JP2002246528A5 - - Google Patents

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Publication number
JP2002246528A5
JP2002246528A5 JP2001036827A JP2001036827A JP2002246528A5 JP 2002246528 A5 JP2002246528 A5 JP 2002246528A5 JP 2001036827 A JP2001036827 A JP 2001036827A JP 2001036827 A JP2001036827 A JP 2001036827A JP 2002246528 A5 JP2002246528 A5 JP 2002246528A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001036827A
Other languages
Japanese (ja)
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JP2002246528A (ja
JP4570797B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2001036827A priority Critical patent/JP4570797B2/ja
Priority claimed from JP2001036827A external-priority patent/JP4570797B2/ja
Publication of JP2002246528A publication Critical patent/JP2002246528A/ja
Publication of JP2002246528A5 publication Critical patent/JP2002246528A5/ja
Application granted granted Critical
Publication of JP4570797B2 publication Critical patent/JP4570797B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2001036827A 2001-02-14 2001-02-14 半導体装置の製造方法 Expired - Fee Related JP4570797B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001036827A JP4570797B2 (ja) 2001-02-14 2001-02-14 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001036827A JP4570797B2 (ja) 2001-02-14 2001-02-14 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2002246528A JP2002246528A (ja) 2002-08-30
JP2002246528A5 true JP2002246528A5 (enrdf_load_html_response) 2008-04-03
JP4570797B2 JP4570797B2 (ja) 2010-10-27

Family

ID=18900046

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001036827A Expired - Fee Related JP4570797B2 (ja) 2001-02-14 2001-02-14 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP4570797B2 (enrdf_load_html_response)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7195953B2 (en) 2003-04-02 2007-03-27 Yamaha Corporation Method of manufacturing a semiconductor package using a lead frame having through holes or hollows therein
JP4055158B2 (ja) 2003-05-28 2008-03-05 ヤマハ株式会社 リードフレーム及びリードフレームを備えた半導体装置
JP2006179760A (ja) 2004-12-24 2006-07-06 Yamaha Corp 半導体パッケージ、および、これに使用するリードフレーム

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5632461U (enrdf_load_html_response) * 1979-08-18 1981-03-30
JPS6265445A (ja) * 1985-09-18 1987-03-24 Hitachi Hokkai Semiconductor Ltd リ−ドフレ−ム
JPH03296254A (ja) * 1990-02-06 1991-12-26 Dainippon Printing Co Ltd リードフレーム
JPH06120398A (ja) * 1992-10-08 1994-04-28 Toshiba Corp リ−ドフレ−ム

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