JP2002231734A - 基板ユニット、半導体素子、半導体素子の実装方法及びその製造方法 - Google Patents

基板ユニット、半導体素子、半導体素子の実装方法及びその製造方法

Info

Publication number
JP2002231734A
JP2002231734A JP2001029424A JP2001029424A JP2002231734A JP 2002231734 A JP2002231734 A JP 2002231734A JP 2001029424 A JP2001029424 A JP 2001029424A JP 2001029424 A JP2001029424 A JP 2001029424A JP 2002231734 A JP2002231734 A JP 2002231734A
Authority
JP
Japan
Prior art keywords
semiconductor element
semiconductor
thermosetting adhesive
mounting
width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001029424A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002231734A5 (https=
Inventor
Hiroshi Toyama
広 遠山
Susumu Ozawa
進 小澤
Satoru Yamada
識 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Oki Digital Imaging Corp
Original Assignee
Oki Data Corp
Oki Digital Imaging Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Data Corp, Oki Digital Imaging Corp filed Critical Oki Data Corp
Priority to JP2001029424A priority Critical patent/JP2002231734A/ja
Publication of JP2002231734A publication Critical patent/JP2002231734A/ja
Publication of JP2002231734A5 publication Critical patent/JP2002231734A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers

Landscapes

  • Die Bonding (AREA)
  • Dicing (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2001029424A 2001-02-06 2001-02-06 基板ユニット、半導体素子、半導体素子の実装方法及びその製造方法 Pending JP2002231734A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001029424A JP2002231734A (ja) 2001-02-06 2001-02-06 基板ユニット、半導体素子、半導体素子の実装方法及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001029424A JP2002231734A (ja) 2001-02-06 2001-02-06 基板ユニット、半導体素子、半導体素子の実装方法及びその製造方法

Publications (2)

Publication Number Publication Date
JP2002231734A true JP2002231734A (ja) 2002-08-16
JP2002231734A5 JP2002231734A5 (https=) 2005-03-10

Family

ID=18893778

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001029424A Pending JP2002231734A (ja) 2001-02-06 2001-02-06 基板ユニット、半導体素子、半導体素子の実装方法及びその製造方法

Country Status (1)

Country Link
JP (1) JP2002231734A (https=)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005238867A (ja) * 2004-02-24 2005-09-08 Mitsubishi Electric Corp 電気部品の固定方法
JP2007165594A (ja) * 2005-12-14 2007-06-28 Denso Corp 電子部品の実装方法
JP2015189036A (ja) * 2014-03-27 2015-11-02 株式会社沖データ 半導体装置、露光ヘッド及び画像形成装置
EP2937218A3 (en) * 2014-03-27 2017-07-26 Oki Data Corporation Semiconductor apparatus, exposing head, and image forming apparatus
CN109701821A (zh) * 2019-02-21 2019-05-03 深圳市晶锐光电有限公司 一种用于led固晶的点胶头及点胶方法
JPWO2022270309A1 (https=) * 2021-06-21 2022-12-29
WO2023075058A1 (ko) * 2021-10-26 2023-05-04 엘지전자 주식회사 반도체 발광 소자를 이용한 디스플레이 장치

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005238867A (ja) * 2004-02-24 2005-09-08 Mitsubishi Electric Corp 電気部品の固定方法
JP2007165594A (ja) * 2005-12-14 2007-06-28 Denso Corp 電子部品の実装方法
JP2015189036A (ja) * 2014-03-27 2015-11-02 株式会社沖データ 半導体装置、露光ヘッド及び画像形成装置
EP2937218A3 (en) * 2014-03-27 2017-07-26 Oki Data Corporation Semiconductor apparatus, exposing head, and image forming apparatus
CN109701821A (zh) * 2019-02-21 2019-05-03 深圳市晶锐光电有限公司 一种用于led固晶的点胶头及点胶方法
CN109701821B (zh) * 2019-02-21 2023-05-23 广东晶锐半导体有限公司 一种用于led固晶的点胶头及点胶方法
JPWO2022270309A1 (https=) * 2021-06-21 2022-12-29
WO2022270309A1 (ja) * 2021-06-21 2022-12-29 京セラ株式会社 半導体デバイスの製造方法および製造装置、半導体デバイスならびに電子機器
JP7637237B2 (ja) 2021-06-21 2025-02-27 京セラ株式会社 半導体デバイスの製造方法および製造装置
WO2023075058A1 (ko) * 2021-10-26 2023-05-04 엘지전자 주식회사 반도체 발광 소자를 이용한 디스플레이 장치
WO2023075059A1 (ko) * 2021-10-26 2023-05-04 엘지전자 주식회사 반도체 발광 소자를 이용한 디스플레이 장치

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