), Sn
-Ag-based solder material (for example, 96.5Sn-3.5Ag). However, after the pins are soldered to the pin holding plate (conductor layer) with the first solder material, the pins are soldered to the pin pads with the second solder material. At this time, the first solder in which the pins are joined to the pin holding plate is used. The second solder material for joining the pin to the pin pad is preferably selected to have a lower melting point so that the material is not melted. Since the pin once fixed to the pin holding plate does not shift its position or come off from the pin holding plate due to re-melting of the first solder material, the pin standing plate and the wiring board are more securely connected. This is because it is possible to obtain a resin wiring board connected to the substrate.

The wiring board is provided with a wiring layer on at least one of the first wiring board main surface, the second wiring board main surface, and the inside thereof. It also includes a multi-layer structure. Examples of the resin forming the wiring board include resins such as epoxy resin, polyimide resin, BT resin, and PPE resin. Examples of the composite material include, for example, glass-epoxy resin, glass-BT resin, and the like, the above-mentioned resin impregnated and cured with an organic fiber such as glass fiber or polyamide fiber, and a resin such as alumina. Examples thereof include a composite material with a ceramic powder, and a composite material obtained by impregnating and curing an epoxy resin or the like into a fluororesin having a three-dimensional network structure such as continuous porous PTFE. The pin pad is a first pad of the wiring board.
On the main surface of the wiring board or the main surface of the second wiring board, refers to a portion where a pin is brought into contact and soldering is possible. Note that a resin wiring board may be formed by injecting resin into a gap between the pin holding plate and the wiring board and fixing the two. This is because the pin holding plate is more firmly fixed to the wiring board, and the reliability of the resin wiring board can be improved.

Another solution is that the first wiring board has a substantially plate shape having a first wiring board main surface and a second wiring board main surface and is made of resin or a composite material containing resin. A wiring board having wiring formed on at least one of the surface, the second wiring board main surface, and the inside, and a pin pad formed on the second wiring board main surface, and a first main surface and a second main surface. A pin holding member having a substantially plate shape and having a large number of through holes penetrating between the first main surface and the second main surface and at least a conductor layer formed at a periphery of the through hole in the first main surface. Board and
A distal end protruding from the second main surface side, an intermediate portion penetrating the through-hole, and a base end having a diameter larger than the distal end and the intermediate portion, wherein the base engages with the through-hole, An engaging portion soldered to the layer, and a melting point higher than that of a first solder material for soldering the engaging portion and the conductor layer, the fixing portion being fixed to a proximal side surface of the engaging portion and extending in a proximal direction. A base end portion having a contact portion having a swelling solder material or a brazing material,
And a plurality of pins soldered by a second solder material while the abutting portion abuts on the pin pad.

According to the present invention, the pins are joined and fixed to the wiring board on which the pin pads are formed on the one hand and to the pin holding plate on which the conductor layer is formed on the other hand. In other words, the pin and the wiring board are joined by soldering the contact portion bulging from the engaging portion of the base end portion of the pin and the pin pad in a contact state. The pin and the pin holding plate are fixed by soldering the engaging portion at the base end of the pin and the conductor layer formed on the pin holding plate. That is, between the wiring board and the pin holding plate, not only the pin engaging portion but also the contact portion intervenes. For this reason, the second solder material for soldering the pin contact portion and the pin pad is spread, and a short circuit does not occur between adjacent input / output terminals, so that a highly reliable resin wiring board can be obtained. it can.

Further, as described above, since the contact portion having a solder material or a brazing material softer than the pin body is interposed between the pin engagement portion and the pin pad, a stress is applied between the pin and the pin pad. However, since the solder material or the brazing material at the contact portion is deformed and absorbs the stress, the connection strength is extremely high. Furthermore, because it has fine irregularities on the surface of the contact part,
Since the contact area between the second solder material and the contact portion increases, the pin in the present invention is connected more firmly than the pin having a relatively smooth surface.

Here, in the above resin wiring board, the engaging portion is shaped like a nail head, and the abutting portion is substantially spherical in the base direction from substantially the entire proximal side surface of the engaging portion. It is preferable to provide a resin wiring board having the solder material or the brazing material bulging in a shape and a spherical contact portion contacting the pin pad.

In the present invention, a pin having a spherical contact portion having a brazing material or the like bulging over substantially the entirety of the proximal side surface of the nail-shaped engaging portion is used. Therefore, it is possible to use an easily formed nail-head-shaped pin (pin body) and use a general-purpose pin obtained by welding a brazing material to such a nail-head-shaped pin in a spherical shape. And an inexpensive resin wiring board can be obtained.

Here, in the resin wiring board, the conductor layer is formed only on the periphery of the through hole on the first main surface, and the base end of the pin and the conductor layer on the periphery of the through hole are formed. And a resin wiring board characterized by being soldered.

According to the present invention, the conductor layer is formed only on the periphery of the through hole of the first main surface of the pin holding plate, and formed on the inner wall of the through hole and the periphery of the through hole on the second main surface of the pin holding plate. Not done. Then, the pin and the pin holding plate are fixed by soldering only the engaging portion of the base end of the pin and this conductor layer. For this reason, as described above, this conductor layer is formed by, for example, forming a through hole in a pin holding plate having a metal foil on the first main surface and forming the conductor layer around the through hole by etching or the like. It may be formed around the through hole on the main surface,
Compared to forming a conductor layer by through-hole plating, less labor and cost are required, so that an inexpensive resin wiring board can be obtained.

The outer diameter of the intermediate portion and the inner diameter of the through hole are appropriately designed, and when the intermediate portion of the pin is pressed into the through hole, the joining strength of the pin can be further increased. On the other hand, when the inner diameter of the through hole is sufficiently larger than the outer diameter of the intermediate portion of the pin and the intermediate portion is loosely inserted into the through hole, the deformable portion of the pin increases, so that the resin wiring When the board is mounted on another wiring board, the stress applied to the pins by, for example, contacting the pin insertion port or the socket can be effectively absorbed. In addition, in the resin wiring board described above, resin is further injected into a gap between the pin holding plate and the wiring board,
A resin wiring board formed by fixing both may be used. This is because the pin holding plate is more firmly fixed to the wiring board, and the reliability of the resin wiring board can be improved.

[0033]

(Embodiment 1) Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. First, the pin standing plate 25 shown in FIG. 1A includes a substantially plate-shaped pin holding plate 21 which is not shown but has a substantially square shape in plan view. On the pin holding plate 21, a large number of pins 16 are inserted from the first main surface (upper surface in the drawing) 21A to the second main surface (lower surface in the drawing) 21B and stand upright. These pins have the second main surface 2
1B protrudes downward in the figure, and the base end side is the first main surface 2.
1A, and is fixed to the pin holding plate 21. As shown in FIG. 1B, this pin holding plate 21
A pin pad 14 of a wiring board 11 which is composed of a holding plate 21 body of a glass BT resin composite material having a thickness of 1 mm and which is to be joined later.
A large number of through holes 24 having a diameter of 0.45 mm are formed in correspondence with the positions of. Then, the first main surface 21A, the second
20 μm thick on the periphery of the through hole of the main surface 21B.
First through hole peripheral portion 22A, second through hole peripheral portion 22B
Is provided on the inner wall surface of the through hole 24 with an inner peripheral portion 22C having a thickness of
Is formed.

On the other hand, the pin 16 is
It has a distal end portion 16A that protrudes from the main surface 21B, an intermediate portion 16B that penetrates the through hole 24, and a base end portion 16C. Here, the tip portion 16A and the intermediate portion 16
B is in the shape of a rod having a diameter of 0.38 mm and a length of 2 mm.
Further, the base end portion 16C is provided with a nail-head-shaped engaging portion 17A (φ0.
6 mm × 0.2 mmt), and a spherical contact portion 17B that bulges into a substantially hemispherical shape (having a radius of about 0.3 mm) from the entire surface of the base side surface 17A1 of the engaging portion. The tip portion 16A, the intermediate portion 16B, and the engagement portion 17A of the pin 16 constitute a nail-head-shaped pin body 16P manufactured by integral molding,
In the present embodiment, it is made of Kovar (Fe-Ni-Co alloy). On the other hand, the spherical contact portion 17B is made of eutectic silver brazing (72A
g-28Cu: melting point 780 ° C). In addition, on the surface of the pin 16 (the pin body 16P and the spherical contact portion 17B),
As will be described later, although not shown, Ni-P plating (thickness: 2.5 μm) and Au plating (thickness: 0.05 μm) are applied to prevent oxidation and improve solderability.

The engaging portion 17A and the peripheral portion 22A of the first through-hole of the conductor layer 22, and the intermediate portion 16B and the inner peripheral portion 22C formed on the inner wall of the through-hole are respectively formed of the first solder material 23. The pins 16 are fixed to the pin holding plate 21 by being soldered. This first solder material 23
Can be soldered at a temperature at which the spherical contact portion 17B does not remelt at the time of soldering, and furthermore, it has been considered that the solder does not remelt at the temperature at which the wiring board or the IC chip is joined later. It has a melting point. In the present embodiment, since the melting point of the eutectic silver solder is sufficiently high (780 ° C.), it is not necessary to consider remelting of the spherical contact portion 17B. However, the soldering temperature of the wiring board to be joined later and the IC chip ic are not considered. In consideration of the soldering temperature (183 ° C.), a 95Sn-5Sb solder material (melting point: 238 to 240 ° C.) is used.

Next, the resin wiring board 10 having the pin standing plate 25 will be described with reference to FIG. The resin wiring board 10 shown in FIG. 2A has a substantially plate-like shape in plan view (not shown), and includes a pin holding plate 21 and a wiring board 11 having substantially the same size and a substantially square shape in plan view. On the second wiring main surface (lower surface in the figure) 11B, a pin standing plate 25 is provided.
Are joined by soldering the contact portion 17B of the pin and the pin pad 14. On the other hand, an IC chip ic can be mounted on the first wiring board main surface 11A of the wiring board 11 as shown by a broken line.

As shown in FIG. 2B, the wiring board 11
Insulating layers 12A, 12B, 12C made of epoxy material ...
Are stacked on the lower surface side of the insulating layer 12A in the figure.
A large number of pin pads 14 made of Cu plating with a thickness of 5 μm and Ni plating with a thickness of 5 μm are formed, and a solder resist layer 13 is formed so that the peripheral portion of the pin pad 14 slightly overlaps. The exposed portion of the pin pad 14 from the solder resist layer 13 has a diameter φ
0.9 mm. In the wiring board 11, vias 15A connected to or not connected to the pin pads 14 and internal wiring layers 15B are formed by a known method. For example, in the present embodiment, the via 15A is formed by piercing the insulating layer and then plating and filling with a conductive material to form the internal wiring layer 15B.
Are formed by plating.

The pin 1 on the pin pad 14 of the wiring board 11
The sixth spherical contact portion 17 </ b> B is fixed by soldering with the second solder material 18 so as to contact the pin pad 14. The second solder material 18 is provided on the spherical contact portion 17.
When soldering B to the pin pad 14, it has a melting point designed to prevent the spherical contact portion 17B and the solder material 23 fixing the pin 16 to the pin holding plate 21 from remelting. In the present embodiment, since the melting point of the eutectic silver solder is sufficiently high (780 ° C.), it is not necessary to consider remelting of the spherical contact portion 17B. Considering the soldering temperature of the IC chip ic, a 37Pb-63Sn solder material (melting point 183)
° C).

Further, the resin wiring board 10 as described above
Is between the pin holding plate 21 and the wiring board 11 by the height of the base end 16C of the pin, that is, the engaging portion 17A of the pin 16
In addition, a gap is left by the height of the contact portion 17B. For this reason, the second solder material 18 for soldering the pins 16 and the pin pads 14 does not spread laterally, and there is no short circuit between adjacent input / output terminals.

Further, the resin wiring board 10 is
1 and the pin standing plate 25 have high bonding strength, and even if a stress is applied between the pin 16 and the pin pad 14, this bonding portion does not break as in the conventional case, and practically sufficient bonding strength is obtained. is there. This is because between the engaging portion 17A of the pin 16 and the pin pad 14, a spherical contact portion 17B having a eutectic silver brazing material bulging substantially hemispherically from the engaging portion 17A and the second contact portion 17B are provided.
This is because the solder material 18 is interposed. Because
When compared by Young's modulus (kg / mm ² ), Kovar is 1
As can be seen from the fact that the eutectic silver brazing material is 9200 while the eutectic silver brazing material is 4000 to 15500, the brazing material and the solder material are soft and easily deformed. Therefore, the brazing material (the contact portion 17) interposed between the engagement portion 17 </ b> A and the pin pad 14.
It is considered that the stress is relieved by the deformation of B) and the second solder material 18, and the second solder material 18 is hardly broken. When the pin body 16P is made of 42 alloy or copper,
Young's modulus 42 alloy is 15000, oxygen-free copper is 1200
Since it is 0, the stress can be similarly reduced by the contact portion 17B and the second solder material 18.

Further, the pin body (for example, the engaging portion 17A)
Surface is relatively smooth, with a surface roughness of 0.05 to
Although it is about 0.5 μmRa, the spherical contact portion 17
B has a rough surface having a surface roughness of 0.5 to 5 μmRa. It is considered that when the silver brazing material cools and hardens, irregularities and voids are generated on the surface thereof, so that the irregularities remain even after the plating process, and the surface of the contact portion 17B becomes rough. When the surface is rough as described above, the contact area with the second solder material 18 is increased and the connection is further strengthened, which is considered to have also contributed to the improvement of the connection strength.

Next, a method of manufacturing the pin standing board 25 and the resin wiring board 10 will be described. Pin standing plate 2
5 is manufactured by the steps shown in FIGS. 3 (a) to 3 (c).
The pin holding plate 21 shown in FIG. 3A is formed by a known method. Specifically, a double-sided copper-clad laminate is prepared, a through-hole 24 is drilled at a predetermined position with a drill, and the periphery of the through-hole 24 and the inner wall of the through-hole 24 are plated with a through-hole by a subtractive method to form a conductor. The layer 22 (the first through-hole peripheral portion 22A, the second through-hole peripheral portion 22B, and the inner peripheral portion 22C) is formed. On the first through-hole peripheral portion 22A on the first main surface (upper surface in the drawing) 21A of the pin holding plate 21,
As shown in FIG.
A solder paste ST of n-5Sb solder material is applied.

Next, a large number of pins 16 each having a spherical contact portion 17B welded to the nail-head-shaped engaging portion 17A are prepared, and the pins 16 are inserted into the through holes 24 from the tips 16A. The pin 16 engages with the through-hole 24 at the nail-shaped base end portion 16C (engaging portion 17A) and stops. In this state, the solder paste ST is put into a reflow furnace (not shown) and heated (for example, in this embodiment, kept at a maximum of 260 ° C. and 240 ° C. or more for 100 seconds) to melt the solder paste ST, thereby obtaining FIG.
As shown in (1), the pin 16 is soldered to the pin holding plate 21 with the first solder material 23. At this time, the molten first solder material 23 spreads over the inner peripheral portion 22 </ b> C of the conductor layer 22, and the engaging portion 17 </ b> A of the pin 16 and the first through-hole peripheral portion 2.
2A, and the pin intermediate portion 16B and the inner peripheral portion 22C are fixed. At this time, since the melting point of the eutectic silver solder is 780 ° C., the spherical contact portion 17B keeps its original shape without re-melting, in this example, a substantially hemispherical shape. Thus, the pin standing plate 25 is completed.

Further, the resin wiring board 10 is formed as shown in FIG.
4A to 4C by using the pin standing plate 25 of FIG.
It is manufactured in the step (c). As shown in FIG. 4A, the wiring board 11 is formed by sequentially laminating insulating layers of a composite material by a known method, and has a second wiring board main surface (upper surface in the drawing).
11B is formed by Cu plating (with a thickness of 20 μm).
m), a large number (two in the figure) of pin pads 14 whose surfaces are plated with Ni (5 μm in thickness) are exposed. In addition,
In order to prevent the Ni plating layer from being oxidized, the exposed surface of the pin pad 14 is very thin (0.05 μm thick) plated with Au (not shown). As shown in FIG. 4B, a solder paste SP of 37Pb-63Sn solder material is applied to the pin pads 14 of the wiring board 11 by screen printing.

Next, the pin standing plate 25 of FIG. 3 (c) is turned upside down and placed on the wiring board 11 of FIG. 4 (b). The contact portion 17B is pressed against the solder paste SP on the pin pad 14. In this state, it is put into a reflow furnace (not shown) and heated (for example, in this embodiment, the maximum is 220 ° C.,
By holding the solder paste SP for 2 seconds, the pins 16 (spherical contact portions 17B) are soldered to the pin pads 14 with the second solder material 18, as shown in FIG. 4C. At this time, since the melting point of the eutectic silver solder is 780 ° C., the spherical contact portion 17B keeps its original shape without re-melting, in this example, a substantially hemispherical shape. For this reason, the engaging portion 17A and the pin pad 14 are soldered in a state where there is an interval of at least the height of the spherical contact portion 17B (about 0.3 mm in this example), and during this time, The silver brazing material (spherical contact portion 17B) and the second solder material 18 are interposed. For this reason, when soldering the pin 16 and the pin pad 14, the second solder material 18
Does not spread laterally, and there is no short circuit between adjacent input / output terminals.

The spherical contact portion 17B and the pin pad 1
4 is substantially in contact with one point, so that when heated, lateral displacement easily occurs between the spherical contact portion 17B and the pin pad 14. Therefore, when a force due to the self-alignment effect is generated, the pin holding plate 25 easily moves in the direction along the surface, so that the positional relationship between the spherical contact portion 17B and the pin pad 14 is automatically arranged at the correct position. Easy to be. Therefore, since the pin holding plate 25 and the wiring board 11 can be reliably connected, a highly reliable resin wiring board 10 can be obtained. Thus, the resin wiring board 10 is completed.

The pin body 16P having a nail-shaped head
The pin 16 having the spherical contact portion 17B formed by welding a silver brazing material substantially hemispherically to the head (engaging portion 17A) may be formed by a known method. For example, a silver brazing piece is placed on the base end side surface 17A1 of the engaging portion 17A (see FIG. 1B), heated to melt the silver brazing material, made hemispherical by surface tension, and then cooled to form a pin. And a method for obtaining No. 16.
According to this method, since the volume and thus the size of the spherical contact portion 17A are regulated by the volume (dimension) of the silver brazing piece, the use of a silver brazing piece having a uniform volume allows the uniform size of the silver brazing piece. It is preferable because the spherical contact portion 17A can be formed easily and inexpensively. Further, since the pins 16 having the silver brazing material fixed to the pin main body 16P are produced and used in large quantities in the production of ceramic PGA type wiring boards, they can be obtained easily and inexpensively, and the quality is stable. are doing. The pins 16 including the spherical contact portions 17B are pre-coated with Ni-P plating (2.5 μm in thickness) and Au plating (0.05 μm). This is to prevent oxidation of the pin body (Kovar portion) and to improve solderability. Also, after plating, to remove plating residue,
Preferably, heat treatment is performed. The heat treatment conditions are as follows:
The temperature is preferably from 150 to 450 ° C in a reducing atmosphere, and more preferably from 300 to 450 ° C. At 150 ° C. or higher, residual moisture can be removed, and at 300 ° C. or higher, organic residues can be removed. When the temperature reaches 450 ° C. or higher,
The Au plating is completely diffused during the Ni plating, and the wettability of the solder is extremely deteriorated.

The pin 16 includes a pin P2 having a protruding portion P2B (see FIG. 7) used in the prior art and a spherical contact portion also made of Kovar, and the pin body 16P (tip portion 16A, intermediate portion 16B). And it is easier and cheaper to manufacture than one molded integrally with the engaging portion 17A). In order to form such an integrally molded pin, it is necessary to form the spherical contact portion by machining or by using a specially shaped press die, and this increases the unit cost of the pin. As can be easily understood from the above, the height of the spherical contact portion 17B is determined by taking into consideration the diameter of the pin pad 14 and the diameter of the engaging portion 17A, and the like. 11
Second main surface 11B of first wiring board and first main surface 2 of pin holding plate 21
1A may be appropriately selected in order to restrict the distance to a desired range, and the shape may be approximately spherical.

(Embodiment 2) Next, a second embodiment will be described with reference to FIG. The present embodiment differs from the first embodiment only in the shape of the pins, and therefore only different portions will be described, and description of similar portions will be omitted or simplified. As can be seen from FIG. 5, a pin 36 having a nail-head-shaped engaging portion 37A is erected on the pin erected plate 45 according to the present embodiment, as in the first embodiment. This pin 3
A contact portion 37B is formed on the engaging portion 37A of FIG. 6 by adhering a eutectic silver brazing material that swells in a substantially hemispherical shape. It protrudes from a part of the joint portion 37A, more specifically, from a substantially central portion of the base side surface 37A1.

The resin wiring board 30 according to the present embodiment is
As in the first embodiment, the pin standing plate 45 is joined by bringing the contact portion 37B of the pin 36 into contact with the pin pad 14 of the wiring board 11 and soldering the same. For this reason, the volume ratio of the second solder material 18 interposed between the engagement portion 37A and the pin pad 14 can be relatively increased as compared with the first embodiment (see FIG. 2B). Also,
The distance between the engagement portion 37A and the pin pad 14 can be reduced. Also in the resin wiring board 30 of the present embodiment, since the silver brazing material (the contact portion 37B) and the second solder material 18 are interposed between the engaging portion 37A of the pin 36 and the pin pad 14, The connection strength of the pin 36 can be increased.

The method of manufacturing the resin wiring board 30 of the present embodiment is the same as that of the first embodiment, except that the manufacturing of the pins 36 is slightly different. The pin 36 used in the present embodiment is, for example, similar to the first embodiment,
After the silver brazing material is welded to the 6P in a substantially hemispherical shape, an etching solution for dissolving the silver brazing (for example, GSS manufactured by Kojima Chemical Co., Ltd.)
D7, etc.) to reduce the volume and size of the material.

(Embodiment 3) Next, a third embodiment will be described with reference to FIG. This embodiment is different from the first embodiment only in the joint portions between the conductor layer and the pins and the conductor layer. Therefore, only the different portions will be described, and the description of the similar portions will be omitted or simplified. As can be seen from FIG. 6, the pin standing plate 65 according to the present embodiment
Reference numeral 2 is formed only at the portion corresponding to the first through-hole peripheral portion 22A in the first embodiment, that is, at the periphery of the through-hole 64 in the first main surface 61A of the pin holding plate 61. And pin 16
The pin holding plate 61 is fixed by soldering only the conductor layer 62 and the engaging portion 17A with the first solder material 63.

The resin wiring board 50 according to this embodiment is
Similar to the first embodiment, the pin standing plate 65 is joined by bringing the contact portion 17B of the pin 16 into contact with the pin pad 14 of the wiring board 11 and soldering the same. The amount of the first solder material 63 is the same as the first solder material of the first embodiment.
It is better to keep the amount smaller than the solder material 23. As can be seen from this figure, since the intermediate portion 16B of the pin 16 is loosely inserted without being pressed into the through hole 64, the deformable portion of the pin 16 is larger than in the first embodiment. Therefore, when the resin wiring board 50 is inserted into a through hole formed in a printed wiring board (not shown) or inserted into a socket, stress applied to the pins 16 can be effectively absorbed. .

The method of manufacturing the resin wiring board 50 of the present embodiment is substantially the same as that of the first embodiment, except that the method of manufacturing the pin holding plate 25 is different. A through hole 64 is formed by drilling a predetermined position on a copper-clad laminate having only one side covered with copper foil. Thereafter, the conductor layer 62 is formed on the periphery of the through hole 64 by etching, and the pin holding plate 6 is formed.
Let it be 1. For this reason, the plating process becomes unnecessary, so that the conductor layer 22 is formed by performing the through-hole plating on the periphery of the through hole 24 and the inner wall of the through hole 24 by the subtractive method or the like as in the first embodiment. In comparison,
No hassle or cost.

In the above, the present invention has been described with reference to the respective embodiments. However, the present invention is not limited to the above embodiments, and it can be said that the present invention can be appropriately modified and applied without departing from the gist thereof. Not even. For example, eutectic silver brazing is used for the spherical contact portions 17B and 37B, but gold-based brazing material or another silver brazing material, or first soldering materials 23 and 63 used for soldering, and second soldering material are used. Obviously, a solder material having a higher melting point than the material 18 (for example, 95Pb-5Sn) may be used. The contact portions 17B and 37B are
Each of the portions in contact with the pin pad 14 has a hemispherical spherical contact portion 17B, 37B, but may have a columnar, conical or other shape. Also in this case, similarly, the brazing material or the second solder material 18 is interposed between the engaging portions 17A, 37A and the pin pad 14, so that the stress can be reduced. However, in consideration of the ease of manufacturing the pin, it is preferable to use a pin having a spherical contact portion.

In the above embodiment, the pin holding plate 2
The pins 16 and 36 are fixed to the pins 1 and 61,
45, 65, and the pin standing plate 25 and the like are joined to the wiring board 11 to manufacture the resin wiring boards 10, 30, and 50. However, the manufacturing method is not limited to this. After the pins 16 and 36 are fixed, the pin holding plate 21 and the like may be fixed thereto. Further, in the above embodiment, after manufacturing the resin wiring boards 10, 30, 50,
The C chip ic is mounted, but the IC chip ic is mounted
It is not necessary to complete the resin wiring boards 10, 30, 50 after completion. For example, after mounting the IC chip ic on the wiring board 11, this wiring board 11 is connected to the pin standing boards 25, 45, 65. You may do it.

[Brief description of the drawings]

FIG. 1A is an overall view and FIG. 1B is a partially enlarged sectional view of a pin standing plate according to an embodiment.

FIG. 2 shows a resin wiring board according to the embodiment;
(A) is an overall view, (b) is a partially enlarged sectional view.

3A and 3B are explanatory diagrams illustrating a method of manufacturing the pin standing plate and the resin wiring board according to the embodiment, wherein FIG. 3A illustrates a pin holding plate, and FIG. 3B illustrates penetration of a first main surface of the pin holding plate. A step of printing a first solder material on the periphery of the hole and the through hole, and (c)
Indicates a step of erecting the pins on the pin holding plate and fixing the pins to form a pin erecting plate.

FIG. 4 is an explanatory view showing a method for manufacturing a resin wiring board according to the embodiment, wherein (d) shows a wiring board, and (e) shows a step of printing a second solder material on pin pads of the wiring board. (F) shows a step of joining a pin standing board to a wiring board to produce a resin wiring board.

FIG. 5 is a partially enlarged cross-sectional view showing a structure of a resin wiring board according to another embodiment, showing a nail-shaped engaging part provided with a contact part in a part thereof.

FIG. 6 is a partially enlarged cross-sectional view showing a structure of a resin wiring board according to another embodiment, in which a conductor layer formed only on the periphery of a through hole of a first main surface and an engaging portion are fixed. .

FIG. 7 shows a pin having a nail-shaped head fixedly mounted on a pin holding plate with a first solder material. The pin head is mounted on a pin pad provided on the main surface of the second wiring board of the wiring board. It is a partial expanded sectional view of the conventional resin-made wiring board joined by soldering.

FIG. 8 shows a nail-shaped pin having a protruding portion fixedly mounted on a pin holding plate with a first solder material. The protruding portion of the pin is attached to a pin pad provided on the main surface of the second wiring board of the wiring board. FIG. 5 is a partially enlarged cross-sectional view of a conventional resin wiring board which is brought into contact, soldered, and joined.

[Explanation of symbols]

 10, 30, 50 Resin wiring board 11 Wiring board 11A First wiring board main surface 11B Second wiring board main surface 12A, 12B, 12C Insulating layer 14 Pin pad 16, 36 pin 16A, 36A Tip portion 16B, 36B Intermediate portion 16C , 36C Base end portion 17A, 37A Engagement portion 17B, 37B Contact portion 21, 61 Pin holding plate 21A, 61A First main surface 21B, 61B Second main surface 22, 62 Conductive layer 22A First conductive layer peripheral portion 24 , 64 Through hole 25, 45, 65 Pin standing plate

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Nobuhiko Miyawaki 14-18 Takatsuji-cho, Mizuho-ku, Nagoya Japan Special Ceramics Co., Ltd. F-term 5F067 AA18 AB07 BB20 DD06 DD07

Claims (7)

[Claims] 1. A substantially plate-like shape having a first main surface and a second main surface, a large number of through holes penetrating between the first main surface and the second main surface, and at least the first main surface. A pin holding plate having a conductor layer formed on the periphery of the through hole on the surface, a tip protruding from the second main surface side, an intermediate part penetrating the through hole, the tip part and the intermediate part A larger diameter base end portion, which is engaged with the through hole and soldered to the conductor layer; and a first solder material for soldering the engagement portion and the conductor layer. A high-melting-point base portion having a contact portion having a solder material or a brazing material that is fixed to the base side surface of the engaging portion and swells in the base direction. Pin upright board. 2. The pin standing plate according to claim 1, wherein the engaging portion is shaped like a nail head, and wherein the abutting portion extends from substantially the entire proximal side surface of the engaging portion. A pin upright plate, which is a spherical contact portion having the solder material or the brazing material bulging in a substantially spherical shape in a direction. 3. The pin standing plate according to claim 1, wherein the conductor layer is formed only on a periphery of the through hole on the first main surface, and a base end of the pin is provided. And a conductor layer on the periphery of the through hole is soldered. 4. A substantially plate-like shape having a first wiring board main surface and a second wiring board main surface, the first wiring board main surface and the second wiring board being made of resin or a composite material containing resin. 4. A wiring board having wiring formed on at least one of the main surface and the inside and a pin pad formed on the second wiring board main surface, and the pin standing board according to claim 1. 5. And a resin wiring board formed by contacting the contact portion of the pin with the pin pad and soldering with a second solder material having a lower melting point than the solder material or the brazing material of the contact portion. . 5. A first wiring board main surface and a second wiring board which have a substantially plate shape having a first wiring board main surface and a second wiring board main surface and are made of resin or a composite material containing resin. A wiring board having wiring formed on at least one of the main surface and the inside and a pin pad formed on the second wiring board main surface; and a substantially plate shape having a first main surface and a second main surface. A pin holding plate having a large number of through holes penetrating between the first main surface and the second main surface, and a conductor layer formed at least on a periphery of the through hole in the first main surface; A leading end protruding from the main surface side, an intermediate part penetrating the through-hole, and a base end larger in diameter than the distal end and the intermediate part. And a melting point higher than that of the first solder material for soldering the engagement portion and the engagement portion and the conductor layer. A base end portion having a contact portion having a solder material or a brazing material fixed to the base side surface of the engagement portion and bulging in the proximal direction, wherein the contact portion contacts the pin pad. And a number of pins soldered with a second solder material. 6. The resin wiring board according to claim 5, wherein said engaging portion is shaped like a nail head, and said abutting portion extends from substantially the entire proximal side surface of said engaging portion to said base end. A resin wiring board, comprising: the solder material or the brazing material bulging in a substantially spherical shape in a direction, and a spherical contact portion in contact with the pin pad. 7. The resin wiring board according to claim 5, wherein the conductive layer is formed only on a periphery of the through hole on the first main surface, and a base end of the pin is provided. And a conductor layer on the periphery of the through hole is soldered.