JP2002246201A - Electronic part and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To dispense with various resin molding dies used for each type of products. SOLUTION: An element 2 equipped with electrodes connected to connecting terminals 1 is dipped into liquid photo-setting resin 12 and held, and light energy is irradiated to the photo-setting resin 12 staying around the element 2 to keep sweeping and cured for the formation of a housing 15.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component used for an electronic device or an electronic circuit, and a method for manufacturing the same.

[0002]

2. Description of the Related Art A conventional electronic component and a method of manufacturing the same will be described with reference to the drawings.

In FIGS. 3 to 5, reference numeral 1 denotes a connection terminal which is electrically and mechanically connected to an external electronic circuit, and is formed of a plate-shaped conductor such as a metal material such as copper, iron, aluminum or an alloy thereof. ing.

[0004] Reference numeral 2 denotes an element having a function such as a resistor, a capacitor, an inductor, an oscillator or an active element, and a connection terminal 1 is electrically and mechanically connected to its electrode.

Reference numeral 3 denotes an exterior body, which is made of a thermoplastic resin or a thermosetting resin, and externally seals the element 2 part.

Reference numeral 4 denotes a gate for injecting a molding resin for forming the exterior body 3, and reference numeral 5 denotes a runner.

Next, a resin molding method for forming the exterior body 3 will be described with reference to FIG. As shown in FIG. 6, the element 2 is provided between an upper mold 6 for transfer molding and a lower mold 7 having a gate portion 4 and a runner portion 5, and is formed via the runner portion 5 and the gate portion 4. Injection resin is injected and cured by heating to complete the exterior body 3 having a predetermined shape.

[0008]

However, the above-mentioned conventional method for manufacturing electronic parts has a problem that a resin molding die is required for each type of finished product having a different shape, and the shape cannot be changed immediately. Was.

An object of the present invention is to solve the above-mentioned problems, and it is an object of the present invention to eliminate the need for an individual resin molding die for each product type.

[0010]

In order to achieve the above object, the present invention has the following arrangement.

According to a first aspect of the present invention, a connection terminal is connected to an electrode of an element, and at least a part of the periphery of the element is covered with an exterior body made of a photocurable resin. In addition, it is possible to obtain an advantageous effect that an electronic component that can be easily sealed and provided can be provided reliably.

According to a second aspect of the present invention, in a state where a connection terminal is connected to an electrode of the element, the element is immersed and held in a liquid photo-curable resin, and an outer periphery of the element is formed. This is to cure the photo-curable resin by sweeping irradiation of light energy to form the outer package.This has the effect of eliminating the need for individual resin molding dies for each product type and being able to respond immediately to shape changes. can get.

[0013] The invention according to claim 3 is, in particular, a laser, a light emitting diode (LED), as a light energy source.
Since at least one of the lamps is used, a special mold for resin molding is not required, and an effect of being able to cope with various materials to be used and the shape of the exterior sealing can be obtained.

According to a fourth aspect of the present invention, the light energy is applied by sweep irradiation by spot points or collective sweep irradiation by lines or areas, and is surely cured to the required shape of the exterior body. There is an operational effect of being able to do things.

According to a fifth aspect of the present invention, a photo-curable resin mixed with at least one additive of a high thermal conductive material, a high specific gravity material, an insulating material or an electrical functional material is used, and a finished product is used. The effect that the required characteristics can be set or improved can be obtained.

According to the present invention, the photocurable resin in the vicinity of the element is uncured, and the effect of not applying stress or load in the curing reaction to the element can be obtained.

According to the seventh aspect of the present invention, the photocurable resin is cured after the device is moved, and the effect of uniformly encapsulating the exterior in a predetermined shape can be obtained.

[0018] The invention according to claim 8 is characterized in that, through a filter that transmits light (wavelength) to which the photocurable resin reacts,
In this method, light energy is swept, and the effect of improving the light energy sweep irradiation efficiency for photocuring can be obtained.

According to the ninth aspect of the present invention, the sweeping irradiation is performed by changing the intensity of the light energy continuously or continuously or intermittently, and it is possible to cope with a change in the configuration and shape and to promote the uniform light curing. can get.

According to a tenth aspect of the present invention, light energy is transmitted through a container in which a photo-curable resin is stored, and is irradiated by sweeping. The effect of being able to stop is obtained.

[0021]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a first embodiment of the present invention; Figure 1
FIG. 2 is a perspective view of a main part configuration for explaining exterior sealing with a photocurable resin in Embodiment 1 of the present invention, and FIG. 2 is a perspective view showing the resin molding step.

It is to be noted that the same reference numerals are given to constituent members described in the related art, and detailed description is simplified.

In FIGS. 1 and 2, reference numeral 11 denotes a metal plate made of brass or stainless steel on the bottom surface and four side surfaces, or one of the bottom surface and four side surfaces transmitting or blocking light energy, thereby chemically and mechanically. This is a container made of glass, hard resin, or the like, which has high stability, and has an open upper part.

Reference numeral 12 denotes a liquid photo-curable resin such as an epoxy-based or urethane-based resin which cures in response to light energy, and a predetermined amount is stored in the container 11. The material and shape of the container 11 can be stored without reacting with the photo-curable resin 12, can sweep and irradiate light energy to a predetermined location, and the shape or the shape if there is no unnecessary reflection, refraction or absorption. The material is not limited.

In addition, additives to the photocurable resin 12, such as a high thermal conductive material such as alumina, ferrite, and magnesium, an insulating material such as an inorganic filler, tungsten,
By mixing inorganic or organic materials with high specific gravity materials such as stainless steel, dielectric or magnetic materials, etc., it is possible to improve various required characteristics and to cope with exterior packaging (packaging) with composite materials. You can do it.

Photocurable resin 1 stored in container 11
In the liquid 2, an element 2 whose electrode (not shown) is connected to the connection terminal 1 is disposed such that the plane of the connection terminal 1 is parallel to the liquid surface of the photocurable resin 12. It is immersed so that it can move horizontally and vertically or rotate freely (the drive mechanism is not shown).

Then, by sweeping and irradiating light energy (irradiation mechanism is not shown), the photocurable resin 12 is cured so as to cover the element 2 and the outer periphery thereof.
The exterior sealing of a predetermined shape is performed.

Lasers, light emitting diodes (LEDs), lamps and the like are used as light energy sources, and visible light and ultraviolet (UV) are used as light types (wavelengths). There is no particular limitation as long as only the conductive resin 12 can be cured.

The method of sweeping irradiation of light energy is as follows: depending on the shape and configuration of the connection terminal 1 and the element 2, sweeping irradiation by a minute spot by a laser, or a line or area by a lamp or a light emitting diode (LED). Then, the photocurable resin 12 is sequentially laminated and cured by sweep irradiation.

Further, a predetermined location is reliably swept and irradiated with light energy, for example, by setting the plane of the connection terminal 1 by rotating the plane by an arbitrary angle or setting the plane to be vertical, and the photocurable resin 12 in that portion is cured. .

Next, the operation and the operation for sealing the exterior with the photocurable resin 12 will be described.

FIG. 2 shows the photocurable resin 12 around the element 2.
Shows a state in which lamination and curing are sequentially performed by the light energy of the sweep irradiation to form and integrally mold.

First, as described above, the connection terminal 1
Is arranged parallel to the liquid surface of the photocurable resin 12, for example, so that the upper surface of the element 2 is immersed in a 0.1 mm liquid from the liquid surface of the photocurable resin 12.

Next, as shown in FIG. 2 (a), the length A and width B, which are larger than the outer shape of the element 2 and are the predetermined outer sealing shape sizes of the completed outer package 15, are used. The photocurable resin 12 on the upper surface of the device 2 is swept and irradiated with light energy to cure the photocurable resin 12 on the upper surface of the device 2 and the periphery of the device 2 within an area of A × B.

Subsequently, the element 2 is further immersed in 0.1 mm, and the light energy is similarly swept and irradiated to cure the photocurable resin 12 in that portion.

As described above, the same operation and operation as described above are repeated to sequentially laminate and harden, thereby forming a laminated cured resin 13 having a required thickness dimension C1.

Subsequently, as shown in FIG. 2B, the device 2 is turned 180 degrees, that is, turned over, so that the plane of the connection terminal 1 is parallel to the liquid surface of the photocurable resin 12. The photocurable resin 12 is disposed so as to be immersed in a 0.1 mm liquid from the liquid surface.

Then, the photocurable resin 1 on the upper surface and the periphery of the back surface of the element 2 with the same length A and width B
2 is scanned and irradiated with light energy, and is sequentially laminated and cured in the same manner as described above to form a laminated cured resin 14 having a required thickness dimension C2.

At this time, in the shape volume having the length dimension A, the width dimension B, and the thickness dimension C1 + C2, the light curable resin 12 except for the portion immediately adjacent to the element 2 is swept and irradiated with light energy to be cured. Accordingly, if the photo-curable resin 12 near the element 2 is uncured, the photo-curable resin 12 is reduced, or a sealed package (hollow package) having a cavity without the photo-curable resin 12 is used. The stress and load on the element 2 in the curing reaction of the conductive resin 12 can be almost eliminated.

When the element 2 itself does not respond to the light energy, the length A, the width B and the thickness are changed to C1 + C without removing the part of the element 2 as described above.
By curing the photo-curable resin 12 by sweeping and irradiating light energy so as to obtain the adhesive strength 2, the adhesion at the interface between the element 2 and the photo-curable resin 12 can be further enhanced, and the moisture resistance in the exterior sealing can be improved. Properties and thermal conductivity can be improved.

A filter is provided between the light source of the light energy and the container 11 or at a position immediately before the light energy of the container 11 is incident. If it is provided, there is no problem except for the necessary parts, and the photoreaction curing can be more reliably promoted.

When the photocuring of the side surface is insufficient, the element 2 is rotated 90 degrees to the left and right, respectively, to sweep the light energy or transmit the light energy of the container 11 as described above. By sweeping and irradiating light energy to a predetermined location from outside the side surface to be lightened, photocuring of the side surface portion is promoted.

As described above, as shown in FIG. 2C, the electronic component 16 having the exterior body 15 having the length A, the width B, and the thickness C1 + C2 (ie, C) is formed.

In the steps described above, sweeping irradiation of light energy or the like is performed on each part or step in accordance with the difference in photocuring depending on the configuration of each part to be continuously sealed or sealed. In addition, if the light energy intensity is varied, intermittently or the operation speed is varied, more reliable exterior sealing can be performed.

Although the product to be transfer-molded has been described above, the present invention can also be applied to a sealing molding method that requires a dedicated molding die, such as injection molding, extrusion molding, and compression molding.

[0046]

As described above, according to the electronic component and the method of manufacturing the same according to the present invention, there is an effect that a resin molding die for each product type becomes unnecessary.

[Brief description of the drawings]

FIG. 1 is a perspective view of a main part configuration according to an embodiment of the present invention.

FIGS. 2A to 2C are perspective views each showing the same resin molding step.

FIG. 3 is a perspective view of an electronic component before exterior sealing by conventional resin molding.

FIG. 4 is a perspective view of an electronic component after resin molding of the conventional example.

FIG. 5 is a sectional view of the same.

FIG. 6 is a perspective view of an essential part of a resin molding die for encapsulating the exterior.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Connection terminal 2 element 11 container 12 photocurable resin 13 laminated cured resin 14 laminated cured resin 15 exterior body 16 electronic component

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H01L 21/56 B29K 101: 00 23/29 105: 16 23/31 105: 22 // B29K 101: 00 B29L 31:34 105: 16 H01G 1/02 Q 105: 22 H01L 23/30 CB29L 31:34 (72) Inventor Hiroaki Higashino 1006 Odakadoma, Kadoma City, Osaka Prefecture F-term in Matsushita Electric Industrial Co., Ltd. 4F204 AA39 AA42 AB13 AD03 AG03 AH33 EA03 EB01 EB12 EF05 EF27 EW01 EW34 4M109 AA01 CA08 EA15 EB12 EB18 5E028 AA10 CA13 EA01 EA23 EB01 5F061 AA01 CA08

Claims (10)

[Claims] An electronic component in which a connection terminal is connected to an electrode of an element and at least a part around the element is covered with an exterior body made of a photocurable resin. 2. A device in which a connection terminal is connected to an electrode of the element, the element is immersed and held in a liquid photocurable resin, and the light curable resin around the element is swept by light energy. A method for producing an electronic component, which is cured by irradiation to form an exterior body. 3. The method according to claim 2, wherein at least one of a laser, a light emitting diode (LED), and a lamp is used as a light source of light energy. 4. The method for manufacturing an electronic component according to claim 2, wherein the light energy is applied by sweep irradiation by spot points or collective sweep irradiation by lines or areas. 5. The production of an electronic component according to claim 2, wherein a photocurable resin mixed with at least one additive of a high thermal conductive material, a high specific gravity material, an insulating material or an electrical functional material is used. Method. 6. The method for manufacturing an electronic component according to claim 2, wherein the photocurable resin near the element is uncured. 7. The method for manufacturing an electronic component according to claim 2, wherein the photocurable resin is cured after the element is moved. 8. The method of manufacturing an electronic component according to claim 2, wherein the light energy is swept and irradiated through a filter that transmits light (wavelength) to which the photocurable resin reacts. 9. The light energy is variable or continuous.
3. The method for manufacturing an electronic component according to claim 2, wherein the sweep irradiation is performed intermittently. 10. The method of manufacturing an electronic component according to claim 2, wherein light energy is transmitted through a container in which the photocurable resin is stored and is irradiated by sweeping.