JP2002231734A5 - - Google Patents

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Publication number
JP2002231734A5
JP2002231734A5 JP2001029424A JP2001029424A JP2002231734A5 JP 2002231734 A5 JP2002231734 A5 JP 2002231734A5 JP 2001029424 A JP2001029424 A JP 2001029424A JP 2001029424 A JP2001029424 A JP 2001029424A JP 2002231734 A5 JP2002231734 A5 JP 2002231734A5
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JP
Japan
Prior art keywords
thermosetting adhesive
semiconductor
semiconductor device
mounting
wiring substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001029424A
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English (en)
Japanese (ja)
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JP2002231734A (ja
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Publication date
Application filed filed Critical
Priority to JP2001029424A priority Critical patent/JP2002231734A/ja
Priority claimed from JP2001029424A external-priority patent/JP2002231734A/ja
Publication of JP2002231734A publication Critical patent/JP2002231734A/ja
Publication of JP2002231734A5 publication Critical patent/JP2002231734A5/ja
Pending legal-status Critical Current

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JP2001029424A 2001-02-06 2001-02-06 基板ユニット、半導体素子、半導体素子の実装方法及びその製造方法 Pending JP2002231734A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001029424A JP2002231734A (ja) 2001-02-06 2001-02-06 基板ユニット、半導体素子、半導体素子の実装方法及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001029424A JP2002231734A (ja) 2001-02-06 2001-02-06 基板ユニット、半導体素子、半導体素子の実装方法及びその製造方法

Publications (2)

Publication Number Publication Date
JP2002231734A JP2002231734A (ja) 2002-08-16
JP2002231734A5 true JP2002231734A5 (https=) 2005-03-10

Family

ID=18893778

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001029424A Pending JP2002231734A (ja) 2001-02-06 2001-02-06 基板ユニット、半導体素子、半導体素子の実装方法及びその製造方法

Country Status (1)

Country Link
JP (1) JP2002231734A (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4506197B2 (ja) * 2004-02-24 2010-07-21 三菱電機株式会社 電気部品の固定方法及び太陽電池パネル
JP2007165594A (ja) * 2005-12-14 2007-06-28 Denso Corp 電子部品の実装方法
US9429867B2 (en) * 2014-03-27 2016-08-30 Oki Data Corporation Semiconductor apparatus, exposing head, and image forming apparatus
JP6358826B2 (ja) * 2014-03-27 2018-07-18 株式会社沖データ 半導体装置、露光ヘッド及び画像形成装置
CN109701821B (zh) * 2019-02-21 2023-05-23 广东晶锐半导体有限公司 一种用于led固晶的点胶头及点胶方法
WO2022270309A1 (ja) * 2021-06-21 2022-12-29 京セラ株式会社 半導体デバイスの製造方法および製造装置、半導体デバイスならびに電子機器
CN117242587A (zh) * 2021-10-26 2023-12-15 Lg电子株式会社 使用半导体发光元件的显示装置

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