JP2000315696A - Adhesive composition for semiconductor device, adhesive sheet, and reinforcing member using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate the occurrence of package cracking, etc., caused by a popcorn phenomenon and internal stress relief which occur in a reflowing process, by preparing an adhesive composition used for a semiconductor device by mixing an epoxy resin, an epoxy curing agent, an elastic material, and silane coupling agent with each other. SOLUTION: An adhesive composition used for a semiconductor device in which a reinforcing member is laminated upon the circuit surface or rear surface of a substrate for IC composed at least of an insulating layer and a conductor circuit is prepared by mixing (a) an epoxy resin, (b) an epoxy curing agent, (c) an elastic material, and (d) a silane coupling agent with each other. The (a) epoxy resin has two or more oxirane rings and the concrete example of the resin includes glycidyl ether, linear aliphatic epoxide, etc. The (b) epoxy curing agent is a chemical material that forms a tree-dimensional network structure by reacting to the epoxy resin and the concrete example of the (c) elastic material includes a resin called elastomer.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC mounted with an IC.
The present invention relates to an adhesive composition for bonding an IC or a reinforcing member to a peripheral portion in a semiconductor device having a C substrate (interposer) and a reinforcing member in a laminated configuration, and more particularly, to an IC, an IC substrate, and an IC. The present invention relates to an adhesive composition for a semiconductor device, an adhesive sheet, and a reinforcing member using the same, for bonding a substrate for use and a reinforcing member thereof, and an interlayer between an IC and the reinforcing member.

[0002]

2. Description of the Related Art With the rapid spread of portable personal computers and portable telephones, electronic devices are required to be further reduced in size, thickness, and multifunctionality. In order to fulfill this demand, miniaturization and high integration of electronic components are indispensable. However, high-density mounting technology for electronic components is also required. IC packages, which form the core of recent electronic components, have Q
FP (Quad Flat Package) or SOP
Peripheral mounting type such as (Small Outline Package) has been the mainstream, but recently BGA (B
all Grid Array), CSP (Chip)
A surface mounting type called “Size Package” has been spotlighted as an IC package capable of high-density mounting.
The BGA and the CSP are provided with solder balls as external connection terminals on the back surface of the package in a plane lattice. Electrodes of an IC (semiconductor integrated circuit) are connected to electrodes of a printed circuit board via an IC substrate which is a circuit wiring pattern conversion substrate.
Depending on the type of the IC substrate, a plastic BGA (hereinafter abbreviated as P-BGA) or a ceramic BGA (hereinafter abbreviated as P-BGA) is used.
Abbreviated as C-BGA. ), Tape BGA (hereinafter, T-BG)
Abbreviated as A. ), Enhanced BGA (hereinafter, abbreviated as E-BGA) has been developed. Until recently, P which can use wire bonding technology in QFP
-BGA was the mainstream, but TAB (Tape A
T using automated bonding technology
-BGA is becoming mainstream because it can be further densified (increased number of pins) and has excellent heat dissipation.
The CSP is a package obtained by further reducing the size and density of the BGA, and is called a micro BGA or a fine pitch BGA. BGA and CSP are packages having excellent electrical characteristics such as low impedance and high-speed frequency response due to their structures.

[0003] T-BGA is based on TCP (Tape Carr).
This has a structure in which solder balls are provided on the circuit surface or the non-circuit surface of an inner package as an electric signal terminal for a printed wiring board (hereinafter abbreviated as PCB). FIG. 1 shows a cross-sectional view of an example of a T-BGA. The semiconductor chip 6 is connected to the wiring 3 formed on one surface of the insulating film 4 via the electrode 5 and further electrically connected to the outside by the solder ball 1. The insulating film 4 has a structure in which the reinforcing film 8 is bonded to the semiconductor chip 6 through an adhesive 7, and another reinforcing member 8 having a heat radiation function is bonded to the semiconductor chip 6 through the adhesive 7. FIG. 2 shows a cross-sectional view of an example of another T-BGA. The semiconductor chip 6 is connected to the wiring 3 formed on one surface of the insulating film 4 via the electrode 5 and further electrically connected to the outside by the solder ball 1. The insulating film 4 is bonded to the reinforcing member 8 via the adhesive 7. The reinforcing member 8 also has a function of dissipating heat, and has a structure in which the reinforcing member 8 is bonded to the semiconductor chip 6 via an adhesive 7. FIG.
FIG. 1 shows a cross-sectional view of an example of the E-BGA. The semiconductor chip 6 is connected to the wiring 3 formed on the substrate 10 made of glass-epoxy or the like via the gold wire 9, and further electrically connected to the outside by the solder ball 1. The substrate 10 and the semiconductor chip 6 have a structure bonded to a reinforcing member 8 having a heat dissipation function via an adhesive 7.

In the T-BGA, as an insulating film 4,
Generally, a polyimide film is used. This polyimide film is usually produced as a polyimide film by imidizing polyamic acid at a high temperature. for that reason,
When the temperature is returned to room temperature after the imidization treatment, heat shrinkage due to the imidization accumulates as internal stress. When joining the T-BGA to the substrate, the melting temperature (200 to
260 ° C.), at which time the internal stress is released and the planarity of the polyimide film is lost. As a result, a connection failure to the mounting board may occur. In recent years, as semiconductor devices have become more sophisticated, the size of IC chips and the number of pins have been increasing. In such a semiconductor device, the area of the T-BGA is also increasing, and the frequency of occurrence of solder ball connection failure due to the above factors is increasing. In order to improve the connection failure, it has been proposed to attach a reinforcing member called a stiffener having a thickness of 100 μm to 500 μm on the lead surface or the non-lead surface of the T-BGA, and the problem of the connection failure has been greatly improved. Further, for heat dissipation of the semiconductor chip and electromagnetic wave shielding, the semiconductor chip is provided with a reinforcing member called a cover plate and serving as a heat radiating plate. Recently, a reinforcing member in which a stiffener and a cover plate are integrated is sometimes used for cost reduction.

[0005] The BGA is finally mounted on a main board called a motherboard via solder balls. This mounting process is called a reflow process, and is a soldering process typified by a solder bath immersion method (dip method), a vapor phase method (soldering by the latent heat of evaporation of an inert solvent), and far-infrared reflow (IR reflow). Yes, the entire package is heated to 200-280 ° C. In recent years, lead-free solder has been developed and started to be used. However, the melting temperature is higher than that of conventional lead-containing solder, and the reflow temperature has to be necessarily increased. On the other hand, FIG.
The prior art adhesive used in FIGS. 2 and 3 is:
Thermosetting types are widely used because they are inexpensive and excellent in workability, electrical characteristics and heat resistance. A representative example thereof is an epoxy resin / epoxy curing agent / NBR (acrylonitrile-butadiene copolymer) -based adhesive.
By the way, conventionally used NBR is a general copolymer of acrylonitrile and butadiene and has no reactivity with the epoxy resin, so that it is used at a high temperature range of 200 to 280 ° C. used for solder reflow. The elastic modulus becomes too low. In such a high-temperature reflow, if moisture is present in the adhesive or the IC substrate, it explosively vaporizes to generate voids, and when the adhesive is pushed away, swelling called "popcorn" occurs. Due to this popcorn phenomenon, the IC substrate is deformed, causing solder balls to come into contact with each other, to cause a short circuit, or to come off from the wiring board, resulting in a significant decrease in production efficiency. In order to prevent this popcorn phenomenon, a method has been adopted in which the package after the adhesive has been heat-cured is completely dried, stored in a sealed container, and shipped (moisture-proof packing).

[0006]

This method of shipping in a moisture-proof package has the drawback that the manufacturing process and the handling of the product are complicated and the product price is high. The purpose of the present invention is
Excellent reflow resistance by solving the problems of conventional adhesives used for laminated structures such as T-BGA, such as the popcorn phenomenon that occurs in the reflow process and package cracks caused by internal stress release. To provide an adhesive composition for semiconductor devices, an adhesive sheet, and a reinforcing member using the same.

[0007]

The adhesive composition for a semiconductor device of the present invention is applied to a semiconductor device in which a reinforcing member is laminated on a circuit surface of an IC substrate comprising at least an insulating layer and a conductor circuit or on the back surface thereof. An adhesive composition to be used,
The composition is characterized by containing (a) an epoxy resin, (b) an epoxy curing agent, (c) an elastic body, and (d) a silane coupling agent. Further, the adhesive sheet of the present invention is characterized in that the adhesive composition for a semiconductor device is laminated on one surface of a support. Further, the reinforcing member of the present invention is characterized in that the adhesive composition for a semiconductor device is laminated on at least one surface of a substrate. Hereinafter, the present invention will be described in detail.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION The adhesive composition and the adhesive sheet of the present invention are used for a semiconductor device in which a reinforcing member is laminated on a circuit surface of an IC substrate comprising at least an insulator layer and a conductor circuit or on the back surface thereof. This is for bonding a reinforcing member such as a stiffener or a cover plate or an IC (semiconductor integrated circuit) to the substrate. The components used in the adhesive composition of the present invention will be described. (A) Epoxy resin: The epoxy resin is a resin having two or more oxirane rings in the molecule, such as glycidyl ether, glycidyl ester, glycidylamine, linear aliphatic epoxide, and alicyclic epoxide. May be used alone or in combination of two or more. Specifically, bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, bisphenol S diglycidyl ether, resorcinol diglycidyl ether, brominated bisphenol A diglycidyl ether, fluorinated bisphenol A diglycidyl ether, phenol novolac glycidyl ether, Glycidyl ethers such as cresol novolak glycidyl ether, brominated novolak glycidyl ether, glycidyl esters such as hexahydrophthalic acid diglycidyl ester, phthalic acid diglycidyl ester, dimer acid diglycidyl ester, triglycidyl isocyanurate, tetraglycidyl diaminodiphenylmethane , Glycidylamines such as tetraglycidyl meta-xylene diamine, epoxidation Linear aliphatic epoxies such as lipbutadiene and epoxidized soybean oil; and alicyclic epoxides such as 3,4-epoxy-6-methylcyclohexylmethylcarboxylate and 3,4-epoxycyclohexylmethylcarboxylate. Can be Of these, bisphenol-type epoxy resins are particularly preferably used because they are inexpensive, and have an epoxy equivalent of 170-4.
000 is preferable, and more preferably, the equivalent is 170 to
500 are preferred. If the epoxy equivalent is larger than 4000, the elasticity of the cured product becomes low, and the adhesive strength decreases. The epoxy resin preferably used in the present invention is specifically manufactured by Yuka Shell Epoxy Co., trade name;
6, 828, 1001, manufactured by Asahi Denka Kogyo KK, trade name; EP
-4100G, EP4400, EP-4901 and the like. Use of a halogenated epoxy, especially a brominated epoxy, is an effective means for imparting flame retardancy. Specific examples of brominated epoxies are available from Yuka Shell Epoxy Co., Ltd., trade names; Epicoat 5045, 504
6, 5050, Nippon Kayaku, brand name: BREN-S, B
REN-105, BREN-301 and the like.

(B) Epoxy curing agent: Epoxy curing agent refers to a chemical substance that reacts with an epoxy resin to form a three-dimensional network structure, and includes aromatic polyamines, aliphatic polyamines, polyamides, acid anhydrides, phenol derivatives, and polyamines. Mercaptans, tertiary amines, Lewis acid complexes and the like are used. Specifically, 4,4'-aminodiphenylmethane, 4,4'-
Diaminodiphenyl ether, diaminodiphenylsulfone, diaminodiphenylsulfide, m-phenylenediamine, 2,4-toluylenediamine, m-toluylenediamine, o-toluylenediamine, metaxylylenediamine, metaaminobenzylamine, benzidine,
4-chloro-O-phenylenediamine, bis (3,4-
Aromatic polyamines such as diaminophenyl) sulfone, 2,6-diaminopyridine, isophthalic dihydrazide, diethylene triamine, dipropylene triamine,
Diethylenetetramine, triethylenetetramine, tetraethylenepentamine, dimethylaminopropylamine, diethylaminopropylamine, dibutylaminopropylamine, hexamethylenediamine, N-aminoethylpiperazine, bis-aminopropylpiperazine, trimethylhexamethylenediamine, bis- ( Hexamethylene) triamine, adipic dihydrazide, sebacic dihydrazide, aliphatic polyamines such as dicyandiamide, dimer acid polyamide, maleic anhydride, dodecenyl succinic anhydride, chlorendex anhydride, sebacic anhydride, phthalic anhydride, pyromellitic anhydride , Trimellitic anhydride, cyclopentane / tetracarboxylic dianhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, tetrame Ren maleic anhydride, tetrahydrophthalic anhydride, methyl tetrahydrophthalic anhydride, endomethylene tetrahydrophthalic anhydride, methyl endomethylene tetrahydrophthalic anhydride, 5- (2,
5-dioxotetrahydroxyfuryl) -3-methyl-
Acid anhydrides such as 3-cyclohexene-1,2-dicarboxylic anhydride and methylnadic anhydride; phenol derivatives such as resole phenolic resin, phenol novolak resin, cresol novolak resin, resorcinol resin and xylene resin; Mercapto diethyl ether,
Polymercaptans such as 1,2-dimercaptopropane, 1,3-dimercaptopropanol, bis (2-mercaptoethylsulfide), dimethylaminomethylphenol, 2,4,6-tri (dimethylaminomethyl)
Phenol, tri (dimethylaminomethyl) phenol tri-2-ethylhexane salt, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2
-Phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole,
2-ethylimidazole, 2-isopropylimidazole, 1-cyanoethyl-2-methylimidazole, 1-
Cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-isopropylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-
Methylimidazole trimellitate, 1-cyanoethyl-2-ethyl 4-methylimidazole trimellitate,
1-cyanoethyl-2-undecylimidazole trimellitate, 1-cyanoethyl-2-phenylimidazole, 2,4-diamino-6- [2′-methylimidazolyl- (1) ′]-ethyl-s-triazine, , 4-Diamino-6- [2'undecylimidazolyl-
(1) ']-ethyl-s-triazine, 2,4-diamino-6- [2'-ethyl-4'-methylimidazolyl-
(1) ']-ethyl-s-triazine, 1-dodecyl-
2-methyl-3-benzylimidazolium chloride,
1,3-dibenzyl-2-methylimidazolium chloride, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 1-cyanoethyl-2-phenyl-
4,5-di (cyanoethoxymethyl) imidazole, 2
Tertiary amines such as -methylimidazole / triazine complex, 2-phenylimidazole / triazine complex,
Lewis acid complexes such as boron trifluoride / monoethylamine complex, boron trifluoride / triethanolamine complex, boron fluoride / piperidine complex, boron fluoride / n-butyl ether complex, etc. No. Among them, phenol derivatives are preferable because of their excellent reactivity and excellent wet heat resistance even in semiconductor device applications.

(C) Elastic body: Any elastic body can be used as long as it imparts flexibility to the adhesive. The elastic body used in the present invention is a resin generally called an elastomer. Specifically, acrylic rubber, acrylonitrile-butadiene copolymer (NBR), acrylonitrile-butadiene-styrene resin (ABS), ethylene- Propylene rubber, chloroprene rubber (CR), styrene-butadiene rubber (SBR), styrene-butadiene-ethylene resin (SEBS), butadiene rubber (BR), polyamide resin, polyamideimide resin, polyimide resin, polyethylene resin, polyester resin, polyurethane resin,
Polyvinyl butyral resin, silicone resin and the like, among which acrylic rubber, acrylonitrile-
Butadiene copolymers, polyamide resins and silicone resins are preferred, most preferably acrylic rubber and acrylonitrile-butadiene copolymer. The acrylonitrile-butadiene copolymer has an acrylonitrile content of 10 to 50.
Mol% is preferred, and more preferably 20 to 40 mol%.
It is. If it is less than 10 mol%, the cured product has low chemical resistance,
If it exceeds 50 mol%, methyl ethyl ketone (hereinafter referred to as ME
Called K. ), The solubility in general-purpose solvents such as toluene is reduced, which is not preferable. Further, these elastic bodies preferably have a functional group capable of reacting with the epoxy resin as the component (a) in order to improve heat resistance after curing. Specific examples of the functional group include an amino group, an isocyanate group, a carboxyl group (including an anhydride), a silanol group, a hydroxyl group, a vinyl group, a methylol group, and a mercapto group. Among them, an amino group, a carboxyl group, and a hydroxyl group are preferable because of their high reactivity. Most preferably, the elastic body has a carboxyl group and a hydroxyl group. Functional group content is 0.2-20 mol%
Is more preferable, more preferably 0.5 to 15 mol%, and still more preferably 2 to 8 mol%. If the amount of the functional group is less than 0.2 mol%, the reactivity is low, and if it exceeds 20 mol%, the stability of the paint is deteriorated.

(D) Silane coupling agent: The silane coupling agent is, as shown in the following formula (1), an organic functional group (X) capable of binding or bonding to an organic matrix to silicon and a silane coupling agent capable of bonding to an inorganic material. It has a structure having a hydrolyzable group (Y). Examples of the organic functional group include an alkyl group, a phenyl group, an amino group, an epoxy group, a vinyl group, a methacryloxy group, and a mercaptooxy group, and are generally bonded to a silicon atom via an alkylene group having 1 to 6 carbon atoms. are doing. Further, the organic functional group having an epoxy group or an amino group is preferable because of good reactivity with an epoxy curing agent. Examples of the hydrolyzable group include a methoxy group, an ethoxy group, a chloro group, and an acetoxy group.

Embedded image Specific silane coupling agents include, when X is an organic functional group having a vinyl group, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltriacetoxysilane, vinyltrichlorosilane, and vinyl tris (β-methoxyethoxy) silane , N-β (N-vinylbenzyl) aminopropyltrimethoxysilane.hydrochloride, and when X is an organic functional group having a methacryloxy group,
—Methacryloxypropyltrimethoxysilane and γ-methacryloxypropylmethyldimethoxysilane. When X is an organic functional group having an epoxy group,
β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldimethoxysilane, and γ-glycidoxypropylmethyldiethoxysilane. When X is an organic functional group having a mercapto group, γ-mercaptopropyltrimethoxysilane, γ-mercaptopropyltriethoxysilane, γ-
When mercaptopropylmethyldimethoxysilane is an organic functional group having an amino group, γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropyl-tris (β-methoxy-ethoxy-ethoxy) Silane, N-methyl-γ-aminopropyltrimethoxysilane, N- (β-aminoethyl)
-Γ-aminopropyltrimethoxysilane, N- (β
-Aminoethyl) -γ-aminopropylmethyldimethoxysilane, triaminopropyltrimethoxysilane, N
-Phenyl-γ-aminopropyltrimethoxysilane,
Octadecyldimethyl [γ- (trimethoxysilyl) propyl] ammonium chloride, γ-4,5 dihydroxyimidazolepropyltriethoxysilane, γ-ureidopropyltriethoxysilane, γ-ureidopropyltrimethoxysilane are exemplified. Furthermore, as those having other organic functional groups, γ-chloropropyltriethoxysilane, γ-chloropropyltrimethoxysilane, γ-chloropropylmethyldichlorosilane,
γ-chloropropylmethyldimethoxysilane, γ-chloropropylmethyldiethoxysilane, γ-cyanopropyltriethoxysilane, trimethylmethoxysilane, trimethylethoxysilane, dimethyldimethoxysilane,
Dimethyldiethoxysilane, methyltrimethoxysilane, tetramethoxysilane, methyltriethoxysilane, tetraethoxysilane, methyldimethoxysilane,
Methyldiethoxysilane, dimethylethoxysilane, dimethylvinylmethoxysilane, dimethylvinylethoxysilane, methylvinyldimethoxysilane, methylvinyldiethoxysilane, diphenyldimethoxysilane, phenyltrimethoxysilane, diphenyldiethoxysilane, phenyltriethoxysilane, methyltrimethylsilane (Methacryloyloxyethoxy) silane, methyltri (glycidyloxy) silane, octadecyltriethoxysilane, trimethylchlorosilane, dimethyldichlorosilane, methyltrichlorosilane, methyldichlorosilane,
Dimethylchlorosilane, dimethylvinylchlorosilane,
Examples include methylvinyldichlorosilane, methylvinyldichlorosilane, triphenylchlorosilane, methyldiphenylchlorosilane, diphenyldichlorosilane, methylphenyldichlorosilane, phenyltrichlorosilane, and chloromethyldimethylchlorosilane. Among them,
A silane coupling agent in which X has an organic functional group having an epoxy group or an amino group is preferable because of excellent popcorn resistance. The above (a), (b), (c),
In addition to the component (d), a reaction accelerator such as an imidazole, an amine catalyst such as 1,8-diazabicyclo (5,4,0) undecene, or a phosphorus catalyst such as triphenylphosphine is added to promote the curing reaction. Is also effective.

The adhesive composition for a semiconductor device of the present invention preferably contains an inorganic or organic filler for the purpose of adjusting the coefficient of thermal expansion and thermal conductivity or controlling workability. As the inorganic filler, crushed silica, fused silica, alumina, titanium oxide, beryllium oxide, magnesium oxide, calcium carbonate, titanium nitride, silicon nitride,
Boron nitride, titanium boride, tungsten boride, silicon carbide,
Titanium carbide, zirconium carbide, molybdenum carbide, mica, zinc oxide, carbon black, aluminum hydroxide, calcium hydroxide, magnesium hydroxide, antimony trioxide or those obtained by treating the surface thereof with a trimethylsiloxyl group or the like. As an organic filler,
Examples include polyimide, polyamide imide, polyether ether ketone, polyether imide, polyester imide, nylon, and silicone. The amounts of these fillers are determined according to the respective components (a), (b), (c) and (d).
Is in the range of 5 to 95 parts by weight, preferably 10 to 50 parts by weight, based on 100 parts by weight in total.

The adhesive composition for a semiconductor device of the present invention containing the above-mentioned components (a) to (d) is cured at 200 ° C. to 28 ° C.
The dynamic elastic modulus in the temperature range of 0 ° C. is preferably 10 ⁶ Pa or more. When the dynamic elastic modulus is less than 10 ⁶ Pa, a popcorn phenomenon is likely to occur, and defects such as short-circuit are likely to occur. The dynamic elastic modulus of the cured adhesive film having a thickness of 100 μm was measured using a Leo Vibron DDV-II manufactured by Orientec, at a frequency of 11 Hz and a heating rate of 3 ° C./min. A preferable mixing ratio of the above components (a) to (c) is [(a) + (b)] / (c) is 0.2.
To 5, more preferably 0.3 to 3.3.
In this case, if it is less than 0.2, the elastic modulus is lower than 10 ⁶ Pa, and if it is more than 5, the film adhesive loses flexibility, which is not preferable. The component (d) is used in an amount of 0.1 to 20 parts by weight, preferably 0.2 to 10 parts by weight, based on 100 parts by weight of the total of the components (a), (b) and (c).
Parts by weight, optimally 0.3-5 parts by weight. The components (a) to (d) are dissolved and mixed in an organic solvent to prepare an adhesive solution. As an organic solvent preferably used, N-
Methyl-2-pyrrolidone, N, N-dimethylacetamide, N, N-dimethylformamide, pyridine, ME
K, methyl isobutyl ketone, toluene, xylene,
1,4-dioxane, tetrahydrofuran, ethanol, methanol, isopropanol, methyl cellosolve, ethyl cellosolve and the like.

The adhesive sheet of the present invention has a structure in which the adhesive composition is laminated on at least one surface of a support.
The adhesive sheet is obtained by applying the above-mentioned adhesive composition solution to a support, followed by drying. Examples of the support used include heat-resistant films such as polyimide, polyamide, polyetheramide, polyphenylene sulfide, polyetherketone, polyparabanic acid, polyethylene terephthalate, and fluororesin; glass cloth, aramid, nylon, amideimide, and polyimide. A non-woven fabric is preferred, and a release film obtained by subjecting the heat-resistant film surface to a release treatment is suitably used. The thickness of the heat-resistant and peelable film is 7.5 to 500 μm, preferably 10 to 1 μm.
30 μm. On the surface of the adhesive composition layer of the adhesive sheet, a protective film is provided on the surface of the adhesive layer as necessary. The releasable film to be used includes the above-mentioned heat-resistant films having releasability, and those having a surface subjected to a release treatment are also preferable films. As the protective film, the above-mentioned film having releasability is preferably used, and the thickness is the same as described above.
Although the thickness of the adhesive layer after drying varies depending on the package shape, it is generally 10 to 200 μm, preferably 30 to 10 μm.
0 μm.

The reinforcing member of the present invention is obtained by laminating the adhesive composition on at least one surface of a substrate described below. Examples of the reinforcing member include the stiffener and / or the cover plate described above. In order to manufacture the reinforcing member, a method of laminating the surface of the adhesive layer of the adhesive sheet and the base material so as to face each other, and then performing a punching process to obtain a desired shape. There is a method obtained by punching an adhesive sheet and a base material individually into a desired shape beforehand, and then laminating the surface of the adhesive layer of the adhesive sheet and the base material so as to face each other. It is also possible to punch out after applying the adhesive composition to the base material. The adhesive sheet used here may be any of an adhesive sheet having an adhesive composition laminated on one surface of a peelable film and an adhesive sheet having an adhesive composition laminated on at least one surface of a support such as a heat-resistant film. The base material constituting the reinforcing member according to the present invention is not particularly limited as long as it can reinforce and dimensionally stabilize an IC substrate such as polyimide.
Aluminum, cobalt, nickel, titanium and their alloys (SUS, 42 alloy, etc.) or plated metals, ceramics (alumina, zirconia, etc.), glass (quartz glass, soda glass, etc.), carbon and polyimide, polyester And other organic materials can be used. Metals having good heat radiation and electromagnetic wave shielding properties are preferable, and SUS which is excellent in workability, dimensional stability, cost, etc.
Forty-two alloys are preferably used. The reinforcing member varies in shape and size depending on the package shape, but generally has a thickness of 100 μm to 2 mm, preferably 200 to 500 μm. The adhesive layer also varies depending on the package shape, but generally has the above-mentioned thickness. Hereinafter, the present invention will be described specifically with reference to examples.

[0016]

EXAMPLES [Preparation of paint for adhesive composition] Epoxy resin, epoxy curing agent, elastic material, silane coupling agent,
A solution was prepared by dissolving a curing accelerator in MEK so as to have a weight percentage shown below, and the solution was dissolved in the weight percentage shown in Table 1.
(Solid content) to obtain a coating of the adhesive composition for a semiconductor device of the present invention. Example 1 Epoxy resin: 80% solution of bisphenol A type epoxy resin (trade name; Epicoat 1001, manufactured by Yuka Shell Epoxy) Epoxy curing agent: 70% solution of novolak phenol resin (trade name: Retop PSM4261, manufactured by Gunei Chemical Co., Ltd.) Elastic body: NBR 22% solution containing 7% of carboxyl groups (trade name: Nippol 1072, manufactured by Zeon Corporation) Silane coupling agent: 10% solution of epoxy silane coupling agent (trade name: SILAACE S-510, manufactured by Chisso Corporation) ) Curing accelerator: 2-undecyl imidazole 1% solution (trade name: C11Z, manufactured by Shikoku Kasei Kogyo Co., Ltd.) The composition of the adhesive composition according to the present invention is uniformly applied, and is applied at 130 ° C. for 5 minutes. After forming an adhesive layer having a thickness of 50μm by thermal drying, to produce an adhesive sheet of the present invention by bonding a polyethylene protective film having a thickness of 50μm which has been subjected to release treatment. Then, while removing the protective film, thickness 250μ
m and a nickel-plated copper plate (substrate for reinforcing member). Next, the resultant was punched into a ring shape by a punching die to produce a reinforcing member (stiffener) of the present invention. The polyester film of the obtained stiffener was peeled off, and 3 /
400 pin two layer TA using 4 oz Cu foil
B was thermocompression-bonded to the non-lead surface (polyimide surface) and heated at 90 ° C. for 1 hour and further at 150 ° C. for 4 hours to cure the adhesive, thereby producing a simulated TAB T-BGA package with a stiffener.

Example 2 Epoxy resin: 80% solution of bisphenol A type epoxy resin (trade name; Epicoat 1001, manufactured by Yuka Shell Epoxy) Epoxy curing agent: 70% solution of novolak phenol resin (trade name: Retop PSM4261, Gunei) Elastic body: NBR 22% solution containing carboxyl group (trade name; Nippol 1072, manufactured by Zeon Corporation) Silane coupling agent: 10% solution of epoxy silane coupling agent (trade name: SILAACE S-530, Chisso Corporation) Hardening accelerator: 1% solution of 2-undecyl imidazole (trade name: C11Z, manufactured by Shikoku Chemical Industry Co., Ltd.) Except for using the adhesive composition paint according to the present invention having the composition shown in Table 1 using the above paint. A simulated TAB T-BGA package with a stiffener was prepared in the same manner as in Example 1. . Example 3 Epoxy resin: 80% solution of bisphenol A type epoxy resin (trade name: Epicoat 1001, manufactured by Yuka Shell Epoxy) Epoxy curing agent: 70% solution of novolak phenol (trade name: Retop PSM4261, manufactured by Gunei Chemical Co., Ltd.) Elastic body: Carboxyl group-containing NBR 22% solution (trade name; Nippol 1072, manufactured by Zeon Corporation) Silane coupling agent: aminosilane coupling agent 10% solution (trade name: SILAACE S-330, manufactured by Chisso Corporation) Curing accelerator : 2-undecyl imidazole 1% solution (trade name; C11Z, manufactured by Shikoku Chemicals Co., Ltd.) In the same manner as in Example 1 except that the adhesive composition paint according to the present invention having the composition shown in Table 1 using the above paint was used. Thus, a simulated TBGA package of TAB with a stiffener was manufactured.

Example 4 Epoxy resin: 80% solution of bisphenol A type epoxy resin (trade name; Epicoat 1001, manufactured by Yuka Shell Epoxy) Epoxy curing agent: 70% solution of novolak phenol resin (trade name: Retop PSM4261, Gunei) Elastic body: 22% solution of NBR containing 7% of carboxyl groups (trade name: PNR-1H, manufactured by Nippon Synthetic Rubber Co., Ltd.) Silane coupling agent: 10% solution of epoxy silane coupling agent (trade name: SILAACE S- Curing accelerator: 2-undecyl imidazole 1% solution (trade name: C11Z, manufactured by Shikoku Chemicals Co., Ltd.) An adhesive composition paint according to the present invention having the composition shown in Table 1 using the above paint is used. A simulated T-BGA package of TAB with stiffener was prepared in the same manner as in Example 1 except for . Example 5 Epoxy resin: 80% solution of bisphenol A type epoxy resin (trade name: Epicoat 1001, manufactured by Yuka Shell Epoxy) Epoxy curing agent: 70% solution of novolak phenol resin (trade name: Retop PSM4261, manufactured by Gunei Chemical Co., Ltd.) Elastic body: Carboxyl group-containing NBR 22% solution (trade name: PNR-1H, manufactured by Nippon Synthetic Rubber Co., Ltd.) Silane coupling agent: vinylsilane coupling agent 10% solution (trade name: SILAACE S-210, manufactured by Chisso Corporation) Curing accelerator: 2-undecylimidazole 1% solution (trade name: C11Z, manufactured by Shikoku Chemicals Co., Ltd.) Example 1 except that the adhesive composition paint according to the present invention having the composition shown in Table 1 using the above paint was used. In the same manner as described above, a simulated TBGA package of TAB with a stiffener was produced.

Comparative Example 1 Epoxy resin: 80% solution of bisphenol A type epoxy resin (trade name; Epicoat 1001, manufactured by Yuka Shell Epoxy) Epoxy curing agent: 70% solution of novolak phenol resin (trade name: Retop PSM4261, Gunei) Elastic body: Carboxyl group-containing NBR 22% solution (trade name: PNR-1H, manufactured by Nippon Synthetic Rubber Co., Ltd.) Curing accelerator: 2-undecyl imidazole 1% solution (trade name: C11Z, Shikoku Chemical Industry Co., Ltd.) Manufacture) A simulated TB-BGA package of TAB with stiffener was prepared in the same manner as in Example 1 except that an adhesive composition paint for comparison of the composition in Table 1 using the above paint was used. Comparative Example 2 Epoxy resin: 80% solution of bisphenol A type epoxy resin (trade name: Epicoat 1001, manufactured by Yuka Shell Epoxy) Epoxy curing agent: 70% solution of novolak phenol resin (trade name: Retop PSM4261, manufactured by Gunei Chemical Co., Ltd.) Elastic body: 22% solution of NBR containing carboxyl group (trade name: PNR-1H, manufactured by Nippon Synthetic Rubber Co.) Titanium coupling agent: 10% solution of isopropyl polyisostearoyl titanate (trade name: KR TTS, manufactured by Ajinomoto Co.) Accelerator: 1% solution of 2-undecylimidazole (trade name: C11Z, manufactured by Shikoku Chemicals Co., Ltd.) Example 1 was repeated except that an adhesive composition paint for comparison of the composition in Table 1 using the above paint was used. In the same manner, a simulated T-BGA package of a TAB with a stiffener was manufactured.

[0020]

[Table 1]

(Evaluation of popcorn resistance)
5 and 20 simulated T-BGAs prepared in Comparative Example 1 and Comparative Example 2 were prepared, left in an environment of a temperature of 85 ° C. and a relative humidity of 85% for 48 hours, and then subjected to a temperature range of 220 to 240 ° C. , Temperature history at 240 ° C. is mandatory)
The sample was subjected to R reflow, the presence or absence of popcorn generation was observed by ultrasonic flaw detection, and the number of packages where generation was observed was counted. The results are shown in Table 2. As is clear from the results in Table 2, it was confirmed that the simulated package using the adhesive composition of the present invention was excellent in popcorn resistance after moisture absorption of the package. (Measurement of Dynamic Elastic Modulus) The above Examples 1 to 5 and Comparative Example 1,
The adhesive sheet having a thickness of 100 μm obtained in Comparative Example 2 was 90
Cured for 1 hour at 150 ° C for 4 hours at 150 ° C, and determined by the above-mentioned measurement method as the dynamic elastic modulus (minimum value at 200 to 280 ° C)
Was measured, and the results are shown in Table 2. As is evident from the results in Table 2, the simulated package using the adhesive composition of the present invention has a dynamic elastic modulus of 10 ⁶ Pa or more required to maintain sufficient popcorn resistance. It was confirmed. (Thermal cycle test) Each of the 20 simulated packages obtained in Examples 1 to 5 and Comparative Examples 1 and 2 was
A thermal cycle test at 55 ° C to 125 ° C was performed. However, in this case, a temperature history of 1 hour is indispensable for each of 125 ° C. and −55 ° C. [normal temperature−high temperature−low temperature−normal temperature]
Was performed under the condition of 600 cycles.
As a result, there was no abnormality in the packages of Examples 1 to 5, but some of the packages of Comparative Examples 1 and 2 had a package crack.

[0022]

[Table 2]

[0023]

When the package using the adhesive composition of the present invention is mounted on a printed wiring board, the package has excellent popcorn resistance even when exposed to the high temperature of the reflow process, and does not cause electrical failure of solder balls. With high reliability.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of an example of a T-BGA package.

FIG. 2 is a cross-sectional view of another example of the T-BGA package.

FIG. 3 is a cross-sectional view of an example of an E-BGA package.

[Explanation of symbols]

1. Solder ball, 3. Wiring, 4. Insulating film, 5. Electrode, 6, Semiconductor chip,
7 ... adhesive, 8 ... reinforcing member, 9 ... gold wire, 10 ... substrate

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4J004 AA05 AA13 AA17 AB05 CA03 CA06 CC02 FA05 4J040 CA071 DF041 DF081 EB032 EC061 EC091 EC121 EC261 HB36 HC01 HD35 HD36 JA09 KA16 LA06 LA09 NA20 5F047 BA34 BB03 BB11 BB16

Claims (7)

[Claims] An adhesive composition for use in a semiconductor device in which a reinforcing member is laminated on a circuit surface of an IC substrate including at least an insulator layer and a conductor circuit or on a back surface thereof,
An adhesive composition for a semiconductor device, comprising: (a) an epoxy resin, (b) an epoxy curing agent, (c) an elastic body, and (d) a silane coupling agent. 2. The adhesive composition for a semiconductor device according to claim 1, wherein the silane coupling agent is an epoxy silane coupling agent or an amino silane coupling agent. 3. The adhesive composition for a semiconductor device according to claim 1, wherein said epoxy curing agent is a phenol derivative. 4. The adhesive composition for a semiconductor device according to claim 1, wherein said elastic body is an acrylic rubber or an acrylonitrile-butadiene copolymer having a functional group capable of reacting with an epoxy group. 5. The semiconductor device of claim 1, wherein said adhesive composition has a dynamic elastic modulus of 1 in a temperature range of 200 ° C. to 280 ° C. after curing.
The adhesive for a semiconductor device according to claim 1, characterized in that 0 ⁶ Pa or more. 6. An adhesive sheet, wherein the adhesive composition for a semiconductor device is laminated on at least one surface of a support. 7. A reinforcing member, wherein the adhesive composition for a semiconductor device is laminated on at least one surface of a substrate.