JP2002280695A - Printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a printed wiring board which can suppress resistance to a low level even if a distance of wirings is prolonged by restrictions, etc., of electronic devices. SOLUTION: In a wiring board, as a conductive pattern P formed on a first base 1 by printing is mutually and conductively connected to a conductor 10a stitched together with a second base 9, the resistance of wirings by the conductor 10a can be reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a wiring board used for electronic equipment such as a video camera.

[0002]

2. Description of the Related Art A conventional wiring board is made by screen-printing a conductive paste such as silver on a synthetic resin sheet-like film to form a contact portion of a switch and an electrode portion on which electric components are mounted.
In addition, a desired wiring pattern including a lead wire drawn from a contact portion, an electrode portion, or the like is formed.

[0003]

However, in the conventional wiring board, since all the wiring patterns are formed by printing a conductive paste, the conductive resistance of the wiring pattern is high. In addition, there is a problem that a relatively large voltage drop occurs and the longer the wiring pattern is, the more significant the voltage drop is. For this reason, when power is supplied to an electric component such as an LED through a long wiring pattern, there is a problem that the LED is darkened.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a wiring board which can keep the conduction resistance low even when the distance becomes long due to restrictions of electronic equipment.

[0005]

Means for Solving the Problems As a first means for solving the above problems, an insulating first base material and a conductive pattern formed by printing on the first base material are described. A second base member made of an insulating sheet having flexibility, and two wires sewn to the second base material, at least one of the wires is formed of a conductive wire, Wiring was formed, and the conductive wire and the conductive pattern were electrically connected to each other.

[0006] As a second solution, an insulating adhesive is provided between the first base material and the second base material, and the first and second base materials are provided by the first and second base materials. The conductive wire and the conductive pattern were electrically connected to each other by being bonded and integrated with an adhesive. As a third solution, the adhesive is formed from a thermosetting adhesive.

Further, as a fourth solution, the adhesive is removed by the conductive wire by heating and pressurizing the conductive wire in a state where the conductive wire is positioned on the adhesive provided on the conductive pattern. In addition, the conductive wire and the conductive pattern are brought into contact with each other so as to be electrically connected to each other, and the first and second base materials around the conductive wire are adhered to each other to be integrated. As a fifth solution, the conductive wire and the conductive pattern are electrically connected to each other by a conductive connector.

[0008] As a sixth solution, the conductive pattern has at least two connection portions provided at an interval, and the two connection portions are electrically connected to each other by the conductive wire. The configuration was adopted. As a seventh solution, the second base material is formed in a belt shape, and the conductive wire is disposed along the longitudinal direction.

According to an eighth aspect of the present invention, the conductive pattern has a pair of patterns provided at an interval, and an electric component is mounted in a state of being electrically connected to the pair of patterns. A configuration in which at least two of the conductive wires provided on the second base material are conductively connected to the pair of patterns, respectively, and a voltage is applied to the electric component via the two conductive wires; did. As a ninth solution, one of the wires is formed of the conductive wire made of a metal wire, and the other of the wires is formed of an insulating yarn that is more flexible than the conductive wire.

[0010] As a tenth solution means, the second
On one surface side of the base material, the conductive wire is arranged, and on the other surface side of the second base material, the yarn is arranged, and the yarn penetrates from the other surface side to the one surface side. A configuration in which the conductive wire is held by being entangled with the conductive wire, the one surface side of the second base member is opposed to the first base material, and the conductive wire and the conductive pattern are electrically connected to each other. And Further, as an eleventh solution, the conductor is used as a lower thread of a sewing machine, and the thread is used as an upper thread passed through a hole of a needle of the sewing machine. The base material was sewn to the second base material.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to the drawings of a wiring board according to the present invention, FIG. 1 relates to a first embodiment of a wiring board according to the present invention and is an exploded plan view, and FIG. FIG. 3 is an enlarged cross-sectional view of a main part of the second substrate according to the embodiment, FIG. 3 is an enlarged cross-sectional view of a main part of the wiring board according to the first embodiment of the present invention, and FIG. 5 is an enlarged sectional view of a main part showing a manufacturing method according to a first embodiment of the wiring board of the present invention. FIG. 6 is a sectional view showing a manufacturing method according to the first embodiment of the wiring board of the present invention. FIG. 6 is a sectional view taken along line 6-6 of FIG.

FIG. 7 is an exploded plan view of a second embodiment of the wiring board of the present invention, and FIG. 8 is an exploded view of a second base member of the second embodiment of the wiring board of the present invention. FIG. 9 is an enlarged perspective view of a main part of the wiring board according to a second embodiment of the present invention, and FIG. 10 is an enlarged cross-sectional view of a main part of the second base member, and FIG. FIG. 11 is a cross-sectional view taken along line 11-11 of FIG. 10, and FIG. 12 is an enlarged cross-sectional view of a main part showing a manufacturing method according to a third embodiment of the wiring board of the present invention. FIG. 13 is a cross-sectional view taken along line 13-13 of FIG. 12 showing a manufacturing method according to a third embodiment of the wiring board of the present invention.

Next, the structure of the first embodiment of the wiring board according to the present invention will be described with reference to FIGS. 1 to 6. The first insulating base material 1 is made of a synthetic resin such as polyester or polyimide. It is made of a flexible sheet-like film or a hard plate-like insulating substrate, and has a wide and rectangular base 1a and a drawer 1b connected to the base 1a and extending in a strip shape.

A conductive pattern P formed by printing a conductive paste of silver or the like includes a plurality of fixed contacts 2a, 2b and 3a, 3b provided on a base 1a, and a plurality of fixed contacts 2a and 2b.
a pattern portion 4a drawn from a, 2b, and 3a, 3b to the end of the drawing portion 1b, and the pattern portions 4a
And a connection terminal 4b provided at one end of the connection terminal.

The conductive pattern P includes a pair of first patterns 5 provided on the base 1 a, a pair of connecting portions 5 a provided on one end of the first pattern 5, and a first pattern 5. A pair of land portions 5 provided at positions facing each other
b, a pair of second patterns 6 provided on the base 1 a at a distance from the first pattern 5, a pair of connecting portions 6 a provided on one end of the second pattern 6, And a pair of land portions 6b provided at positions facing the pattern 6.

Then, the second pattern 6 is provided with the drawer 1b.
And a connection terminal portion 6c is provided at one end thereof, and the connection terminal portion 6a is arranged side by side with the connection terminal portion 4b of the pattern portion 4a. Further, the C-shaped fixed contacts 2a, 3a are formed so as to surround the circular fixed contacts 2b, 3b, and the C-shaped fixed contacts 2a, 3b are formed.
a on the pattern portion 4a provided in the notch portion
An insulating resist layer 7 is provided.

Although not shown here, the conductive pattern P except for the fixed contacts 2a, 2b, 3a, 3b, the connecting portions 5a, 6a, the lands 5b, 6b, and the connecting terminals 4b, 6c, The surface of the base material 1 is provided with an insulating resist layer. The electrical component 8 is L
In this embodiment, two electric components 8 made of an ED or the like are connected to a pair of land portions 5b and a pair of land portions 6b by solder, respectively. Connected to pattern 5 of one and another one
The individual electric components 8 are connected to the second pattern 6.

Although not shown here, the outer peripheral edge of the dome-shaped movable contact made of a metal plate having a spring property comes into contact with the C-shaped fixed contacts 2a and 3a, respectively, and the top of the movable contact is respectively formed. A push-type switch is formed so as to face the circular fixed contacts 2b and 3b. The movable contact is insulated from the fixed contacts 2b and 3b by the resist layer 7, and when the movable contact is pressed, the movable contact reverses and the top contacts the fixed contact 2b or 3b, and the fixed contact 2a , 2b or between the fixed contacts 3a, 3b are turned on, and when the pressing of the movable contact is released, the movable contact self-returns to its original state,
The fixed contacts 2a and 2b or the fixed contacts 3a and 3b are turned off.

The insulating second substrate 9 is made of a flexible sheet-like film or cloth made of a synthetic resin such as polyester or polyimide, and is formed of a rectangular strip. One of the two wires 10 is made of a conductive wire 10a, the other is made of an insulative yarn 10b.
a is a copper wire, an alloy wire made of an alloy of silver and copper, or a metal wire made of a gold wire or the like, or a conductive wire other than a metal wire made of a conductive resin or the like, and has a wire diameter of about 50 μm. , An oval line, or a square line such as a square.

The flexible yarn 10b is made of polyester,
Insulating material such as nylon, cotton, or silk, and made of fiber such as polyester, cotton, or silk. In this embodiment, a yarn 10b of polyester having a yarn type of 100 is used. As the wire 10b, a wire having greater flexibility than the conductive wire 10a is used. Then, as shown in FIG. 2, the conducting wire 10a is arranged on one surface side of the second base material 9, and the yarn 10b is arranged on the other surface side of the second base material 9. Conductor 10a located at
To hold the conducting wire 10a. Also,
The lead wire 10a and the thread 10b are sewn to the second base material 9 using the lead wire 10a for the lower thread of a sewing machine (not shown) and the thread 10b for the upper thread passing through the needle hole of the sewing machine. It is designed to be machined.

When the conductor 10a and the thread 10b are sewn together, as shown in FIG. 2, the conductor 10a is arranged so as to extend on one side of the second base material 9, and the conductor 10a
On the other hand, the thread 10b penetrates from the other surface of the second base material 9 to the one surface, and is entangled with the conductor 10a to hold the conductor 10a. That is, the flexibility of the conductive wire 10a is small, and therefore, the conductive wire 10a is extended on one surface side without being bent toward the other surface side of the second base material 9. Further, in this manner, the conductor 10a is arranged on one surface side of the second base member 9 to form a wiring. In this embodiment, the two conductors 10a are arranged in the longitudinal direction of the second base member 9 in the longitudinal direction. The wirings are arranged in parallel.

Then, as shown in FIGS. 3 and 4, the second base material 9 to which the conductive wires 10a are sewn is provided with the side provided with the conductive wires 10a facing the first base material 1, and The two substrates 1 and 9 are superimposed on each other, and two respective conductors 10
a is a connecting portion 5a of the first and second patterns 5 and 6,
The first and second base materials 1 and 9 are bonded and integrated by a thermosetting insulating adhesive 11 in a state where they are pressed into contact with each other and are electrically connected to each other. I have. With such a configuration, the first and second patterns 5 and 6 are electrically connected by the conductor 10a,
The adhesive 11 has a strong state in which the first and second base materials 1 and 9 around the conducting wire 10a are adhered to each other.

Next, a method of connecting the conductive wire 10a to the conductive pattern P will be described with reference to FIGS. 5 and 6. First, the connection between the connection portions 5a and 6a of the first and second patterns 5 and 6 and the first
A thermosetting and insulative adhesive 11 such as an epoxy adhesive which is in a liquid state at room temperature is applied on the base material 1. Next, in a state where the second base material 9 is opposed to the first base material 1 and the conductive wire 10a is mounted on the adhesive 11, the first and second base materials 1 and 2
9. A thermocompression punch (not shown) is pressed from above and below 9.

Then, for example, with the temperature of the thermocompression bonding punch set at 180 to 190 ° C., the required time (30 to 60)
When the first and second base materials 1 and 9 are pressurized and heated for 2 seconds, the liquid adhesive 11 located under the conductive wire 10a
Is removed by pressurization, and the conductor 10a and the connection portion 5 are removed.
a and 6a are in contact with each other. Also, like this:
When the required time elapses in a state where the conductive wire 10a and the connecting portions 5a and 6a are pressed against each other, the adhesive 11 is hardened, and as shown in FIGS.
The substrates 1 and 9 are bonded together and integrated,
The conductor 10a and the connection portions 5a and 6a are in a state of being electrically connected to each other, and the manufacture thereof is completed.

The wiring board having such a configuration is incorporated in various electronic devices, and the connection terminal 4
The connectors b and 6c are connected to a connector (not shown) or the like, and used while being connected to a desired circuit. The pair of connection terminals 6c are supplied with power by applying a voltage. Then, a voltage is applied to the pair of second patterns 6 which are relatively short, and the voltage drop due to the second patterns 6 is small. Therefore, the electric components 8 connected to the second patterns 6 are formed.
LED illuminates in a state of high luminance.

The voltage applied to the second pattern 6 is supplied to the first pattern 5 which is relatively long away from the second pattern 6 through the two conductors 10a. Due to the small voltage drop due to
LED, which is an electric component 8 connected to the pattern 5 of
The light comes to be illuminated with high brightness.

FIGS. 7 to 9 show a second embodiment of the wiring board according to the present invention. The structure of the second embodiment will be described.
A conductive pattern P formed by printing a conductive paste such as silver is provided on a rectangular first base material 1 made of the same material as in the first embodiment, as in the first embodiment. And
The conductive pattern P includes a pair of fixed contacts 2a, 2b,
It has a pattern part 4a which is routed from these fixed contacts 2a, 2b to the end of the first base material 1, and a connection terminal part 4b provided at one end of these pattern parts 4a.

The conductive pattern P includes a pair of first patterns 5 provided on the base 1 a, a pair of connecting portions 5 a provided at one end of the first pattern 5, and a first pattern 5. A pair of land portions 5 provided at positions facing each other
b. As in the case of the first embodiment, the C-shaped fixed contact 2a is formed so as to surround the circular fixed contact 2b and is provided in the cutout of the C-shaped fixed contact 2a. On the pattern portion 4a, an insulating resist layer 7 is provided.

Further, similarly to the first embodiment, although not shown here, the fixed contacts 2a and 2b, the connecting portion 5a,
The conductive pattern P excluding the land portions 5b and the connection terminal portions 4b and the surface of the first base material 1 are provided with an insulating resist layer. Then, an electric component 8 composed of an LED is connected to the pair of land portions 5b by soldering.

The strip-shaped second base material 9 made of the same material as that of the first embodiment is provided with the same material as that of the first embodiment.
According to the method, the two wires 10 of the conducting wire 10a and the thread 10b are sewn together, and a wire including four conducting wires 10a is provided along the longitudinal direction of the second base material 9.
A plurality of terminal plates 12 made of a metal plate are caulked near the end of the second base member 9, and each terminal plate 12 is connected to one conductor 10 a. ing.

The four conductive wires 10a sewn to the second base material 9 are made of an adhesive 11
As a result, they are electrically connected to the pair of connecting portions 4b and the pair of connecting portions 5a, respectively. The configuration and method of this connection are the same as in the first embodiment, and a description thereof will be omitted.

The wiring board having such a configuration is used in a state where it is incorporated in various electronic devices and the terminal plate 12 is connected to a connector (not shown) or the like and connected to a desired circuit. At the same time, a voltage is applied to the pair of terminal plates 12 connected to the first pattern 5 and the conductive wire 10a to be supplied with power. Then, the voltage is supplied to the first pattern 5 relatively long away from the terminal plate 12 through the two conductors 10a, and the voltage drop due to the conductor 10a is small. The LED as the connected electric component 8 is illuminated in a state of high luminance.

FIGS. 10 to 13 show a third embodiment of the wiring board of the present invention. The structure of the third embodiment will be described.
are electrically connected to each other by a conductive connector 13 such as a low melting point solder or a conductive adhesive. FIG. 1 shows a method of connecting the conductive wire 10a to the conductive pattern P.
2. Referring to FIG. 13, first, a conductive connecting body 13 made of a paste-like conductive adhesive is applied on the connecting portion 5a of the conductive pattern P and the first base material 1.

Next, in a state where the second base material 9 is opposed to the first base material 1 and the conductive wire 10 a is placed on the conductive connecting body 13, heating is performed to dry the conductive connecting body 13. I do. Then
The conductive connector 13 is cured, and as shown in FIGS. 10 and 11, the first and second base materials 1 around the conductive wire 10a.
9 are adhered to each other and integrated, and the conductor 10a
And the connection portion 5a are electrically connected to each other by the conductive connection body 13, and the manufacture thereof is completed.

When the conductive connector 13 is formed of a conductive adhesive such as a silver paste, a binder made of a thermosetting resin or a thermoplastic resin may be used.

A connection method when a low-melting solder, which is a solder, is used as the conductive connector 13 will be described. First, a paste-like material is formed on the connection portion 5a of the conductive pattern P and the first base material 1. A conductive connector 13 made of solder cream having a low melting point (melting point of 120 to 150 ° C.) is applied. Next, with the second base material 9 facing the first base material 1,
In a state where Oa is placed on the conductive connecting body 13, these are transported to a heating furnace to melt the low melting point solder cream, and then transported out of the heating furnace and left. Then, the conductive connector 13 is solidified, and the conductive wire 10a and the connection portion 5a are electrically connected to each other by the conductive connector 13, thereby completing the manufacturing.

When the conductive wire 10a is connected to the conductive pattern P, the connection of the LED, which is the electrical component 8, to the conductive pattern P can be performed simultaneously. That is, a low melting point solder cream is applied on the land portion of the conductive pattern P, and the LED is placed on the low melting point solder cream, and is conveyed to a heating furnace. This can be performed simultaneously with the connection of P.

In the third embodiment, since the other structure is the same as that of the first embodiment or the second embodiment, the same parts are denoted by the same reference numerals and the description thereof will be omitted. I do.

Although the yarn 10b in the above embodiment has been described as being formed of an insulating fiber,
A conductive wire having greater flexibility than 0a may be used. In the above embodiment, the connection portions 5a and 6a provided on the conductive pattern P are described as being provided at the ends of the patterns 5 and 6. However, the connection portions 5a and 6a are provided on the patterns 5 and 6.
May be provided in the middle part of.

[0040]

According to the wiring board of the present invention, the conductive pattern P formed on the first base material 1 by printing and the conducting wire 10a sewn on the second base material 9 are electrically connected to each other. In addition, the conduction resistance of the wiring by the conductor 10a can be reduced.
For this reason, even if the distance to the LED, which is the electric component 8, is increased due to restrictions on electronic devices, the conduction resistance can be suppressed to be low, and the LED with good brightness can be obtained.

An insulating adhesive 11 is provided between the first substrate 1 and the second substrate 9, and the first and second substrates 1 and 9 are bonded by the adhesive 11. As a result, the conductive wire 10a and the conductive pattern P are conductively connected to each other. Therefore, even if the conductive pattern P is provided in a close state, the conductive wire 10a is undesirably conductive by the insulating adhesive 11. Short circuit). In addition, the first and second
Since the base materials 1 and 9 are bonded by the adhesive 11, the two can be firmly bonded to each other and can be provided without peeling.

Further, since the adhesive 11 is formed of a thermosetting adhesive, even if the temperature in the electronic device rises, there is no peeling between the first and second base materials 1 and 9 and the reliability is improved. We can provide high prices.

Further, by applying heat and pressure while the conductive wire 10a is positioned on the adhesive 11 provided on the conductive pattern P, the adhesive 11 is removed by the conductive wire 10a, and the conductive wire 10a and the conductive pattern P are removed. And the first and second base materials 1 and 9 around the conductor 10a are adhered and integrated with each other, so that the connection between the conductor 10a and the conductor pattern P is ensured. Along with
Adhesion between the first and second base materials 1 and 9 is strengthened, and a material without peeling can be provided.

Since the conductive wire 10a and the conductive pattern P are conductively connected to each other by the conductive connector 13, when the conductive connector 13 is made of a conductive adhesive, a thermocompression punch (hot press) or the like is used. The conductive wire 10a and the connection portion 5a can be electrically connected to each other by the conductive connection body 13 without using the conductive wire. When the conductive connector 13 is made of low-melting solder, the connection between the conductive wire 10a and the conductive pattern P is performed.
The connection of the LED, which is the electric component 8, to the conductive pattern P can be performed at the same time, and a product with good productivity can be obtained.

The conductive pattern P has at least two connection portions 5a and 6a provided at intervals, and the two connection portions 5a and 6a are electrically connected to each other by the conducting wire 10a. Since the conduction resistance between the connection portions 5a and 6a can be suppressed and the voltage drop due to the conductor 10a is small, even if there is a relatively long distance, the LED as the electric component 8 connected to the conductive pattern P ,
Illumination can be performed in a state of high luminance.

The second base member 9 is formed in a belt shape,
Since the conducting wire 10a was arranged along the longitudinal direction,
A conductor obtained by sewing the conductive wire 10a to the band-shaped second base material 9 in advance can be prepared and cut to a predetermined length for use, and the versatility of the second base material 9 can be improved. .

The conductive pattern P has a pair of patterns 5 provided at an interval, and an electric component 8 is mounted in a state of being electrically connected to the pair of patterns 5. 9 at least two wires 1
0a are conductively connected to the pair of patterns 5, respectively.
Since the voltage is applied to the electric component via the conductor 10a, the voltage drop due to the conductor 10a is small, and thus the LE as the electric component 8 connected to the pattern 5 is formed.
D can be illuminated with high brightness.

Further, one of the wires 10 is formed of a conductive wire 10a made of a metal wire, and the other of the wires 10 is formed of an insulating thread 10b which is more flexible than the conductive wire 10a. Also, by using the flexible yarn 10b, the wire 10 can be stitched to the second base material 9 without difficulty, the wire 10 is hardly broken, and the reliability can be improved.
Further, by forming the yarn 10b with an insulating material,
The flexibility is enhanced, the yarn 10b is hard to be cut, the productivity is good, and a cheap one can be obtained.

On one surface side of the second base material 9,
0a is arranged, and on the other surface side of the second base material 9,
The yarn 10b is arranged, the yarn 10b penetrates from the other surface to the one surface, is entangled with the conductor 10a and holds the conductor 10a, and the one surface of the second base material 9 is connected to the first base material 1. Since the conductive wire 10a and the conductive pattern P are conductively connected to each other so as to face each other, the highly flexible thread 10b is sewn so as to penetrate the second base material 9, so that the conductive wire 10a extends in the other surface direction. The deformation is small, so that the conductor 10a is harder to break and the reliability can be further improved.

Further, the conductor 10a is used as a lower thread of the sewing machine, and the thread 10b is used as an upper thread passed through a hole of a needle of the sewing machine. Easily sewn to the conductor 10
In addition to being able to carry out wiring by a, it is possible to easily cope with various shapes, and since the flexible thread 10b is used as the upper thread, even if the needle moves up and down, the thread 10b does not have to worry about being cut and has a good yield. Is obtained.

[Brief description of the drawings]

FIG. 1 is an exploded plan view of a first embodiment of a wiring board according to the present invention;

FIG. 2 is an enlarged sectional view of a main part of a second base material according to the first embodiment of the wiring board of the present invention.

FIG. 3 is an enlarged sectional view of a main part according to the first embodiment of the wiring board of the present invention.

FIG. 4 is a sectional view taken along line 4-4 in FIG. 3;

FIG. 5 is an enlarged sectional view of a main part showing a manufacturing method according to the first embodiment of the wiring board of the present invention.

FIG. 6 is a cross-sectional view taken along line 6-6 of FIG. 5 illustrating a manufacturing method according to the first embodiment of the wiring board of the present invention;

FIG. 7 is an exploded plan view according to a second embodiment of the wiring board of the present invention.

FIG. 8 is an enlarged perspective view of a main portion of a second embodiment of the wiring board according to the present invention in which a second base material is disassembled.

FIG. 9 is an enlarged sectional view of a main part of a second base member according to a second embodiment of the wiring board of the present invention.

FIG. 10 is an enlarged sectional view of a main part according to a third embodiment of the wiring board of the present invention.

FIG. 11 is a sectional view taken along line 11-11 of FIG. 10;

FIG. 12 is an enlarged sectional view of a main part showing a manufacturing method according to a third embodiment of the wiring board of the present invention.

FIG. 13 is a sectional view taken along line 13-13 of FIG. 12 showing a manufacturing method according to the third embodiment of the wiring board of the present invention;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 1st base material 1a Base 1b Lead-out part P Conduction pattern 2a Fixed contact 2b Fixed contact 3a Fixed contact 3b Fixed contact 4a Pattern part 4b Connection terminal part 5 First pattern 5a Connection part 5b Land part 6 Second pattern 6a Connection part 6b Land part 6c Connection terminal part 7 Resist layer 8 Electrical component 9 Second base material 10 Wire rod 10a Conductive wire 10b Thread 11 Adhesive 12 Terminal plate 13 Conductive connector

Claims (11)

[Claims] 1. An insulating first base material, a conductive pattern formed on the first base material by printing, and a second base material made of a flexible insulating sheet. And two wires sewn to the second base material, and at least one of the wires is formed of a conductive wire, and a wire is formed by the conductive wire, and the conductive wire and the conductive pattern are electrically connected to each other. A wiring board characterized by being made. 2. An insulating adhesive is provided between the first base material and the second base material, and the first and second base materials are bonded by the adhesive to form an integral body. 2. The wiring substrate according to claim 1, wherein the conductive wire and the conductive pattern are electrically connected to each other. 3. The wiring board according to claim 2, wherein the adhesive is formed of a thermosetting adhesive. 4. A heating and pressurizing method in which the conductive wire is positioned on the adhesive provided on the conductive pattern, whereby the adhesive is removed by the conductive wire, and the conductive wire and the conductive pattern are removed. 4. The wiring substrate according to claim 2, wherein the first and second base materials around the conductive wire are adhered to each other and integrated with each other, while making contact with each other to make conductive connection with each other. 5. The wiring board according to claim 1, wherein the conductive wire and the conductive pattern are electrically connected to each other by a conductive connector. 6. The conductive pattern according to claim 1, wherein the conductive pattern has at least two connection portions spaced apart from each other, and the two connection portions are electrically connected to each other by the conductive wire. 6. The wiring board according to any one of 1 to 5. 7. The wiring board according to claim 1, wherein the second base material has a band shape, and the conductive wire is disposed along a longitudinal direction of the second base material. 8. The conductive pattern has a pair of patterns provided at an interval, and an electric component is mounted in a state of being electrically connected to the pair of patterns.
At least two of the conductive wires provided on the second base material are each conductively connected to the pair of patterns, so that a voltage is applied to the electric component via the two conductive wires. The wiring board according to any one of claims 1 to 7, wherein 9. One of the wires is formed of the conductive wire made of a metal wire, and the other of the wires is formed of an insulating yarn that is more flexible than the conductive wire. The wiring board according to claim 1. 10. The conductive wire is arranged on one surface of the second base material, and on the other surface of the second base material,
The yarn is disposed, the yarn penetrates from the other surface side to the one surface side, and is entangled with the conductive wire to hold the conductive wire, and the one surface side of the second base member is the first surface. The wiring board according to claim 9, wherein the conductive wire and the conductive pattern are electrically connected to each other so as to face the base material. 11. The method according to claim 11, wherein the conductor is used as a lower thread of a sewing machine, and the thread is used as an upper thread passed through a hole of a needle of the sewing machine. 11. The wiring board according to claim 9, wherein the wiring board is sewn.