JP3376312B2 - Adhesive composition for semiconductor device, adhesive sheet, and reinforcing member using the same - Google Patents

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to an IC having an IC mounted thereon.
In a semiconductor device having a C substrate (interposer) and a reinforcing member in a laminated structure, the present invention relates to an adhesive composition for adhering an IC or a reinforcing member to a peripheral portion, and more specifically, to an IC, an IC substrate, and an IC. The present invention relates to a substrate and its reinforcing member, an adhesive composition for a semiconductor device that bonds the layers between the IC and the reinforcing member, an adhesive sheet, and a reinforcing member using the same.

[0002]

2. Description of the Related Art With the rapid spread of portable personal computers and mobile phones, electronic devices are required to be further downsized, thinned, and multifunctional. In order to meet this requirement, it is indispensable to downsize and highly integrate electronic components, but further high-density mounting technology for electronic components is required. The IC package that forms the core of recent electronic parts has
FP (Quad Flat Package) and SOP
Peripheral mounting type such as (Small Outlook Package) was the mainstream, but recently BGA (B
all Grid Array), CSP (Chip)
A surface mounting type called Size Package) has been in the spotlight as an IC package capable of high density mounting.
The BGA and CSP are provided with solder balls in the form of a surface lattice on the back surface of the package as external connection terminals. The electrodes of the IC (semiconductor integrated circuit) are connected to the electrodes of the printed circuit board via the IC substrate which is the circuit wiring pattern conversion substrate.
Depending on the type of the IC substrate, plastic BGA (hereinafter abbreviated as P-BGA), ceramic BGA (hereinafter,
Abbreviated as C-BGA. ), Tape BGA (hereinafter T-BG
Abbreviated as A. ), And an enhanced BGA (hereinafter abbreviated as E-BGA) have been developed. Until recently, P that can use wire bonding technology with QFP
-BGA was the mainstream, but TAB (Tape A
T using automated bonding technology
-BGA is becoming the mainstream because it can achieve higher density (higher number of pins) and is excellent in heat dissipation.
The CSP is a package in which the BGA is further downsized and has a higher density, and is called a micro BGA or a fine pitch BGA. BGA and CSP are packages that have excellent electrical characteristics such as low impedance and high-speed frequency response due to their structure.

T-BGA is a TCP (Tape Carr).
A solder ball is provided as an electric signal terminal with a printed wiring board (hereinafter, abbreviated as PCB) on the circuit surface or non-circuit surface of the ier package. FIG. 1 shows a sectional view of an example of the T-BGA. The semiconductor chip 6 is connected to the wiring 3 formed on one surface of the insulating film 4 via the electrode 5, and is further electrically connected to the outside by the solder ball 1. The insulating film 4 has a structure in which it is bonded to the reinforcing member 8 via the adhesive 7, and another reinforcing member 8 having a role of heat dissipation is bonded to the semiconductor chip 6 via the adhesive 7. FIG. 2 shows a sectional view of an example of another T-BGA. The semiconductor chip 6 is connected to the wiring 3 formed on one surface of the insulating film 4 via the electrode 5, and is further electrically connected to the outside by the solder ball 1. The insulating film 4 is bonded to the reinforcing member 8 via the adhesive 7. The reinforcing member 8 also has a role of heat dissipation, and has a structure in which the reinforcing member 8 is bonded to the semiconductor chip 6 via the adhesive 7. Figure 3
A sectional view of an example of the E-BGA is shown in FIG. The semiconductor chip 6 is connected to the wiring 3 formed on the substrate 10 made of glass-epoxy or the like via the gold wire 9, and further electrically connected to the outside by the solder ball 1. The substrate 10 and the semiconductor chip 6 have a structure in which they are bonded to a reinforcing member 8 having a heat dissipation function via an adhesive 7.

As the insulating film 4 for T-BGA,
Generally, a polyimide film is used. This polyimide film is usually manufactured as a polyimide film by imidizing polyamic acid at high temperature. for that reason,
When the temperature is returned to room temperature after the imidization treatment, thermal contraction due to imidization is accumulated as internal stress. When joining T-BGA to the substrate, the melting temperature of the solder (200-
When exposed to 260 ° C., the internal stress is released at that time and the flatness of the polyimide film is lost. As a result, poor connection to the mounting board may occur. In recent years, as semiconductor devices have become more sophisticated, IC chips have become larger and have more pins. In such a semiconductor device, the area of the T-BGA is also increasing, and the frequency of occurrence of defective solder ball connection due to the above factors is increasing. In order to improve this connection failure, it has been proposed to mount a reinforcing member called a stiffener having a thickness of 100 μm to 500 μm on the lead surface or the non-lead surface of the T-BGA, and the problem of connection failure has been greatly improved. Further, for heat dissipation of the semiconductor chip and electromagnetic wave shielding, the semiconductor chip is provided with a reinforcing member called a cover plate, which functions as a heat dissipation plate. Recently, in order to reduce the price, a stiffener and a cover plate may be integrally used as a reinforcing member.

The BGA is finally mounted on a main board called a motherboard via solder balls. This mounting process is called a reflow process, and is a soldering process typified by a solder bath dipping method (dip method), vapor phase method (soldering by evaporation latent heat of an inert solvent), and far infrared reflow (IR reflow). Yes, the entire package is heated to 200-280 ° C. In recent years, lead-free solders have been developed and are beginning to be used, but the melting temperature is higher than that of conventional lead-containing solders, and the reflow temperature is inevitably increased. On the other hand, in FIG.
Prior art adhesives used in FIGS. 2 and 3 are:
The thermosetting type is widely used because it is inexpensive and has excellent workability, electrical characteristics, and heat resistance. Typical examples thereof include epoxy resin / epoxy curing agent / NBR (acrylonitrile-butadiene copolymer) adhesives.
By the way, the conventionally used NBR is a general copolymer of acrylonitrile and butadiene and does not have reactivity with an epoxy resin. Therefore, NBR used in solder reflow at a high temperature range of 200 to 280 ° C. The elastic modulus becomes too low. In such high temperature reflow, when moisture is present in the adhesive or the substrate for IC, it is explosively vaporized to generate voids, and the adhesive is pushed away to cause swelling called “popcorn”. Due to this popcorn phenomenon, the IC substrate is deformed, and solder balls come into contact with each other, causing a short circuit, or causing a defect such as detachment from the wiring substrate, resulting in a marked decrease in production efficiency. In order to prevent this popcorn phenomenon, a method has been adopted in which the package after the adhesive is heat-cured is completely dried, and the package is stored in a sealed container and shipped (moisture-proof packaging).

[0006]

The shipping method of moisture-proof packaging has a drawback that the manufacturing process and the handling of the product are complicated, and the product price becomes expensive. The purpose of the present invention is to
Solves problems with conventional adhesives used for laminated structures such as T-BGA, that is, popcorn phenomenon that occurs in the reflow process, package cracks that result from internal stress release, and excellent reflow resistance. Another object of the present invention is to provide an adhesive composition for a semiconductor device, an adhesive sheet, and a reinforcing member using the same.

[0007]

The adhesive composition for a semiconductor device of the present invention is applied to a semiconductor device in which a reinforcing member is laminated on the circuit surface or the back surface of an IC substrate composed of at least an insulating layer and a conductor circuit. An adhesive composition to be used,
The composition contains (a) an epoxy resin, (b) an epoxy curing agent, (c) an elastic body, and (d) a silane coupling agent, and the silane coupling agent is an epoxy silane coupling agent.
It is characterized by being a pulling agent or an aminosilane coupling agent . Further, the adhesive sheet of the present invention is characterized in that the adhesive composition for a semiconductor device is laminated on one surface of a support. Further, the reinforcing member of the present invention is characterized in that the adhesive composition for a semiconductor device is laminated on at least one surface of a base material. Hereinafter, the present invention will be described in detail.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION The adhesive composition and adhesive sheet of the present invention are used for a semiconductor device in which a reinforcing member is laminated on the circuit surface or the back surface of an IC substrate composed of at least an insulating layer and a conductor circuit, It is for bonding a reinforcing member such as a stiffener or a cover plate or an IC (semiconductor integrated circuit) to a substrate. The components used in the adhesive composition of the present invention will be described. (A) Epoxy resin: The epoxy resin is a resin having two or more oxirane rings in the molecule, for example, glycidyl ether, glycidyl ester, glycidyl amine, linear aliphatic epoxide, alicyclic epoxide, etc. The resin having the structure may be used alone or in combination of two or more kinds. Specifically, bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, bisphenol S diglycidyl ether, resorcinol diglycidyl ether, brominated bisphenol A diglycidyl ether, fluorinated bisphenol A diglycidyl ether, phenol novolac glycidyl ether, Cresol novolac glycidyl ether, brominated novolac glycidyl ether and other glycidyl ethers, hexahydrophthalic acid diglycidyl ester, phthalic acid diglycidyl ester, dimer acid diglycidyl ester and other glycidyl esters, triglycidyl isocyanurate, tetraglycidyl diaminodiphenylmethane , Glycidyl amines such as tetraglycidyl metaxylene diamine, epoxidation Examples include linear aliphatic epoxies such as rebutadiene and epoxidized soybean oil, and alicyclic epoxies such as 3,4-epoxy-6-methylcyclohexylmethylcarboxylate and 3,4-epoxycyclohexylmethylcarboxylate. To be Among these, bisphenol type epoxy resin is particularly preferable because it is inexpensive and its epoxy equivalent is 170 to 4
000 is preferable, and more preferably 170 to 170
500 is preferable. If the epoxy equivalent is greater than 4000 and is large, the elastic modulus of the cured product becomes low, and the adhesive strength decreases. The epoxy resin preferably used in the present invention is specifically manufactured by Yuka Shell Epoxy Co., Ltd., trade name; Epicoat 80.
6,828,1001, Asahi Denka Kogyo KK, trade name; EP
-4100G, EP4400, EP-4901 etc. can be mentioned. Further, it is an effective means to use halogenated epoxy, especially brominated epoxy, for imparting flame retardancy. Specific examples of the brominated epoxy are manufactured by Yuka Shell Epoxy Co., Ltd., trade name; Epicoat 5045, 504.
6, 5050, Nippon Kayaku Co., Ltd., trade name; BREN-S, B
Examples include REN-105 and BREN-301.

(B) Epoxy curing agent: Epoxy curing agent refers to a chemical substance that reacts with an epoxy resin to form a three-dimensional network structure, and includes aromatic polyamine, aliphatic polyamine, polyamide, acid anhydride, phenol derivative, poly Mercaptan, tertiary amine, Lewis acid complex and the like are used. Specifically, 4,4'-aminodiphenylmethane, 4,4'-
Diaminodiphenyl ether, diaminodiphenyl sulfone, diaminodiphenyl sulfide, m-phenylenediamine, 2,4-toluylenediamine, m-toluylenediamine, o-toluylenediamine, metaxylylenediamine, metaaminobenzylamine, benzidine,
4-chloro-O-phenylenediamine, bis (3,4-
Aromatic polyamines such as diaminophenyl) sulfone, 2,6-diaminopyridine, isophthalic acid dihydrazide, diethylenetriamine, dipropylenetriamine,
Diethylenetetramine, triethylenetetramine, tetraethylenepentamine, dimethylaminopropylamine, diethylaminopropylamine, dibutylaminopropylamine, hexamethylenediamine, N-aminoethylpiperazine, bis-aminopropylpiperazine, trimethylhexamethylenediamine, bis- ( Hexamethylene) triamine, adipic acid dihydrazide, sebacic acid dihydrazide, dicyandiamide and other aliphatic polyamines, dimer acid polyamide, maleic anhydride, dodecenyl succinic anhydride, chlorendic anhydride, sebacic anhydride, phthalic anhydride, pyromellitic anhydride , Trimellitic anhydride, cyclopentane / tetracarboxylic dianhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, tetrame Ren maleic anhydride, tetrahydrophthalic anhydride, methyl tetrahydrophthalic anhydride, endomethylene tetrahydrophthalic anhydride, methyl endomethylene tetrahydrophthalic anhydride, 5- (2,
5-dioxotetrahydroxyfuryl) -3-methyl-
3-cyclohexene-1,2-dicarboxylic acid anhydride, acid anhydride such as methylnadic acid anhydride, phenol derivative such as resole phenol resin, phenol novolac resin, cresol novolac resin, resorcinol resin, xylene resin, 2,2 dicarboxylic acid Mercaptodiethyl ether,
Polymercaptans such as 1,2-dimercaptopropane, 1,3-dimercaptopropanol, bis (2-mercaptoethyl sulfide), dimethylaminomethylphenol, 2,4,6-tri (dimethylaminomethyl)
Phenol, tri (dimethylaminomethyl) phenol tri-2-ethylhexane salt, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2
-Phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole,
2-ethylimidazole, 2-isopropylimidazole, 1-cyanoethyl-2-methylimidazole, 1-
Cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-isopropylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-
Methyl imidazole trimellitate, 1-cyanoethyl-2-ethyl 4-methyl imidazole trimellitate,
1-Cyanoethyl-2-undecylimidazole trimellitate, 1-cyanoethyl-2-phenylimidazole, 2,4-diamino-6- [2'-methylimidazolyl- (1) ']-ethyl-s-triazine, 2 , 4-diamino-6- [2'undecylimidazolyl-
(1) ′]-Ethyl-s-triazine, 2,4-diamino-6- [2′-ethyl-4′-methylimidazolyl-
(1) ′]-Ethyl-s-triazine, 1-dodecyl-
2-methyl-3-benzylimidazolium chloride,
1,3-Dibenzyl-2-methylimidazolium chloride, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 1-cyanoethyl-2-phenyl-
4,5-di (cyanoethoxymethyl) imidazole, 2
-Methylimidazole-triazine complex, 2-phenylimidazole-triazine complex, and other tertiary amines,
3 Lewis acid complexes such as boron trifluoride / monoethylamine complex compound, boron trifluoride / triethanolamine complex compound, boron trifluoride / piperidine complex compound, boron trifluoride / n-butyl ether complex compound Can be mentioned. Among them, the phenol derivative is preferable because it is excellent in reactivity and is also excellent in moist heat resistance in semiconductor device applications.

(C) Elastic body: The elastic body can be used as long as it gives flexibility to the adhesive. The elastic body used in the present invention is a resin generally called an elastomer, specifically, acrylic rubber, acrylonitrile-butadiene copolymer (NBR), acrylonitrile-butadiene-styrene resin (ABS), ethylene- Propylene rubber, chloroprene rubber (CR), styrene-butadiene rubber (SBR), styrene-butadiene-ethylene resin (SEBS), butadiene rubber (BR), polyamide resin, polyamideimide resin, polyimide resin, polyethylene resin, polyester resin, polyurethane resin,
Examples thereof include polyvinyl butyral resin and silicone resin. Among them, acrylic rubber, acrylonitrile-
Butadiene copolymer, polyamide resin and silicone resin are preferable, and acrylic rubber and acrylonitrile-butadiene copolymer are most preferable. The acrylonitrile-butadiene copolymer has an acrylonitrile content of 10 to 50.
Mol% is preferred, more preferably 20-40 mol%
Is. If it is less than 10 mol%, the chemical resistance of the cured product is low,
If it exceeds 50 mol%, methyl ethyl ketone (hereinafter referred to as ME
It is called K. ), The solubility in a general-purpose solvent such as toluene decreases, which is not preferable. Further, these elastic bodies preferably have a functional group capable of reacting with the epoxy resin as the component (a) in order to improve heat resistance after curing. Specific functional groups include amino groups, isocyanate groups, carboxyl groups (including anhydrides), silanol groups, hydroxyl groups, vinyl groups, methylol groups, mercapto groups, and the like. Of these, an amino group, a carboxyl group, and a hydroxyl group are preferable because they are highly reactive, and most preferably, an elastic body having a carboxyl group and a hydroxyl group. Functional group content is 0.2 to 20 mol%
Is more preferable, 0.5 to 15 mol% is more preferable, and 2 to 8 mol% is more preferable. When the amount of the functional group is less than 0.2 mol%, the reactivity is low, and when the amount of the functional group exceeds 20 mol%, the stability is deteriorated in the state of paint.

(D) Silane coupling agent: The silane coupling agent is capable of binding an organic functional group (X) capable of binding or binding to an organic matrix to silicon and an inorganic material, as shown in the following formula (1). It has a structure having a hydrolyzable group (Y). As the organic functional group , an amino group, an
There is a poxy group, which is generally bonded to a silicon atom via an alkylene group having 1 to 6 carbon atoms. The organic functional group having an epoxy group or an amino group has good reactivity with the epoxy curing agent . Examples of the hydrolyzable group include methoxy group, ethoxy group, chloro group, acetoxy group and the like.

[Chemical 1] Specific silane coupling agent, if the organic functional group X has the epoxy group, beta-(3,4-epoxycyclohexyl) ethyltrimethoxysilane, .gamma.-glycidoxypropyltrimethoxysilane, .gamma. glycidol Examples include xypropylmethyldimethoxysilane and γ-glycidoxypropylmethyldiethoxysilane. Further, when the organic functional group X has an amino group, .gamma.-aminopropyltriethoxysilane, .gamma.-aminopropyltrimethoxysilane, .gamma.-aminopropyl - tris (beta-methoxy - ethoxy - ethoxy) silane, N- methyl -Γ-aminopropyltrimethoxysilane, N- (β-aminoethyl)-
γ-aminopropyltrimethoxysilane, N- (β-
Aminoethyl) -γ-aminopropylmethyldimethoxysilane, triaminopropyltrimethoxysilane, N-
Phenyl-γ-aminopropyltrimethoxysilane, octadecyldimethyl [γ- (trimethoxysilyl) propyl] ammonium chloride, γ-4,5 dihydroxyimidazolepropyltriethoxysilane, γ-ureidopropyltriethoxysilane, γ-ureido Examples include propyltrimethoxysilane . A silane coupling agent in which X has an organic functional group having an epoxy group or an amino group has excellent resistance to popcorn . In addition to the above components (a), (b), (c), and (d), in order to accelerate the curing reaction, imidazoles, amine catalysts such as 1,8-diazabicyclo (5,4,0) undecene, triphenyl, etc. It is also effective to add a phosphorus catalyst reaction promoter such as phosphine.

Further, the adhesive composition for a semiconductor device of the present invention preferably contains an inorganic or organic filler for the purpose of adjusting the coefficient of thermal expansion, thermal conductivity or controlling workability. As the inorganic filler, pulverized silica, fused silica, alumina, titanium oxide, beryllium oxide, magnesium oxide, calcium carbonate, titanium nitride, silicon nitride,
Boron nitride, titanium boride, tungsten boride, silicon carbide,
Titanium carbide, zirconium carbide, molybdenum carbide, mica, zinc oxide, carbon black, aluminum hydroxide, calcium hydroxide, magnesium hydroxide, antimony trioxide or those whose surface is treated with a trimethylsiloxyl group, etc. As an organic filler,
Examples include polyimide, polyamide imide, polyether ether ketone, polyether imide, polyester imide, nylon and silicone. The blending amount of these fillers is such that each component (a), (b), (c) and (d)
The total amount is 5 to 95 parts by weight, preferably 10 to 50 parts by weight.

200 ° C. to 28 ° C. after curing of the adhesive composition for a semiconductor device of the present invention containing the components (a) to (d).
The dynamic elastic modulus in the temperature range of 0 ° C. is preferably 10 ⁶ Pa or more. If the dynamic elastic modulus is less than 10 ⁶ Pa, the popcorn phenomenon is likely to occur and defects such as short circuits are likely to occur. The dynamic elastic modulus was measured by using a cured adhesive film having a thickness of 100 μm with Rheovibron DDV-II manufactured by Orientec Co., Ltd. at a frequency of 11 Hz and a heating rate of 3 ° C./min. [(A) + (b)] / (c) is 0.2 as a preferable blending ratio of the components (a) to (c).
It is -5, and more preferably 0.3-3.3.
In this case, if it is less than 0.2, the elastic modulus is lower than 10 ⁶ Pa, and if it is more than 5, the film adhesive loses flexibility, which is not preferable. The component (d) is 0.1 to 20 parts by weight, preferably 0.2 to 10 parts by weight based on 100 parts by weight of the total of the components (a), (b) and (c).
Parts by weight, optimally 0.3 to 5 parts by weight. The components (a) to (d) are dissolved in an organic solvent and mixed to prepare an adhesive solution. The organic solvent preferably used is N-
Methyl-2-pyrrolidone, N, N-dimethylacetamide, N, N-dimethylformamide, pyridine, ME
K, methyl isobutyl ketone, toluene, xylene,
1,4-dioxane, tetrahydrofuran, ethanol, methanol, isopropanol, methyl cellosolve, ethyl cellosolve and the like.

The adhesive sheet of the present invention has a constitution in which the adhesive composition is laminated on at least one surface of a support.
The adhesive sheet is obtained by applying the adhesive composition solution to a support and then drying it. As the support used, heat-resistant films such as polyimide, polyamide, polyetheramide, polyphenylene sulfide, polyether ketone, polyparabanic acid, polyethylene terephthalate, and fluororesin, glass cloth, aramid, nylon, amide imide, heat-resistant polyimide, etc. A non-woven fabric may be used, and a peelable film obtained by subjecting the surface of the heat resistant film to a release treatment is preferably used. The heat-resistant and peelable film has a thickness of 7.5 to 500 μm, preferably 10 to 1
It is 30 μm. On the surface of the adhesive composition layer of the adhesive sheet, a protective film is provided on the adhesive layer surface, if necessary. Examples of the peelable film used include the above-mentioned heat-resistant films having peelability, and those having a surface subjected to a peeling treatment are also preferable films. As the protective film, a film having releasability as described above is preferably used, and the thickness thereof is the same as above.
The thickness of the adhesive layer after drying varies depending on the package shape, but is generally 10 to 200 μm, preferably 30 to 10 μm.
It is 0 μm.

The reinforcing member of the present invention is obtained by laminating the adhesive composition on at least one surface of a base material described below. Examples of the reinforcing member include the stiffener and / or the cover plate described above. In order to produce the reinforcing member, a method is used in which the adhesive layer surface of the adhesive sheet and the base material are laminated so as to face each other, and then punched to obtain a desired shape. There is a method in which the adhesive sheet and the base material are individually punched into a desired shape in advance, and then the adhesive layer surface of the adhesive sheet and the base material are laminated so as to face each other. Moreover, it is also possible to punch out after applying the adhesive composition to the substrate. The adhesive sheet used here may be either an adhesive sheet having an adhesive composition laminated on one surface of a peelable film or an adhesive sheet having an adhesive composition laminated on at least one surface of a support such as a heat resistant film. The base material constituting the reinforcing member in the present invention is not particularly limited as long as it can reinforce and dimensionally stabilize the IC substrate such as polyimide, but iron, copper,
Aluminum, cobalt, nickel, titanium and alloys thereof (SUS, 42 alloy, etc.) or plated metals, ceramics (alumina, zirconia, etc.), glass (quartz glass, soda glass, etc.), carbon and polyimide, polyester Organic materials such as can be used. Metals having good heat dissipation and electromagnetic wave shielding properties are preferable, and SUS excellent in workability, dimensional stability, cost, etc.
42 alloy is preferably used. The shape and size of the reinforcing member differ depending on the package shape, but generally the thickness is 100 μm to 2 mm, preferably 200 to 500 μm. The adhesive layer also varies depending on the package shape, but generally has the above-mentioned thickness. Hereinafter, the present invention will be specifically described with reference to examples.

[0016]

Examples [Preparation of paint for adhesive composition] Epoxy resin, epoxy curing agent, elastic body, silane coupling agent,
A solution was prepared by dissolving the curing accelerator in MEK to the respective weight% shown below, and the solution was prepared in the weight% shown in Table 1.
(Solid content) was blended to obtain a coating material of the adhesive composition for a semiconductor device of the present invention. Example 1 Epoxy resin: Bisphenol A type epoxy resin 80% solution (trade name; Epicoat 1001, manufactured by Yuka Shell Epoxy Co., Ltd.) Epoxy curing agent: Novolac phenol resin 70% solution (trade name: Resin Top PSM4261, Gunei Chemical Co., Ltd.) ) Elastomer: NBR 22% solution containing 7% of carboxyl groups (trade name; Nippon Pole 1072, manufactured by Zeon Corporation) Silane coupling agent: Epoxy silane coupling agent 10% solution (trade name: Sila Ace S-510, manufactured by Chisso Corporation) ) Curing accelerator: 2-undecylimidazole 1% solution (trade name; C11Z, manufactured by Shikoku Chemicals Co., Ltd.) A support made of a polyester film having a thickness of 38 μm and subjected to a peeling treatment, and the above coating composition was used as shown in Table 1. The composition of the adhesive composition according to the present invention is applied uniformly, and at 130 ° C. for 5 minutes. After forming an adhesive layer having a thickness of 50μm by thermal drying, to produce an adhesive sheet of the present invention by bonding a polyethylene protective film having a thickness of 50μm which has been subjected to release treatment. After that, while peeling off the protective film, the thickness is 250μ.
m nickel-plated copper plate (base material for reinforcing member) was thermocompression bonded. Then, it was punched into a ring shape by a punching die to manufacture the reinforcing member (stiffener) of the present invention. Remove the obtained stiffener polyester film and remove
400pin dual layer TA using 4oz Cu foil
The non-lead surface (polyimide surface) of B was thermocompression-bonded and heated at 90 ° C. for 1 hour and further at 150 ° C. for 4 hours to cure the adhesive, and a simulated T-BGA package with a stiffener was prepared.

Example 2 Epoxy resin: Bisphenol A type epoxy resin 80% solution (trade name; Epicoat 1001, manufactured by Yuka Shell Epoxy Co., Ltd.) Epoxy curing agent: Novolac phenol resin 70% solution (trade name: Resin Top PSM4261, Gunei) Chemical company) Elastomer: Carboxyl group-containing NBR 22% solution (trade name; Nippon Pole 1072, manufactured by Nippon Zeon Co., Ltd.) Silane coupling agent: Epoxy silane coupling agent 10% solution (trade name: Sila Ace S-530, Chisso Corporation) Curing accelerator: 2-undecylimidazole 1% solution (trade name; C11Z, manufactured by Shikoku Chemicals Co., Ltd.) Except that the adhesive composition coating composition of the present invention having the composition of Table 1 using the above coating composition was used. A TAB simulated T-BGA package with a stiffener was prepared in the same manner as in Example 1. . Example 3 Epoxy resin: Bisphenol A type epoxy resin 80% solution (trade name; Epicoat 1001, manufactured by Yuka Shell Epoxy Co., Ltd.) Epoxy curing agent: Novolac phenol 70% solution (trade name: Resin Top PSM4261, manufactured by Gunei Chemical Co., Ltd.) Elastomer: Carboxyl group-containing NBR 22% solution (trade name; Nippon Pole 1072, manufactured by Zeon Corporation) Silane coupling agent: Aminosilane coupling agent 10% solution (trade name: Sila Ace S-330, manufactured by Chisso Corporation) Curing accelerator : 2-undecylimidazole 1% solution (trade name; C11Z, manufactured by Shikoku Chemicals Co., Ltd.) In the same manner as in Example 1 except that the adhesive composition coating composition of the present invention having the composition shown in Table 1 was used. A TAB simulated T-BGA package with a stiffener was produced.

Example 4 Epoxy resin: Bisphenol A type epoxy resin 80% solution (trade name; Epicoat 1001, made by Yuka Shell Epoxy Co., Ltd.) Epoxy curing agent: Novolac phenol resin 70% solution (trade name: Resintop PSM4261, Gunei) Chemical company) Elastic body: NBR 22% solution containing 7% of carboxyl group (trade name; PNR-1H, manufactured by Japan Synthetic Rubber Co., Ltd.) Silane coupling agent: Epoxy silane coupling agent 10% solution (trade name: Sila Ace S- 510, manufactured by Chisso Co., Ltd. Curing accelerator: 2-undecylimidazole 1% solution (trade name; C11Z, manufactured by Shikoku Chemicals Co., Ltd.) For the adhesive composition coating composition of the present invention having the composition shown in Table 1 using the above coating composition A TAB simulated T-BGA package with a stiffener was prepared in the same manner as in Example 1 except that .

Comparative Example 1 Epoxy resin: Bisphenol A type epoxy resin 80% solution (trade name; Epicoat 1001, manufactured by Yuka Shell Epoxy Co., Ltd.) Epoxy curing agent: Novolac phenol resin 70% solution (trade name: Resin Top PSM4261, Gunei) Chemical company) Elastomer: Carboxyl group-containing NBR 22% solution (trade name; PNR-1H, manufactured by Nippon Synthetic Rubber Co., Ltd.) Curing accelerator: 2-undecylimidazole 1% solution (trade name; C11Z, Shikoku Chemicals Co., Ltd. Manufacture) A simulated T-BGA package of TAB with a stiffener was produced in the same manner as in Example 1 except that a comparative adhesive composition coating composition having the composition of Table 1 using the above coating composition was used. Comparative Example 2 Epoxy resin: Bisphenol A type epoxy resin 80% solution (trade name; Epicoat 1001, manufactured by Yuka Shell Epoxy Co., Ltd.) Epoxy curing agent: Novolac phenol resin 70% solution (trade name: Resin Top PSM4261, manufactured by Gunei Chemical Co., Ltd.) ) Elastomer: Carboxyl group-containing NBR 22% solution (trade name; PNR-1H, manufactured by Japan Synthetic Rubber Co., Ltd.) Titanium coupling agent: isopropyl polyisostearoyl titanate 10% solution (trade name; KR TTS, manufactured by Ajinomoto Co., Inc.) Curing Accelerator: 2-undecylimidazole 1% solution (trade name; C11Z, manufactured by Shikoku Chemicals Co., Ltd.) and Example 1 except that an adhesive composition paint for comparison with the composition of Table 1 using the above paint was used. Similarly, a TAB simulated T-BGA package with a stiffener was produced.

[0020]

[Table 1]

(Evaluation of Popcorn Resistance) Twenty simulated T-BGAs prepared in Examples 1 to 4 and Comparative Examples 1 and 2 were prepared, and the temperature was 85 ° C. and the relative humidity was 8
220-240 ° C after leaving in 5% environment for 48 hours
IR reflow for 10 seconds in the temperature range (however, the temperature history at 240 ° C is essential), observe the presence or absence of popcorn generation by ultrasonic flaw detection, measure the number of packages where generation is found, and The results are shown in Table 2. As apparent from the results in Table 2, the simulated package using the adhesives compositions of the present invention, it was confirmed to have excellent resistance to popcorn resistance after packaging moisture absorption. (Measurement of Dynamic Elastic Modulus) The adhesive sheets having a thickness of 100 μm obtained in Examples 1 to 4 and Comparative Examples 1 and 2 were 90 ° C. for 1 hour and 150 ° C. for 4 hours.
It is cured for a period of time, and the dynamic elastic modulus (2
(Minimum value at 00 to 280 ° C.), and the results are shown in Table 2.
It was shown to. The results in Table 2 As is apparent, contact <br/> Chakuzai composition simulating package using a a sufficient 10 ⁶ Pa or more dynamic elastic modulus required to maintain resistance to popcorn of the present invention Was confirmed to have. (Thermal cycle test) Each of the 20 simulated packages obtained in Examples 1 to 4 and Comparative Examples 1 and 2 was subjected to a thermal cycle test at -55 ° C to 125 ° C. However, in this case, a temperature history of 1 hour is essential at 125 ° C. and −55 ° C.,
[Normal temperature-high temperature-low temperature-normal temperature] as one cycle 600
It was carried out under the condition of cycle. As a result, the packages of Examples 1 to 4 were not abnormal, but some of the packages of Comparative Example 1 and Comparative Example 2 had package cracks.

[0022]

[Table 2]

[0023]

When the package using the adhesive composition of the present invention is mounted on a printed wiring board, it is excellent in popcorn resistance even when it is exposed to the high temperature of the reflow process, and electrical defects of solder balls do not occur. It had high reliability.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of an example of a T-BGA package.

FIG. 2 is a cross-sectional view of another example of a T-BGA package.

FIG. 3 is a cross-sectional view of an example of an E-BGA package.

[Explanation of symbols]

1 ... Solder ball, 3 ... Wiring, 4 ... Insulating film, 5 ... Electrode, 6 ... Semiconductor chip,
7 ... Adhesive, 8 ... Reinforcing member, 9 ... Gold wire, 10 ... Substrate

Claims (6)

(57) [Claims] 1. An adhesive composition for use in a semiconductor device in which a reinforcing member is laminated on the circuit surface or the back surface of an IC substrate composed of at least an insulating layer and a conductor circuit,
The composition contains (a) an epoxy resin, (b) an epoxy curing agent, (c) an elastic body, and (d) a silane coupling agent, and the silane coupling agent is an epoxy silane coupling agent.
An adhesive composition for a semiconductor device, which is a pulling agent or an aminosilane coupling agent . 2. The adhesive composition for a semiconductor device according to claim 1, wherein the epoxy curing agent is a phenol derivative. 3. The adhesive composition for a semiconductor device according to claim 1, wherein the elastic body is an acrylic rubber or an acrylonitrile-butadiene copolymer having a functional group capable of reacting with an epoxy group. 4. The dynamic elastic modulus in the temperature range of 200 ° C. to 280 ° C. after curing of the adhesive composition for a semiconductor device is 1.
The adhesive for semiconductor devices according to claim 1, wherein the adhesive is 0 ⁶ Pa or more. 5. An adhesive sheet, characterized in that the adhesive composition for a semiconductor device is laminated on at least one surface of a support. 6. A reinforcing member comprising the adhesive composition for a semiconductor device laminated on at least one surface of a base material.