JP2002249753A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2002249753A5 JP2002249753A5 JP2001048281A JP2001048281A JP2002249753A5 JP 2002249753 A5 JP2002249753 A5 JP 2002249753A5 JP 2001048281 A JP2001048281 A JP 2001048281A JP 2001048281 A JP2001048281 A JP 2001048281A JP 2002249753 A5 JP2002249753 A5 JP 2002249753A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- resin
- semiconductor device
- adhesive composition
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 description 20
- 230000001070 adhesive Effects 0.000 description 20
- 239000004065 semiconductor Substances 0.000 description 19
- 229920005989 resin Polymers 0.000 description 18
- 239000011347 resin Substances 0.000 description 18
- 239000000203 mixture Substances 0.000 description 14
- 239000003963 antioxidant agent Substances 0.000 description 8
- 229920005992 thermoplastic resin Polymers 0.000 description 7
- 229920001187 thermosetting polymer Polymers 0.000 description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 6
- 125000004432 carbon atoms Chemical group C* 0.000 description 6
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-M methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 5
- -1 methylol group Chemical group 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 125000003277 amino group Chemical group 0.000 description 4
- 230000000111 anti-oxidant Effects 0.000 description 4
- 230000003078 antioxidant Effects 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 4
- 125000005372 silanol group Chemical group 0.000 description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 4
- 229920000459 Nitrile rubber Polymers 0.000 description 3
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 230000001681 protective Effects 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 2
- 229920000800 Acrylic rubber Polymers 0.000 description 2
- LJCFOYOSGPHIOO-UHFFFAOYSA-N Antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N Antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 229920001721 Polyimide Polymers 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- ATMLPEJAVWINOF-UHFFFAOYSA-N acrylic acid acrylic acid Chemical compound OC(=O)C=C.OC(=O)C=C ATMLPEJAVWINOF-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 239000011528 polyamide (building material) Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- YXFVVABEGXRONW-UHFFFAOYSA-N toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K Aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229960005069 Calcium Drugs 0.000 description 1
- 229960003563 Calcium Carbonate Drugs 0.000 description 1
- LBFUKZWYPLNNJC-UHFFFAOYSA-N Cobalt(II,III) oxide Chemical compound [Co]=O.O=[Co]O[Co]=O LBFUKZWYPLNNJC-UHFFFAOYSA-N 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L Magnesium hydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N Silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N Silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N TiO Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N al2o3 Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- SMYKVLBUSSNXMV-UHFFFAOYSA-J aluminum;tetrahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[Al+3] SMYKVLBUSSNXMV-UHFFFAOYSA-J 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- WJAKXPUSJAKPHH-UHFFFAOYSA-N buta-1,3-diene;ethene;styrene Chemical group C=C.C=CC=C.C=CC1=CC=CC=C1 WJAKXPUSJAKPHH-UHFFFAOYSA-N 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 229910000428 cobalt oxide Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001771 impaired Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910000460 iron oxide Inorganic materials 0.000 description 1
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000002530 phenolic antioxidant Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000002516 radical scavenger Substances 0.000 description 1
- 230000003014 reinforcing Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000003351 stiffener Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 229910001929 titanium oxide Inorganic materials 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Description
【特許請求の範囲】
【請求項１】 熱可塑性樹脂および熱硬化性樹脂を含有する半導体装置用接着剤組成物であって、前記熱可塑性樹脂が、カルボキシル基および／または水酸基を有し、炭素数１〜８の側鎖を有するアクリル酸および／またはメタクリル酸エステル樹脂と、エポキシ基、アミノ基、メチロール基、ビニル基、シラノール基またはイソシアネート基を有し、炭素数１〜８の側鎖を有するアクリル酸および／またはメタクリル酸エステル樹脂を含有し、シート化された該半導体装置用接着剤組成物を１７０℃で２時間加熱硬化した後と、さらに１５０℃で２５０時間放置した後の引張弾性率変化率が１００％以下であることを特徴とする半導体装置用接着剤組成物。
【請求項２】熱硬化性樹脂が、エポキシ樹脂および／またはフェノール樹脂であることを特徴とする請求項１記載の半導体装置用接着剤組成物。
【請求項３】 シリカ、酸化アルミニウム、水酸化アルミニウム、窒化ケイ素、炭化ケイ素から選ばれる、平均粒径３μｍ以下、最大粒径１０μｍ以下の無機質充填材を含有することを特徴とする請求項１記載の半導体装置用接着剤組成物。
【請求項４】請求項１〜３のいずれか記載の半導体装置用接着剤組成物を接着剤層とし、かつ少なくとも１層以上の剥離可能な保護フィルム層を有する半導体装置用接着剤シート。
【請求項５】保護フィルム層が着色されていることを特徴とする請求項４記載の半導体装置用接着剤シート。
【請求項６】請求項１〜３のいずれか記載の半導体装置用接着剤組成物を用いた半導体接続用基板。
【請求項７】請求項６記載の半導体接続用基板を用いた半導体装置。
[Claims]
(1) An adhesive composition for a semiconductor device containing a thermoplastic resin and a thermosetting resin, wherein the thermoplastic resin has a carboxyl group and / or a hydroxyl group, and has acrylic acid having a side chain having 1 to 8 carbon atoms. And / or a methacrylate resin and an acrylic and / or methacrylate resin having an epoxy group, an amino group, a methylol group, a vinyl group, a silanol group or an isocyanate group and having a side chain having 1 to 8 carbon atoms. ContainsSheetedFor the semiconductor deviceAn adhesive composition for a semiconductor device, wherein the adhesive composition has a change rate of tensile modulus of 100% or less after being heated and cured at 170 ° C. for 2 hours and further left at 150 ° C. for 250 hours.
Claims210. A thermosetting resin according to claim 1, wherein said thermosetting resin is an epoxy resin and / or a phenol resin.1The adhesive composition for a semiconductor device according to the above.
Claims3] Silica, aluminum oxide, aluminum hydroxide, silicon nitride, silicon carbide, having an average particle size of 3 μm or less and a maximum particle size of 10 μm or lessThe adhesive composition for a semiconductor device according to claim 1, further comprising an inorganic filler.
Claims4Claim 13An adhesive sheet for a semiconductor device, comprising the adhesive composition for a semiconductor device according to any one of the above, as an adhesive layer, and having at least one or more peelable protective film layers.
Claims513. The protective film layer is colored.4An adhesive sheet for a semiconductor device according to the above.
Claims6Claim 13A substrate for connecting a semiconductor, comprising the adhesive composition for a semiconductor device according to any one of the above.
Claims7Claims6A semiconductor device using the semiconductor connection substrate according to any one of the preceding claims.
さらに、半導体接続用基板には剛性と平面性の付与のための補強板（スティフナー）あるいは放熱のための放熱板（ヒートスプレッダー）等の部品を積層することも行われるが、その際にも接着剤が使用される。 Further, a component such as a reinforcing plate (stiffener) for imparting rigidity and flatness or a heat radiating plate (heat spreader) for radiating heat may be laminated on the substrate for semiconductor connection. Agent is used.
【００１３】
【課題を解決するための手段】
すなわち、本発明は、熱可塑性樹脂および熱硬化性樹脂を含有する半導体装置用接着剤組成物であって、前記熱可塑性樹脂が、カルボキシル基および／または水酸基を有し、炭素数１〜８の側鎖を有するアクリル酸および／またはメタクリル酸エステル樹脂と、エポキシ基、アミノ基、メチロール基、ビニル基、シラノール基またはイソシアネート基を有し、炭素数１〜８の側鎖を有するアクリル酸および／またはメタクリル酸エステル樹脂を含有し、シート化された該半導体装置用接着剤組成物を１７０℃で２時間加熱硬化した後と、さらに１５０℃で２５０時間放置した後の引張弾性率変化率が１００％以下であることを特徴とする半導体装置用接着剤組成物であり、それを用いた半導体装置用接着剤シート、半導体接続用基板ならびに半導体装置である。
[0013]
[Means for Solving the Problems]
That is, the present invention is an adhesive composition for a semiconductor device containing a thermoplastic resin and a thermosetting resin, wherein the thermoplastic resin has a carboxyl group and / or a hydroxyl group, and has 1 to 8 carbon atoms. Acrylic acid and / or methacrylic acid ester resin having a side chain, and acrylic acid and / or having an epoxy group, an amino group, a methylol group, a vinyl group, a silanol group or an isocyanate group and having a side chain having 1 to 8 carbon atoms; Alternatively, the rate of change in tensile modulus after heating and curing the adhesive composition for a semiconductor device containing a methacrylic acid ester resin at 170 ° C. for 2 hours and further after standing at 150 ° C. for 250 hours is 100%. % Or less, a semiconductor device adhesive sheet, a semiconductor connection substrate, and a semiconductor device using the same. A conductor arrangement.
熱可塑性樹脂としては、アクリロニトリル−ブタジエン共重合体（ＮＢＲ）、アクリロニトリル−ブタジエンゴム−スチレン樹脂（ＡＢＳ）、ポリブタジエン、スチレン−ブタジエン−エチレン樹脂（ＳＥＢＳ）、炭素数１〜８の側鎖を有するアクリル酸および／またはメタクリル酸エステル樹脂（アクリルゴム）、ポリビニルブチラール、ポリアミド、ポリエステル、ポリイミド、ポリアミドイミド、ポリウレタン、等が例示される。また、これらの熱可塑性樹脂は後述の熱硬化性樹脂との反応が可能な官能基を有していてもよい。具体的には、アミノ基、カルボキシル基、エポキシ基、水酸基、メチロール基、イソシアネート基、ビニル基、シラノール基等である。これらの官能基により熱硬化性樹脂との結合が強固になり、耐熱性が向上するので好ましい。配線基板層（Ａ）の素材との接着性、可撓性、熱応力の緩和効果の点から、本発明の接着剤組成物は、アミノ基、カルボキシル基、エポキシ基、水酸基、メチロール基、イソシアネート基、ビニル基またはシラノール基を有する、炭素数１〜８の側鎖を有するアクリル酸および／またはメタクリル酸エステルを含有する。さらにこの場合、官能基としてカルボキシル基および／または水酸基を有するアクリル酸および／またはメタクリル酸エステル樹脂と、他の官能基を有するアクリル酸および／またはメタクリル酸エステル樹脂とを含有する。 Examples of the thermoplastic resin include acrylonitrile-butadiene copolymer (NBR), acrylonitrile-butadiene rubber-styrene resin (ABS), polybutadiene, styrene-butadiene-ethylene resin (SEBS), and acrylic having a side chain having 1 to 8 carbon atoms. Examples thereof include acid and / or methacrylate resin (acrylic rubber), polyvinyl butyral, polyamide, polyester, polyimide, polyamide imide, and polyurethane. Further, these thermoplastic resins may have a functional group capable of reacting with a thermosetting resin described below. Specific examples include an amino group, a carboxyl group, an epoxy group, a hydroxyl group, a methylol group, an isocyanate group, a vinyl group, and a silanol group. These functional groups are preferable because the bond with the thermosetting resin is strengthened and the heat resistance is improved . Materials and adhesion of the wiring substrate layer (A), a flexible, in terms of relaxation effect of thermal stress, the adhesive composition of the present invention, an amino group, a carboxyl group, an epoxy group, a hydroxyl group, methylol group, It contains an acrylic acid and / or methacrylic acid ester having an isocyanate group, a vinyl group or a silanol group and having a side chain having 1 to 8 carbon atoms . Furthermore, in this case, it contains an acrylic acid and / or methacrylate resin having a carboxyl group and / or a hydroxyl group as a functional group, and an acrylic acid and / or methacrylate resin having another functional group.
以上の成分以外に、接着剤の特性を損なわない範囲で酸化防止剤、イオン捕捉剤などの有機、無機成分を添加することは何ら制限されるものではない。微粒子状の無機成分としては水酸化マグネシウム、カルシウム・アルミネート水和物等の金属水酸化物、酸化ジルコニウム、酸化亜鉛、三酸化アンチモン、五酸化アンチモン、酸化マグネシウム、酸化チタン、酸化鉄、酸化コバルト、酸化クロム、タルク等の金属酸化物、炭酸カルシウム等の無機塩、アルミニウムなどの金属微粒子、あるいはカーボンブラック、ガラスが挙げられ、有機成分としてはスチレン、ＮＢＲゴム、アクリルゴム、ポリアミド、ポリイミド、シリコーン等の架橋ポリマが例示される。また、本発明では酸化防止剤の使用が有効である。酸化防止剤としては、酸化防止の機能を付与するものであれば特にされず、フェノール系酸化防止剤、チオエーテル系酸化防止剤、リン系酸化防止剤、アミン系酸化防止剤等の公知の酸化防止剤を使用できる。これは、例えばＮＢＲゴムなど二重結合を含む樹脂の場合、高温で長時間放置すると二重結合部分の架橋が徐々に進行し、接着剤膜が脆くなる傾向があるが、酸化防止剤を使用することにより、これらの反応を抑えることができるからである。これらの有機、無機成分は単独または２種以上混合して用いても良い。微粒子状の成分の平均粒径は分散安定性を考慮すると、０．２〜５μｍが好ましい。また、配合量は接着剤組成物全体の０．１〜５０重量部が適当である。 In addition to the above components, addition of organic and inorganic components such as an antioxidant and an ion scavenger is not limited as long as the properties of the adhesive are not impaired. Examples of fine inorganic components include magnesium hydroxide, metal hydroxides such as calcium aluminate hydrate, zirconium oxide, zinc oxide, antimony trioxide, antimony pentoxide, magnesium oxide, titanium oxide, iron oxide, and cobalt oxide. Metal oxides such as chromium oxide and talc; inorganic salts such as calcium carbonate; metal fine particles such as aluminum; carbon black and glass; and organic components such as styrene, NBR rubber, acrylic rubber, polyamide, polyimide and silicone. And the like. In the present invention, the use of an antioxidant is effective. The antioxidant is not particularly limited as long as it has an antioxidant function, and known antioxidants such as phenolic antioxidants, thioether antioxidants, phosphorus antioxidants, and amine antioxidants. Agents can be used. This is because, for example, in the case of a resin containing a double bond such as NBR rubber, if the resin is left at a high temperature for a long time, the cross-linking of the double bond gradually progresses and the adhesive film tends to become brittle. By doing so, these reactions can be suppressed. These organic and inorganic components may be used alone or in combination of two or more. The average particle size of the fine particle component is preferably 0.2 to 5 μm in consideration of dispersion stability. Further, the compounding amount is suitably from 0.1 to 50 parts by weight of the whole adhesive composition.
実施例１〜３、比較例１〜１０
（接着剤シートの作成）
表１〜２にあるような各無機質充填剤をトルエンと混合した後、サンドミル処理して分散液を作成した。この分散液に、各熱可塑性樹脂、熱硬化性樹脂、硬化剤、硬化促進剤および分散液と等重量のメチルエチルケトンをそれぞれ表１〜２の組成比となるように加え、３０℃で撹拌、混合して接着剤溶液を作成した。この接着剤溶液をバーコータで、シリコーン離型剤付きの厚さ３８μｍのポリエチレンテレフタレートフィルム（藤森工業（株）製“フィルムバイナ”ＧＴ）に約５０μｍの乾燥厚さとなるように塗布し、１２０℃で５分間乾燥し、表１〜２に示したような保護フィルムを貼り合わせて、本発明の半導体装置用接着シートを作成した。組成、特性を表１〜２に示す。
Examples 1 to 3 , Comparative Examples 1 to 10
(Create adhesive sheet)
Each of the inorganic fillers as shown in Tables 1 and 2 was mixed with toluene and then subjected to a sand mill treatment to prepare a dispersion. To this dispersion, each of a thermoplastic resin, a thermosetting resin, a curing agent, a curing accelerator, and methyl ethyl ketone of the same weight as that of the dispersion are added so as to have the composition ratios shown in Tables 1 and 2 , and stirred and mixed at 30 ° C. Thus, an adhesive solution was prepared. This adhesive solution was applied to a 38 μm thick polyethylene terephthalate film (“Film Vina” GT manufactured by Fujimori Kogyo Co., Ltd.) with a silicone release agent to a dry thickness of about 50 μm using a bar coater. After drying for 5 minutes, a protective film as shown in Tables 1 and 2 was attached to form an adhesive sheet for a semiconductor device of the present invention. The compositions and properties are shown in Tables 1 and 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001048281A JP4876317B2 (en) | 2001-02-23 | 2001-02-23 | Adhesive composition for semiconductor device, adhesive sheet for semiconductor device using the same, substrate for semiconductor connection, and semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001048281A JP4876317B2 (en) | 2001-02-23 | 2001-02-23 | Adhesive composition for semiconductor device, adhesive sheet for semiconductor device using the same, substrate for semiconductor connection, and semiconductor device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002249753A JP2002249753A (en) | 2002-09-06 |
| JP2002249753A5 true JP2002249753A5 (en) | 2008-01-31 |
| JP4876317B2 JP4876317B2 (en) | 2012-02-15 |
Family
ID=18909573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001048281A Expired - Lifetime JP4876317B2 (en) | 2001-02-23 | 2001-02-23 | Adhesive composition for semiconductor device, adhesive sheet for semiconductor device using the same, substrate for semiconductor connection, and semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4876317B2 (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5046366B2 (en) * | 2005-10-20 | 2012-10-10 | 信越化学工業株式会社 | Adhesive composition and sheet provided with an adhesive layer comprising the adhesive |
| JP4523611B2 (en) * | 2007-02-20 | 2010-08-11 | 日東電工株式会社 | Manufacturing method of semiconductor device |
| JP5521364B2 (en) * | 2008-03-18 | 2014-06-11 | 日立化成株式会社 | Adhesive sheet |
| JP5549182B2 (en) * | 2008-10-28 | 2014-07-16 | 日立化成株式会社 | Adhesive sheet and method of manufacturing semiconductor device using the same |
| WO2013002001A1 (en) * | 2011-06-28 | 2013-01-03 | 日東電工株式会社 | Thermosetting adhesive sheet and flexible printed circuit board |
| JP2017088759A (en) * | 2015-11-11 | 2017-05-25 | リンテック株式会社 | Adhesive sheet |
| WO2018174446A1 (en) * | 2017-03-22 | 2018-09-27 | 주식회사 엘지화학 | Resin composition for semiconductor package, prepreg using same, and metal foil laminated plate |
| KR102049024B1 (en) | 2017-03-22 | 2019-11-26 | 주식회사 엘지화학 | Resin composition for semiconductor package, prepreg and metal clad laminate using the same |
| WO2019150433A1 (en) * | 2018-01-30 | 2019-08-08 | 日立化成株式会社 | Thermosetting resin composition, film-form adhesive, adhesive sheet, and method for producing semiconductor device |
| KR102246974B1 (en) * | 2018-04-10 | 2021-04-30 | 주식회사 엘지화학 | Resin composition for semiconductor package, prepreg and metal clad laminate using the same |
| KR102257926B1 (en) | 2018-09-20 | 2021-05-28 | 주식회사 엘지화학 | Multilayered printed circuit board, method for manufacturing the same, and semiconductor device using the same |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0249087A (en) * | 1988-08-11 | 1990-02-19 | Toray Ind Inc | Adhesive composition |
| JP3528639B2 (en) * | 1998-11-24 | 2004-05-17 | 日立化成工業株式会社 | Adhesive, adhesive member, wiring board for mounting semiconductor provided with adhesive member, and semiconductor device using the same |
| JP3539242B2 (en) * | 1998-11-24 | 2004-07-07 | 日立化成工業株式会社 | Adhesive member, wiring board for mounting semiconductor provided with adhesive member, and semiconductor device using the same |
| JP3376312B2 (en) * | 1999-04-28 | 2003-02-10 | 株式会社巴川製紙所 | Adhesive composition for semiconductor device, adhesive sheet, and reinforcing member using the same |
-
2001
- 2001-02-23 JP JP2001048281A patent/JP4876317B2/en not_active Expired - Lifetime
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4379387B2 (en) | Epoxy resin inorganic composite sheet and molded product | |
| JP6029990B2 (en) | Thermally conductive sheet | |
| JP2009060146A (en) | Epoxy resin inorganic composite sheet for sealing semiconductor, and molded product | |
| JP2002249753A5 (en) | ||
| TW202026349A (en) | Resin composition, substrate-attached film, metal/resin laminated body and semiconductor device | |
| JP2013007028A (en) | Sealing sheet and electronic component device | |
| JP2016002669A (en) | Metal foil-clad substrate, circuit board and electronic component-mounted substrate | |
| JP2016004841A (en) | Metal foil-clad board, circuit board and heating element mounting board | |
| JP3847022B2 (en) | Thermally conductive elastomer composition, molded product thereof and laminate thereof | |
| KR20060051762A (en) | Acrylic flame retardant adhesive composition and acrylic flame retardant adhesive sheet | |
| JP4068983B2 (en) | Thermally conductive sheet | |
| JP2850698B2 (en) | Epoxy resin structural adhesive composition | |
| JP6575321B2 (en) | Resin composition, circuit board, heating element mounting board, and circuit board manufacturing method | |
| WO2016063695A1 (en) | Metal-foil-clad substrate, circuit board, and substrate with heat-generating body mounted thereon | |
| JP2661944B2 (en) | Coated articles | |
| WO2015178393A1 (en) | Metal-foil-clad substrate, circuit board, and substrate with electronic component mounted thereon | |
| JP4434569B2 (en) | Halogen-free flame-retardant adhesive composition and coverlay film | |
| JP6533399B2 (en) | Method of manufacturing sealing sheet and package | |
| JP2003128873A (en) | Epoxy resin composition and adhesive sheet using the same | |
| JP2010135587A (en) | Semiconductor device | |
| JP4771445B2 (en) | Insulating resin composition for electronic parts and adhesive sheet | |
| JP2018168234A (en) | Adhesive sheet for electronic component protection | |
| JP2008031405A (en) | Method of manufacturing thermoconductive resin composition | |
| WO2016063694A1 (en) | Metal-foil-clad substrate, circuit board, and substrate with heat-generating body mounted thereon | |
| JPH0429393A (en) | Cover lay film |